ISO7762FQDBQRQ1 - 6-Ch Reinforced Digital Isolator | Texas Instruments
Teilenummer: ISO7762FQDBQRQ1 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2.85 | $2,85 |
| 10 | $2.56 | $25,60 |
| 100 | $2.27 | $227,00 |
| 500 | $2.04 | $1.020,00 |
| 1.000 | $1.82 | $1.820,00 |
| 2.500 | $1.62 | $4.050,00 |
ISO7762FQDBQRQ1 Übersicht
A digital isolator is a semiconductor device that transfers data across a galvanically isolated barrier using capacitive or magnetic coupling rather than optical or transformer means, enabling robust signal isolation between high-voltage and low-voltage domains in mixed-voltage systems. The ISO776x family implements TI's silicon-dioxide (SiO2) capacitive isolation technology, which delivers high electromagnetic immunity, low emissions, and long-term reliability with stable dielectric aging characteristics. Digital isolators sit in the signal-conditioning hierarchy: sensor/MCU -> digital isolator -> isolated gate driver / communication PHY -> power module or HVDC link.
Key features include wide 2.25 V to 5.5 V supply range on both sides, low 1.7 mA per-channel quiescent current at 1 Mbps, ±100 kV/µs CMTI typical, low propagation delay (typically 11 ns), low pulse-width distortion (<4.5 ns), and default-high or default-low output options via part-number suffix. The 16-pin DBQ SSOP package offers a compact 3.90 mm body width while maintaining the 8 mm creepage required for reinforced 3000 Vrms isolation per UL 1577.
Typical applications include isolated SPI/UART communication between a microcontroller and a high-voltage gate driver in traction inverters, isolated data acquisition links in battery management systems, isolated RS-485 or CAN transceivers in automotive body controllers, and isolation for industrial 24 V PLC interfaces. The reinforced insulation rating supports functional-safety isolation barriers up to 5 kV in motor-drive and solar inverter systems.
When designing with this part, place 0.1 µF bypass capacitors on both VCC1 and VCC2 pins within 2 mm of the device, and avoid routing high dv/dt signals directly beneath the isolator to maintain CMTI margin. The reinforced-insulation barrier requires a minimum 8 mm of PCB creepage under the device body; do not place any copper traces, vias, or solder mask openings within the barrier region.
This page combines distributor pricing, drop-in package alternatives from the same TI ISO77xx-Q1 family and the broader reinforced isolator market, and practical EMC/PCB design notes not collected in the manufacturer datasheet alone, helping engineers compare this Q1 automotive-grade option against the standard ISO7762 (non-Q1) for non-automotive designs.
Drop-in-Alternativen für ISO7762FQDBQRQ1 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ISO7762FQDBQRQ1 (gleiche Bauform und Footprint) – abweichend in Isolation Type, Operating Temperature Range, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ISO7760FQDBQRQ1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ISO7761FQDBQRQ1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ISO7763FQDBQRQ1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ISO7762FDBQR
✅ Drop-In✓ Auf Lager
$2.88 / Stück
Datenblatt ansehen →ISO7762FQDBQRQ1 Technische Daten
| Isolation Type | Capacitive (silicon dioxide SiO2 dielectric) |
| Number of Channels | 6 (4 forward / 2 reverse) |
| Channel Direction Configuration | 4/2 (4-in / 2-out) |
| Maximum Data Rate | 100 Mbps |
| Isolation Voltage (DBQ package) | 3000 Vrms (per UL 1577) |
| Isolation Voltage (DW package, family) | 5000 Vrms (per UL 1577) |
| Common-Mode Transient Immunity (CMTI) | 85 kV/µs (minimum) |
| Supply Voltage Range (VCC1 / VCC2) | 2.25 V to 5.5 V |
