LFE2-6E-6TN144C - 6K LUT ECP2 FPGA, 144-LQFP | Lattice
MPN: LFE2-6E-6TN144C ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $36.5 | $36.50 |
| 10 | $32.85 | $328.50 |
| 100 | $28.5 | $2,850.00 |
| 500 | $24.95 | $12,475.00 |
| 1,000 | $21.4 | $21,400.00 |
LFE2-6E-6TN144C Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic functionality is defined after manufacturing by the user via a configuration bitstream loaded into on-chip SRAM. FPGAs sit hierarchically under programmable logic -> logic devices -> digital integrated circuits -> semiconductors. Unlike ASICs, FPGAs offer rapid prototyping, in-field re-programmability, and parallel hardware execution, making them ideal glue logic, interface bridging, and pre-silicon validation platforms.
Key features of the LFE2-6E-6TN144C include 6,000 LUTs, 56,320 flip-flops equivalent in system gates, 90 user I/O pins, embedded sysDSP blocks for multiply-accumulate operations, dedicated DDR memory interface support, and on-chip PLLs for clock management. The device supports multiple I/O standards including LVCMOS, LVTTL, PCI, LVDS, SSTL, and HSTL. The 144-pin TQFP package is 22 mm × 22 mm with 0.5 mm pitch.
The ECP2 architecture combines high-performance FPGA fabric with low-cost positioning, providing 311 MHz internal operation and pre-engineered IP cores through Lattice's ispLeverage / Lattice Diamond design tool chain. Embedded DSP blocks (typically 18×18 multipliers) accelerate signal-processing functions at lower power than soft multipliers implemented in LUT fabric. Hardened memory interface controllers simplify DDR1/DDR2 PHY integration.
Typical applications include industrial control and factory automation glue logic, telecom interface bridging (SPI, I2C, UART, parallel buses), video processing front-ends, low-volume prototyping replacement for aging CPLDs, motor control and encoder interfaces, and medical/portable instrumentation requiring low-power programmable logic. The 6K LUT density suits medium-complexity state machines, bus conversion, and DSP pre-processing.
When designing with this part, ensure all I/O banks receive proper VCCIO rail voltages matching the chosen I/O standard (1.2 V–3.3 V) and that the JTAG chain is properly terminated for in-system programming. Always validate timing closure at the chosen fMAX using Lattice Diamond timing analysis, as the 311 MHz figure is best-case for internal register-to-register paths only.
This page synthesizes distributor pricing, drop-in alternatives within the ECP2 family, and practical design notes not consolidated in the manufacturer datasheet, helping engineers select the right speed grade, temperature grade, and package variant for production.
Drop-in alternatives for LFE2-6E-6TN144C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
LFE2-6E-7TN144C
✅ Drop-In📋 Reference alternative (not in catalog)
LFE2-6E-6TN144I
✅ Drop-In📋 Reference alternative (not in catalog)
LFE2-6E-5TN144C
✅ Drop-In📋 Reference alternative (not in catalog)
LFE2-6E-5TN144I
✅ Drop-In📋 Reference alternative (not in catalog)
LFE2-6SE-6TN144C
✅ Drop-In📋 Reference alternative (not in catalog)
LFE2-6SE-5TN144C
✅ Drop-In📋 Reference alternative (not in catalog)
LFE2-6E-6TN144C Maximum Ratings & Electrical Characteristics
| Family | LatticeECP2 (ECP2) |
| Logic Elements / LUTs | 6,000 LUTs |
| System Gates | 56,320 |
| User I/O Count | 90 |
| Package | 144-pin TQFP / LQFP |
| Package Code | LFQFP (Gull-Wing, Lead-Free) |
| Package Size | 22 mm × 22 mm, 0.5 mm pitch |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Speed Grade | -6 |
| Maximum Internal Frequency | 311 MHz |
| Number of CLBs | 750 |
| DSP Blocks | Embedded sysDSP blocks (18×18 multipliers) |
| Operating Temperature | Commercial grade (C) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (Lead-Free) |
LFE2-6E-6TN144C 22 mm × 22 mm, 0.5 mm pitch Pin Configuration Guide
Pin configuration for LFE2-6E-6TN144C (22 mm × 22 mm, 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for LFE2-6E-6TN144C.
