EPF81500ARC304-4 - FLEX 8000 FPGA, 16K Gates, 304-RQFP | Altera
Teilenummer: EPF81500ARC304-4 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $58.17 | $58,17 |
| 10 | $53.2 | $532,00 |
| 100 | $48.75 | $4.875,00 |
| 500 | $44.1 | $22.050,00 |
| 1.000 | $40.5 | $40.500,00 |
EPF81500ARC304-4 Übersicht
A Field-Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be reconfigured by the end user after manufacture. FPGAs occupy a tier in the digital logic hierarchy above simple PLDs and below fixed-function ASICs, offering high gate density, in-system reconfigurability, and parallel processing capability. The FLEX 8000 architecture sits within this hierarchy as a register-rich, low-cost family optimized for glue logic, bus interfaces, TTL integration, coprocessor functions, and high-speed controllers.
Key features include 1,296 logic cells, an in-circuit reconfigurability (ICR) interface that supports external EPC1, EPC1213, EPC1064, and EPC1441 configuration devices, and a maximum internal operating frequency in the 125 MHz class. The 304-RQFP package exposes 208 user I/Os, enabling integration of multiple 32-bit buses and wide data-path manipulation within a single device - a strong fit for DSP pre/post-processing and data transformation pipelines. The SRAM-based configuration memory allows unlimited reconfiguration cycles, supporting prototyping and field-upgrade scenarios.
The architecture combines four-input look-up tables with fast carry chains for arithmetic, dedicated registers on every logic cell for pipelined designs, and a continuous routing fabric with predictable delay. MultiVolt I/O permits mixed 3.3 V/5.0 V interfacing on supported package variants, simplifying board-level integration with legacy and modern logic families. The device is configured at system power-up via industry-standard parallel EPROM, an Altera serial configuration device, or a microprocessor - giving designers flexibility across manufacturing flows.
Typical applications include high-speed bus interfaces, TTL gate-array replacement, coprocessor and peripheral controller functions, and DSP pre/post-processing in telecommunications, industrial control, and military/aerospace systems. Designers choose the FLEX 8000 family when register density and I/O count matter more than the absolute lowest per-unit cost of a fixed ASIC, particularly in low-to-medium volume production where NRE charges cannot be amortized.
When designing with this part, plan configuration memory storage and clock distribution carefully: the FLEX 8000 architecture requires a clean 5 V rail and proper decoupling near the supply pins, plus a configuration clock source if using a serial configuration device. The 304-RQFP package is large (40x40 mm) and requires a substantial PCB footprint, so mechanical layout and thermal vias under the die-attach pad should be considered for high-utilization designs.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the standalone manufacturer datasheet.
Drop-in-Alternativen für EPF81500ARC304-4 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPF81500ARC304-4 (gleiche Bauform und Footprint) – abweichend in Configuration Method, Process Technology, Usable Gates, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPF81500ARC304-3
✅ Drop-In✓ Auf Lager
$32.5 / Stück
Datenblatt ansehen →EPF81500ARC304-2
✅ Drop-In✓ Auf Lager
$92.5 / Stück
Datenblatt ansehen →EPF81500ARC304-2A
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EPF81500ARC304-3N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EPF81500ARC304-4N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EPF81500ARC304-4 Grenzwerte & elektrische Eigenschaften
| Family | FLEX 8000 |
| Usable Gates | 16,000 (max) |
| Logic Elements / Cells | 1,296 |
| Registers | 1,500 |
| User I/O Pins | 208 |
| Supply Voltage (VCCINT) | 4.75 V to 5.25 V |
| I/O Voltage | 5.0 V (MultiVolt on supported packages) |
| Process Technology | 0.42 µm CMOS, SRAM-based |
| Internal Frequency (max) | 125 MHz |
| Configuration Method | Serial or parallel EPROM, EPC1/EPC1213/EPC1064/EPC1441, or microcontroller |
| In-Circuit Reconfigurability | Yes (ICR) |
| Gehäuse / Bauform | 304-RQFP (304-BFQFP, 40x40 mm) |
| Supplier Device Package | 304-RQFP |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +85C (industrial) |
| RoHS-Status | Compliant (per current distributor listings) |
EPF81500ARC304-4 304-rqfp Pinbelegungsleitfaden
Pinbelegung für EPF81500ARC304-4 (304-rqfp-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPF81500ARC304-4.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPF81500ARC304-4 ist geeignet für 6 Anwendungs: High-Speed Bus Interface Bridging, TTL Gate-Array Replacement, DSP Pre/Post-Processing Pipeline, Peripheral and Coprocessor Controller, Industrial Control Logic Integration, Legacy Avionics and Defense Logic.
