LFE2-6E-6T144C - 6K LUT, 90 I/O FPGA | Lattice Semiconductor
Teilenummer: LFE2-6E-6T144C ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
LFE2-6E-6T144C Übersicht
A field-programmable gate array is a semiconductor whose configurable logic and interconnect resources implement digital functions after fabrication. An FPGA occupies the programmable-logic portion of the wider semiconductor hierarchy, above fixed-function logic ICs and below application-specific programmable systems. The ECP2 family combines programmable logic blocks, memory resources, digital signal processing capability, and general-purpose I/O in one reconfigurable device. This makes the LFE2-6E-6T144C useful when design rules change faster than a custom ASIC can be produced.
Key features include 6K LUTs, 6,320 cells, 90 I/O, a 1.2 V supply, and a -6 speed designation. The 144-pin TQFP package provides 144 external terminals in a surface-mount gull-wing format. Verified web results describe the part as an ECP2 FPGA with DSP capability, but detailed block counts, I/O standards, memory parameters, and timing values were not supplied in the retrieved evidence. Those values should therefore be confirmed against the manufacturer datasheet before a design is released.
The part’s architecture is appropriate for glue-logic implementations, protocol conversion, control-plane logic, parallel data acquisition, and compact embedded systems. Its 90 I/O count can reduce the need for external programmable peripherals when the board-level pin budget is constrained. The -6 designation identifies the manufacturer’s speed grade, while the commercial C suffix appears in the ordering code; the retrieved evidence does not provide the exact commercial-temperature limits.
Typical uses include industrial controllers, sensor aggregation modules, test equipment, embedded communications bridges, and compact control systems. A 1.2 V FPGA core simplifies power partitioning when the surrounding board already includes a 1.2 V rail, but external interface voltage levels must be selected independently and checked against the actual I/O specifications. The 144-pin package is larger than common QFN options, so PCB area and routing resources must be included in the mechanical design.
For a new board, place the FPGA close to its clocks, decoupling network, configuration interface, and high-speed I/O routes. Keep power and ground connections short, follow the manufacturer’s recommended land pattern, and validate signal integrity for any external interface. This page consolidates verified distributor specifications, procurement information, replacement analysis, and engineering guidance rather than repeating only the part-number description.
Drop-in-Alternativen für LFE2-6E-6T144C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit LFE2-6E-6T144C (gleiche Bauform und Footprint) – abweichend in Package, Package Code, Speed Grade, DSP Support, Logic Cells.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
LFE2-6E-6TN144C
✅ Drop-In✓ Auf Lager
$21.4 / Stück
Datenblatt ansehen →LFE2-6E-7TN144C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LFE2-6E-7TN144I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LFE2-12E-6T144I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LFE2-6E-6T144C
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →LFE2-6E-6T144C Grenzwerte & elektrische Eigenschaften
| Device Type | ECP2 Field Programmable Gate Array (FPGA) |
| Logic Cells | 6,320 cells |
| Lookup Tables | 6K LUTs |
| I/O Count | 90 I/O |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -6 |
| Process Technology | 90 nm |
| Gehäuse | 144-pin TQFP |
| Terminal Count | 144 terminals |
| Package Code | LFQFP |
| Montagestil | Surface mount |
| Terminal Form | Gull wing |
| Package Shape | Square |
| DSP Capability | DSP |
LFE2-6E-6T144C square Pinbelegungsleitfaden
Pinbelegung für LFE2-6E-6T144C (square-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für LFE2-6E-6T144C.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
LFE2-6E-6T144C ist geeignet für 6 Anwendungs: Industrial Control Logic, Sensor Aggregation, Protocol Conversion, Test and Measurement, Embedded Communications Bridge, Compact Embedded Platform.
Industrial Control Logic
The LFE2-6E-6T144C fits compact industrial control systems that need programmable timing, state management, and multiple external signals. Its verified 6K LUT capacity and 90 I/O provide room for sequencing logic, machine-state tables, interlocks, and interface conditioning without moving every function into an ASIC. The 144-pin TQFP provides a generous physical pin count for control signals and supports surface-mount manufacturing. Because the retrieved evidence does not provide the operating-temperature range, the design should use the device only when its verified temperature grade meets the enclosure environment.
Empfohlen
Sensor Aggregation
The FPGA is suitable for combining signals from multiple sensors before forwarding them to a processor or communications module. The 90 I/O count allows parallel digital inputs, interrupt outputs, and control signals to be consolidated in one programmable device, while the 6K LUT capacity supports sampling control, filtering, threshold logic, and data packing. The 1.2 V core should be planned alongside level-shifting or mixed-signal interface components because the verified data specifies the core supply but not the complete I/O voltage matrix. Confirm pin assignments and timing in the manufacturer datasheet.