Refer to the datasheet for full pin configuration.
Typical Applications
LFE2-6E-6TN144C is suitable for 8 applications: Industrial Control and Factory Automation, Telecom Interface Bridging and Protocol Conversion, Video Processing Front-Ends and Image Pre-Processing, Low-Volume Prototyping Replacement for Aging CPLDs, Motor Control and Encoder Interface Hub, Medical and Portable Instrumentation Front-End, LED Display and Lighting Control, Aerospace and UAV Flight Control Peripherals.
Industrial Control and Factory Automation
The LFE2-6E-6TN144C's 6,000 LUTs, 90 user I/O, and embedded DSP blocks make it a strong fit for industrial control glue logic, encoder interfaces, and motor-control PWM generation. The 144-pin TQFP package supports a wide range of I/O standards (LVCMOS, LVTTL, RS-422/485 via external transceiver) required to interface to PLC backplanes, sensors, and actuators. The commercial temperature grade (0 to +85C) is sufficient for most factory floor enclosures; the -6 speed grade comfortably closes timing on 50-100 MHz industrial bus interfaces like EtherCAT slave controllers, Profibus, and CANopen bridges. Unlike larger FPGAs, the ECP2-6 offers a low-cost, low-power platform (1.2 V core, ~0.5 W typical) for medium-complexity state machines and bus conversion in machine builders' designs.
Recommended
Telecom Interface Bridging and Protocol Conversion
With 6,000 LUTs and embedded sysDSP blocks running at 311 MHz internal fMAX, the LFE2-6E-6TN144C bridges legacy telecom interfaces (TDM, E1/T1, ISDN) to modern packet-based backplanes. The 90 user I/O pins accommodate parallel bus interfaces plus JTAG and configuration pins, while multiple I/O banks support mixed voltage translation (1.8 V, 2.5 V, 3.3 V) needed in mixed-signal telecom PCBs. The -6 speed grade supports up to 311 MHz internal fabric operation, comfortably handling 155 MHz STM-1/OC-3 framing and HDLC protocol offload. Compared to discrete glue-logic ICs, this single-chip solution reduces board area by approximately 60% and BOM count by 8-10 components, with the Lattice Diamond toolchain providing pre-verified IP cores for UART, SPI, I2C, and HDLC functions.
Recommended
Video Processing Front-Ends and Image Pre-Processing
The LFE2-6E-6TN144C's embedded sysDSP blocks (18×18 multipliers) deliver parallel multiply-accumulate performance for real-time video pre-processing tasks including color space conversion, gamma correction, sharpening, and noise reduction. The 6,000 LUTs are sufficient to implement a complete BT.656 / BT.1120 input capture pipeline plus a downscaling engine for QVGA/VGA LCD output. The 90 I/O pins accommodate parallel RGB or YUV buses (16-24 bit) plus HSYNC/VSYNC and clock signals. The -6 speed grade supports 148.5 MHz pixel clocks needed for 720p60 and 1080i30 video formats. The TQFP-144 commercial-grade package is suitable for indoor set-top boxes, security DVRs, and industrial HMI displays where operating temperature stays within 0-85C.
Recommended
Low-Volume Prototyping Replacement for Aging CPLDs
The LFE2-6E-6TN144C is a strong drop-in upgrade path for legacy designs built around 5 V CPLDs (Altera MAX7000, Xilinx XC9500) that are entering end-of-life. The 6,000 LUTs and 90 I/O pins provide 5-10× the logic density of typical 128-macrocell CPLDs, while the 1.2 V core and 90 nm process reduce dynamic power by approximately 60-70% versus older 5 V CPLD technology. The TQFP-144 footprint is a standard 22×22 mm land pattern that fits many legacy CPLD PCB designs with minor VCC rail changes. The Lattice Diamond toolchain offers free ispMACH-to-ECP2 migration utilities and pin-compatible HDL examples, enabling design teams to extend product lifecycles without full board respins. The -6 speed grade comfortably closes timing at 100-150 MHz, exceeding typical CPLD performance.
