EPF81500AQC240-3 - FLEX 8000 FPGA 16K Gates 240-PQFP | Altera
Teilenummer: EPF81500AQC240-3 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2.890,00 |
| 500 | $24.5 | $12.250,00 |
| 1.000 | $21.75 | $21.750,00 |
EPF81500AQC240-3 Übersicht
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines the high integration of a gate array with the flexibility of in-system reprogrammability. Within the broader semiconductor taxonomy, an FPGA sits below custom ASICs (higher NRE cost, lower unit cost) and above discrete glue logic, occupying the niche of high-density register-rich logic with fast design iteration. The FLEX 8000 series in particular is known for its low-cost, register-rich architecture targeting system-level integration.
Key features include 5V CMOS operation (4.75V to 5.25V supply), 1296 logic elements, 1.7 ns propagation delay, and a 240-pin PQFP (also described as 240-BFQFP) package measuring 32x32 mm. The device is specified for commercial operating temperature range (0 to 70 C) and uses SRAM configuration cells that must be reloaded on every power-up, enabling unlimited re-programmability but requiring an external configuration memory.
The EPF81500AQC240-3 is built on a 0.42 um CMOS SRAM process with Altera's classic 4-input look-up table (LUT) logic element and continuous FastTrack interconnect. The 162 LABs each contain 8 logic elements (LEs), providing register-rich density for state machines, datapath control, and bus interfacing. Architecture supports JTAG boundary-scan testing and PCI-compliant I/O for bus interface applications.
Typical applications include telecom line cards, industrial control logic, PCI bus interface glue logic, glue-logic consolidation around microprocessors, and ASIC prototyping for designs up to 16K gates. Its 181 user I/Os and PQFP package make it suitable for systems needing high pin count without BGA complexity.
When designing with the EPF81500AQC240-3, note that SRAM-based configuration means the device loses its configuration on power-down - a boot PROM or system controller must reload it on every reset. The 240-pin PQFP package requires careful PCB layout for the high pin count and is best suited for designs migrating from 5V legacy ASICs to programmable logic.
This page synthesizes distributor pricing, same-family drop-in alternatives from the FLEX 8000 series, and practical design notes not consolidated in any single manufacturer datasheet.
Drop-in-Alternativen für EPF81500AQC240-3 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPF81500AQC240-3 (gleiche Bauform und Footprint) – abweichend in Package, Configuration Method, Process Technology, Operating Temperature, In-Circuit Reconfigurability.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPF81500AQC240-3N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EPF81500AQC240-2
✅ Drop-In✓ Auf Lager
$61.4 / Stück
Datenblatt ansehen →EPF81500AQC240-2N
✅ Drop-In✓ Auf Lager
$18.95 / Stück
Datenblatt ansehen →EPF81500AQC240-3 Grenzwerte & elektrische Eigenschaften
| Family | FLEX 8000 |
| Logic Elements / Gates | 1296 logic elements, up to 16,000 usable gates |
| Registers | 1500 |
| Logic Array Blocks (LABs) | 162 |
| User I/Os | 181 |
| Propagation Delay | 1.7 ns |
| Versorgungsspannung | 4.75 V to 5.25 V |
| Logic Family | CMOS SRAM |
| Process Technology | 0.42 um CMOS |
| Gehäuse | 240-BFQFP (240-PQFP, 32x32 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | 0 C to 70 C (Commercial) |
| Configuration Method | SRAM, loaded at power-up via EPC1/EPC1064/EPC1213/EPC1441 or parallel EPROM |
EPF81500AQC240-3 240-bfqfp (240-pqfp, 32x32 mm) Pinbelegungsleitfaden
Pinbelegung für EPF81500AQC240-3 (240-bfqfp (240-pqfp, 32x32 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPF81500AQC240-3.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPF81500AQC240-3 ist geeignet für 6 Anwendungs: Telecom Line Card Glue Logic, ASIC Prototyping (up to 16K gates), PCI Bus Interface Glue Logic, Industrial Control Logic Consolidation, Legacy Microprocessor Peripheral Integration, Datacom Peripheral Glue and Bridging.
Telecom Line Card Glue Logic
The EPF81500AQC240-3 is well-suited for telecom line card designs where 5V CMOS-compatible glue logic must consolidate bus arbitration, framing, and timing functions. Its 1296 logic elements and 1500 registers handle state-machine-intensive protocols (HDLC, UART bridges) at line-card clock rates. The 181 user I/Os interface to multiple bus segments and PHY devices without external bus-switching logic. Unlike modern FPGAs, the 5V tolerance allows direct connection to legacy line-interface ICs without level shifters.
Empfohlen
ASIC Prototyping (up to 16K gates)
Engineers used the EPF81500AQC240-3 as a fast-turnaround prototype platform for ASIC designs in the 8K-16K gate range. Its register-rich architecture (1500 flip-flops across 162 LABs) maps cleanly to control-logic-heavy ASICs, allowing verification of state machines, FIFO controllers, and bus bridges before committing to NRE mask charges. The 240-PQFP package exposes enough I/Os (181) to replicate most ASIC pinouts, and SRAM-based configurability enables rapid design-iteration cycles of minutes rather than weeks.
