LFE5UM-85F-8BG554C - ECP5 FPGA 84K LUTs SERDES 554-BGA | Lattice
Teilenummer: LFE5UM-85F-8BG554C ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $220 | $220,00 |
| 10 | $198 | $1.980,00 |
| 100 | $175 | $17.500,00 |
| 500 | $158 | $79.000,00 |
| 1.000 | $142 | $142.000,00 |
LFE5UM-85F-8BG554C Übersicht
An FPGA (Field Programmable Gate Array) is a class of programmable logic device that allows hardware designers to implement custom digital circuits via a configuration bitstream after manufacturing. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> complex programmable logic device (CPLD) -> FPGA -> system-on-chip (SoC). Lattice ECP5 specifically targets low-power, high-volume connectivity and acceleration applications, consuming roughly half the power of competing 40nm FPGAs.
Key differentiating features include 156 18x18 multipliers, 208 EBR (Embedded Block RAM) blocks at 9.4 Mbits usable memory, integrated 3.2 Gbps SERDES with hardened PCI Express Gen 2 and Gigabit Ethernet MAC blocks, and support for DDR3/LPDDR3 memory interfaces with hardened PHY. The device supports 1.1V core operation and offers multiple I/O standards including LVCMOS 1.2/1.5/1.8/2.5/3.3, LVDS, SSTL, and HSTL.
Architecturally, ECP5 uses Lattice's logic-cell fabric with 4-input LUTs, dedicated DSP slices for signal processing, and a programmable sysIO buffer system. The hardened SERDES and PCIe blocks reduce soft-logic resource consumption, allowing more design headroom for custom logic. The device supports 1000 Mbps Ethernet, DisplayPort 1.1a, and 7:1 LVDS interfaces natively.
Typical applications include small-cell baseband, industrial video and image processing, LED video walls, low-cost PCIe bridging cards, machine vision, and IoT edge acceleration. The combination of low static power (typically 0.5W), high integration, and high I/O count makes it well suited for cost-sensitive high-volume designs.
When designing with this device, ensure proper power-rail sequencing (VCC + 1.1V core must stabilize before VCCIO banks) and provide adequate decoupling. For SERDES applications, follow Lattice's reference design for 100-ohm differential routing and AC-coupling capacitor placement near the transmitter balls.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, accelerating the engineer's component selection process.
Drop-in-Alternativen für LFE5UM-85F-8BG554C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit LFE5UM-85F-8BG554C (gleiche Bauform und Footprint) – abweichend in Family, Mounting Type, SERDES Channels.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
LFE5UM-85F-8BG554I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
LFE5UM5G-85F-8BG554C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LFE5U-85F-6BG554C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LFE5U-85F-6BG554I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LFE5UM-85F-8BG554C Grenzwerte & elektrische Eigenschaften
| Family | LatticeECP5 |
| Series | LFE5UM |
| Logic Elements / Cells | 84000 |
| Number of LUTs | 83600 (83.6K) |
| Embedded Memory (EBR) | 3833856 bits (3.83 Mbit, 208 blocks) |
| Number of I/O | 259 |
| Supply Voltage - Core | 1.1 V |
| Supply Voltage - I/O Banks | 1.2 V to 3.3 V |
| Montageart | Surface Mount |
| Gehäuse / Bauform | 554-FBGA / cABGA-554 |
| Betriebstemperatur | 0C to +85C (Commercial) |
| Number of Multipliers (18x18) | 156 |
| SERDES Channels | Yes, integrated |
| SERDES Data Rate | Up to 3.2 Gbps |
| Process Technology | 40 nm CMOS |
| MSL-Level | 3 |
| RoHS-Status | Compliant |
LFE5UM-85F-8BG554C 554-fbga / cabga-554 Pinbelegungsleitfaden
Pinbelegung für LFE5UM-85F-8BG554C (554-fbga / cabga-554-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für LFE5UM-85F-8BG554C.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
LFE5UM-85F-8BG554C ist geeignet für 8 Anwendungs: Small-Cell Baseband Processing, Industrial Machine Vision, LED Video Wall Controllers, Low-Cost PCIe Bridge Cards, IoT Edge Acceleration, Automotive Infotainment (AEC-Q100 Variants), Software-Defined Radio (SDR) Front Ends, Medical Imaging Diagnostics.
