EPF10K100EQC240-2X - 100K Gate FLEX-10KE FPGA, 240-BQFP | Intel / Altera
Teilenummer: EPF10K100EQC240-2X ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $88.5 | $885,00 |
| 100 | $78.2 | $7.820,00 |
| 500 | $70.1 | $35.050,00 |
| 1.000 | $62 | $62.000,00 |
EPF10K100EQC240-2X Übersicht
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (LUTs), programmable interconnect, and I/O cells, all user-defined via a hardware description language (HDL) and a vendor toolchain. FPGAs sit hierarchically between fixed-function ASICs (highest performance, highest NRE) and CPLDs (simpler, non-volatile, lower density), offering parallel processing, in-system reprogrammability, and high I/O count without mask charges. The FLEX-10KE family is an SRAM-based, volatile-configuration architecture, so an external configuration memory (typically an EPC configuration device) is required at every power-up.
Key features of the EPF10K100EQC240-2X include 49,152 flip-flops equivalent storage, embedded array blocks (EABs) for RAM/ROM implementation, multiVolt I/O support for interfacing with 5.0 V / 3.3 V / 2.5 V rails, and 189 user I/Os on the 240-BQFP package - the highest I/O count of any FLEX-10KE package option. The device supports in-system programmability via the IEEE 1149.1 (JTAG) boundary-scan interface and the legacy Altera ByteBlaster / BitBlaster download cables.
Architecturally, the FLEX-10KE combines fine-grained logic (LUT-based LABs) with coarse-grained embedded memory (EABs of 2 Kbit each), enabling efficient implementation of register-rich datapaths alongside FIFO, ROM, and dual-port RAM blocks. The -2 speed grade offers faster propagation delays than -1, supporting higher fMAX designs in the 80-120 MHz range for typical 16-bit state machines and bus interfaces.
Typical applications include telecommunications line cards, industrial control backplanes, military/aerospace retrofit boards, legacy PCI bus bridges, and ASIC prototyping. The wide 240-BQFP footprint is chosen for through-hole or socketed assemblies where mechanical robustness matters more than PCB area.
When designing with this FPGA, note that configuration data is volatile - an EPC1, EPC2, or EPC8 configuration PROM is mandatory. The BQFP package requires a socket or careful solder profiling due to its 0.5 mm lead pitch and large thermal mass; thermal management is usually not critical at typical FLEX-10KE power budgets (under 1.5 W), but junction temperature must still be checked against the 70 °C commercial or 85 °C industrial limit.
This page synthesizes distributor pricing, FLEX-10KE family cross-references, drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet, sourced from DigiKey, Mouser, Octopart, and Altera legacy product documentation as of 2026-09-11.
Drop-in-Alternativen für EPF10K100EQC240-2X – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPF10K100EQC240-2X (gleiche Bauform und Footprint) – abweichend in Package / Case, Family, Total RAM Bits, Operating Temperature, Configuration Method.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPF10K100EQC240-2N
✅ Drop-In✓ Auf Lager
$18.4 / Stück
Datenblatt ansehen →EPF10K100EQC240-2
✅ Drop-In✓ Auf Lager
$198 / Stück
Datenblatt ansehen →EPF10K100EQC240-1X
✅ Drop-In✓ Auf Lager
$65 / Stück
Datenblatt ansehen →EPF10K100EQC240-1N
✅ Drop-In✓ Auf Lager
$55.95 / Stück
Datenblatt ansehen →EPF10K100EQC240-1
✅ Drop-In✓ Auf Lager
$18.5 / Stück
Datenblatt ansehen →EPF10K100BQC240-3
✅ Drop-In✓ Auf Lager
$16.95 / Stück
Datenblatt ansehen →EPF10K100EQC240-2X Grenzwerte & elektrische Eigenschaften
| Series | FLEX-10KE |
| Family | FLEX-10KE SRAM-based FPGA |
| Manufacturer | Altera (now Intel) |
| Logic Elements / Gates | 100,000 gates |
| Logic Array Blocks (LABs) | 624 |
| Look-Up Tables (LUTs) | 4,992 |
| User I/Os | 189 |
| Core Supply Voltage | 2.375 V to 2.625 V |
| I/O Supply Voltage | multiVolt: 2.5 V / 3.3 V / 5.0 V |
| Gehäuse / Bauform | 240-BQFP (PQFP, 32x32 mm) |
| Supplier Device Package | 240-PQFP |
| Speed Grade | -2 |
| Process / Temperature Grade | Industrial (suffix X indicates extended / lead-free per Altera legacy nomenclature) |
| Configuration Method | SRAM (volatile), requires external EPC configuration PROM |
| Programming Interface | JTAG (IEEE 1149.1) + ByteBlaster/BitBlaster |
| Montageart | Surface Mount |
| RoHS-Status | Compliant (X suffix) |
EPF10K100EQC240-2X 240-pqfp Pinbelegungsleitfaden
Pinbelegung für EPF10K100EQC240-2X (240-pqfp-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPF10K100EQC240-2X.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPF10K100EQC240-2X ist geeignet für 6 Anwendungs: Legacy Industrial Control Backplane Glue Logic, Telecommunications Line Card Interface Bridging, Military / Aerospace Retrofit Boards, ASIC Prototyping and Emulation, Medical Imaging Front-End Processing, Test and Measurement Instrumentation.
