KGM133S - 78MHz Cortex-M33 Matter/Thread/Zigbee/BLE Module | Quectel
Teilenummer: KGM133S ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.5 | $6,50 |
| 10 | $5.85 | $58,50 |
| 100 | $5.2 | $520,00 |
| 500 | $4.7 | $2.350,00 |
| 1.000 | $4.25 | $4.250,00 |
KGM133S Übersicht
An MCU-integrated wireless module like the KGM133S belongs to a broader family of short-range radio modules that combine an application processor and a 2.4 GHz transceiver on a single PCB. Within the system hierarchy it sits inside the IoT/connected-device stack, which itself spans modules, transceivers, MCUs, and full SoCs; for engineers building Matter-compliant end devices, the module layer eliminates the FCC/CE pre-certification work that a bare chip would otherwise require.
Key features include 78 MHz Cortex-M33 compute, IEEE 802.15.4 PHY support for Thread and Zigbee, BLE 6.0 dual-role, BLE mesh 1.x, integrated antenna variants, and an operating temperature range that spans industrial deployments. Variants like KGM133SABTB and KGM133SABMD offer different antenna and certification bundles, while KGM133S-P is the LGA-only variant without integrated antenna for embedded designs.
Architecturally, the module integrates a Cortex-M33 core, a 2.4 GHz radio transceiver supporting OQPSK/8-FSK modulations for 802.15.4 and GFSK for BLE, on-module crystal and matching network, and a low-power sleep path that lets battery-powered nodes achieve multi-year coin-cell runtime. The integration removes RF design risk for the host product team.
Typical applications include Matter-over-Thread smart lighting, Zigbee home automation gateways and end devices, BLE mesh building automation, and battery-powered wireless sensors. Industrial use cases such as asset tracking and predictive-maintenance beacons also fit thanks to the industrial operating range.
When designing with the KGM133S, ensure the host PCB keeps the antenna keep-out zone clear, follow the Quectel reference layout for the LGA footprint, and select the matching variant (integrated PCB antenna vs U.FL connector) for the enclosure. Compliance with regional RF rules is preserved only when the host follows Quectel's reference design.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing and second-sourcing the KGM133S family.
Drop-in-Alternativen für KGM133S – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
KGM133SABTB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
KGM133SABMD
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
KGM133S-P
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
KGM133SABTB-0L-03
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
KGM133SABMD-0L-03
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
KGM133S Spezifikationen (herstellerveröffentlicht)
| Processor | ARM Cortex-M33 |
| Max CPU Clock | 78 MHz |
| Wireless Protocols | Matter, Thread (802.15.4), Zigbee, BLE 6.0, BLE mesh |
| Frequency Band | 2.4 GHz ISM |
| IEEE Standard | IEEE 802.15.4 |
| Modulation | O-QPSK (802.15.4), GFSK (BLE) |
| Package Type | LGA surface-mount module |
| Antenna | Integrated PCB antenna or U.FL (variant dependent) |
| Module Series Variants | KGM133S, KGM133S-P (LGA only), KGM133SABTB, KGM133SABMD |
| RoHS-Status | Compliant (per JLCPCB listing) |
| Montageart | Surface Mount (SMD/SMT) |
| Evaluation Board | KGM133SABTB-0L-03 (DigiKey listing 29719229) |
KGM133S Schnittstellen & Anschlüsse
KGM133S bietet die folgenden, vom Hersteller veröffentlichten Schnittstellen und Anschlüsse: Funk. Pinbelegung der Erweiterungsheader, Nummerierung der Anschlüsse und elektrische Grenzwerte sind in der Herstellerdokumentation definiert.
| Funk | Matter, Thread (802.15.4), Zigbee, BLE 6.0, BLE mesh |
Siehe die Herstellerdokumentation für die vollständige Pinbelegung der Erweiterungsleiste und die Nummerierung der Steckverbinder-Pins.
Typische Anwendungen
KGM133S ist geeignet für 6 Anwendungs: Matter-over-Thread Smart Lighting, Zigbee 3.0 Home Automation Devices, BLE Mesh Building Automation, Battery-Powered Wireless Sensors, Industrial IoT Asset Trackers, Smart Home Gateways and Bridges.
Matter-over-Thread Smart Lighting
The KGM133S is purpose-built for Matter-over-Thread smart-lighting end nodes because it integrates a Cortex-M33 core at 78 MHz that comfortably runs the full Matter 1.x stack alongside PWM/0-10 V dimming firmware. Its 2.4 GHz Thread radio and integrated antenna eliminate the need for an external MCU or RF matching network, so a Matter-certified luminaire can be built around the module with a small BOM. Quectel's pre-certified radio further reduces FCC/CE certification cost. Recommended companion parts include a Quectel antenna variant for the enclosure layout.
Empfohlen
Zigbee 3.0 Home Automation Devices
For Zigbee 3.0 end devices such as door sensors, smart plugs, and wall switches, the KGM133S provides a certified IEEE 802.15.4 radio plus a Cortex-M33 capable of running the ZCL application layer on-chip. The integrated antenna option simplifies small-form-factor designs, while the BLE 6.0 co-residency enables convenient commissioning via mobile apps. Quectel pre-certifies the radio for major markets, removing a major compliance hurdle for consumer home-automation SKUs.
Empfohlen
BLE Mesh Building Automation
Commercial building automation networks using BLE mesh benefit from the KGM133S's BLE 6.0 support combined with Cortex-M33 headroom for vendor-specific sensor fusion. The module's low-power sleep modes enable multi-year coin-cell operation for wireless switches, occupancy sensors, and HVAC controllers. Its pre-certified radio shortens time-to-market for luminaires and HVAC gateways that must ship globally. The 78 MHz CPU also handles on-module OTA updates for fleet management.
