LCMXO2-1200HC-4SG32C - MachXO2 1280-LUT FPGA, 32-QFNS | Lattice
Teilenummer: LCMXO2-1200HC-4SG32C ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $9.95 | $9,95 |
| 10 | $8.95 | $89,50 |
| 100 | $7.95 | $795,00 |
| 500 | $6.95 | $3.475,00 |
| 1.000 | $5.95 | $5.950,00 |
LCMXO2-1200HC-4SG32C Übersicht
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to configure digital logic blocks and interconnect after fabrication. Within the broader IC hierarchy, an FPGA belongs to programmable logic -> logic ICs -> integrated circuits. The MachXO2 family targets low-power, instant-on bridging and control applications that historically used CPLDs or small ASICs. Compared to a CPLD (non-volatile, deterministic, instant-on) the FPGA category adds LUT-based distributed RAM, true dual-port block memory, dedicated FIFO control logic, and hard I/O features. Compared with high-density FPGAs, MachXO2 prioritizes low standby power, instant-on behavior, and small packages over raw LUT count.
Key feature highlights include advanced 65 nm low-power process technology, as little as 22 µW standby power, programmable low-swing differential I/O, dedicated FIFO control logic, and up to 256 kbits of user Flash memory plus up to 54 kbits of distributed RAM. The HC devices integrate an internal linear voltage regulator that allows single-supply operation while supporting I/O bank voltages from 1.2 V to 3.3 V.
The HC variant (high-performance, with linear regulator) sits between the ZE ultra-low-power variant and the HE high-performance with enhanced I/O variant. Pin selection across HC, HE and ZE families is compatible at the same package, allowing power-tier upgrades on the same PCB. The device supports instant-on via internal Flash, SPI, I2C and parallel configuration ports, and includes embedded hard IP for common bridging protocols.
Typical applications include I/O expansion and bus bridging for consumer and industrial boards, glue logic replacement, LED control, system monitoring, and low-density control PLD functions. Industrial automation, IoT edge nodes, and portable consumer designs use MachXO2 for its instant-on and low standby current.
When selecting a MachXO2, consider standby power (ZE lowest), I/O performance (HE fastest edges, more I/O standards), and internal regulator (HC and HE include, ZE requires external 3.3 V). For -4SG32C users, the package and pinout allow migration to ZE and HE versions without PCB changes.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für LCMXO2-1200HC-4SG32C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
LCMXO2-1200HC-4SG32I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LCMXO2-1200HE-4SG32C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LCMXO2-1200ZE-4SG32C
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
LCMXO2-640HC-4SG32C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LCMXO2-1200HC-4SG32C Grenzwerte & elektrische Eigenschaften
| Family | MachXO2 |
| Variant | HC (High Performance, internal linear voltage regulator) |
| Speed Grade | -4 |
| Logic Cells / LUTs | 1280 LUTs |
| Number of I/O Banks | 21 |
| Distributed RAM | Up to 54 kbits |
| User Flash Memory | Up to 256 kbits |
| Configuration Memory | 65,536 bits Flash |
| Dedicated FIFO Control Logic | Yes |
| Core Voltage | 2.5 V / 3.3 V (internal regulator on HC) |
| I/O Voltage Support | 1.2 V to 3.3 V |
| Process Technology | 65 nm low power |
| Standby Power | As low as 22 µW |
| Programmable Differential I/O | Low-swing, programmable |
| Standby Mode | Yes, with power-saving options |
| Gehäuse | 32-pin QFNS Exposed Pad (5x5 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | Commercial (0C to +85C) |
| RoHS-Status | Compliant |
LCMXO2-1200HC-4SG32C 32-pin qfns exposed pad (5x5 mm) Pinbelegungsleitfaden
Pinbelegung für LCMXO2-1200HC-4SG32C (32-pin qfns exposed pad (5x5 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für LCMXO2-1200HC-4SG32C.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
LCMXO2-1200HC-4SG32C ist geeignet für 6 Anwendungs: I/O Expansion and Bus Bridging, Consumer Electronics Glue Logic, Industrial Control and Automation, LED Matrix and Display Control, Portable and Battery-Powered IoT Edge Nodes, System Monitoring and Housekeeping.
