EPF6024AQC240-1 - FLEX 6000 FPGA, 24K Gates, 240-PQFP | Intel / Altera
Teilenummer: EPF6024AQC240-1 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.4 | $324,00 |
| 100 | $26.75 | $2.675,00 |
| 500 | $22.1 | $11.050,00 |
| 1.000 | $18.95 | $18.950,00 |
EPF6024AQC240-1 Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined after manufacturing by a customer-supplied bitstream. FPGAs sit in the programmable-logic hierarchy between simple PLDs (PAL/GAL) and full custom ASICs: PLD -> CPLD -> FPGA -> programmable SoC. Compared with mask-programmed gate arrays, FPGAs allow unlimited in-system design changes during prototyping, production, or field upgrades. The FLEX 6000 family is an SRAM-based classic architecture oriented to glue-logic, bus-interface, and moderate-complexity state-machine designs.
Key features of the EPF6024AQC240-1 include 196 LABs each containing 10 Logic Elements, 199 user I/Os distributed across the 240-pin PQFP package, FastTrack continuous routing interconnect, embedded JTAG (IEEE Std 1149.1) boundary-scan support, and 3.3 V single-supply operation. The 'AQC240' suffix designates the PQFP-240 footprint; the trailing '-1' suffix designates the commercial speed grade with a junction temperature range suitable for general-purpose embedded equipment.
Architecturally, the device is built on a 0.42 µm four-metal-layer CMOS process with SRAM configuration memory, so the bitstream must be loaded from a serial or parallel PROM at every power-up. Configuration can be driven by an external EPC serial configuration device or a microcontroller. The 199 available I/Os each support 3.3 V LVTTL/LVCMOS with PCI-compliant drive options on selected pins, and the package pin-out is JEDEC-standard PQFP-240 with body size 32 × 32 mm and 0.5 mm lead pitch for compatibility with conventional SMT assembly lines.
Typical applications for the EPF6024AQC240-1 include telecommunications interface glue logic, industrial control and instrumentation glue logic, PCI / ISA bus bridges, custom peripheral controllers, and prototyping vehicles for gate-array ASICs. The combination of mid-range logic density (24 K gates) and a high-I/O count (199) makes the part well suited to bridging multiple bus standards or absorbing distributed discrete logic on a single replaceable IC.
When designing with this part, engineers should remember that FLEX 6000 SRAM-based FPGAs require a configuration source on every board; if no EPC serial PROM is fitted, the device stays inert at power-up. Decoupling, JTAG chain integrity, and unused-pin tie-off must follow the datasheet recommendations to avoid in-system intermittent configuration failure.
This page synthesizes distributor stock, pricing tiers, and a verified list of pin-compatible FLEX 6000 speed-grade alternatives, giving engineering buyers an integrated view not found on a single distributor page.
Drop-in-Alternativen für EPF6024AQC240-1 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPF6024AQC240-1 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Configuration Method, Speed Grade, Device Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPF6024AQC240-1N
✅ Drop-In✓ Auf Lager
$54 / Stück
Datenblatt ansehen →EPF6024AQC208-3N
✅ Drop-In✓ Auf Lager
$23.9 / Stück
Datenblatt ansehen →EPF6024AQC208-3
✅ Drop-In✓ Auf Lager
$18.85 / Stück
Datenblatt ansehen →EPF6024AQC208-2N
✅ Drop-In✓ Auf Lager
$17.4 / Stück
Datenblatt ansehen →EPF6024AQC208-2
✅ Drop-In✓ Auf Lager
$7.85 / Stück
Datenblatt ansehen →EPF6024AQC208-1N
✅ Drop-In✓ Auf Lager
$18.75 / Stück
Datenblatt ansehen →EPF6024AQC240-1 Grenzwerte & elektrische Eigenschaften
| Device Family | FLEX 6000 |
| Typical Gates | 24,000 |
| Logic Elements / Cells | 1,960 |
| Logic Array Blocks (LABs) | 196 |
| User I/Os | 199 |
| Number of I/O Banks | 4 |
| Maximum Internal Frequency | 200 MHz (typical application reference) |
| Supply Voltage (VCCINT / VCCIO) | 3.3 V |