High-Speed Bus Interface Bridging
The EPF81500ARC304-4 is well suited to bridge legacy and modern bus architectures - for example, gluing a 32-bit PCI bus to a custom peripheral bus or aggregating multiple 8/16-bit legacy interfaces into a single wider channel. Its 208 user I/Os in the 304-RQFP are sufficient to bring in three full 32-bit buses plus control, while the 16K-gate / 1,500-register capacity absorbs moderate state-machine and FIFO logic without external TTL. Designers typically instantiate async FIFOs and bus-state machines; the FLEX 8000 register-rich fabric helps meet timing at 33 MHz PCI and similar rates. MultiVolt I/O on supported package variants enables 5 V/3.3 V mixing on the same board, easing integration with older peripherals.
Empfohlen
TTL Gate-Array Replacement
For designs that would otherwise consume a board full of 74LS/74F TTL glue, the EPF81500ARC304-4 collapses random logic, decoders, latches, and simple state machines into a single programmable device. With 1,296 logic cells and 1,500 registers, it can replace dozens of TTL packages, reducing board area, power, and BOM count. In-system SRAM configuration makes prototype iterations fast: a designer can re-spin logic in minutes without board rework. MultiVolt I/O further helps when the TTL mix spans 3.3 V and 5 V, eliminating level-translator chips. This use case is a sweet spot for FLEX 8000 in legacy industrial and aerospace systems.
Empfohlen
DSP Pre/Post-Processing Pipeline
The register-rich FLEX 8000 fabric makes the EPF81500ARC304-4 effective as a pre- or post-processor ahead of a dedicated DSP or ASIC. Designers implement FIR/IIR filter stages, data-format converters, address generators, and ping-pong buffer control in the FPGA, freeing the DSP for inner-loop math. The 208 user I/Os accommodate wide data paths (16/32-bit) plus parallel memory buses for SRAM or dual-port RAM buffering. At 125 MHz internal fMAX, real-time video or telecom sample rates up to tens of MSPS are realistic. Designers should plan pipelined arithmetic and use the dedicated fast-carry chains for adder trees.
Empfohlen
Peripheral and Coprocessor Controller
The EPF81500ARC304-4 fits the role of a peripheral controller or coprocessor in larger systems - for example, offloading DMA, scatter-gather list management, interrupt aggregation, or protocol handling from a host CPU. Its 16K-gate capacity absorbs the controller state machine plus small FIFOs and register files, while 208 I/Os are ample for the host interface, multiple peripheral interfaces, and interrupt/control lines. In-circuit reconfigurability (ICR) lets the same board support several controller personalities loaded at boot, useful for field-upgradable industrial platforms and test equipment. Plan configuration memory (EPC1/EPC1441) accordingly.
Empfohlen
Industrial Control Logic Integration
In industrial automation, the EPF81500ARC304-4 integrates discrete I/O handling, encoder/counter logic, PWM generation, and Modbus/Profibus-style protocol framing in a single device. The 208 user I/Os comfortably serve 24V-to-5V optically-isolated inputs and outputs at typical 8- or 16-bit channel groupings, while 1,500 registers support state machines and timing generators. SRAM-based configuration enables on-line firmware updates for long-life industrial platforms. Designers must respect the 5 V supply requirement, add robust decoupling, and observe ESD handling on field-wired I/O lines. The 304-RQFP is large but proven in industrial layouts.