Legacy Industrial Control Backplane Glue Logic
The EPF10K100EQC240-2X is well suited to industrial backplane glue-logic roles where its 100,000-gate capacity, 189 user I/Os, and 2.5 V core fit between older 5 V TTL controllers and 3.3 V peripherals. The multiVolt I/O banks (2.5 V / 3.3 V / 5.0 V) eliminate external level shifters on mixed-voltage buses common in PLC and SCADA backplanes. The FLEX-10KE's embedded array blocks (EABs) implement FIFO buffers for serial-to-parallel bus conversion at line rates up to 33 MHz. Designers use the 240-BQFP footprint for through-hole socketed assemblies on legacy backplanes that must remain field-serviceable without surface-mount rework, and the -2 speed grade provides comfortable timing margin at 25 MHz industrial backplane clocks.
Empfohlen
Telecommunications Line Card Interface Bridging
Telecom line cards frequently use the EPF10K100EQC240-2X to bridge between legacy 8-bit TDM buses (H.110 / MVIP) and modern 16-/32-bit PCM or Ethernet backplanes, where the device's 189 I/Os accommodate both bus widths simultaneously. The FLEX-10KE LUT-based LABs implement TDM framers, HDLC controllers, and clock-recovery PLLs in a single device at line rates up to E1/T1 (2.048 Mbps / 1.544 Mbps) and E3/T3 (34 Mbps / 45 Mbps). The 240-BQFP package's 0.5 mm pitch and gull-wing leads support hand-rework for service-depot repairs on installed line cards. Power consumption stays under 1.5 W at typical 60% utilization, allowing closed chassis deployment without active cooling on line cards.
Empfohlen
Military / Aerospace Retrofit Boards
The EPF10K100EQC240-2X serves long-life aerospace and defense programs where re-qualification of a new FPGA is cost-prohibitive. Programs certified against FLEX-10KE bitstreams (D0-254, MIL-STD-810) can swap to modern Intel Cyclone equivalents only after re-running environmental and EMC qualification - often a 12-18 month effort. By keeping the 240-BQFP footprint, the FPGA stays socketed and field-replaceable on ATR chassis and ARINC 600 line-replaceable units. The industrial temperature grade (X suffix) supports the -40 °C to +85 °C operating envelope required by MIL-STD-810 method 501/502, and the SRAM-based configuration supports field reprogramming via JTAG during depot-level maintenance cycles.
Empfohlen
ASIC Prototyping and Emulation
ASIC prototyping teams use EPF10K100EQC240-2X to validate ASIC RTL before tape-out, leveraging the FLEX-10KE's 49,152 LUTs and 624 LABs to map typical 50-80K-gate ASIC blocks at 1:1 utilization. The 240-BQFP's 189 I/Os provide enough breakout pins to map most ASIC pad frames for functional verification at speeds up to 80 MHz on registered I/O paths. Quartus II's TimeQuest timing analyzer produces accurate static-timing reports that match the target ASIC's synthesis constraints within 10-15%, enabling pre-tapeout sign-off validation. Multiple FLEX-10KE devices can be cascaded on a prototyping board to emulate ASICs up to 300K gates, using the JTAG chain to load partitioned bitstreams per device.
Empfohlen
Medical Imaging Front-End Processing
The EPF10K100EQC240-2X fits medical imaging front-ends (ultrasound beamformers, CT detector boards) where its parallel processing capability and deterministic latency suit real-time DSP pipelines. Ultrasound beamforming requires 16-128 parallel multiply-accumulate channels at 40 MHz, well within the FLEX-10KE's LAB-based arithmetic capability when paired with external high-speed ADCs. The 189 I/Os accommodate 12-/14-bit ADC interfaces alongside the LVDS link to the back-end image processor. The 240-BQFP package supports the through-hole assemblies still common on medical imaging boards that prioritize field-serviceability for hospital-grade equipment maintenance windows. Designers pair the FPGA with an EPC2 configuration PROM and use JTAG for in-field firmware updates during regulatory change cycles.
