EP4SGX110DF29C2XG - Stratix IV GX FPGA, 105.6K LEs, 780-FCBGA | Intel
Teilenummer: EP4SGX110DF29C2XG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1575.89 | $1.575,89 |
| 10 | $1489.5 | $14.895,00 |
| 100 | $1395 | $139.500,00 |
| 500 | $1320 | $660.000,00 |
| 1.000 | $1265 | $1.265.000,00 |
EP4SGX110DF29C2XG Übersicht
An FPGA (Field Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs), dedicated DSP slices, on-chip memory blocks, and routing interconnect. Stratix IV GX extends this baseline by adding multi-gigabit transceivers, hard PCIe IP cores, and external memory controller support, placing it in the high-end programmable logic family that sits between general-purpose FPGAs and ASICs in the programmable device hierarchy: programmable logic device -> FPGA -> high-end FPGA with transceivers -> SoC FPGA.
Key device features include an FPGA fabric with embedded DSP blocks (variable-precision multipliers and accumulators), dedicated memory blocks (M9K and MLAB), and a hard memory controller that interfaces to DDR/DDR2/DDR3 SDRAM, QDR II/II+ SRAM, and RLDRAM II. The GX suffix denotes the integrated multi-gigabit transceiver subsystem supporting standards such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, and 1G/10G Ethernet through hard PCS channels.
Typical applications include high-throughput digital signal processing (radar, beamforming, software-defined radio), high-speed serial protocol bridging (PCIe, Serial RapidIO, 10G Ethernet), ASIC prototyping, and high-end test and measurement instrumentation. The 780-FCBGA package provides the signal and power integrity needed for parallel LVDS and multi-gigabit serial interfaces while remaining compatible with high-density PCB stack-ups.
When designing with this device, plan FPGA floorplanning and pin assignment with Quartus II early to close timing on transceiver channels, and verify signal integrity on the multi-gigabit lanes through IBIS-AMI simulation. Power estimation must include the GX transceiver analog supply rails separately from the core FPGA rails, since the transceivers dominate total device power at full line rate.
Drop-in-Alternativen für EP4SGX110DF29C2XG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP4SGX110DF29C2XG (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Speed Grade, Mounting Type, Adaptive Logic Modules (ALM).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP4SGX230DF29C2X
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP4SGX290DF29C2X
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP4SGX110DF29C2XG Grenzwerte & elektrische Eigenschaften
| Series | Stratix IV GX |
| Manufacturer | Intel (formerly Altera) |
| Process Technology | 40 nm |
| Logic Elements (LEs) | 105,600 |
| Total Memory Bits | 9,793,536 |
| User I/O Count | 372 |
| Gehäuse | 780-FCBGA (29 mm) |
| Montageart | Surface Mount |
| Multi-Gigabit Transceivers | Yes (GX series, hard PCS) |
| Embedded DSP Blocks | Yes (variable-precision) |
| External Memory Interface | DDR/DDR2/DDR3, QDR II/II+, RLDRAM II |
| Hard PCIe IP | Yes (PCIe Gen1/Gen2 hard IP) |
| Configuration Method | FPGA configuration flash / JTAG |
| RoHS-Status | Compliant |
EP4SGX110DF29C2XG 780-fcbga (29 mm) Pinbelegungsleitfaden
Pinbelegung für EP4SGX110DF29C2XG (780-fcbga (29 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP4SGX110DF29C2XG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP4SGX110DF29C2XG ist geeignet für 7 Anwendungs: Software-Defined Radio (SDR) Baseband, High-Speed Serial Protocol Bridge, ASIC Prototyping and Emulation, High-End Test & Measurement Instrumentation, Radar and Beamforming Signal Processing, Video Broadcast and Image Processing, Industrial High-Speed Control Systems.
Software-Defined Radio (SDR) Baseband
The EP4SGX110DF29C2XG's multi-gigabit transceivers interface directly to JESD204B/C ADCs and DACs used in wideband SDR baseband cards, while its variable-precision DSP blocks execute channelization, decimation, and digital down-conversion (DDC) chains in hardware. The 105,600 LEs and 9.79 Mbits of embedded memory buffer ADC capture across multiple antennas, and the hard PCIe Gen2 IP links the FPGA to a host CPU for higher-layer baseband processing. With 372 user I/Os the device exposes LVDS pairs for backplane synchronization.
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High-Speed Serial Protocol Bridge
Used as a bridge between PCIe Gen2, Serial RapidIO, 10G Ethernet, and custom backplane protocols, the EP4SGX110DF29C2XG integrates hard PCS channels that close timing at 6.375 Gbps line rates without soft-IP overhead. Its 105,600 LEs handle protocol state machines and DMA, while the 780-FCBGA package preserves signal integrity on multi-gigabit lanes. Engineers use this configuration in telecom base-station line cards and protocol-conversion ASICs.
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ASIC Prototyping and Emulation
The 105,600 logic elements of the EP4SGX110DF29C2XG combined with 9.79 Mbits of embedded memory make it a viable target for ASIC prototyping of mid-complexity SoCs. Designers partition the ASIC RTL across multiple Stratix IV GX FPGAs using TimeGen or HapsCheck timing closure tools, with the integrated multi-gigabit transceivers modelling chip-to-chip SerDes at near-SoC line rates. The 780-FCBGA package exposes enough user I/Os to bring out ASIC peripherals for real-time verification.