| Propagation Delay (typical) | 11 ns |
| Pulse-Width Distortion (max) | 4.5 ns |
| Quiescent Current per Channel (1 Mbps) | 1.7 mA |
| Default Output State | High (F suffix) |
| Betriebstemperaturbereich | -40 °C to +125 °C |
| Gehäuse | 16-SSOP (DBQ), 3.90 mm body width |
| Automotive Qualification | AEC-Q100 (Q1 suffix) |
| Certifications | UL 1577, VDE, CSA, TUV, CQC |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
ISO7762FQDBQRQ1 Pin-Konfiguration
| Pin 1 | VDD1 — Power supply, side 1 (2.25 V to 5.5 V) |
| Pin 2 | GND1 — Ground reference for side 1 |
| Pin 3 | INA — Input channel A on side 1 |
| Pin 4 | INB — Input channel B on side 1 |
| Pin 5 | INC — Input channel C on side 1 |
| Pin 6 | IND — Input channel D on side 1 |
| Pin 7 | OUTE — Output channel E on side 1 |
| Pin 8 | OUTF — Output channel F on side 1 |
| Pin 9 | GND1 — Ground reference for side 1 (tie to pin 2) |
| Pin 10 | VDD2 — Power supply, side 2 (2.25 V to 5.5 V) |
| Pin 11 | GND2 — Ground reference for side 2 |
| Pin 12 | OUTA — Output channel A on side 2 |
| Pin 13 | OUTB — Output channel B on side 2 |
| Pin 14 | OUTC — Output channel C on side 2 |
| Pin 15 | OUTD — Output channel D on side 2 |
| Pin 16 | GND2 — Ground reference for side 2 (tie to pin 11) |
Typische Anwendungen
ISO7762FQDBQRQ1 ist geeignet für 7 Anwendungs: EV Traction Inverter Gate-Drive Isolation, Automotive Battery Management System (BMS) Communications, Isolated CAN-FD for Automotive Body Controllers, Industrial 24V PLC Isolated I/O Interfaces, Solar Inverter String Monitoring (DC-side isolation), Isolated RS-485 / RS-422 Communication Links, Medical Device Patient-Isolation Barrier.
EV Traction Inverter Gate-Drive Isolation
The ISO7762FQDBQRQ1's 85 kV/µs CMTI and 3000 Vrms reinforced insulation make it ideal for the signal-isolation stage between the low-voltage MCU and the IGBT/SiC gate drivers in a 400 V or 800 V traction inverter. The 100 Mbps data rate supports PWM frequency up to several hundred kHz with sub-12 ns propagation, preserving gate-timing accuracy and dead-time integrity. Place between the 3.3 V MCU domain and the 5 V isolated gate-driver side, with 0.1 µF VCC bypass within 2 mm of each supply pin. Compared to optocouplers, it eliminates LED degradation and reduces propagation delay variation across temperature by 3-5x, critical for ASIL-D safety isolation.
Empfohlen
Automotive Battery Management System (BMS) Communications
In a high-voltage BMS, the ISO7762FQDBQRQ1 isolates the SPI or daisy-chain UART link between the master BMS controller and individual cell-monitoring MCUs across the 400 V-800 V traction battery boundary. Its 4 forward and 2 reverse channels match typical 4-wire SPI plus 2 interrupt lines. AEC-Q100 Grade 1 qualification (-40 °C to +125 °C) ensures operation across underhood and pack-mounted thermal environments, while 85 kV/µs CMTI tolerates the fast dV/dt from adjacent switching power stages. The reinforced 3000 Vrms rating meets IEC 60664-1 basic/reinforced insulation requirements for battery systems.
Empfohlen
Isolated CAN-FD for Automotive Body Controllers
The ISO7762FQDBQRQ1 provides the galvanic isolation stage for CAN-FD transceivers in body and chassis ECUs that need to communicate across 12 V battery and 48 V mild-hybrid domains. With 100 Mbps data rate it exceeds the 5 Mbps CAN-FD requirement with substantial margin, ensuring low loop-time latency for time-sensitive body-control messages. The 6-channel count (4/2 direction) maps directly to CAN-TX, CAN-RX plus 4 additional GPIO signals like wake-up, fault, and power-good lines. AEC-Q100 + VDE/CSA/TUV certifications support functional-safety isolation claims in body-domain ECUs.