Empfohlen
Battery-Powered Wireless Sensors
Industrial and consumer sensor nodes that run on coin cells or 2x AA batteries benefit from the KGM133S's integrated low-power architecture: the Cortex-M33 supports deep-sleep states while the 2.4 GHz radio delivers the link budget needed for reliable Thread/Zigbee/BLE connectivity at modest TX power. The on-module SoC removes the need for a host MCU, shrinking the BOM and quiescent current. Use the integrated-antenna variant where the sensor housing is non-metallic.
Empfohlen
Industrial IoT Asset Trackers
For BLE-based indoor asset tracking and industrial IoT telemetry, the KGM133S provides the BLE 6.0 radio plus Cortex-M33 processing to run proprietary RTLS algorithms or Thread mesh backhaul concurrently. The industrial temperature range (subject to confirmation in the datasheet) and Quectel's pre-certified radio make it suitable for factory and warehouse deployments. Antenna selection is critical; the U.FL variant allows flexible external antenna placement on metal assets.
Empfohlen
Smart Home Gateways and Bridges
Multi-protocol smart-home gateways that need to bridge Matter, Thread, Zigbee, and BLE can use the KGM133S as the radio front-end, offloading the protocol stacks to its on-board Cortex-M33. This frees the gateway's host processor for application logic, cloud connectivity, and user-interface rendering. The module's compact LGA package fits into slim gateway enclosures, and Quectel's pre-certification accelerates global SKU rollouts.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für KGM133S – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | KGM133SABTB | KGM133SABMD | KGM133S-P | KGM133SABTB-0L-03 | KGM133SABMD-0L-03 |
|---|---|---|---|---|---|---|
| Package | LGA (Quectel KGM-series footprint) | LGA (same) | LGA (same) | LGA (same) | LGA on evaluation board | LGA on evaluation board |
| Brand | Quectel | Quectel | Quectel | Quectel | Quectel | Quectel |
| Antenna | Integrated PCB antenna | Integrated PCB antenna | U.FL connector | No integrated antenna (LGA only) | Integrated PCB antenna (EVB) | U.FL connector (EVB) |
| CPU Core | ARM Cortex-M33, 78 MHz | ARM Cortex-M33, 78 MHz | ARM Cortex-M33, 78 MHz | ARM Cortex-M33, 78 MHz | ARM Cortex-M33, 78 MHz | ARM Cortex-M33, 78 MHz |
| Protocol Support | Matter, Thread, Zigbee, BLE 6.0, BLE mesh | Matter, Thread, Zigbee, BLE 6.0, BLE mesh | Matter, Thread, Zigbee, BLE 6.0, BLE mesh | Matter, Thread, Zigbee, BLE 6.0, BLE mesh | Matter, Thread, Zigbee, BLE 6.0, BLE mesh | Matter, Thread, Zigbee, BLE 6.0, BLE mesh |
| Form Factor | Module (production SKU) | Module (production SKU) | Module (production SKU) | Module (production SKU) | Evaluation board | Evaluation board |
| Certification Bundle | Quectel standard pre-certification | Quectel standard pre-certification | Quectel standard pre-certification | Quectel standard pre-certification | Same module on dev board | Same module on dev board |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Wichtigste Unterscheidungsmerkmale
- Multi-protocol Matter/Thread/Zigbee/BLE in a single certified module (vs. Single-protocol modules (e.g. BLE-only or Zigbee-only modules))
- Integrated Cortex-M33 application processor on-module (vs. Radio-only modules that require an external host MCU)
- Quectel pre-certified FCC/CE radio (vs. Bare-chip designs requiring customer-driven RF certification)
Designhinweise
Follow the Quectel KGM133S reference PCB layout exactly, including the antenna keep-out zone and ground clearance around the LGA pads. Any deviation from the recommended footprint can detune the integrated PCB antenna and degrade the TX power / RX sensitivity by several dB, potentially voiding the module's pre-certified FCC/CE status. Keep high-speed digital traces and switching power components away from the antenna region. Refer to the Quectel hardware design manual mirrored on Manuals+ for the keep-out drawing.
Do not assume the KGM133S is pin-compatible with Nordic nRF52840, Silicon Labs BGM220, or TI CC2652 modules - the LGA pad map, pin assignments, and antenna keep-out region are Quectel-specific. Migrating from the KGM133S to a competing module requires a full PCB redesign and re-certification. Within the Quectel portfolio, switching between KGM133S, KGM133SABTB, KGM133SABMD, and KGM133S-P is a true drop-in because the LGA footprint is shared; firmware is also portable across these variants.
Power the KGM133S from a low-noise LDO or DC-DC converter placed close to the module's VDD pins; place decoupling capacitors (typically 10 µF bulk plus 100 nF high-frequency) directly at the supply pins. During TX bursts the module can draw peak currents significantly higher than the average; insufficient bulk capacitance causes VDD droop that can reset the Cortex-M33 or cause link failures. Verify the exact VDD range and TX peak current against the Quectel specification PDF before finalizing the host power tree.
Compliance-Informationen
RoHS compliance confirmed by JLCPCB Assembly listing (C9900234379). REACH, halogen-free, and conflict-minerals status should be requested directly from Quectel. AEC-Q100 is not applicable - this is a wireless module, not an automotive-grade IC.
