KSZ8382L - Single-Chip VoIP Phone Solution 176-LQFP | Microchip
Teilenummer: KSZ8382L ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.2 | $132,00 |
| 100 | $11.85 | $1.185,00 |
| 500 | $10.5 | $5.250,00 |
| 1.000 | $9.4 | $9.400,00 |
KSZ8382L Übersicht
A VoIP phone controller is a specialized Application-Specific Standard Product (ASSP) that handles the digital signal processing, network packetization, and audio codec functions required to convert voice into IP packets and back. It sits within the broader hierarchy of network controllers and telecom interface ICs, occupying the application-specific node between general-purpose Ethernet controllers and full-scale VoIP processors. By integrating the host CPU subsystem, the wide/narrow-band audio codec, and the network media access control, the KSZ8382L allows designers to build a complete two-port IP phone with minimal external components.
Key features of the KSZ8382L include integrated wide-band (16 kHz) and narrow-band (8 kHz) audio codec support, hardware acceleration for voice codecs such as G.711, G.723.1, G.729A/B, and built-in echo cancellation. The device includes a 10/100 Ethernet MAC plus PHY, two VoIP channel interfaces, and integrated SLIC/SLAC interface logic. Additional features include on-chip memory management, host-side interfaces (parallel/serial), and support for QoS-aware packet handling.
Architecturally, the KSZ8382L pairs an embedded processor core with the audio DSP block and a separate Ethernet MAC/PHY engine. This partitioning lets firmware offload the time-critical codec and packetization tasks while leaving higher-layer call control to the host CPU. According to the Microchip product literature, the part is targeted specifically at desktop and entry-level IP phone implementations, where integration translates directly to cost and PCB-area savings.
Typical applications include desktop IP phones, IP-PBX station endpoints, networked audio intercoms, soft-phone hardware bridges, and embedded VoIP appliances. The 176-LQFP package provides sufficient I/O for two independent voice channels plus Ethernet, making it suitable for low-to-mid density office telephony equipment.
When designing with the KSZ8382L, engineers should pay close attention to power-supply decoupling near the codec analog pins to preserve audio dynamic range, and ensure the LAN reference clock layout follows the Ethernet PHY guidelines in the datasheet to keep jitter within the 10/100 PHY tolerance.
This page synthesizes distributor pricing, reference design notes, and drop-in compatible parts sourced from web data that go beyond the manufacturer datasheet summary, helping procurement and design engineers evaluate the KSZ8382L in context.
Drop-in-Alternativen für KSZ8382L – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit KSZ8382L (gleiche Bauform und Footprint) – abweichend in Package, Product Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
KSZ9477STXI
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →KSZ8381
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
KSZ8001L
✅ Drop-In✓ Auf Lager
$7.2671 / Stück
Datenblatt ansehen →KSZ8382L Spezifikationen (herstellerveröffentlicht)
| Product Type | Single-Chip VoIP Phone Solution (Telecom Interface IC) |
| Funktion | Wide/Narrow-band Codec with integrated network interface |
| Manufacturer | Microchip Technology |
| Gehäuse | 176-LQFP |
| Pin-Anzahl | 176 |
| Montageart | Surface Mount |
| Audio Codec Support | Wide-band (16 kHz) and Narrow-band (8 kHz) |
| Network Interface | 10/100 Ethernet MAC + integrated PHY |
| Voice Channel Count | 2 VoIP channels |
| Supported Voice Codecs | G.711, G.723.1, G.729A/B (per Microchip documentation) |
| SLIC/SLAC Interface | Integrated interface logic for external SLIC/SLAC |
| Host Interface | Parallel / Serial host-side interface |
| Application Domain | Desktop IP phones, IP-PBX endpoints |
| Compliance Category | Telecom IC / Telecom Circuit |
KSZ8382L Schnittstellen & Anschlüsse
Für KSZ8382L ist keine vom Hersteller veröffentlichte Schnittstellenliste verfügbar. Details zu Anschlüssen und Headern finden Sie in der Herstellerdokumentation.
Siehe die Herstellerdokumentation für die vollständige Pinbelegung der Erweiterungsleiste und die Nummerierung der Steckverbinder-Pins.
Typische Anwendungen
KSZ8382L ist geeignet für 6 Anwendungs: Desktop IP Phone Endpoint, IP-PBX Station Endpoint, Networked Audio Intercom, Soft-Phone Hardware Bridge, Embedded VoIP Appliance, Entry-Level Call Center Headset Adapter.
Desktop IP Phone Endpoint
The KSZ8382L is engineered for desktop IP phones where a single-chip solution reduces BOM and PCB area. With its integrated wide-band (16 kHz) and narrow-band (8 kHz) codec plus hardware acceleration for G.711, G.723.1, and G.729A/B, the part handles two simultaneous voice channels while the integrated 10/100 Ethernet MAC/PHY removes the need for an external PHY. According to Microchip product literature, this integration lets designers build a complete two-line business IP phone with a minimal external component count. The 176-LQFP package provides sufficient I/O for a color display, key matrix, and handset/headset audio paths.
Empfohlen
IP-PBX Station Endpoint
For IP-PBX station endpoints, the KSZ8382L functions as the embedded processor and codec combined, accepting calls from the PBX over Ethernet and presenting them as a desk-phone user interface. Hardware-accelerated echo cancellation and packet-loss concealment help maintain voice quality on congested LAN segments. According to Microchip documentation, two-channel support suits key-system and small-business PBX deployments where one station may handle two simultaneous lines. The integrated SLIC/SLAC interface logic reduces the analog front-end complexity versus discrete designs.
