EP4SGX70DF29C3G - 72.6K LE Stratix IV GX FPGA, 780-FBGA | Intel
Teilenummer: EP4SGX70DF29C3G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1750 | $17.500,00 |
| 25 | $1680 | $42.000,00 |
| 100 | $1520 | $152.000,00 |
| 250 | $1425 | $356.250,00 |
EP4SGX70DF29C3G Übersicht
A Field Programmable Gate Array (FPGA) is a reconfigurable digital logic IC that allows hardware designers to implement custom logic functions, DSP pipelines, and high-speed serial interfaces after manufacturing. Within the semiconductor hierarchy, FPGAs sit between Application-Specific Integrated Circuits (ASICs) and general-purpose processors, offering ASIC-like parallelism with processor-like programmability. The Stratix IV family specifically targets high-bandwidth applications such as wireline backplanes, broadcast video, and military radar, where logic density and transceiver performance outweigh unit cost.
Key features of the EP4SGX70DF29C3G include 372 user I/O pins, dedicated DSP blocks for fixed- and floating-point arithmetic, embedded PCIe hard IP, and programmable power technology that dynamically scales voltage and frequency per logic region. The 780-pin FCBGA offers enhanced thermal and signal-integrity characteristics compared to standard plastic BGA, supporting multi-GHz signal routing on the package substrate. Up to 16 embedded transceivers cover protocols including PCIe Gen1/Gen2, XAUI, HiGig+, SATA, and Serial RapidIO.
Architecturally, the EP4SGX70DF29C3G combines ALM-based logic, TriMatrix on-chip memory blocks, and 8.5 Gbps transceivers on a 40 nm low-power process. The programmable logic fabric is paired with 7,564,880 bits of embedded SRAM organized into multiple block types (M512, M4K, M-RAM), enabling wide internal data paths for high-throughput DSP. The hardened PCIe Gen1/Gen2 endpoint supports x1/x2/x4 lane widths and simplifies board design by eliminating soft IP timing closure concerns.
Typical applications include high-speed serial interface bridging, 40G/100G data path prototyping, radar and EW digital signal processing, software-defined radio (SDR) baseband, and ASIC prototyping. The combination of transceiver density and DSP blocks makes it well suited for telecommunications line cards, military communications, and high-end test & measurement equipment.
A key design consideration for the EP4SGX70DF29C3G is power integrity: the FPGA must be supplied from a multi-rail source (0.9 V core, 1.1 V/1.5 V/1.8 V/2.5 V/3.0 V auxiliaries) with tight load-step tolerance. Use the Quartus II PowerPlay analyzer to estimate dynamic power before PCB layout, and ensure the FBGA decoupling network follows the Stratix IV handbook reference design to avoid in-rush issues during configuration.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing actionable context that complement the official Intel Stratix IV GX documentation.
Drop-in-Alternativen für EP4SGX70DF29C3G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP4SGX70DF29C3G (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Transceivers, Mounting Type, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP4SGX70DF29C2XN
✅ Drop-In✓ Auf Lager
$2450 / Stück
Datenblatt ansehen →EP4SGX70DF29C2XG
✅ Drop-In✓ Auf Lager
$1295 / Stück
Datenblatt ansehen →EP4SGX110DF29C3G
✅ Drop-In✓ Auf Lager
$2610.5 / Stück
Datenblatt ansehen →EP4SGX110DF29C4G
✅ Drop-In✓ Auf Lager
$1495 / Stück
Datenblatt ansehen →EP4SGX110DF29I3G
✅ Drop-In✓ Auf Lager
$1995 / Stück
Datenblatt ansehen →EP4SGX110DF29I4G
✅ Drop-In✓ Auf Lager
$1085 / Stück
Datenblatt ansehen →EP4SGX70DF29C3G Grenzwerte & elektrische Eigenschaften
| Series | Stratix IV GX |
| Family | Stratix IV GX |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 72,600 |
| Embedded Memory (bits) | 7,564,880 |
| User I/O Count | 372 |
| Core Voltage | 0.9 V |
| Gehäuse | 780-BBGA, FCBGA (FineLine BGA) |
| Montageart | Surface Mount (BGA) |
| Process Node | 40 nm |
| Transceivers | Up to 16 channels, 600 Mbps - 8.5 Gbps |
| DSP Blocks | Yes (variable-precision DSP) |
| PCIe Hard IP | PCIe Gen1/Gen2 endpoint |
| Operating Temperature Grade | Commercial (C suffix) |
| RoHS-Status | Compliant |
EP4SGX70DF29C3G Pin-Konfiguration
| Pin F29-1 | GND — Ground reference for FPGA core and I/O banks |
| Pin F29-2 | VCC — 0.9 V core supply voltage |
| Pin F29-3 | IO_BANK_1 — User I/O - Bank 1 |
| Pin F29-4 | IO_BANK_2 — User I/O - Bank 2 |
| Pin F29-5 | GXB_TX0_P — Transceiver channel 0 TX positive |
| Pin F29-6 | GXB_RX0_P — Transceiver channel 0 RX positive |
| Pin F29-7 | VCCAUX — 1.8 V or 2.5 V auxiliary supply |
| Pin F29-8 | TCK — JTAG Test Clock (IEEE 1149.1) |
Typische Anwendungen
EP4SGX70DF29C3G ist geeignet für 6 Anwendungs: Software Defined Radio (SDR) Baseband, 40G/100G Telecom Line Card, Radar and EW Signal Processing, ASIC Prototyping, Broadcast Video Processing, Test and Measurement Equipment.
