EPF10K200SFC484-2X vs EPF10K200SFC484-2N Vergleich

Detaillierter Direktvergleich von EPF10K200SFC484-2X von Intel und EPF10K200SFC484-2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K200SFC484-2X EPF10K200SFC484-2N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $171,00 $95,00
Series FLEX 10KS —
Family FLEX 10K FLEX 10KE
Number of Logic Elements / Cells 9984 —
Number of LABs / CLBs 1248 —
Total RAM Bits 98304 —
Number of Gates 200000 (typical) —
Number of I/O 369 —
Core Voltage - Supply 2.375 V to 2.625 V —
Operating Frequency (max) 250 MHz (family-typical, -2 speed grade) —
Betriebstemperatur 0C to +70C (commercial) 0°C to 70°C (Commercial)
Gehäuse / Bauform 484-BBGA (FineLine BGA) —
Supplier Device Package 484-FBGA (23 x 23 mm, 1.0 mm pitch) —
Montageart Surface Mount Surface Mount
Technology CMOS, SRAM-based configuration —
Configuration Memory External serial (EPC1/EPC2 family compatible) —
JTAG Support IEEE 1149.1-1990 boundary-scan —
Process Technology [DATA_NEEDED: process node nm] 0.22 µm CMOS
RoHS-Status [DATA_NEEDED: rohs status] —
Logic Elements / Cells — 9,984
Gate Count — 200,000
Logic Array Blocks (LABs) — 1,248
Embedded RAM Bits — 98,304 (96 Kbit)
User I/O Pins — 369
Number of I/Os (alt spec) — 470 (per digchip datasheet summary)
Core Supply Voltage — 2.375 V to 2.625 V (2.5 V nominal)
Internal Performance — 200 MHz
Propagation Delay — 0.4 ns
Gehäuse — 484-FBGA FineLine BGA, 23 x 23 mm, 1.0 mm pitch
Programming Interface — JTAG (IEEE 1149.1), SRAM configuration
I/O Standard Support — 5 V-tolerant, MultiVolt (1.8 V / 2.5 V / 3.3 V)
Logic Family — CMOS
Compliance / Lead Status — [DATA_NEEDED: RoHS status]

Datenblätter & Ressourcen

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