Empfohlen
Test and Measurement Instrumentation
Test and measurement instruments (logic analyzers, protocol exercisers, custom ATE) use the EPF10K100EQC240-2X to implement pattern generators, protocol state machines, and timing-critical capture logic. The device's 189 I/Os can drive 32-channel logic-analyzer pods at 200 MHz sample rates by external oversampling, while the FLEX-10KE's LAB-based architecture supports deep pattern sequencers (4K-8K vectors) in distributed RAM. The 240-BQFP package is preferred on through-hole ATE load boards where the FPGA sits in a test socket for periodic re-characterization. Designers use Altera Quartus II 13.0 SP1 (the last release supporting FLEX-10KE) for compile, with JTAG-based field upgrades for new test patterns.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPF10K100EQC240-2X – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPF10K100EQC240-2N | EPF10K100EQC240-2 | EPF10K100EQC240-1X | EPF10K100EQC240-1N | EPF10K100EQC240-1 | EPF10K100BQC240-3 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 240-BQFP (PQFP 32x32 mm) | 240-BQFP - same | 240-BQFP - same | 240-BQFP - same | 240-BQFP - same | 240-BQFP - same | 240-BQFP - same |
| Family | FLEX-10KE | FLEX-10KE | FLEX-10KE | FLEX-10KE | FLEX-10KE | FLEX-10KE | FLEX-10K (no EAB) |
| Logic Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Speed Grade | -2 | -2 | -2 | -1 (slower) | -1 (slower) | -1 (slower) | -3 (slowest) |
| User I/Os | 189 | 189 | 189 | 189 | 189 | 189 | 189 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lead Finish | Lead-free (X suffix) | Tin-lead (N suffix) | Standard (legacy) | Lead-free (X suffix) | Tin-lead (N suffix) | Standard (legacy) | Standard (legacy) |
Wichtigste Unterscheidungsmerkmale
- Lead-free lead finish with identical silicon to leaded N-suffix variant (vs. EPF10K100EQC240-2N)
- -2 speed grade for higher fMAX vs -1 / -3 grades (vs. EPF10K100EQC240-1X)
- FLEX-10KE EAB blocks versus FLEX-10K (no EAB) (vs. EPF10K100BQC240-3)
Designhinweise
Estimated: at 60% logic utilization and 100 MHz toggle rate, EPF10K100EQC240-2X core current is approximately 200 mA from the 2.5 V VCCINT rail (about 0.5 W core). I/O bank current scales with VCCIO selection and switching frequency - 3.3 V LVTTL at 50 MHz on 60 active outputs draws roughly 250 mA per bank. Provide at least 4 bulk decoupling capacitors (10 uF tantalum) near each VCCINT/VCCIO pin pair, plus 0.1 uF ceramic decoupling within 5 mm of every supply pin. Power sequencing must bring VCCINT up before or simultaneously with VCCIO; reverse sequencing can trigger I/O latch-up via the multiVolt input structures.
The 240-BQFP package has 0.5 mm lead pitch and a 32x32 mm body; allocate at least 35x35 mm of PCB area including a 1.5 mm solder mask dam between pads. Use a 4-layer board with continuous VCCINT and GND planes on inner layers, and route all 189 user I/Os on outer layers with matched lengths within 5 mm if used as parallel buses. The exposed die-attach paddle is not present on BQFP (unlike QFN), so thermal dissipation relies entirely on the leads - for designs above 1 W dissipation, add a top-side copper heatsink bonded with thermal epoxy to the package body. JTAG pins (TCK, TMS, TDI, TDO) need 10 kohm pull-ups on TMS and TDI per the IEEE 1149.1 standard.
Do not assume a modern Intel Quartus Prime release supports FLEX-10KE - only Quartus II 13.0 SP1 or MAX+PLUS II will compile designs for EPF10K100EQC240-2X. The configuration bitstream requires a 33 ohm series resistor on DCLK to dampen reflections; values below 10 ohm can overstress the EPC PROM driver. The X suffix indicates lead-free but the device is NRND - confirm longevity with Rochester Electronics (the authorized Altera legacy distributor) before committing to long-life programs. When migrating from FLEX-10K (non-E) to FLEX-10KE, check that all EAB-based RAM/ROM inference is preserved; the Quartus II migration guide documents timing differences of approximately 10-15% in interconnect delay.
Compliance-Informationen
Lead-free (X suffix) per Altera legacy ordering nomenclature. Not AEC-Q100 qualified (industrial / commercial grade FPGA). Conflict-minerals status from Altera / Intel CMRT filings. Lifecycle status NRND (Not Recommended for New Designs) per Rochester Electronics listing.
