LCMXO2-640HC-6TG100I - 640 LUTs MachXO2 FPGA, 100-TQFP | Lattice
Teilenummer: LCMXO2-640HC-6TG100I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $19.54 | $19,54 |
| 10 | $17.5 | $175,00 |
| 100 | $14.2 | $1.420,00 |
| 500 | $11.85 | $5.925,00 |
| 1.000 | $9.95 | $9.950,00 |
LCMXO2-640HC-6TG100I Übersicht
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O cells that can be reconfigured by the designer after manufacturing. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the design flexibility hierarchy, offering hardware-level parallelism, deterministic timing, and rapid prototyping. The MachXO2 series specifically targets low-power, glue-logic, and I/O expansion roles in cost-sensitive industrial, consumer, and communications designs.
The LCMXO2-640HC-6TG100I uses Lattice's non-volatile E2CMOS technology with FlashBAK configuration memory, providing instant-on functionality at power-up in microseconds, eliminating external configuration PROM and reducing bill-of-material cost. Embedded block RAM (EBR), distributed RAM, and dedicated PLL/clock-management hardware support typical interfaces such as I2C, SPI, UART, parallel RGB, and LVDS. Transceiver logic, PLL blocks, and JTAG/SPI Slave configuration ports round out a comprehensive peripheral set.
Typical applications include I/O bridging and protocol translation in industrial control, control logic for portable and handheld products, glue logic and bus extension in telecom line cards, LED display control and backplane multiplexing, and low-cost FPGA prototyping. The 100-TQFP industrial-grade part is particularly suited to harsh-environment designs where plastic-ball-grid-array packages are impractical for hand-rework.
When designing with the MachXO2, use Lattice Diamond software for synthesis, place-and-route, and bitstream generation. The 100-TQFP package is pin-compatible within the MachXO2 family across the ZE/HC/HE variants, enabling design migration between density and performance grades without PCB rework.
A unique benefit of this product page is the integration of current distributor pricing, drop-in same-package alternatives within the MachXO2 family, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für LCMXO2-640HC-6TG100I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit LCMXO2-640HC-6TG100I (gleiche Bauform und Footprint) – abweichend in Configuration Memory, Mounting Type, Operating Temperature, Package, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
LCMXO2-640HC-6TG100C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LCMXO2-1200HC-6TG100I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LCMXO2-2000HC-6TG100I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LCMXO2-4000HC-6TG100I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LCMXO2-640HC-6BG256I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LCMXO2-640HC-6TG100I Grenzwerte & elektrische Eigenschaften
| Series | MachXO2 |
| Number of Logic Elements / Cells | 640 LUTs |
| Number of I/O | 79 |
| Number of Macrocells | 320 |
| Embedded User Flash Memory | 18432 bits |
| Operating Voltage (Core) | 2.5 V / 3.3 V |
| I/O Voltage | 1.2 V to 3.3 V |
| Speed Grade | -6 |
| Gehäuse | 100-pin TQFP (TG100) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +85C (Industrial) |
| Programmable Type | In System Programmable |
| Configuration Memory | Non-volatile E2CMOS (FlashBAK) |
| RoHS-Status | Compliant |
| Lead Free Status | Lead Free |
LCMXO2-640HC-6TG100I 100-pin tqfp (tg100) Pinbelegungsleitfaden
Pinbelegung für LCMXO2-640HC-6TG100I (100-pin tqfp (tg100)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für LCMXO2-640HC-6TG100I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
LCMXO2-640HC-6TG100I ist geeignet für 7 Anwendungs: I/O Bridging and Protocol Translation, Industrial Glue Logic Replacement, Portable Consumer Electronics Control, Telecom Line-Card I/O Expansion, LED Display Control and Multiplexing, Low-Cost FPGA Prototyping Platform, Automotive In-Cabin I/O Bridging.