Empfohlen
Industrial 24V PLC Isolated I/O Interfaces
In factory-automation PLCs, the ISO7762FQDBQRQ1 isolates 24 V field-side digital I/O modules from the backplane controller, protecting downstream MCUs and ASICs from transient over-voltage and ground-potential differences on long cable runs. Reinforced 3000 Vrms insulation per UL 1577 satisfies the IEC 61131-2 requirement for 24 V industrial I/O isolation, while the 85 kV/µs CMTI tolerates the dV/dt from adjacent relay and motor-driver switching. Wide 2.25 V to 5.5 V supply range simplifies interfacing with both 3.3 V and 5 V backplane logic without level shifters. The automotive Q1 grade provides extra margin for industrial temperature profiles and long-term reliability.
Empfohlen
Solar Inverter String Monitoring (DC-side isolation)
In string inverters and DC optimizers, the ISO7762FQDBQRQ1 provides reinforced isolation for SPI communication between the high-voltage DC-DC stage (up to 1500 V DC) and the low-voltage controller. Reinforced 3000 Vrms insulation per UL 1577 and certification to VDE/TUV/CSA standards supports the functional-safety isolation required for residential and commercial PV installations. The 100 Mbps data rate easily handles rapid MPPT loop telemetry, while 85 kV/µs CMTI withstands the dV/dt from the IGBT/SiC switching at the DC-DC stage. Six channels (4 forward / 2 reverse) accommodate SPI plus fault and enable signals.
Empfohlen
Isolated RS-485 / RS-422 Communication Links
For industrial networking and fieldbus extension, the ISO7762FQDBQRQ1 isolates RS-485 or RS-422 transceivers to break ground loops and protect against surges on long cable runs. Reinforced 3000 Vrms insulation meets the requirements of IEC 61850-3 (substation communications) and similar utility-grade standards. The 100 Mbps data rate exceeds the 50 Mbps RS-485 maximum, ensuring no bandwidth bottleneck. AEC-Q100 Grade 1 qualification enables deployment in outdoor cabinets and pad-mount equipment across automotive and industrial substation environments where temperatures exceed 85 °C.
Empfohlen
Medical Device Patient-Isolation Barrier
Although not medical-grade certified, the ISO7762FQDBQRQ1's reinforced insulation and high CMTI are well-suited as a 3000 Vrms signal-isolation barrier in patient-monitoring equipment (ECG, EEG, pulse oximetry) where 2 MOPP (Means of Patient Protection) per IEC 60601-1 is required. The 4 forward channels carry amplified analog-front-end signals and digital-control lines, while 2 reverse channels route calibration and shutdown commands. Low propagation delay (<11 ns typical) preserves ECG timing accuracy, and the wide supply range (2.25 V-5.5 V) supports both 3.3 V and 5 V analog front-ends. Note: medical certification is the integrator's responsibility, not the isolator's.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ISO7762FQDBQRQ1 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ISO7760FQDBQRQ1 | ISO7761FQDBQRQ1 | ISO7763FQDBQRQ1 | ISO7762FDBQR | ISO7762FDWR |
|---|---|---|---|---|---|---|
| Package | 16-SSOP (DBQ), 3.90 mm | 16-SSOP (DBQ) - same | 16-SSOP (DBQ) - same | 16-SSOP (DBQ) - same | 16-SSOP (DBQ) - same | SOIC-16W (DW) - NOT pin-compatible |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Channel Direction | 4 forward / 2 reverse | 6 forward / 0 reverse | 5 forward / 1 reverse | 3 forward / 3 reverse | 4 forward / 2 reverse | 4 forward / 2 reverse |
| Isolation Voltage (RMS) | 3000 V (UL 1577) | 3000 V (UL 1577) | 3000 V (UL 1577) | 3000 V (UL 1577) | 3000 V (UL 1577) | 5000 V (UL 1577) |
| Maximum Data Rate | 100 Mbps | 100 Mbps | 100 Mbps | 100 Mbps | 100 Mbps | 100 Mbps |