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High-End Test & Measurement Instrumentation
Test instruments such as protocol analyzers, oscilloscopes, and bit-error-rate testers rely on the EP4SGX110DF29C2XG to capture and generate multi-gigabit serial traffic in real time. Its variable-precision DSP blocks perform on-the-fly decoding, error counting, and pattern matching, while 9.79 Mbits of embedded memory buffer acquisition captures. The 780-FCBGA package supports fine BGA fan-out to high-pin-count probe fixtures and high-speed connector backplanes.
Empfohlen
Radar and Beamforming Signal Processing
In phased-array and MIMO radar front-ends the EP4SGX110DF29C2XG implements beamforming weight calculation, pulse compression, and CFAR detection directly in its variable-precision DSP blocks. The 9.79 Mbits of embedded memory store range-Doppler maps across multiple PRIs, and the integrated multi-gigabit transceivers distribute digitized sub-array data across the backplane. The 372 user I/Os expose LVDS synchronization lines between array elements.
Empfohlen
Video Broadcast and Image Processing
Broadcast video routers and image-processing pipelines use the EP4SGX110DF29C2XG for real-time 3G-SDI/HD-SDI switching, color-space conversion, and scaling. Its 105,600 LEs handle multi-stream pixel pipelines, the 9.79 Mbits of embedded memory buffer line-rate frame buffers, and the integrated transceers transport SDI and HDMI streams without external PHYs. The 780-FCBGA package supports the high-pin-count parallel video buses used in broadcast routers.
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Industrial High-Speed Control Systems
Industrial motion controllers and machine-vision systems use the EP4SGX110DF29C2XG for sub-microsecond servo-loop processing and real-time image preprocessing. Its variable-precision DSP blocks execute multi-axis PID loops in hardware, the 9.79 Mbits of embedded memory buffer camera frames, and the multi-gigabit transceivers link to GigE Vision cameras over the CoaXPress or 10G Ethernet physical layers. The 780-FCBGA package handles dense encoder and GPIO routing.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP4SGX110DF29C2XG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP4SGX230DF29C2X | EP4SGX290DF29C2X | EP4SGX110FF35C2X |
|---|---|---|---|---|
| Package | 780-FCBGA (DF29) | 780-FCBGA (DF29) - same | 780-FCBGA (DF29) - same | 1152-FCBGA (FF35) - different |
| Brand | Intel | Intel | Intel | Intel |
| Logic Elements | 105,600 | 228,000 | 290,000 | 105,600 |
| Embedded Memory | 9,793,536 bits | 17,133,312 bits | 21,041,664 bits | 9,793,536 bits |
| User I/O | 372 | 372 | 372 | 480 |
| Multi-Gigabit Transceivers | Yes (GX) | Yes (GX) | Yes (GX) | Yes (GX) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (C2) | Commercial (C2) | Commercial (C2) |
Wichtigste Unterscheidungsmerkmale
- Optimal price-density point for 100K-LE class designs (vs. EP4SGX230DF29C2X)
- Same 780-FCBGA DF29 footprint across the Stratix IV GX family (vs. EP4SGX110FF35C2X)
- Integrated multi-gigabit transceivers and hard PCIe IP (vs. Cyclone IV GX (EP4CGX110DF27))
Designhinweise
The 780-FCBGA package requires a multi-layer PCB stack-up with microvia or stacked-via technology to fan out from the 1.0 mm ball pitch. Use 8+ layers, with dedicated GND and PWR planes beneath the FPGA to control impedance for the multi-gigabit transceiver lanes. Reference the Stratix IV GX pin connection guidelines for recommended decoupling (typically 0.1 uF, 0.01 uF, and bulk caps on each transceiver analog rail).
Multi-gigabit transceiver channels in the Stratix IV GX series require 100-ohm differential routing with controlled length matching of better than 150 mils across P and N pairs. Use IBIS-AMI simulation for channel losses above 5 GHz, and place AC-coupling capacitors close to the FPGA transmitter pins. Verify TX pre-emphasis and RX equalization settings in Quartus II against the actual channel loss profile.
Do not assume the EP4SGX110DF29C2XG and EP4SGX110FF35 are interchangeable - they share the same die but use different packages (780-FCBGA vs 1152-FCBGA) and are NOT pin-compatible. The 'C2' suffix denotes commercial temperature grade (0C to +85C); for industrial (-40C to +100C) operation choose the 'I2' suffix variant. Quartus II software version compatibility must be checked - Stratix IV GX support requires Quartus II v10.0 or later with the Stratix IV device library installed.
Compliance-Informationen
RoHS compliant per Altera (now Intel) part-number convention; 'G' suffix in the MPN denotes lead-free / RoHS-compliant assembly. C2 suffix denotes commercial temperature grade (0C to +85C); for industrial temperature range choose the I2 suffix variant. AEC-Q100 is not applicable to high-density FPGAs in this performance class.