Small-Cell Baseband Processing
The LFE5UM-85F-8BG554C fits small-cell baseband processing where its 84K LUTs and 156 18x18 multipliers deliver sufficient DSP throughput for LTE PHY-layer functions, while the integrated 3.2 Gbps SERDES handles the CPRI or OBSAI fronthaul link to the baseband unit. The 1.1V core and low static power (typically 0.5W) make it suitable for outdoor pico/femtocell deployments with passive thermal management.
Empfohlen
Industrial Machine Vision
The LFE5UM-85F-8BG554C serves as the image-processing engine in industrial machine-vision systems, leveraging 84K LUTs for Bayer-to-RGB conversion, lens distortion correction, and feature-extraction pipelines. Its 259 I/O support multiple Camera Link channels, while the hardened SERDES accepts gigabit Ethernet (GigE Vision) inputs directly. The 0C to +85C commercial grade is suitable for factory-floor enclosures with active cooling.
Empfohlen
LED Video Wall Controllers
The LFE5UM-85F-8BG554C drives high-density LED video walls by buffering and reformatting incoming DisplayPort or HDMI streams into parallel LVDS or HSTL channels for LED driver panels. The 3.83 Mbit embedded block RAM absorbs line-buffer traffic, while 259 I/O support a 32+ channel video pipeline. The integrated SERDES receives DisplayPort 1.1a natively, reducing the external component count and BOM cost.
Empfohlen
Low-Cost PCIe Bridge Cards
The LFE5UM-85F-8BG554C's hardened PCI Express Gen 2 controller (x1 or x2) enables cost-effective PCIe bridge cards that adapt legacy parallel interfaces to modern PCIe systems. The integrated 3.2 Gbps SERDES eliminates the need for external transceiver ICs, while 84K LUTs provide ample logic for protocol-translation firmware. The cABGA-554 package supports high-density PCB layouts.
Empfohlen
IoT Edge Acceleration
The LFE5UM-85F-8BG554C accelerates inference workloads at the IoT edge by offloading convolutional neural network (CNN) layers from a host microcontroller. The 156 18x18 multipliers and 3.83 Mbit block RAM execute quantized INT8 inference with sub-millisecond latency, while 1.1V core operation keeps the design within USB-power budgets. The device is also a fit for sensor-fusion preprocessing in robotics.
Empfohlen
Automotive Infotainment (AEC-Q100 Variants)
For automotive infotainment, the industrial-grade LFE5UM-85F-8BG554I variant in the same cABGA-554 package operates from -40C to +100C, suitable for cabin-mounted head units and rear-seat entertainment. The integrated SERDES receives LVDS camera inputs for surround-view systems, while the 259 I/O drives multiple display panels. Note: for under-hood or safety-critical applications, AEC-Q100-qualified Lattice parts in other packages are recommended.
Empfohlen
Software-Defined Radio (SDR) Front Ends
The LFE5UM-85F-8BG554C implements digital down-conversion (DDC), digital up-conversion (DUC), and channelization filters in software-defined radio front ends, leveraging 156 18x18 multipliers for FIR pulse-shaping and 3.83 Mbit EBR for sample buffering. The integrated 3.2 Gbps SERDES accepts high-speed ADC outputs directly, while 1.1V core operation suits battery-powered tactical radios.