I/O Expansion and Bus Bridging
The LCMXO2-1200HC-4SG32C is purpose-built for I/O expansion and bus bridging between mismatched interfaces such as SPI to I2C, parallel RGB to MIPI-DSI, and GPIO expansion for processors lacking sufficient pins. With 21 I/O banks supporting 1.2 V to 3.3 V, the device can interface directly to 1.8 V processors and 3.3 V legacy peripherals on the same die, eliminating level shifters. The 1280 LUTs are sufficient to implement UART, I2C, SPI master/slave cores plus state machines, while the 54 kbits of distributed RAM buffer small packets. Internal 256 kbits of user Flash store configuration parameters. Compared with discrete logic or CPLD, the HC variant offers instant-on from non-volatile Flash at 22 µW standby, critical for battery-powered bridging.
Empfohlen
Consumer Electronics Glue Logic
In consumer electronics such as set-top boxes, smart speakers, and wearables, the LCMXO2-1200HC-4SG32C replaces discrete 74-series logic and small ASICs for power management, key-scanning, and LED driving. Its 65 nm low-power process draws as little as 22 µW in standby, matching the battery-life targets of portable devices. The internal linear voltage regulator simplifies power tree design by accepting a single 2.5 V or 3.3 V supply, eliminating the need for an external core regulator. The QFNS-32 EP package fits in space-limited wearables and Smartspeaker enclosures. The instant-on Flash configuration eliminates the cold-boot delay of SRAM-based FPGAs, allowing fast user response. 1280 LUTs are typically enough for power sequencing plus RGB LED PWM plus a touch-panel interface.
Empfohlen
Industrial Control and Automation
The MachXO2 HC variant is widely deployed in industrial PLCs, motor controllers, and sensor hubs where deterministic instant-on behavior and long product life cycles are required. The -4 speed grade combined with the 65 nm low-power process supports 100 MHz internal operation while maintaining low junction temperatures in enclosed industrial cabinets. The dedicated FIFO control logic simplifies UART-to-parallel sensor aggregation. With 256 kbits of user Flash, the device stores factory calibration parameters and firmware revision IDs without an external EEPROM. The -4SG32C package operates over the commercial 0C to +85C range; for harsh environments, migrate to the -4SG32I industrial variant, which is pin-compatible and offers -40C to +100C.
Empfohlen
LED Matrix and Display Control
For LED matrix walls, signage, and small TFT/LCD timing backplanes, the LCMXO2-1200HC-4SG32C delivers 21 I/O banks sufficient to drive 16-bit parallel RGB plus control row interfaces as one chip. Dedicated FIFO logic and embedded block memory buffer pixel data from a host processor, offloading refresh overhead. The HC internal regulator handles the 2.5 V core, freeing the host power tree. Programmable low-swing differential I/O supports MIPI-DSI or LVDS physical layers without external transceivers in many cases. The QFNS-32 EP package provides a 5x5 mm footprint with exposed pad for thermal dissipation in continuous-on LED driving. Compared with CPLD-only solutions, the FPGA fabric also handles PWM dimming curves in hardware.
Empfohlen
Portable and Battery-Powered IoT Edge Nodes
The LCMXO2-1200HC-4SG32C targets battery-powered IoT sensors, BLE beacons, and wearables that demand microamp-level standby current. Standby power as low as 22 µW (per the Lattice MachXO2 Family Data Sheet) is significantly lower than SRAM-based FPGAs, which require configuration memory to stay powered. The instant-on Flash configuration lets the device wake from sleep and execute within microseconds, suiting event-driven sensor readouts. The 1280 LUTs can implement a hardware sensor fusion state machine while the host MCU sleeps. With internal regulator accepting 2.5 V/3.3 V from a coin cell or Li-ion, the design avoids a separate LDO. The QFNS-32 EP package fits inside small IoT enclosures.