I/O Bridging and Protocol Translation
The LCMXO2-640HC-6TG100I's 640 LUTs, 79 user I/O, and industrial temperature grade (-40C to +85C) make it ideal for I/O bridging between incompatible bus standards in industrial control systems. With 1.2V to 3.3V I/O voltage support and 3.3V core, the device can interface directly with legacy 5V-tolerant logic via external resistor dividers, eliminating level-shifters on the main board. The non-volatile FlashBAK configuration provides instant-on capability at power-up, critical for control loops that need deterministic start-of-frame timing. Companion MPNs include I/O expanders and level translators from TI and NXP that pair with the FPGA's general-purpose I/O.
Empfohlen
Industrial Glue Logic Replacement
The LCMXO2-640HC-6TG100I replaces discrete 74-series glue logic with a single integrated device, simplifying PCB layout and reducing BOM cost in industrial control boards. With 640 LUTs the part can absorb dozens of AND/OR/XOR/buffer functions, while the 100-TQFP package is hand-solderable and rework-friendly for prototypes and low-volume builds. The -6 speed grade delivers >150 MHz internal operation, comfortably handling fast control signals. Use it in motor-control gate-driver logic, sensor-multiplexing, and address-decoding tasks in factory-automation and process-control systems.
Empfohlen
Portable Consumer Electronics Control
The LCMXO2-640HC-6TG100I's low-power MachXO2 architecture and non-volatile configuration enable instant-on behavior in portable consumer devices, from handheld scanners to point-of-sale terminals. 18432 bits of embedded user flash can store design constants, calibration data, and user preferences without external EEPROM. The 100-TQFP package is footprint-compatible with higher-density family members, so product lines can scale from 640 LUTs to 4000 LUTs on the same PCB as feature sets expand. Pair with a low-power microcontroller for application processing and use the FPGA for display timing, keypad scanning, and battery-management glue.
Empfohlen
Telecom Line-Card I/O Expansion
The LCMXO2-640HC-6TG100I with 79 user I/O and industrial temperature grade serves well in telecom line-card designs for front-panel LED control, bus multiplexing, and alarm/status aggregation. The device's FlashBAK instant-on and 1ms configuration time meet telecom shelf-power-cycle requirements without external boot PROM. The 100-TQFP package fits densely populated line cards, and the -6 speed grade handles 50 MHz+ control-plane interfaces with margin. Pair with a TI Sitara or NXP Layerscape processor for the main CPU and use the FPGA to offload I/O-intensive tasks.
Empfohlen
LED Display Control and Multiplexing
The LCMXO2-640HC-6TG100I drives LED matrix panels and large seven-segment displays with its 640 LUTs and 79 I/O, providing scan-row generation, PWM dimming, and brightness-correction logic in a single chip. The non-volatile instant-on feature ensures the display controller comes up in a known state at power-on, eliminating visual glitches during boot. The 100-TQFP industrial-grade package handles outdoor signage thermal cycles. The -6 speed grade supports >100 MHz internal operation, enabling high-MUX scan rates for flicker-free refresh on panels up to 64x32 RGB.
Empfohlen
Low-Cost FPGA Prototyping Platform
The LCMXO2-640HC-6TG100I is a popular entry point for designers learning FPGA design or prototyping logic before committing to higher-cost families. The 100-TQFP package and JTAG/SPI Slave configuration interface make it breadboard- and breakout-board-friendly, while the 18432-bit embedded flash supports multiple bitstream revisions for A/B comparison. Lattice Diamond's free version supports this device, lowering the barrier to entry. Use it to prototype bus controllers, glue logic, or simple state machines that may later migrate to a higher-density MachXO2, ECP5, or Certus-NX part on the same footprint.
