LS1012AXN7HKA - 800MHz Cortex-A53 MPU | NXP
Teilenummer: LS1012AXN7HKA ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $19.127 | $19,13 |
| 10 | $19.127 | $191,27 |
| 100 | $19.127 | $1.912,70 |
| 500 | $19.127 | $9.563,50 |
| 1.000 | $19.127 | $19.127,00 |
LS1012AXN7HKA Übersicht
What is an embedded network processor? An embedded network processor is a system-on-chip or microprocessor platform designed to manage network traffic while executing control-plane software. Its hierarchy includes processor, embedded processor, SoC, networking semiconductor, and power-management-aware embedded computing platform. The LS1012A combines a general-purpose Arm core with dedicated packet-forwarding hardware and interfaces including dual Gigabit Ethernet, PCIe, USB 3.0, USB 2.0, and SATA 3.
The verified distributor listing identifies the LS1012AXN7HKA as a single-core, 64-bit 800 MHz Cortex-A53 MPU. It also identifies a 1 GHz DDR3L memory class, QorIQ Layerscape positioning, and the extended-temperature grade. The NXP overview further describes the part for battery-backed or USB-powered, space-constrained networking and IoT applications where line-rate networking performance and low typical power are important.
Compared with a general application processor, this part emphasizes network I/O and packet handling rather than display, multimedia, or accelerator performance. The hardware packet-forwarding engine can offload routine traffic handling from the Cortex-A53 core, leaving more processor time for control software. The integrated dual Gigabit Ethernet and high-speed expansion interfaces make it suitable for compact gateways, routers, bridges, and industrial network equipment.
A primary design consideration is that this processor requires a complex platform: DDR3L memory, power rails, clocking, boot support, thermal management, and multilayer PCB routing must be designed together. The 211-ball FCLGA package is large and fine-pitch relative to simple leaded packages, so assembly capability, via-in-pad or escape routing, and thermal design should be reviewed before layout release.
This page consolidates NXP product positioning, distributor specifications, sourcing information, and engineering application guidance. It also distinguishes verified facts from parameters unavailable in the supplied data, avoiding assumptions about memory capacity, security configuration details, transceiver integration, or electrical limits that were not explicitly stated.
Drop-in-Alternativen für LS1012AXN7HKA – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit LS1012AXN7HKA (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Product Type, Mounting Type, Ethernet.
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LS1012AXN7HKA
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Datenblatt ansehen →LS1012AXN7HKA Grenzwerte & elektrische Eigenschaften
| Product Type | QorIQ Layerscape network microprocessor |
| Processor Core | Single-core Arm Cortex-A53 |
| Architecture | 64-bit ARM |
| Core Frequency | 800 MHz |
| Maximum Core Frequency | 1 GHz |
| Memory Class | DDR3L, 1 GHz |
| Ethernet | 2x Gigabit Ethernet |
| PCI Express | 1 interface |
| USB | 1x USB 3.0 and 1x USB 2.0 |
| SATA | 1x SATA 3 |
| Packet Processing | Hardware packet-forwarding engine |
| Security Configuration | Security disabled |
| Typical Power Dissipation | 1 W |
| Betriebstemperatur | -40 °C to +105 °C |
| Gehäuse | 211-FCLGA, 9.6 mm x 9.6 mm |
| Terminal Count | 211 terminals |
| Montageart | No-lead surface mount |
| Lebenszyklusstatus | End of Life |
LS1012AXN7HKA 211-fclga, 9.6 mm x 9.6 mm Pinbelegungsleitfaden
Pinbelegung für LS1012AXN7HKA (211-fclga, 9.6 mm x 9.6 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für LS1012AXN7HKA.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
LS1012AXN7HKA ist geeignet für 6 Anwendungs: Industrial IoT Gateway, Compact Ethernet Router, USB-Powered Network Bridge, Industrial Network Switch Control Plane, Battery-Backed Edge Network Device, Space-Constrained Network Appliance.
Industrial IoT Gateway
The LS1012AXN7HKA fits an industrial IoT gateway because it combines a single 64-bit Arm Cortex-A53 core running at 800 MHz with a hardware packet-forwarding engine and dual Gigabit Ethernet. Place the processor in the control-plane heart of the gateway while the packet engine handles routine traffic forwarding. Its verified -40 °C to 105 °C temperature range supports industrial environments, and the listed 1 W typical dissipation is useful when sizing thermal and power budgets. The design must account for the disabled security configuration, so authentication, secure update, and key protection should be implemented elsewhere if required.
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Compact Ethernet Router
The LS1012AXN7HKA is suited to a compact Ethernet router because its two Gigabit Ethernet interfaces provide a direct network-processing foundation and its hardware packet-forwarding engine can offload traffic handling from the Cortex-A53 core. The 800 MHz CPU remains available for routing control, management, diagnostics, and protocol services. The 9.6 mm by 9.6 mm FCLGA package reduces reliance on multiple discrete network controllers, but the board still needs DDR3L memory, regulated supplies, clocking, magnetics, and careful high-speed layout. Verify link-rate performance and thermal behavior against the final board design.