Empfohlen
System Monitoring and Housekeeping
The LCMXO2-1200HC-4SG32C is frequently used as a system monitor in servers, networking switches, and base stations to sequence power rails, monitor watchdog timers, and report faults. With 256 kbits user Flash, the device stores error logs and boot counters without external EEPROM. The 21 I/O banks interface to 1.0 V, 1.8 V, and 3.3 V rails simultaneously, monitoring each with built-in comparators. The instant-on behavior ensures the monitor is active before the host SoC boots, enabling secure fault recording. The dedicated FIFO control logic aggregates telemetry streams. Compared with a dedicated supervisor IC, the MachXO2 also implements reset sequencing in programmable logic.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für LCMXO2-1200HC-4SG32C – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | LCMXO2-1200HC-4SG32I | LCMXO2-1200HE-4SG32C | LCMXO2-1200ZE-4SG32C | LCMXO2-640HC-4SG32C |
|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 32-QFNS Exposed Pad | 32-QFNS Exposed Pad - same | 32-QFNS Exposed Pad - same | 32-QFNS Exposed Pad - same | 32-QFNS Exposed Pad - same |
| LUT Count | 1280 | 1280 | 1280 | 1280 | 640 |
| Variant (Power Tier) | HC (High Performance, internal LDO) | HC (industrial temp) | HE (Enhanced I/O) | ZE (Ultra Low Power, no internal LDO) | HC (640 LUTs) |
| Speed Grade | -4 | -4 | -4 | -4 | -4 |
| Operating Temperature | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Internal Voltage Regulator | Yes (linear, 2.5/3.3V) | Yes | Yes | No (requires external 3.3V) | Yes |
| User Flash Memory | Up to 256 kbits | Up to 256 kbits | Up to 256 kbits | Up to 256 kbits | Up to 128 kbits |
Wichtigste Unterscheidungsmerkmale
- Internal linear voltage regulator for single-supply 2.5/3.3 V operation (vs. LCMXO2-1200ZE-4SG32C)
- Commercial temperature grade (0C to +85C) for cost-sensitive consumer and industrial designs (vs. LCMXO2-1200HC-4SG32I)
- 1280 LUTs double the logic capacity of the 640 LUT sibling (vs. LCMXO2-640HC-4SG32C)
Designhinweise
The 32-QFNS Exposed Pad package requires the EP to be soldered to a ground plane for both thermal dissipation and electrical reference. Per the MachXO2 Family Data Sheet, missing or insufficient EP soldering increases junction temperature and can cause reliability issues. Use at least four thermal vias in the EP land pattern to a ground pour on the opposite PCB layer. Decoupling: place 0.1 µF and 1 µF capacitors as close as possible to each VCCIO and VCC core pin pair.
Estimated: at maximum toggle rate and 3.3 V supply, the MachXO2 -4SG32C may dissipate roughly 100-300 mW. With the 5x5 mm QFNS EP package, theta_JA is typically 30-40 C/W on a JEDEC test board. For continuous high-utilization designs (PWM + logic + I/O switching), derate to 70% maximum toggle and verify junction temperature with a thermal probe on a representative board.
Do not confuse the HC variant (internal linear regulator, 2.5/3.3 V supply) with the ZE variant (no internal regulator, requires external 3.3 V). The pinout is compatible but the power tree is not - dropping a ZE onto an HC PCB without the external 3.3 V regulator will fail to operate. Similarly, the -C (commercial) and -I (industrial) suffixes share pinout but differ in temperature range - always select the correct suffix for the deployment environment.
For high-speed I/O at the -4 speed grade, follow Lattice's recommended termination for LVDS and sub-LVDSI signaling. Keep differential pair lengths within 150 mils of each other and route over a continuous ground reference plane. Enable the on-chip programmable input delay or PLL for clock-data alignment above 100 MHz. The HE variant (LCMXO2-1200HE-4SG32C) is recommended when the design needs faster slew rates than -4 grade provides.
Compliance-Informationen
Per Lattice MachXO2 Family Data Sheet, all MachXO2 packages are halogen-free and RoHS compliant. AEC-Q100 qualification is not applicable for -SG32C commercial-grade parts; industrial -SG32I parts offer extended temperature but are still not AEC-Q100 qualified.