Empfohlen
PCI Bus Interface Glue Logic
The EPF81500AQC240-3 supports PCI-compliant 5V/33 MHz bus interfaces, making it a popular choice for bridging PCI to legacy peripheral buses (ISA, VME, local processor buses). Its 181 user I/Os comfortably accommodate a 32-bit PCI bus plus side-band signals and target-side glue. The 5V I/O tolerance matches PCI 5V signaling directly. Designers implement target/master state machines, parity generation, and interrupt handling in the 1296 logic elements, eliminating discrete 74-series logic arrays.
Empfohlen
Industrial Control Logic Consolidation
Industrial controller designs leveraged the EPF81500AQC240-3 to replace dozens of discrete 74LS/74HC glue-logic ICs with a single programmable device, reducing board area and improving reliability. The 16,000 usable gates handle combinational and sequential control logic for PLCs, motor controllers, and HMI interfaces. The commercial 0-70 C temperature range suits enclosure-protected industrial environments. The 5V tolerance interfaces directly to industrial sensor and actuator signal-conditioning chains.
Empfohlen
Legacy Microprocessor Peripheral Integration
Designers used the EPF81500AQC240-3 to integrate the many peripheral functions (memory controller, DMA, interrupt controller, address decoding) required around 80x86, 68k, and MIPS microprocessors of the 1990s. Its register-rich architecture mapped well to control/status register banks, while the 240-PQFP's 181 I/Os comfortably handled 32-bit address/data buses plus chip-select, wait-state, and interrupt signals. SRAM-based configurability enabled post-production bug fixes via in-system reprogramming.
Empfohlen
Datacom Peripheral Glue and Bridging
Datacom routers, switches, and access multiplexers of the late 1990s and early 2000s used the EPF81500AQC240-3 to bridge between custom ASICs, network processors, and standard bus interfaces. The device's 181 user I/Os provide ample connections for multiple serial datastreams, status LEDs, and configuration EEPROMs, while the 1500 registers handle cell/packet processing state machines. The 240-PQFP package with exposed leads allowed conventional SMT assembly without BGA X-ray inspection costs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPF81500AQC240-3 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPF81500AQC240-3N | EPF81500AQC240-2 | EPF81500AQC240-2N | EPF81500AGC280-3 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 240-BFQFP (240-PQFP, 32x32 mm) | 240-BFQFP - same | 240-BFQFP - same | 240-BFQFP - same | 280-PGA - different |
| Speed Grade | -3 (fastest) | -3 (same speed grade) | -2 (slower) | -2 (slower) | -3 (same speed grade) |
| Terminal Finish | SnPb (non-RoHS) | Lead-free (RoHS) | SnPb (non-RoHS) | Lead-free (RoHS) | SnPb (non-RoHS) |
| Logic Elements | 1296 | 1296 | 1296 | 1296 | 1296 |
| Usable Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Registers | 1500 | 1500 | 1500 | 1500 | 1500 |
| Supply Voltage | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V |
Wichtigste Unterscheidungsmerkmale
- Speed grade -3 is the fastest bin within the FLEX 8000 family (vs. EPF81500AQC240-2)
- SnPb terminal finish - compatible with legacy non-RoHS assembly lines (vs. EPF81500AQC240-3N)
- Same 240-PQFP package as the entire FLEX 8000 240-pin family (vs. EPF81500AGC280-3)
Designhinweise
The EPF81500AQC240-3 is SRAM-based, meaning it loses all configuration when power is removed. Unlike antifuse or flash FPGAs, you MUST provide a non-volatile boot source (EPC1, EPC1064, EPC1213, EPC1441 serial PROM, parallel EPROM, or microprocessor) that reloads configuration on every power-up. Forgetting this configuration memory is the single most common design mistake with FLEX 8000 - the device appears completely dead on first power-up if configuration data is missing.
The 240-PQFP package has gull-wing leads on 0.5 mm pitch. PCB layout requires careful escape routing and a continuous ground plane under the package for the 5V switching currents. Decoupling: place 0.1 uF ceramic caps adjacent to every VCC pin pair, plus bulk 10-100 uF tantalum or polymer caps near the package corners. The high pin count means signal-integrity simulations are recommended for buses faster than 33 MHz to control simultaneous-switching noise.
Estimated: At 33 MHz toggle rate with 50% I/O utilization (approximately 90 outputs switching), the EPF81500AQC240-3 draws roughly 200-400 mA from the 5V rail during operation. Total 5V quiescent current (unconfigured) is specified under 50 mA typical. Configuration adds a brief inrush of approximately 200 mA during the parallel/serial boot phase; bulk decoupling must accommodate this without sagging the rail. Always check the configuration device's drive capability against the EPF81500AQC240-3's DCLK input loading.
The 5V CMOS I/O on the EPF81500AQC240-3 has limited drive strength (typically 4-8 mA per pin) compared to modern FPGAs. For buses with high capacitive loading (>50 pF), use external bus buffers (74FCT245, 74ABT244) rather than relying on direct FPGA drive. PCI-compliant 33 MHz signaling requires careful trace-impedance control (50-65 ohm microstrip or stripline) and series-damping resistors near the FPGA for signal-quality compliance.
Compliance-Informationen
EPF81500AQC240-3 base part uses SnPb finish (non-RoHS). The -3N variant is RoHS-compliant / lead-free. AEC-Q100 not applicable - this is a commercial-grade FPGA. REACH, halogen-free, and conflict-mineral declarations not located in verified web data.