Empfohlen
Medical Imaging Diagnostics
The LFE5UM-85F-8BG554C serves as the image-processing pipeline in portable medical imaging systems such as ultrasound and endoscopy, where its 84K LUTs perform real-time beamforming and pixel interpolation. The integrated SERDES ingests data from high-speed analog front-ends, while the 3.83 Mbit block RAM buffers raw frames. The 0C to +85C commercial grade suits controlled clinical environments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für LFE5UM-85F-8BG554C – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | LFE5UM-85F-8BG554I | LFE5UM5G-85F-8BG554C | LFE5U-85F-6BG554C | LFE5U-85F-6BG554I |
|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 554-FBGA (cABGA-554) | 554-FBGA (cABGA-554) - same | 554-FBGA (cABGA-554) - same | 554-FBGA (cABGA-554) - same | 554-FBGA (cABGA-554) - same |
| Logic Cells / LUTs | 84000 cells / 83.6K LUTs | 84000 cells / 83.6K LUTs | 84000 cells / 83.6K LUTs | 84000 cells / 83.6K LUTs | 84000 cells / 83.6K LUTs |
| SERDES | Yes, 3.2 Gbps | Yes, 3.2 Gbps | Yes, 5 Gbps | No SERDES | No SERDES |
| PCIe Hardening | PCIe Gen 2 | PCIe Gen 2 | PCIe Gen 2 | None | None |
| Temperature Grade | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Embedded Block RAM | 3.83 Mbit (208 EBR) | 3.83 Mbit (208 EBR) | 3.83 Mbit (208 EBR) | 3.83 Mbit (208 EBR) | 3.83 Mbit (208 EBR) |
| Multipliers (18x18) | 156 | 156 | 156 | 156 | 156 |
| User I/O | 259 | 259 | 259 | 259 | 259 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
Wichtigste Unterscheidungsmerkmale
- Integrated 3.2 Gbps SERDES with hardened PCIe Gen 2 (vs. LFE5U-85F-6BG554C)
- Largest ECP5 logic-density tier with 84K LUTs (vs. LFE5UM-45F-8BG554C (lower-density variant))
- 259 user I/O - highest in ECP5 family (vs. LFE5UM-85F-7BG554C (different speed grade, same density))
Designhinweise
Estimated: The LFE5UM-85F-8BG554C requires multiple power rails - 1.1V core (VCC), 1.2V-3.3V VCCIO for I/O banks, and 1.2V/2.5V auxiliary supplies. Power-rail sequencing is critical: the 1.1V core must stabilize before VCCIO to prevent I/O driver latch-up. Use a dedicated FPGA supervisor (e.g., Lattice POWR1014 or discrete RC delay) to enforce sequencing, and place 10uF + 0.1uF + 1nF decoupling networks within 5mm of each power ball.
Estimated: At 100% utilization with 3.2 Gbps SERDES active, the device dissipates approximately 1.5-2.5W. The cABGA-554 package has theta_JA around 15-20 C/W (with standard 4-layer PCB and minimal copper pour), giving a junction-temperature rise of 25-50C above ambient. For continuous operation near 85C ambient, attach a 10x10mm copper pad array directly under the BGA and use 0.5 m/s airflow. Without airflow, de-rate operating temperature to 70C ambient.
The 554-ball cABGA has a 0.8mm ball pitch requiring laser-drilled microvias on a high-density-interconnect (HDI) PCB stack-up. Use a 1-2-1 or 1-2-2-1 layer structure with 0.5oz copper on outer layers. For SERDES traces, maintain 100-ohm differential impedance with matched-length pairs (within 5 mils). Place AC-coupling capacitors within 5mm of the transmitter balls, using 0402-size 100nF X7R capacitors.
Common pitfalls when designing with the LFE5UM-85F-8BG554C: (1) Do not enable SERDES channels without first providing a stable reference clock - configuration errors result in non-functional links. (2) The INITN pin must be pulled high to VCCIO_0 via a 4.7kohm resistor to ensure proper configuration at power-up. (3) The PROGRAMN pin requires a 10kohm pull-up. (4) LVDS I/O requires external 100-ohm differential termination across each pair. (5) Do not exceed 3.3V on any VCCIO bank - higher voltages damage the I/O cells.
Compliance-Informationen
RoHS and REACH compliant per Lattice product page and LCSC listing. Standard part is commercial grade (0C to +85C) and not AEC-Q100 qualified - for automotive, use industrial-grade variant or Lattice's dedicated automotive ECP5 family members. Conflict-minerals compliance per Lattice supplier declarations.