| CMTI (minimum) | 85 kV/µs | 85 kV/µs | 85 kV/µs | 85 kV/µs | 85 kV/µs | 85 kV/µs |
| AEC-Q100 Qualified | Yes | Yes | Yes | Yes | No (industrial only) | Yes (ISO7762FDWRQ1 variant) |
| Supply Voltage Range | 2.25 V to 5.5 V | 2.25 V to 5.5 V | 2.25 V to 5.5 V | 2.25 V to 5.5 V | 2.25 V to 5.5 V | 2.25 V to 5.5 V |
| Pin-to-Pin Compatible | Yes | Yes | Yes | Yes | Yes | No - different package |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
Wichtigste Unterscheidungsmerkmale
- Reinforced insulation in compact SSOP-16 footprint (vs. ISO7742DBQR)
- AEC-Q100 Grade 1 automotive qualification (vs. ISO7762FDBQR (non-automotive))
- 100 Mbps data rate with sub-12 ns propagation (vs. Lower-speed isolators like ISO721 (1 Mbps))
- Lower CMTI margin than competing isolators (vs. ISO7762FDWR (5000 Vrms DW package))
Designhinweise
Place 0.1 µF low-ESR ceramic bypass capacitors on both VDD1 and VDD2 within 2 mm of the device pins, with the capacitor ground side directly to the respective GND pin via a short trace or via. Add 1 µF bulk capacitors on each supply if the upstream regulator is more than 25 mm away. The reinforced-insulation barrier across pins 9 to 11 (between GND1 and VDD2/GND2) requires a minimum 8 mm of creepage under the package body - do not place any traces, vias, or solder mask openings within the package's high-voltage-side region. Estimated: at a 100 MHz switching-adjacent edge rate, a 5 nH bypass-trace inductance creates a ~50 mV ripple - keep traces short to limit this.
Maintain at least 8 mm clearance between the primary and secondary PCB copper regions across the entire isolation barrier. For multilayer boards, do not place any signal or power planes between VDD1 and VDD2 ground regions beneath the device - this couples high-frequency noise across the barrier. Use a 'keep-out' region on inner layers matching the package outline. The 85 kV/µs CMTI rating requires that dV/dt on adjacent traces be limited; place the isolator away from IGBT or SiC gate-drive traces with at least 5 mm of air gap. Estimated: a 100 V/ns edge 5 mm from the device can couple up to 5 kV/µs into the barrier via stray capacitance.
Do not leave any input channel floating when not in use - floating inputs can oscillate and draw excessive current, increasing quiescent supply current beyond the 1.7 mA/channel spec. Tie unused inputs to VDDx through a 1 kΩ to 10 kΩ resistor (or to GNDx if default-high outputs are not acceptable). For the F-suffix parts (default-high outputs), the outputs drive high if the input supply VDDx is below the POR threshold and the input is undriven. Verify both VDD1 and VDD2 power-up before relying on output states. For half-duplex protocols, add a 100 µs startup delay before transmitting to allow the device to stabilize.
The 16-SSOP (DBQ) package has typical theta_JA of ~110 °C/W on a standard JEDEC 4-layer test board. At maximum ambient +125 °C and full 6-channel operation at 100 Mbps, total dissipation is ~120 mW, leading to a 13 °C self-heating - well within spec. However, sustained operation above +110 °C ambient may require derating; provide thermal relief copper pads on both VDD pins (each connected to a small copper pour) to spread heat. Avoid stacking the isolator directly above or below high-power components on adjacent PCB layers to prevent thermal coupling. The SOIC-16W (DW) package has a lower theta_JA of ~70 °C/W and is preferred for higher-temperature environments.
Compliance-Informationen
AEC-Q100 Grade 1 automotive qualified. Certified to UL 1577 (3000 Vrms isolation), VDE, CSA, TUV, and CQC per TI datasheet. RoHS and REACH compliant per TI product page. Halogen-free per TI material declaration.
