EP3SL70F780C2 - Stratix III L FPGA, 67.5K LE, 780-FCBGA | Intel
Teilenummer: EP3SL70F780C2 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1576.88 | $1.576,88 |
| 10 | $1485.5 | $14.855,00 |
| 100 | $1395 | $139.500,00 |
| 500 | $1310.2 | $655.100,00 |
| 1.000 | $1245.75 | $1.245.750,00 |
EP3SL70F780C2 Übersicht
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs occupy the tier above general-purpose microcontrollers and below ASICs in the compute hierarchy, offering hardware-level parallelism with the flexibility of in-system reprogrammability. The Stratix III series specifically targets high-end signal processing, ASIC prototyping, and compute-intensive workloads where microcontrollers cannot deliver sufficient throughput.
Key features include 2,700 LABs (Logic Array Blocks) with adaptive logic modules, embedded multiplier/DSP blocks, dedicated memory interfaces supporting DDR3/QDRII+, and 8.625 Mbits of MLAB memory. The 780-pin FCBGA package provides a robust substrate for high-speed signal integrity and supports industrial-grade thermal envelopes. Per the Stratix III Device Handbook, the device supports Partial Reconfiguration, enabling live logic swaps without full device resets.
Architecturally, the EP3SL70F780C2 integrates programmable logic, routing, and I/O elements optimized for low static power relative to earlier Stratix generations. The device supports multiple I/O standards including LVDS, LVCMOS, SSTL, and HSTL, enabling direct interfacing to high-speed external memories and backplane transceivers. Designers leverage Quartus II software for synthesis, place-and-route, and timing closure.
Typical applications span high-end communications infrastructure (baseband processing, packet inspection), high-performance computing accelerators, ASIC prototyping, medical imaging signal chains, and broadcast video processing. Industrial automation and military/aerospace platforms also deploy this device for mission-critical embedded processing.
When designing with the EP3SL70F780C2, prioritize signal-integrity-driven PCB stackup planning due to the 780-ball BGA footprint and high-speed I/O counts. Use Intel's Stratix III Device Handbook reference designs for DDR3 interface calibration and pinout guidelines. Note that Stratix III is in mature production status - verify long-term availability for new programs.
This page synthesizes distributor pricing, drop-in alternatives drawn from the Stratix III L family, and practical design considerations not aggregated on DigiKey, Mouser, or Octopart individually.
Drop-in-Alternativen für EP3SL70F780C2 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP3SL70F780C2 (gleiche Bauform und Footprint) – abweichend in Speed Grade, RoHS Status, Package, Family, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP3SL70F780C2N
✅ Drop-In✓ Auf Lager
$139 / Stück
Datenblatt ansehen →EP3SL70F780C3N
✅ Drop-In✓ Auf Lager
$198 / Stück
Datenblatt ansehen →EP3SL70F780C4N
✅ Drop-In✓ Auf Lager
$1210 / Stück
Datenblatt ansehen →EP3SL70F780I3N
✅ Drop-In✓ Auf Lager
$1240 / Stück
Datenblatt ansehen →EP3SL70F780I4N
✅ Drop-In✓ Auf Lager
$875.4 / Stück
Datenblatt ansehen →EP3SL70F780C2 Grenzwerte & elektrische Eigenschaften
| Family | Stratix III L |
| Series | Stratix III |
| Logic Elements | 67,500 |
| Embedded Memory | 2,699,264 bits |
| Logic Array Blocks (LABs) | 2,700 |
| User I/Os | 488 |
| Process Technology | 65 nm |
| Core Voltage | 1.1 V |
| Package Type | 780-BBGA, FCBGA (FineLine BGA) |
| Number of Pins/Terminals | 780 |
| Montageart | Surface Mount |
| Operating Temperature Grade | Commercial (0C to +85C, inferred from C2 suffix) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
| Speed Grade | C2 (inferred from part suffix) |
| In-System Programmability | Yes (Quartus II) |
EP3SL70F780C2 780-bbga, fcbga (fineline bga) Pinbelegungsleitfaden
Pinbelegung für EP3SL70F780C2 (780-bbga, fcbga (fineline bga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP3SL70F780C2.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP3SL70F780C2 ist geeignet für 7 Anwendungs: High-Performance DSP Signal Processing, ASIC Prototyping Platform, Telecommunications Baseband Processing, Broadcast Video Processing, Medical Imaging Acceleration, Industrial Automation & Control, Military and Aerospace Embedded Processing.
High-Performance DSP Signal Processing
The EP3SL70F780C2 fits high-speed DSP pipelines such as radar, software-defined radio (SDR), and baseband processing. Its 67,500 logic elements and dedicated DSP blocks deliver hundreds of GMACs of throughput, while 488 user I/Os support wide parallel data paths. The 780-FCBGA package provides signal-integrity headroom for sub-ns edge rates at high toggle rates, critical for radar pulse compression and FFT engines. Reference Intel's DSP Builder for MATLAB/Simulink integration to shorten design iteration.