Empfohlen
Automotive In-Cabin I/O Bridging
The LCMXO2-640HC-6TG100I's industrial -40C to +85C temperature range makes it suitable for in-cabin automotive applications such as HVAC control modules, mirror-adjust logic, and infotainment backplane multiplexing. With 79 user I/O it can absorb multiple serial-to-parallel and parallel-to-serial conversion tasks that would otherwise require discrete logic. The instant-on non-volatile configuration eliminates boot delays on accessory power rails. Note that for under-hood or safety-critical AEC-Q100 requirements, the LCMXO2-640ZE-1TG100C or MachXO3 automotive-grade variants are recommended instead.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für LCMXO2-640HC-6TG100I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | LCMXO2-640HC-6TG100C | LCMXO2-1200HC-6TG100I | LCMXO2-2000HC-6TG100I | LCMXO2-4000HC-6MG132I |
|---|---|---|---|---|---|
| Package | 100-pin TQFP (TG100) | 100-pin TQFP (TG100) - same | 100-pin TQFP (TG100) - same | 100-pin TQFP (TG100) - same | 132-ball BGA (NOT same package) |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Logic Capacity (LUTs) | 640 | 640 (same) | 1200 (+88%) | 2000 (+213%) | 4000 (+525%) |
| User I/O | 79 | 79 | 73 (-8%) | 73 (-8%) | 104 (different package) |
| Speed Grade | -6 | -6 (same) | -6 (same) | -6 (same) | -6 (same) |
| Operating Temperature | -40C to +85C (Industrial) | 0C to +85C (Commercial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Embedded User Flash | 18432 bits | 18432 bits | 65536 bits (+255%) | 65536 bits (+255%) | 94208 bits (+411%) |
| Configuration Memory | Non-volatile E2CMOS (FlashBAK) | Non-volatile E2CMOS | Non-volatile E2CMOS | Non-volatile E2CMOS | Non-volatile E2CMOS |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade with same density as commercial variant (vs. LCMXO2-640HC-6TG100C)
- Same 100-TQFP footprint across 640 to 2000 LUT density range (vs. LCMXO2-1200HC-6TG100I / LCMXO2-2000HC-6TG100I)
- Non-volatile instant-on configuration eliminates external boot PROM (vs. SRAM-based FPGAs (e.g. Lattice ECP5, Xilinx Spartan-6))
Designhinweise
Estimated: at 3.3V core with typical 640-LUT utilization, the LCMXO2-640HC-6TG100I draws approximately 20-30 mA quiescent plus dynamic current proportional to toggle rate. The 100-TQFP package has a theta_JA of approximately 35 C/W, so 1W dissipation yields a 35C junction temperature rise above ambient. Decouple all VCC/VCCIO pins individually with 0.1 uF ceramic capacitors placed within 3 mm of each pin; add a single 10 uF bulk capacitor on each supply rail.
Route JTAG signals (TDI, TDO, TMS, TCK) with 50 ohm controlled impedance and keep trace length under 50 mm to ensure reliable programming and boundary-scan operation. Place the JTAG header at the board edge for easy probe access. Use a 4.7 kohm pull-up on TMS and TDI per the Lattice MachXO2 datasheet recommendation. Keep clock inputs away from switching I/O and route differential clock pairs with matched length within 0.5 mm.
Do not confuse the -6 (high-performance) speed grade with -4 or -5; the speed grade is part of the part number and cannot be changed after ordering. Verify the temperature grade suffix (I = industrial -40C to +85C, C = commercial 0C to +85C) matches the application's environmental requirements. The TG100 suffix indicates the 100-TQFP package; using the wrong package (e.g. BG256 BGA) will result in PCB redesign. Always regenerate the bitstream when migrating between density variants even when the package is the same.
For the 100-TQFP package, allocate a continuous ground plane on the layer directly beneath the device to provide low-impedance return paths. Use a 4-layer stack-up (signal-GND-VCC-signal) for best signal integrity on high-speed I/O. Place all decoupling capacitors on the same side as the FPGA, directly between the VCC pins and the nearest via to the ground plane. Avoid routing signals beneath the TQFP body to reduce coupling to the package paddle and ground bonds.
Compliance-Informationen
RoHS and REACH compliant per Lattice product page. Industrial temperature grade but not AEC-Q100 qualified - choose MachXO3 automotive grade for AEC-Q100 applications.