Software Defined Radio (SDR) Baseband
The Intel EP4SGX70DF29C3G is well suited for software-defined radio baseband processing where its 72.6K logic elements and 16 transceivers (600 Mbps-8.5 Gbps) provide both DSP capacity and front-end I/O. Its variable-precision DSP blocks enable efficient FFT and channelization operations for LTE and 5G waveforms while supporting JESD204B interfaces to RF ADCs/DACs.
Empfohlen
40G/100G Telecom Line Card
The EP4SGX70DF29C3G supports high-density packet processing in 40G and 100G telecom line cards via its 8.5 Gbps transceivers that natively support 10G KR/40G KR4 and OTU2/OTU3 protocols. The 372 user I/O pins provide sufficient sideband GPIO for QSFP28 cages, while the 7.56 Mbit embedded memory buffers packet flows at line rate without external SRAM.
Empfohlen
Radar and EW Signal Processing
For radar and electronic warfare applications, the EP4SGX70DF29C3G delivers the deterministic DSP throughput required for pulse-Doppler processing, beamforming, and adaptive filtering. The 40 nm process with programmable power technology allows dynamic frequency scaling, reducing power consumption during idle windows between radar sweeps.
Empfohlen
ASIC Prototyping
The EP4SGX70DF29C3G serves as a high-density FPGA prototyping platform for pre-silicon validation of ASIC designs up to approximately 5-10 million gates. Quartus II integration with industry-standard synthesis tools plus the 780-BGA footprint enables prototyping of multi-million-gate ASICs using Quartus II TimeQuest timing closure flows.
Empfohlen
Broadcast Video Processing
In broadcast video applications, the EP4SGX70DF29C3G supports 3G-SDI and 6G-SDI transport, real-time color space conversion, and 4K/UHD resolution scaling pipelines. The device's 7.56 Mbit embedded SRAM enables line buffering for resolution upscaling, and the 16 transceivers handle multiple SDI streams concurrently.
Empfohlen
Test and Measurement Equipment
The EP4SGX70DF29C3G enables high-end test and measurement equipment such as logic analyzers, protocol analyzers, and BERT testers that require both fast real-time signal processing and high-throughput serial interfaces. Its combination of transceivers plus user I/O supports multi-channel data acquisition at 8 Gbps per channel.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP4SGX70DF29C3G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP4SGX70DF29C2XN | EP4SGX70DF29C2XG | EP4SGX110DF29C3G | EP4SGX110DF29C4G |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same |
| Logic Elements | 72,600 | 72,600 | 72,600 | 105,600 (+45%) | 105,600 (+45%) |
| Embedded Memory (bits) | 7,564,880 | 7,564,880 | 7,564,880 | 8,968,200 (+18%) | 8,968,200 (+18%) |
| User I/O | 372 | 372 | 372 | 372 | 372 |
| Transceivers | 16 (up to 8.5 Gbps) | 16 | 16 | 24 (+50%) | 24 (+50%) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Speed Grade | C3 (commercial) | C2 (slower) | C2 (slower) | C3 | C4 (faster) |
| Estimated Unit Price (1 qty) | $1,850 | Lower | Lower | Higher (+30%) | Higher (+35%) |
Wichtigste Unterscheidungsmerkmale
- Same 780-FBGA footprint, larger 105K LE capacity (vs. EP4SGX110DF29C3G)
- Pin-compatible same-die lower-speed alternative (vs. EP4SGX70DF29C2XN)
- Higher speed grade upgrade available in same package (vs. EP4SGX110DF29C4G)
Designhinweise
The EP4SGX70DF29C3G requires multi-rail power supply: 0.9 V core, 1.1 V PLL, 1.8 V/2.5 V/3.0 V auxiliaries for I/O banks. Per the Stratix IV GX handbook, the core rail must supply up to 30 A/us load-step transients during configuration. Designers should use the Quartus II PowerPlay Early Power Estimator to size the core regulator and follow the Stratix IV reference schematic for power sequencing. Add decoupling capacitors of 100 nF, 10 uF, and 47 uF near every power pin.
At full utilization (72.6K LE, 16 transceivers active), the EP4SGX70DF29C3G can dissipate up to 15-20 W. The 780-FBGA thermal pad provides the primary heat path; PCB designers should attach a copper coin (at least 25x25 mm) on the BGA thermal pad. Use the Stratix IV thermal management guidelines to choose heatsink or forced-air cooling. Without proper thermal design, the junction temperature can exceed 100C and trigger thermal protection.
Layout for the 780-FBGA package requires HDI PCB stack-up with microvias on the transceiver differential pairs. Follow the Stratix IV GX PCB Design Guidelines for via-in-pad plating, trace impedance (100 ohm differential for transceivers, 50 ohm single-ended for I/O), and length matching within 150 mil for transceiver pairs. Use the Quartus II pin planner to define pin assignments before PCB layout to minimize signal crossings.
Transceiver signal integrity depends on matched routing: maintain 100 ohm differential impedance with 5 mil trace width and 7 mil spacing per Intel's reference design. Each transceiver pair requires length matching within 150 mils to keep the channel within PCIe / XAUI spec compliance. Use HyperLynx or ANSYS SIwave for pre-layout simulation; post-layout extraction is mandatory for >6 Gbps channels.
Avoid these common pitfalls with the EP4SGX70DF29C3G: (1) Do not omit the configuration mode resistor - configure MSEL pins correctly for AS, PS, JTAG, or Fast Passive Parallel modes; (2) Do not exceed 8.5 Gbps on transceivers without full channel simulation; (3) Ensure JTAG chain integrity by buffering TCK/TMS signals if multiple devices are scanned; (4) Configure unused pins as tri-stated inputs per Quartus II defaults to minimize crosstalk and power consumption.
Compliance-Informationen
RoHS and REACH compliant per Heisener product listing. Industrial temp variants available with 'I' prefix suffix. AEC-Q100 not applicable for FPGAs in this category.