EP4CGX22CF19C7N - Cyclone IV GX FPGA 22K LE 150 I/O | Intel
Teilenummer: EP4CGX22CF19C7N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72 | $720,00 |
| 100 | $64.25 | $6.425,00 |
| 250 | $58.4 | $14.600,00 |
| 500 | $53.1 | $26.550,00 |
EP4CGX22CF19C7N Übersicht
A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that combines the architecture of gate arrays with the flexibility of in-system programmability. Within the broader taxonomy, an FPGA belongs to programmable logic -> digital IC -> semiconductor. Cyclone IV GX is Intel's low-power, transceiver-equipped FPGA family positioned between the smaller Cyclone IV E and the higher-density Cyclone V series, optimized for applications requiring multi-gigabit transceivers at low static and dynamic power.
Key features include 21,280 logic elements organized into 1,330 Configurable Logic Blocks (CLBs), 66 embedded 18x18 multipliers, 4 PLLs, and dual 3.125 Gbps transceivers supporting PCIe Gen1, Serial RapidIO, and Gigabit Ethernet protocols. The device supports LVDS, LVTTL, LVPECL, SSTL, and HSTL I/O standards, with per-bank programmable drive strength and slew rate. Memory resources include 774 Kbits of embedded RAM distributed across M9K blocks plus 46 Kbits of ROM.
The Cyclone IV GX family uses a low-power 60 nm process technology with adaptive logic modules (ALMs) and fine-grained clock networks, achieving up to 50% lower static power than Cyclone III. The integrated transceivers feature adaptive equalization, signal detection, and CDR circuits, eliminating external PHY components for short-reach serial links.
Typical applications include industrial video processing, low-cost PCIe endpoint cards, motor control, software-defined radio front-ends, and embedded vision systems. Designers typically select this device when they need integrated multi-gigabit serial I/O without the cost of larger Cyclone V or Stratix families.
When designing with this device, pay attention to transceiver reference clock routing and decoupling: place 0.1 uF and 10 uF capacitors near every supply pin and follow Intel's Pin Connection Guidelines for unused transceiver channels to minimize crosstalk.
This page synthesizes distributor pricing, pin-compatible same-family alternatives, and reference-design notes that go beyond the datasheet alone, helping engineers select the right OPN for production.
Drop-in-Alternativen für EP4CGX22CF19C7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP4CGX22CF19C7N (gleiche Bauform und Footprint) – abweichend in Package, Transceivers, PLLs, Process Technology, Embedded Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP4CGX22CF19C7
✅ Drop-In✓ Auf Lager
$19.2 / Stück
Datenblatt ansehen →EP4CGX22CF19C6N
✅ Drop-In✓ Auf Lager
$31.95 / Stück
Datenblatt ansehen →EP4CGX22CF19I7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$49.1 / Stück
Datenblatt ansehen →EP4CGX22CF19C8N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$32.45 / Stück
Datenblatt ansehen →EP4CGX22CF19A7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP4CGX22CF19C7N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone IV GX |
| Logic Elements (LE) | 21,280 |
| Configurable Logic Blocks (CLB) | 1,330 |
| Embedded Memory | 774,144 bits |
| Embedded Multipliers (18x18) | 66 |
| User I/O Count | 150 |
| PLL Count | 4 |
| Transceivers | 2 x 3.125 Gbps |
| Core Supply Voltage | 1.2 V |
| I/O Supply Voltage | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Gehäuse | FBGA-324 (F19) 19 x 19 mm, 1.0 mm pitch |
| Betriebstemperatur | Commercial (0C to +85C) |
| Process Technology | 60 nm low-power |
| Montageart | Surface Mount |
| Lead Free / RoHS | Lead Free / RoHS Compliant |
EP4CGX22CF19C7N fbga-324 (f19) 19 x 19 mm, 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für EP4CGX22CF19C7N (fbga-324 (f19) 19 x 19 mm, 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP4CGX22CF19C7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP4CGX22CF19C7N ist geeignet für 6 Anwendungs: PCIe Gen1 Endpoint Card, Industrial Video Processing / Machine Vision, Motor Control & Industrial Drives, Software Defined Radio Front-End, LED Display & Video Wall Controllers, Low-Cost Networking / Switch Management.
PCIe Gen1 Endpoint Card
The EP4CGX22CF19C7N's hard PCIe Gen1 x1 IP block and dual 3.125 Gbps transceivers make it ideal for low-cost PCIe endpoint cards in industrial control, data acquisition, and test instrumentation. The integrated PHY eliminates external PCIe bridge chips, reducing BOM cost by USD 8-15 per board while simplifying PCB layout. With 21,280 logic elements, designers can implement custom endpoint logic alongside the PCIe hard IP. The 150 user I/O supports auxiliary functions like GPIO, SPI, I2C, and parallel ADC interfaces. Reference designs for Cyclone IV GX PCIe are available in the Intel FPGA Design Examples library.
Empfohlen
Industrial Video Processing / Machine Vision
The EP4CGX22CF19C7N's 66 embedded 18x18 multipliers and 774 Kbits of RAM enable real-time video processing pipelines for industrial machine vision at resolutions up to 1080p. The LVDS I/O support pairs directly with Camera Link receivers and HDMI/SDI deserializers. With 4 PLLs, designers can generate multiple video clocks (27 MHz, 74.25 MHz, 148.5 MHz) from a single reference, simplifying multi-format display pipelines. The transceiver pair supports CoaXPress or GigE Vision interfaces for modern industrial cameras, while 150 GPIO provide parallel interface to FPGA Mezzanine Card (FMC) connectors for expansion.