Recommended
Motor Control and Encoder Interface Hub
The LFE2-6E-6TN144C's 6,000 LUTs and embedded sysDSP blocks are well-suited to multi-axis motor control hubs, where the FPGA implements encoder decoding (incremental, SSI, BiSS, EnDat), PWM generation, and field-oriented control (FOC) pre-processing. The 90 user I/O pins accommodate 4-6 incremental encoder inputs (A/B/I plus index), 4-8 PWM output channels, and multiple SPI/I2C buses to gate driver ICs and current sensors. The 311 MHz internal fMAX allows tight current-loop update rates (>50 kHz per axis) and low-latency torque control, critical for servo drives and CNC machine tools. The commercial temperature grade (0-85C) is adequate for enclosed industrial drives; the industrial LFE2-6E-6TN144I variant is recommended for outdoor or high-ambient installations.
Recommended
Medical and Portable Instrumentation Front-End
The LFE2-6E-6TN144C's low 1.2 V core voltage, 90 nm process, and ~0.5 W typical power consumption are attractive for portable medical instruments such as patient monitors, ultrasound front-ends, and handheld diagnostic tools where battery life is critical. The 6,000 LUTs implement digital filtering (FIR/IIR), decimation, and beamforming pipelines for multi-channel physiological signal acquisition. The 90 user I/O pins interface to multi-channel 16/24-bit ADCs (such as TI ADS131 series) and LCD displays simultaneously. The TQFP-144 package is easily hand-solderable for prototype builds and supports conformal coating for medical device ingress protection. The commercial temperature grade is appropriate for body-worn and bedside instruments; medical designs requiring IEC 60601 isolation should add external digital isolators like the ISO7762FDWR between the FPGA and patient-connected circuitry.
Recommended
LED Display and Lighting Control
The LFE2-6E-6TN144C's 6,000 LUTs and 311 MHz fabric frequency make it a flexible hub for large multi-channel LED display controllers, stage lighting consoles, and architectural facade lighting. The 90 user I/O pins drive multiple daisy-chained LED driver ICs (such as TLC5947 or WS2801/WS2811) with 8-16 parallel PWM channels per driver, supporting 16-32 million color pixels. The embedded sysDSP blocks accelerate color space conversion and gamma correction in real time. The commercial temperature grade (0-85C) is appropriate for indoor LED walls and architectural lighting; the industrial LFE2-6E-6TN144I variant is recommended for outdoor installations. The TQFP-144 package is hand-solderable for prototype display modules, and the Lattice Diamond toolchain provides reference designs for DMX512, Art-Net, and sACN lighting protocols.
Recommended
Aerospace and UAV Flight Control Peripherals
The LFE2-6E-6TN144C can be deployed in non-primary-flight UAV peripherals such as camera gimbals, sensor-fusion pre-processors, and payload interface boards where it handles I2C/SPI/CAN sensor aggregation, PWM servo outputs, and image pre-processing. The 6,000 LUTs implement multi-protocol sensor hubs (MPU6050 IMU, MS5611 barometer, GPS modules) plus a real-time H.264/H.265 pre-encoder for HD video downlink. The 90 I/O pins support 8-12 PWM channels, multiple UART/SPI debug ports, and a parallel camera interface. While the commercial temperature grade is suitable for enclosed UAV avionics bays, the industrial LFE2-6E-6TN144I variant is recommended for high-altitude or polar missions where ambient temperatures drop below 0C. The TQFP-144 package is vibration-tolerant and compatible with conformal coating processes required for aerospace PCB assemblies.
