LPC55S28JBD64E - 150MHz Cortex-M33 MCU 512KB Flash | NXP
Teilenummer: LPC55S28JBD64E ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.28 | $5,28 |
| 10 | $4.74 | $47,40 |
| 100 | $4.22 | $422,00 |
| 500 | $3.79 | $1.895,00 |
| 1.000 | $3.44 | $3.440,00 |
LPC55S28JBD64E Übersicht
A microcontroller (MCU) is a single-chip integrated circuit that combines a processor core, memory, and programmable peripherals into one device, forming the compute layer of an embedded system. The LPC55S28 belongs to the LPC552x/S2x family within NXP's EdgeVerse edge computing platform, part of the broader hierarchy of Cortex-M general-purpose MCUs that target power-efficient, deterministic real-time control.
Key features include a dual-bank flash architecture supporting live firmware updates, a Memory Protection Unit (MPU), an Arm Cortex-M33 built-in Nested Vectored Interrupt Controller (NVIC), and a non-maskable interrupt (NMI) input with selectable sources. The secure S-series variant integrates Arm TrustZone technology and NXP's PUF (Physically Unclonable Function) based security subsystem, enabling root-of-trust and secure firmware update flows.
Technically, the LPC55S2x family is manufactured on a cost-effective 40-nm NVM process, delivering high efficiency at 150 MHz while keeping active current low. The family offers pin-, software-, and peripheral-compatibility across memory variants, which simplifies migration from smaller to larger flash densities without PCB rework. Peripherals typically include high-speed USB, multiple SPI, I2C, and UART interfaces, flexible timers, and a 12-bit ADC, supporting deterministic real-time behavior required in industrial control.
Typical applications include industrial motor control and automation nodes, IoT edge devices requiring hardware security, and consumer or computing accessories such as sensor hubs and USB peripherals. The 64-pin HTQFP with 10 x 10 mm body offers a practical balance of GPIO count and board area.
Design consideration: use the dual-bank flash for in-field OTA updates and plan GPIO allocation early, since pin functions are multiplexed through a flexible switch matrix.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für LPC55S28JBD64E – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit LPC55S28JBD64E (gleiche Bauform und Footprint) – abweichend in Core Processor, Interrupt Controller, Package, Flash Memory, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
LPC55S26JBD64E
✅ Drop-In✓ Auf Lager
$3.02 / Stück
Datenblatt ansehen →LPC5528JBD64E
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
LPC5526JBD64E
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2.95 / Stück
Datenblatt ansehen →LPC55S16JBD64E
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
LPC55S69JBD64E
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
LPC55S28JBD64E Grenzwerte & elektrische Eigenschaften
| Core Processor | Arm Cortex-M33 |
| Core Size | 32-Bit |
| Maximale Taktfrequenz | 150 MHz |
| Flash Memory Size | 512 KB (512K x 8) |
| SRAM Size | 128 KB |
| Series | LPC55S2x |
| Gehäuse | 64-HTQFP (10x10 mm) |
| Montageart | Surface Mount |
| Security Features | TrustZone, PUF-based security (S-series) |
| Memory Protection Unit | Yes (MPU) |
| Interrupt Controller | NVIC with NMI input (selectable sources) |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 |
| Peak Reflow Temperature | 260 C |
| Maximum Time at Peak Reflow | 30 s |
| Terminal Finish | Tin (JESD-609 code e3) |
| RoHS-Status | Compliant (e3 lead-free finish) |
| Process Technology | 40 nm NVM |
LPC55S28JBD64E 64-htqfp (10x10 mm) Pinbelegungsleitfaden
Pinbelegung für LPC55S28JBD64E (64-htqfp (10x10 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für LPC55S28JBD64E.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
LPC55S28JBD64E ist geeignet für 6 Anwendungs: Industrial Motor Control, Secure IoT Edge Nodes, USB Peripheral Devices, Building Automation and HVAC Controllers, Test and Measurement Instruments, Medical and Health Monitoring Devices.
Industrial Motor Control
The LPC55S28JBD64E's deterministic 150 MHz Cortex-M33 core executes field-oriented control loops with DSP-enhanced instructions, while the MPU partitions safety-critical code from application logic. Its timer and ADC peripheral set supports high-resolution PWM generation and current-sense sampling for three-phase drives. Placed as the main control MCU with an isolated gate driver stage, it achieves the cycle times demanded by industrial servo and BLDC drives. The NMI input with selectable sources provides fast hardware fault shutdown, and the TrustZone-based secure series variant protects fieldbus authentication keys. With 512 KB dual-bank flash, firmware updates can be staged without halting the drive, reducing downtime in continuous-process equipment.
Empfohlen
Secure IoT Edge Nodes
The LPC55S28JBD64E fits IoT edge nodes that must authenticate to cloud services and protect firmware IP: the S-series integrates Arm TrustZone and NXP's PUF-based security for hardware root-of-trust, secure key storage, and encrypted over-the-air updates. The 150 MHz core leaves headroom for TLS stacks and sensor-fusion algorithms, while 512 KB dual-bank flash allows staging a new image before committing the swap. The 40 nm process keeps active current low enough for mains-independent nodes with duty-cycled radios. Communication typically uses SPI/I2C to sensors plus UART/SPI to a wireless module; the flexible pin multiplexing simplifies routing within the compact 10x10 mm HTQFP footprint on dense sensor boards.
Empfohlen
USB Peripheral Devices
With integrated USB device support and a 150 MHz core, the LPC55S28JBD64E serves as the main controller for USB-connected peripherals such as sensor hubs, audio interfaces, and programming probes. The LPC55 family's Cortex-M33 with DSP instructions handles audio streaming and CDC/HID class processing while leaving margin for application logic. The 512 KB flash accommodates composite USB class stacks plus application firmware, and 128 KB SRAM buffers endpoint data without external memory. The 64-pin HTQFP package offers enough GPIO for button matrices, LED indication, and side-band signaling around the USB interface. Dual-bank flash enables field firmware updates over the USB bus itself, a common requirement for accessorized consumer products.