Empfohlen
Protocol Conversion
LFE2-6E-6T144C can be used for protocol conversion when two interfaces require different framing, timing, or signal formats. Programmable logic can translate parallel bus behavior, generate handshake signals, and manage data buffering without a dedicated bridge IC for every format. The 6K LUT capacity and DSP designation provide moderate implementation room, but actual protocol throughput depends on the clock, I/O standards, timing constraints, and selected pin mapping. The verified sources do not supply complete timing tables, so timing closure must be performed with the official ECP2 documentation.
Empfohlen
Test and Measurement
The device is appropriate for programmable test systems that coordinate instrument control, trigger sequencing, status reporting, and data capture. A 6K LUT FPGA can implement timing generators, pattern logic, counters, and interface state machines, while 90 I/O can connect multiple control and measurement signals. The 144-pin TQFP footprint leaves room for a larger external interface than a compact QFN device. The verified evidence does not establish differential I/O rates, clock tolerance, or temperature limits, so these parameters require direct confirmation before high-speed test equipment is released.
Empfohlen
Embedded Communications Bridge
The LFE2-6E-6T144C can bridge embedded serial or parallel interfaces by combining endpoint logic, buffering, and control in one FPGA. Its 6K LUT capacity is suitable for moderate protocol engines, while 90 I/O supports multiple chip-select, clock, enable, and data signals. The 1.2 V core can share a board-level rail with other digital circuitry, but external transceivers remain necessary for physical-layer signals. Engineers should validate clock domain crossings, I/O voltage compatibility, and protocol timing against the actual datasheet.
Empfohlen
Compact Embedded Platform
The device can serve as the programmable-logic core of a compact embedded platform when a microcontroller leaves insufficient I/O or peripheral flexibility. The FPGA can implement boot-time peripherals, display-control logic, keypad scanning, timing, or custom bus masters around a host processor. Its 90 I/O and 144-pin package make board routing easier to plan than a very small fine-pitch package, although the larger footprint increases PCB area. The verified sources do not provide detailed power consumption, I/O standards, or package thermal data, so those values should be obtained before final schematic release.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für LFE2-6E-6T144C – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | LFE2-6E-6TN144C | LFE2-6E-7TN144C | LFE2-6E-7TN144I | LFE2-12E-6T144I |
|---|---|---|---|---|---|
| Package | 144-pin TQFP | 144-pin TQFP | 144-pin TQFP family package | 144-pin TQFP family package | 144-pin TQFP family package |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| FPGA Family | ECP2 | ECP2 family | ECP2 family | ECP2 family | ECP2 family |
| Logic Capacity | 6K LUTs; 6,320 cells | 6K LUTs; 6,320 cells | 6K LUT class | 6K LUT class | 12E density class |
| Speed Grade | -6 | -6 | -7 | -7 | -6 |
| Commercial Availability | Listed by DigiKey, Mouser, and Octopart | Listed by DigiKey, Mouser, and Octopart | Cross-reference result available | Comparison result available | Cross-reference result available |
Wichtigste Unterscheidungsmerkmale
- Six-thousand LUT-class logic capacity (vs. LFE2-12E-6T144I)
- Direct -6 speed-grade positioning (vs. LFE2-6E-7TN144C)
- Verified 90-I/O integration (vs. LFE2-12E-6T144I)
- 144-pin TQFP board footprint (vs. LFE2-6E-6TN144C)
Designhinweise
The verified core supply is 1.2 V, so the power tree should provide that rail with local decoupling and adequate sequencing. Estimated: because the verified data does not provide dynamic current, static current, or I/O loading, no power-dissipation or regulator-sizing calculation can be made responsibly. Confirm quiescent current, maximum I/O current, and recommended capacitor values in the manufacturer datasheet before selecting the supply.
Follow the official 144-pin TQFP land pattern exactly and keep the FPGA close to its bypass capacitors and clock components. Route power and ground planes to minimize loop area, especially around the 1.2 V core. The verified package data establishes the footprint class but does not provide pin locations, exposed-pad details, or recommended PCB geometry; use the datasheet package drawing for manufacturing.
Assign clock, configuration, and high-speed user signals only after checking the ECP2 timing and I/O standards in the manufacturer documentation. The verified 90 I/O count is useful for planning board-level connectivity, but it does not identify differential pairs, voltage standards, slew limits, or input thresholds. Use shortest practical routes, controlled impedance for external links, and series damping only after confirming the actual interface specification.
Do not treat LFE2-6E-6T144C, LFE2-6E-6TN144C, and other ECP2 144-pin listings as interchangeable solely because their package names match. Verify speed grade, temperature suffix, device density, pin assignment, configuration interface, and supply sequencing. The verified search results contain a close family candidate and several comparison MPNs, but they do not provide a complete manufacturer substitution table.
Compliance-Informationen
The supplied verified web data does not provide explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements. Obtain current compliance documentation from Lattice Semiconductor or the authorized distributor.