Empfohlen
Legacy Avionics and Defense Logic
Because the FLEX 8000 family is mature and still supported by long-term-supply distributors such as Rochester Electronics, the EPF81500ARC304-4 remains a viable option for legacy avionics, defense, and aerospace programs requiring continued production of fielded designs. Its 5 V operation, proven 304-RQFP hermetic-compatible footprint, and known radiation-tolerance characteristics make it familiar to systems that must not be redesigned. The 16K-gate capacity suits mission-specific I/O expansion, MIL-STD-1553 bridging, or discrete-signal consolidation. Always verify the latest long-term-supply roadmap with the manufacturer before committing to new programs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPF81500ARC304-4 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPF81500ARC304-3 | EPF81500ARC304-2 | EPF81500ARC304-2A | EPF81500ARC304-3N | EPF81500ARC304-4N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 304-RQFP (40x40 mm) | 304-RQFP (40x40 mm) - same | 304-RQFP (40x40 mm) - same | 304-RQFP (40x40 mm) - same | 304-RQFP (40x40 mm) - same | 304-RQFP (40x40 mm) - same |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 |
| Usable Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Logic Cells | 1,296 | 1,296 | 1,296 | 1,296 | 1,296 | 1,296 |
| User I/Os | 208 | 208 | 208 | 208 | 208 | 208 |
| Speed Grade | -4 (fastest) | -3 | -2 (slowest) | -2A | -3 (Pb-free) | -4 (Pb-free) |
| Supply Voltage | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V |
| Configuration Interface | Serial/parallel EPROM, EPC1/EPC1213/EPC1064/EPC1441, MCU | Same | Same | Same | Same | Same |
| Lifecycle Status | Obsolete (per Rochester Electronics listing) | Obsolete / NRND | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Highest 304-RQFP speed grade in the FLEX 8000 EPF81500 family (vs. EPF81500ARC304-3)
- 208 user I/Os - the largest in the FLEX 8000 family (vs. EPF81500ARC240-4)
- Mature long-term supply chain via authorized aftermarket (vs. EPF10K50VRC240-4)
Designhinweise
The EPF81500ARC304-4 requires a tightly regulated 4.75 V to 5.25 V supply on VCCINT; place 100 nF decoupling capacitors within 5 mm of every VCC pin and add bulk 10-47 µF tantalum or polymer caps near the package. I/O banks draw additional current proportional to switching frequency and load - estimate up to several hundred mA per bank at full utilization. MultiVolt I/O lets 3.3 V and 5 V interfaces coexist on supported package variants, but each bank must be configured consistently; mixing within one bank is not allowed.
Configuration failures are the most common bring-up issue. Verify that nCONFIG is driven correctly during power-up, that the configuration clock (DCLK) is clean, and that CONF_DONE goes high before the FPGA enters user mode. Mismatched MSEL/ mode-pin settings between the FPGA and the EPC1/EPC1213/EPC1064/EPC1441 configuration device will prevent configuration. Plan for at least 100 ms of POR delay before driving user I/O. Designers upgrading from EPC1 to EPC1441 must also re-validate configuration timing because data-stream length changes.
The 304-RQFP (40x40 mm) package dissipates heat primarily through its leads and PCB copper, with no exposed thermal pad. Estimated junction-to-ambient thermal resistance (theta_JA) is roughly 20-25 C/W on a 4-layer JEDEC test board with adequate copper pour. Estimated: at 5 V VCCINT and 80% utilization the device can draw 0.5-1 A, so worst-case power dissipation approaches 5 W. For continuous operation above 2-3 W, add thermal vias under the package perimeter and consider airflow. Always measure under worst-case vector patterns because FPGA power is design-dependent.
The 304-RQFP has a 0.5 mm or 0.8 mm pitch (verify against the family datasheet for this specific variant) and requires a substantial PCB footprint. Use controlled-impedance routing for clocks and high-speed buses, and keep configuration signals (DATA, DCLK, nCONFIG, nSTATUS, CONF_DONE) short and away from switching I/O to avoid coupling into the configuration stream. The 208 user I/Os benefit from escaping the package in a star or fly-by topology - plan BGA-like breakout discipline even though the package is peripheral-leaded.
Compliance-Informationen
Lifecycle is obsolete per Rochester Electronics listing. RoHS compliance per current distributor listings. AEC-Q100 not applicable (FPGA). Lead-free and halogen-free status not explicitly stated in the verified web data.