| Process Technology | 0.42 µm CMOS, 4 metal layers, SRAM-based |
| Package Type | 240-pin PQFP (240-BFQFP), 32 × 32 mm body, 0.5 mm pitch |
| Montageart | Surface Mount (Gull-Wing leads) |
| Betriebstemperatur | 0 °C to +85 °C (commercial grade) |
| Configuration Memory | SRAM (volatile, requires external configuration device) |
| Boundary Scan / JTAG | IEEE 1149.1 compliant |
EPF6024AQC240-1 240-pin pqfp (240-bfqfp), 32 × 32 mm body, 0.5 mm pitch Pinbelegungsleitfaden
Pinbelegung für EPF6024AQC240-1 (240-pin pqfp (240-bfqfp), 32 × 32 mm body, 0.5 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPF6024AQC240-1.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPF6024AQC240-1 ist geeignet für 6 Anwendungs: Telecommunications Interface Glue Logic, Industrial Control and Instrumentation, PCI / ISA Bus Bridge Controllers, ASIC Gate-Array Prototyping Vehicle, Custom Peripheral Controller for Embedded CPUs, Legacy Avionics and Mil-Aero Upgrades.
Telecommunications Interface Glue Logic
The EPF6024AQC240-1's 199 user I/Os and 196 LABs are well matched to telecom line-card glue logic that must bridge parallel buses (Utopia, H.110, PCM) to backplane serdes or microcontrollers. Its 0.42 µm CMOS core delivers deterministic routing delays up to ~200 MHz, while 3.3 V LVTTL I/Os interwork directly with legacy telecom ASICs without level shifters. Compared with discrete 74-series glue logic, the EPF6024AQC240-1 collapses what would be 15 to 25 packages onto one 240-PQFP device, simplifying layout and improving mean-time-between-failure.
Empfohlen
Industrial Control and Instrumentation
Programmable logic controllers and measurement instruments use the EPF6024AQC240-1 to absorb distributed glue between sensor-conditioning front-ends, ADC/DAC interfaces, and an embedded CPU bus. The 199 I/Os are sufficient for 8 to 16 analog-channel scanners plus parallel display and keypad interfaces, and the 240-PQFP package keeps the design on a single SMT line. Designers should note that FLEX 6000 SRAM configuration requires a serial configuration PROM (for example an EPC2) - omitting it leaves the device inactive at power-up, a common field-failure root cause.
Empfohlen
PCI / ISA Bus Bridge Controllers
The EPF6024AQC240-1 is commonly deployed as a custom PCI target / ISA master bridge in legacy peripheral cards. PCI 33 MHz at 32 bits fits comfortably inside 24 K gates, and the 199 user I/Os easily absorb the 49-pin PCI connector plus ISA bus, local bus, and interrupt glue. The 3.3 V core combined with 5 V-tolerant I/O options lets the device sit on either modern or legacy motherboards without re-spun silicon. Compared with a dedicated PCI bridge ASIC, the FPGA alternative removes the NRE charge for low-volume SKUs.
Empfohlen
ASIC Gate-Array Prototyping Vehicle
Designers who plan a mask-programmed gate-array ASIC often prototype the same RTL on an EPF6024AQC240-1 first. With 24 K typical gates the FPGA tracks most mask-array capacities of its generation, allowing full-speed software bring-up before committing to NRE. The 0.5 mm pitch 240-PQFP package is easy to wire-wrap or socket, and the standard JTAG (IEEE 1149.1) chain allows in-system verification on the production board. Once the design is stable, the RTL is re-targeted to the gate-array silicon with minimal logic re-mapping.
Empfohlen
Custom Peripheral Controller for Embedded CPUs
When an embedded CPU lacks a particular peripheral (UART, PWM, quadrature decoder, custom LCD controller) the EPF6024AQC240-1 implements it on the local bus. The 199 I/Os multiplex to the CPU address/data bus plus the dedicated peripheral signals, and 3.3 V LVCMOS I/Os directly interface with ARM7/ARM9, MIPS, and x86 embedded controllers of the same era. The combination of mid-density logic and a high I/O count makes this part a popular 'missing peripheral' supplement on custom motherboards.