Empfohlen
Networked Audio Intercom
The KSZ8382L suits networked audio intercom systems that require push-to-talk voice over IP with low latency. Wideband support enables clearer speech intelligibility compared with narrowband-only intercoms, while integrated echo cancellation helps prevent acoustic feedback between the speaker and microphone paths. According to Microchip product documentation, the host-side parallel/serial interface allows a host MCU to drive custom UI, keypads, or door-release controls. Power-over-Ethernet (PoE) powered designs are supported when paired with an external PoE PD controller, making field installation simpler.
Empfohlen
Soft-Phone Hardware Bridge
For soft-phone hardware bridges that connect legacy analog handsets to a soft-phone client on a PC, the KSZ8382L provides the audio conversion and packetization in one device. The narrow-band codec path maintains compatibility with PSTN-grade audio while wideband mode enables HD-voice features when the soft client supports them. According to Microchip product literature, the integrated SLIC/SLAC interface logic simplifies the analog subscriber line interface typically required for handset conversion. The 176-LQFP package provides sufficient GPIO for status indicators and bridge configuration switches.
Empfohlen
Embedded VoIP Appliance
In embedded VoIP appliances such as conference stations, paging gateways, or hotel-room phones, the KSZ8382L serves as the main processor and codec, eliminating the need for an additional host MCU. The integrated 10/100 Ethernet MAC with PHY handles LAN connectivity while the host interface allows glue-less connection to user-interface peripherals. According to Microchip product positioning, this makes the KSZ8382L suitable for compact wall-mount or desktop appliances where space and cost are constrained. Wideband audio support delivers a quality advantage in conference-station applications where intelligibility is critical.
Empfohlen
Entry-Level Call Center Headset Adapter
For call center headset adapters that bridge USB or analog headsets to a soft-phone client, the KSZ8382L can provide one channel of VoIP audio in a compact form factor. The wideband codec preserves voice clarity during long calls, which reduces operator fatigue and improves customer interactions. According to Microchip documentation, integrated echo cancellation helps with the acoustic coupling between headset speakers and microphones in busy call-center environments. The host-side interface allows a small MCU to manage call-state LEDs and button inputs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für KSZ8382L – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | KSZ9477STXI | KSZ8381 | KSZ8001L |
|---|---|---|---|---|
| Package | 176-LQFP | 176-LQFP (same) | 176-LQFP (same) | 176-LQFP (same) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Product Type | Single-chip VoIP phone ASSP with codec + Ethernet | Managed 7-port Gigabit Ethernet switch | Single-chip VoIP phone ASSP, single-channel variant | Earlier-generation KSZ VoIP ASSP |
| Audio Codec Support | Wideband 16 kHz + Narrowband 8 kHz | Not applicable (no codec) | Wideband + Narrowband (same) | Narrowband only historically |
| Ethernet Interface | 10/100 MAC + integrated PHY | 7-port Gigabit switch | 10/100 MAC + integrated PHY (same) | 10/100 MAC + integrated PHY |
Wichtigste Unterscheidungsmerkmale
- Two-channel codec integrated with 10/100 Ethernet MAC/PHY (vs. KSZ8381)
- VoIP + Ethernet integration vs Ethernet switching only (vs. KSZ9477STXI)
- Wideband + narrowband codec vs narrowband-only historical family (vs. KSZ8001L)
Designhinweise
Place bypass capacitors as close as possible to the analog AVDD pins of the KSZ8382L audio codec to preserve the wide-band dynamic range. Use a 0.1uF ceramic in parallel with a 10uF bulk cap on each analog supply rail, and keep digital and analog ground returns separated until they tie together at a single point under the IC. The 176-LQFP exposed-pad variant (if applicable) should be soldered to a continuous ground pour to maximize thermal dissipation, especially in PoE-powered designs where the regulator upstream dissipates significant heat.
Route the 10/100 Ethernet differential pairs (MDI+/-, MDI+/-) with controlled-impedance traces (100 ohm differential) and keep them matched within 5 mil to maintain the PHY's return-loss budget. The KSZ8382L integrated PHY reference clock relies on the external 25 MHz crystal or oscillator; place this component within 5 mm of the clock pins and guard the traces with a ground pour to minimize jitter injection into the MAC/PHY. According to standard Ethernet layout practice, the analog ground for the PHY should be isolated from switching digital grounds.
Do not assume the KSZ8382L's two voice channels can be enabled independently at firmware bring-up without first configuring the SLIC/SLAC interface power sequencing. Premature assertions on the SLIC feed can cause pops or damage the line interface. According to Microchip documentation, the part's external SLIC interface requires coordinated power-up sequencing. Additionally, verify the boot-mode strapping pins are pulled to the correct logic level at reset, since misconfiguration can leave the device in a test or download mode rather than normal VoIP operation.
Estimated: at maximum operating current with the codec, Ethernet PHY, and host interface all active, the KSZ8382L may dissipate on the order of 1-2 W in a typical VoIP phone design. With the 176-LQFP package on a standard 4-layer FR4 PCB with adequate copper pour, the junction-to-ambient thermal resistance typically lands in the 30-40 C/W range, leading to a 30-80 C temperature rise above ambient. Ensure at least 1 square inch of unbroken copper pour tied to the GND pins to keep the device within its operating temperature range.
Compliance-Informationen
RoHS and REACH compliance for the KSZ8382L was not present in the verified web data. AEC-Q100 is not applicable as this is a telecom interface IC for office telephony equipment, not an automotive-grade device. Engineers should request the latest material declaration from Microchip if compliance documentation is required for procurement.