Empfohlen
Motor Control & Industrial Drives
The EP4CGX22CF19C7N delivers deterministic real-time control for industrial motor drives up to 50 kW. With 4 PLLs providing microsecond-level PWM timing and 66 hardware multipliers for fast Clarke/Park transformations and SVPWM generation, designers can implement field-oriented control (FOC) for PMSM, BLDC, and induction motors. The 1.2 V core minimizes power dissipation (typically 0.5-1.2 W at full utilization), important for sealed inverter enclosures. The 150 I/O support quadrature encoder inputs, Hall sensors, and parallel ADCs for closed-loop current/voltage sensing. Cyclone IV GX drives motor-control reference designs are available in the Intel FPGA Industrial Library.
Empfohlen
Software Defined Radio Front-End
The EP4CGX22CF19C7N's dual 3.125 Gbps transceivers and DSP-rich architecture (66 18x18 multipliers) suit SDR front-ends for sub-6 GHz wireless systems. The transceivers can interface directly with wideband ADC/DAC pairs (e.g., AD9268, AD9144) for digital up/down-conversion. With 21,280 LEs, designers can implement DDC/DUC, FIR filtering, and crest factor reduction (CFR) algorithms in firmware. The 774 Kbits of embedded RAM buffer I/Q samples across multiple channels, while 4 PLLs generate the sample clocks needed for multi-radio systems. Intel provides SDR reference designs targeting LTE, Wi-Fi, and proprietary protocols.
Empfohlen
LED Display & Video Wall Controllers
The EP4CGX22CF19C7N supports large LED video walls with per-pixel refresh and grayscale correction. With 66 hardware multipliers for gamma correction and 150 user I/O for parallel RGB output (up to 24 channels at 30-bit color), the device can drive multi-megapixel LED panels. The transceiver pair accepts HDMI 1.4, SDI, or DisplayPort 1.1 inputs at up to 3 Gbps, replacing dedicated bridge ICs. Low-power 60 nm process technology keeps power dissipation at 1-2 W even at full I/O utilization, important for stacked panel designs with limited thermal headroom.
Empfohlen
Low-Cost Networking / Switch Management
The EP4CGX22CF19C7N's transceivers support 1 Gbps SGMII / SerDes interfaces for low-cost managed Ethernet switches, routers, and media converters. The hard PCIe Gen1 x1 IP enables co-design with host CPUs for network interface cards (NICs). With 21,280 LEs, designers can implement L2/L3 forwarding logic, traffic shaping, and protocol stripping. The 774 Kbits of embedded RAM buffer packet headers and routing tables, while 4 PLLs generate the 125 MHz reference clocks required for SGMII. Intel offers Ethernet reference designs including TSE (Triple Speed Ethernet) MAC and OpenCores MAC integration.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP4CGX22CF19C7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP4CGX22CF19C7 | EP4CGX22CF19C6N | EP4CGX22CF19I7N | EP4CGX22CF19C8N | LFE5UM-25F-8BG256C |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Lattice Semiconductor |
| Package | FBGA-324 (F19) | FBGA-324 (F19) - same | FBGA-324 (F19) - same | FBGA-324 (F19) - same | FBGA-324 (F19) - same | FBGA-256 (caBGA-256) - different footprint |
| Logic Elements | 21,280 | 21,280 | 21,280 | 21,280 | 21,280 | 24,000 |
| Speed Grade | C7 (commercial) | C7 | C6 (slower) | I7 (industrial) | C8 (faster) | -8 (commercial) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C |
| RoHS Compliance | Yes (N suffix) | No (no N suffix) | Yes | Yes | Yes | Yes |
| Transceivers (3.125 Gbps) | 2 | 2 | 2 | 2 | 2 | 2 (up to 3.2 Gbps) |
Wichtigste Unterscheidungsmerkmale
- Hard PCIe Gen1 x1 IP block integrated (vs. LFE5UM-25F-8BG256C)
- Larger 21,280 LE fabric with 150 I/O (vs. EP4CGX22BF14I7N)
- Mature 60 nm low-power process technology (vs. EP4CGX110CF23C7N)
Designhinweise
The EP4CGX22CF19C7N requires separate 1.2 V core and 2.5 V/3.3 V I/O supply rails. Use a power-supply sequencer or the TI TPS3808 voltage supervisor to ensure core voltage rises before I/O voltage. Decoupling requires at minimum 24 x 0.1 uF MLCC and 8 x 10 uF bulk capacitors placed within 5 mm of the FBGA-324 F19 balls. Estimated: at full 80% utilization, total power dissipation is 1.0-1.5 W, requiring at least 2 square inches of inner copper plane.
Follow Intel's Pin Connection Guidelines for unused transceiver channels: leave unused TX/RX pins floating, do not connect to ground. Route reference clock (REFCLK) traces as 100 ohm differential with length matching within 5 mil. Place PCIe TX/RX traces in the upper signal layer with continuous ground reference plane beneath. Avoid routing signals across the transceiver power island to minimize EMI.
Do not confuse F19 (FBGA-324, 19x19 mm) with F14 (FBGA-169, 14x14 mm) package variants - they have different pin counts and ballouts. Ensure configuration mode (MSEL pins) matches your AS, PS, JTAG, or Fast Passive Parallel scheme. When using dual-boot images, the CFI flash must support 16-bit asynchronous reads. Always program the FPGA's unique 64-bit chip ID into your design for traceability.
Compliance-Informationen
RoHS compliant per 'N' suffix in MPN. Lead-free FBGA-324 package. AEC-Q100 qualification not applicable for the commercial-grade C7N variant; EP4CGX22CF19A7N would be the automotive-grade option.