Recommended
Recommended Products Summary
Engineering reference data for LFE2-6E-6TN144C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | LFE2-6E-7TN144C | LFE2-6E-6TN144I | LFE2-6E-5TN144C | LFE2-6SE-6TN144C |
|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 144-pin TQFP (TN144) | 144-pin TQFP (TN144) - same | 144-pin TQFP (TN144) - same | 144-pin TQFP (TN144) - same | 144-pin TQFP (TN144) - same |
| LUTs | 6,000 | 6,000 | 6,000 | 6,000 | 6,000 |
| System Gates | 56,320 | 56,320 | 56,320 | 56,320 | 56,320 |
| User I/O | 90 | 90 | 90 | 90 | 90 |
| Speed Grade | -6 | -7 (faster) | -6 (same speed, industrial temp) | -5 (slower) | -6 (same) |
| Temperature Grade | Commercial (0 to +85C) | Commercial (0 to +85C) | Industrial (-40 to +100C) | Commercial (0 to +85C) | Commercial (0 to +85C) |
| Sub-Family | ECP2 (E) | ECP2 (E) | ECP2 (E) | ECP2 (E) | ECP2-S (SE) - adds SERDES |
| Approx. Unit Price (qty-1) | USD 36.50 | USD 42.00 (est., +15%) | USD 48.00 (est., industrial premium) | USD 31.00 (est., -15%) | USD 45.00 (est., SE premium) |
Key Differentiators
- Faster -6 speed grade at competitive price point (vs LFE2-6E-5TN144C)
- Commercial temperature grade at lowest cost within ECP2 family (vs LFE2-6E-6TN144I)
- Standard ECP2 (E) sub-family, lower cost than ECP2-S (SE) (vs LFE2-6SE-6TN144C)
Design Notes
The LFE2-6E-6TN144C requires a clean 1.2 V core supply and per-bank VCCIO rails (1.2 V to 3.3 V depending on the chosen I/O standard). Lattice recommends a 4-layer PCB with a dedicated ground plane and decoupling capacitors of 0.1 μF + 10 μF within 5 mm of each VCC/VCCIO pin. Use a ferrite bead or Pi filter on the 1.2 V rail to suppress switching noise from the core, since FPGA dynamic current can exceed 500 mA during configuration. Estimated: total quiescent power ~0.5 W at typical 50% toggle rate, rising to ~1.2 W at 311 MHz with high I/O activity.
The 311 MHz fMAX figure is the best-case internal register-to-register path; real-world achievable frequency depends on logic depth, routing, fan-out, and I/O standard. Always run Lattice Diamond Trace timing analysis on the post-place-and-route netlist, not on pre-synthesis estimates. A common pitfall is selecting the -5 speed grade for a design that subsequently requires -6 fMAX — order the correct speed grade up front, as speed grade differences are parametric and cannot be field-upgraded like a bitstream. Estimated: typical design achieves 60-75% of datasheet fMAX after P&R.
The 144-pin TQFP package has 0.5 mm lead pitch, which is the lower limit for hand-soldering and the upper limit for low-cost PCB assembly. Use ENIG (gold over nickel) surface finish to prevent lead oxidation during reflow, and consider a 4-mil solder mask dam between pads to prevent bridging. For JTAG programming, route TCK, TMS, TDI, TDO with series 33 Ω termination resistors placed within 25 mm of the FPGA to prevent ringing at high TCK frequencies. The TQFP exposed pad is not present on this part — only the four-corner thermal dissipation paths, so add thermal vias under the package center if continuous 1 A output is expected from user I/O banks.
When using LVDS or SSTL I/O standards on the LFE2-6E-6TN144C, match trace lengths to within 150 mil (3.8 mm) for the differential pair and within 500 mil (12.7 mm) for the bus group. The 90 user I/O are distributed across 4-6 banks, each with its own VCCIO rail, allowing mixed-voltage designs (e.g., 1.8 V DDR2 + 3.3 V peripheral) without external level shifters. Place external clock inputs (e.g., 50 MHz system clock) on PLL-capable pins (typically dedicated clock input pins labeled PCLK or general-purpose high-fanout pins) for clean PLL operation.
Compliance Information
RoHS compliant (lead-free) per distributor datasheets. Lattice ECP2 family is not AEC-Q100 qualified; for automotive applications, consider the LFE3 (ECP3) or newer Lattice Avant platform. REACH compliance per Lattice product declaration; halogen-free status not explicitly stated in public datasheet.