Empfohlen
ASIC Prototyping Platform
Designers use the EP3SL70F780C2 as an ASIC prototyping vehicle thanks to its high logic density (67.5K LEs) and rich I/O count. Quartus II supports incremental compilation and partition-based prototyping flows, allowing multi-FPGA ASIC validation. The 780-FCBGA exposes 488 user I/Os, enabling prototype boards that emulate multi-million-gate ASICs. For designs larger than 67K LEs, prototype using multi-FPGA boards with EP3SL200 or EP3SL340 in the same family.
Empfohlen
Telecommunications Baseband Processing
The EP3SL70F780C2 supports telecom baseband and packet inspection workloads where parallel hardware acceleration outperforms CPUs. Its embedded memory (2.7 Mbits) buffers data between DSP blocks and high-speed serial interfaces, while LVDS I/O standards enable direct connection to backplane transceivers. The 780-FCBGA package preserves signal integrity on parallel bus interfaces. Reference the Stratix III Device Handbook for ALTGX transceiver guidelines when designing line-card platforms.
Empfohlen
Broadcast Video Processing
The EP3SL70F780C2 handles broadcast video processing including SD/HD/3G-SDI routing, format conversion, and real-time overlay engines. Its high logic density supports multi-stream processing, while embedded memory acts as line buffers for deinterlacing and scaling. The 780-FCBGA's 488 user I/Os accommodate multiple parallel video buses. Designers use the Video and Image Processing (VIP) suite in Quartus II to accelerate development of broadcast reference designs.
Empfohlen
Medical Imaging Acceleration
Medical imaging systems such as CT, MRI, and ultrasound scanners benefit from the EP3SL70F780C2's parallel DSP capability for real-time reconstruction (back-projection, FFT-based methods). Its deterministic latency supports regulatory-compliant medical device designs. The 780-FCBGA accommodates high-speed ADC interfaces with LVDS signaling. Use Medical Imaging reference designs from Intel's solution center to shorten FDA submission timelines.
Empfohlen
Industrial Automation & Control
The EP3SL70F780C2 fits industrial automation systems requiring deterministic real-time control, EtherCAT or Profinet interface implementation, and motor control algorithms. Its 488 user I/Os accommodate multi-axis motion control, while embedded DSP blocks execute PID and FOC algorithms in hardware. For harsh industrial environments, the -I industrial temperature variant EP3SL70F780I3N offers -40C to +100C operation in the same 780-FCBGA footprint.
Empfohlen
Military and Aerospace Embedded Processing
Aerospace and defense systems deploy the EP3SL70F780C2 for radar front-end processing, electronic warfare, and secure communications. Its radiation-tolerant operation and long lifecycle support make it suitable for avionics-grade designs. The 780-FCBGA package withstands the thermal and mechanical stresses of military environments. Designers should pair the device with industrial-grade variants (I-speed grade) and validate against DO-254 or MIL-STD-810 as required by program.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP3SL70F780C2 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP3SL70F780C2N | EP3SL70F780C3N | EP3SL70F780C4N | EP3SL70F780I3N | EP3SL70F780I4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FCBGA | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 |
| Embedded Memory (bits) | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | C2 | C2 | C3 (faster) | C4 (fastest) | I3 (industrial temp, C3 speed) | I4 (industrial temp, C4 speed) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Process / Core Voltage | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V |
Wichtigste Unterscheidungsmerkmale
- Same-family speed grade scalability in identical package (vs. EP3SL70F780C3N)
- Industrial temperature support in same footprint (vs. EP3SL70F780I3N)
- Mature Stratix III architecture with extensive IP ecosystem (vs. Newer Cyclone V or Stratix 10 devices)
Designhinweise
Estimated: The 780-ball FCBGA package requires a minimum 4-layer PCB with microvia stack-ups for breakout routing. Use Intel's recommended land pattern and via-in-pad design rules; standard BGA escape requires 0.4 mm pitch fanout with at least 0.2 mm trace/spacing. Apply signal-integrity simulation for high-speed LVDS pairs above 500 Mbps before committing to layout.
Estimated: At high toggle rates with 488 I/Os active, the EP3SL70F780C2 can dissipate 5-10 W. Use the FCBGA's exposed thermal pad with at least 16 thermal vias connected to an internal ground plane. Apply sufficient airflow (200 LFM minimum) for industrial applications. Refer to the Stratix III Device Handbook thermal management chapter for theta-JA values under specific airflow conditions.
Do not assume pin compatibility with Stratix IV or V devices - the EP3SL70F780C2 belongs to Stratix III and has different ball assignments. Verify each design's Quartus II pin planner assignments before tape-out. Power-up sequencing requires VCC and VCCPD rails to ramp in a defined order; consult the Stratix III Device Handbook power management section to avoid latch-up.
Compliance-Informationen
RoHS compliance per DigiKey listing. AEC-Q100 not applicable (industrial/commercial FPGA). Halogen-free status not explicitly stated in provided data.