Empfohlen
Building Automation and HVAC Controllers
The LPC55S28JBD64E is well suited to building automation nodes controlling dampers, valves, and VAV controllers: its 150 MHz real-time core runs PID loops deterministically, its 12-bit ADC digitizes temperature and pressure inputs, and the 512 KB flash holds protocol stacks such as BACnet or Modbus alongside the application. TrustZone security protects network credentials and supports secure commissioning, increasingly mandated in commercial building systems. The MPU isolates the communication stack from control logic for improved robustness, and the NMI input can latch hardware fault conditions from watch-dog or power-monitor circuitry. The 10x10 mm 64-pin HTQFP balances I/O count for relay/driver expansion against compact controller PCB area.
Empfohlen
Test and Measurement Instruments
Handheld and bench instruments benefit from the LPC55S28JBD64E's combination of a 150 MHz Cortex-M33 for measurement math, fast ADC interfaces, and generous 512 KB flash for calibration tables and UI code. The MCU manages front-end configuration, processes sampled data with DSP instructions, and drives displays and USB connectivity for data export. Dual-bank flash enables firmware field upgrades, important for instruments with evolving measurement features, and TrustZone protects calibration constants and licensing data from tampering. The 128 KB SRAM provides buffer space for waveform capture at moderate sample rates, while the MPU helps partition acquisition firmware from the user interface for deterministic timing during a measurement cycle.
Empfohlen
Medical and Health Monitoring Devices
Portable medical and health monitoring equipment uses the LPC55S28JBD64E for its low active power at 150 MHz, hardware security for patient-data protection, and sufficient compute for digital filtering of biopotential signals. The Cortex-M33 DSP instructions run IIR/FIR filtering for ECG/EEG signal conditioning, while the 12-bit ADC and flexible analog multiplexing sample sensor channels. TrustZone and PUF-based key storage help designs meet data-security expectations for connected health devices, and dual-bank flash allows validated firmware updates in the field without exposing the device to unauthenticated images. The 64-pin HTQFP provides enough I/O for display, buzzer, and multi-sensor front ends within a compact battery-powered enclosure.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für LPC55S28JBD64E – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | LPC55S26JBD64E | LPC5528JBD64E | LPC55S16JBD64E | LPC55S69JBD64E |
|---|---|---|---|---|---|
| Package | 64-HTQFP (10x10 mm) | 64-HTQFP (10x10) - same | 64-HTQFP (10x10) - same | 64-HTQFP (10x10) - same | 64-HTQFP (10x10) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Frequency | Cortex-M33, 150 MHz | Cortex-M33, 150 MHz | Cortex-M33, 150 MHz | Cortex-M33, 150 MHz | Cortex-M33, 150 MHz |
| Flash Memory | 512 KB | 256 KB | 512 KB | 256 KB | 1 MB |
| SRAM | 128 KB | 128 KB | 128 KB | 96 KB | 256 KB |
| Security (TrustZone/PUF) | Yes | Yes | No (non-secure series) | Yes | Yes |
| Dual-Bank Flash (OTA) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Active | Active | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Largest flash in the pin-compatible 64-pin secure series for this footprint (vs. LPC55S26JBD64E)
- Hardware security (TrustZone + PUF) at the same pinout as non-secure parts (vs. LPC5528JBD64E)
- Better memory balance than LPC55S16 at comparable cost (vs. LPC55S16JBD64E)
Designhinweise
The 64-pin HTQFP (10x10 mm, 0.5 mm pitch) requires a well-defined solder-mask-defined land pattern per the NXP datasheet footprint. Add a thermal relief via array under the center of the package where the die paddle sits if your layout allows. Keep the VDD/VSS decoupling network - typically 100 nF ceramics at each supply pin pair plus bulk capacitance - within 2-3 mm of the pins. The MSL-3 rating means opened reels must be reflowed within the floor-life window or baked per IPC/JEDEC moisture-reflow guidance to avoid popcorn cracking.
The LPC552x/S2x family uses separate supply domains (core regulator and I/O rails); follow the datasheet's recommended external component values for the on-chip regulator output capacitor exactly, as incorrect capacitance can cause startup or brown-out instability. Estimated: budget active current by measuring your application, since the 150 MHz core current depends on flash execution vs SRAM execution and peripheral activity; use the datasheet's typical active-mode figures plus peripheral estimates for battery-life calculations rather than maximum-table values.
Pin functions on the LPC55 family are assigned through a flexible switch matrix - do not assume legacy LPC pinmaps. Configure the switch matrix in MCUXpresso config tools before finalizing the schematic to verify each desired peripheral maps to physically available pins on the 64-pin package; some high-pin-count peripherals (e.g., full octal interfaces) are not routable on 64-pin parts. Also remember the SWD debug pins and ISP/boot pin states at reset, which determine boot source and can be disturbed by external pull values.
For USB or fast SPI interfaces routed from the 10x10 mm HTQFP, keep D+/D- as a 90-ohm differential pair with length matching, and place the series termination and common-mode choke near the connector. High-speed GPIO switching can couple into the analog front end; group analog pins (ADC inputs, VREF) away from switching GPIO in your pin plan and use the analog ground island strategy recommended in NXP application notes for the LPC55 series.
Compliance-Informationen
Terminal finish matte tin per JESD-609 code e3 (lead-free), MSL 3, peak reflow 260 C / 30 s per distributor part data. REACH and conflict-minerals declarations available in NXP environmental quality documents on the official product page.