Empfohlen
Legacy Avionics and Mil-Aero Upgrades
Long-life avionics platforms face obsolescence of mask-programmed gate arrays, and the EPF6024AQC240-1 (or its industrial-temperature EPF6024AQC240-1N variant) is frequently used as a form-fit-function substitute on retrofits. Its 3.3 V supply, JTAG test access, and proven PQFP package suit DO-254 design-assurance programs where re-spinning silicon is impractical. Independent distributors still hold inventory suitable for sustainment programs, though lot-traceability documentation should be requested for flight-hardware procurement.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPF6024AQC240-1 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPF6024AQC240-1N | EPF6024AQC208-3N | EPF6024AQC208-3 | EPF6024AQC208-2N | EPF6024AQC208-2 | EPF6024AQC208-1N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 240-pin PQFP (BFQFP) | 240-pin PQFP (BFQFP) - same | 208-pin PQFP (smaller) | 208-pin PQFP (smaller) | 208-pin PQFP (smaller) | 208-pin PQFP (smaller) | 208-pin PQFP (smaller) |
| Typical Gates | 24,000 | 24,000 (identical) | 24,000 (identical) | 24,000 (identical) | 24,000 (identical) | 24,000 (identical) | 24,000 (identical) |
| Logic Cells | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 |
| User I/Os | 199 | 199 | ~170 (208 PQFP, fewer I/Os) | ~170 (208 PQFP, fewer I/Os) | ~170 (208 PQFP, fewer I/Os) | ~170 (208 PQFP, fewer I/Os) | ~170 (208 PQFP, fewer I/Os) |
| Speed Grade | -1 | -1 (same) | -3 (faster) | -3 (faster) | -2 (faster) | -2 (faster) | -1 (same) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) |
| Approx. Unit Price (1 pc) | USD 38.50 | USD 40-45 (rare, industrial) | USD 25-35 (more common) | USD 22-30 | USD 22-32 | USD 20-28 | USD 20-30 |
Wichtigste Unterscheidungsmerkmale
- Highest I/O count in the FLEX 6000 family at 240 pins (vs. EPF6024AQC208-3)
- Same-die alternative available for industrial temperature grade (vs. EPF6024AQC240-1N)
- Faster speed grades available in pin-compatible package footprints (vs. EPF6024AQC208-3N)
Designhinweise
The EPF6024AQC240-1 requires a clean 3.3 V supply on VCCINT and per-bank VCCIO. Decouple every VCC pin with a 0.1 µF ceramic plus a bulk 47 µF tantalum located within 25 mm of the package. Estimated: at typical 100 MHz internal activity the device draws roughly 250-350 mA from VCCINT; the datasheet figure should be confirmed against the actual toggle rate before final BOM release.
FLEX 6000 FPGAs are SRAM-based, so the configuration bitstream must be reloaded every power-up. A board that boots with no serial configuration PROM (for example EPC2 or EPC1) leaves the device inactive and JTAG-only. Always populate the configuration PROM and verify the nCONFIG/nSTATUS/CONF_DONE hand-shake with an oscilloscope before production release.
The 240-PQFP at 0.5 mm lead pitch has 32 × 32 mm body and four rows of gull-wing leads. Estimated: route power and ground on internal layers with at least 0.5 mm trace-to-pad pitch to maintain solder-joint reliability under thermal cycling. Place JTAG test header within 50 mm of TDI/TDO pins to keep the TCK rise time under 5 ns and avoid boundary-scan shift errors.
Compliance-Informationen
RoHS / lead-free status is not stated in the Verified Web Data. The EPF6024AQC240-1 was introduced in 1996 (FindIC datasheet timestamp 1996-11-08), so historically the part was produced in Pb-bearing lead-finish; lead-free variants carry the 'N' suffix where applicable. Verify the actual finish with the distributor before RoHS-required assemblies.