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USB-Powered Network Bridge
For a USB-powered network bridge, the LS1012AXN7HKA offers a useful combination of network acceleration and compact integration. The hardware packet-forwarding engine supports line-rate forwarding tasks while the Cortex-A53 core handles bridge configuration and management. USB 3.0 and USB 2.0 support can simplify connectivity to a host or storage device, while dual Gigabit Ethernet covers the network side. The verified 1 W typical-power figure is a useful initial system target, but engineers must include regulator losses, memory power, PHY power, and thermal rise before claiming compliance with a USB power budget.
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Industrial Network Switch Control Plane
The LS1012AXN7HKA can serve as the control-plane processor in a managed network switch when hardware forwarding, Ethernet integration, and an Arm software ecosystem are more important than display performance. The two Gigabit Ethernet ports support management and uplink or stacking-related functions, while the Cortex-A53 core handles configuration, telemetry, and control protocols. Its extended temperature range is advantageous for industrial cabinets, but the disabled security configuration must be addressed at the system level. Layout should separate high-speed Ethernet, DDR3L, and power paths while controlling the 211-FCLGA thermal and escape-routing requirements.
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Battery-Backed Edge Network Device
The LS1012AXN7HKA is appropriate for a battery-backed edge device when low typical processor power and network acceleration matter. The listed 1 W typical dissipation provides a starting point for battery sizing, but average consumption depends on CPU utilization, packet rates, DDR3L activity, Ethernet PHYs, and standby modes. Hardware packet forwarding can reduce software processing demand, improving suitability for power-constrained networking. Because the security configuration is disabled, a battery-backed product that stores credentials or updates firmware should include an external secure element or another hardware-root-of-trust mechanism.
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Space-Constrained Network Appliance
The LS1012AXN7HKA fits space-constrained appliances that need networking and general-purpose control in one processor platform. Its single Cortex-A53 core, hardware packet-forwarding engine, dual Gigabit Ethernet, PCIe, USB, and SATA interfaces reduce the need for several companion controllers. The processor is specified for -40 °C to 105 °C, making it suitable for harsh enclosure environments when the complete system thermal design is validated. The 211-FCLGA package is fine-pitch and not a simple through-hole replacement, so assembly, inspection, thermal vias, signal integrity, and manufacturing yield should be considered before committing to a compact board.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für LS1012AXN7HKA – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | LS1012AXN7HKA |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Package | 211-FCLGA (9.6mm x 9.6mm) | 211-FCLGA (9.6mm x 9.6mm) |
| Processor Core | Single-core Arm Cortex-A53 | Single-core Arm Cortex-A53 |
| Architecture | 64-bit ARM | 64-bit ARM |
| Rated Core Frequency | 800 MHz | 800 MHz |
| Maximum Core Frequency | 1 GHz | 1 GHz |
| Ethernet | 2x Gigabit Ethernet | 2x Gigabit Ethernet |
| High-Speed Interfaces | PCIe, USB 3.0, USB 2.0, SATA 3 | PCIe, USB 3.0, USB 2.0, SATA 3 |
| Memory | DDR3L, 1 GHz | DDR3L, 1 GHz |
| Typical Power | 1 W | 1 W |
| Operating Temperature | -40 °C to +105 °C | -40 °C to +105 °C |
| Security Configuration | Security disabled | Security disabled |
Wichtigste Unterscheidungsmerkmale
- Integrated network acceleration (vs. Generic Cortex-A53 MPU)
- Networking interface integration (vs. Generic Cortex-A53 MPU)
- Power and environmental positioning (vs. General-purpose application processor)
- Security trade-off (vs. Security-enabled network processor)
Designhinweise
Estimated: using the NXP-listed 1 W typical processor dissipation as a starting point, a design operating at 85 °C ambient with a 1 W package loss produces a heat load of 1 W before memory, PHYs, PMIC, and storage losses. If the selected thermal design has an effective system thermal resistance of 30 °C/W, the estimated temperature rise is 30 °C and the estimated junction temperature is 115 °C. This is only an estimate; use the manufacturer thermal data and actual board airflow before signoff.
The 211-FCLGA package on a 9.6 mm by 9.6 mm body creates a demanding escape-routing problem. Keep the DDR3L, Ethernet, PCIe, USB, SATA, and power connections on independently reviewed layers, and preserve the manufacturer’s recommended ball-map and reference-plane treatment. Estimated: if each high-speed net requires 0.15 mm trace width and 0.1 mm spacing, a full 211-ball escape cannot be assumed to route on one layer; use multilayer blind or buried via strategies only after stackup and return-path analysis.
Place thermal vias and exposed copper according to the NXP package mechanical and thermal recommendations, while checking whether the selected PCB stackup can distribute heat from the FCLGA center. Do not rely on the 1 W typical figure as a worst-case limit. Validate the final assembly across -40 °C to +105 °C operating range, including processor activity, memory traffic, Ethernet transmit activity, enclosure temperature, and neighboring component heating.
Do not substitute a generic Cortex-A53 processor or a different networking SoC solely from CPU frequency. A drop-in decision must match the 211-FCLGA footprint, ball map, DDR3L interface, I/O voltage domains, clocking, boot behavior, thermal constraints, and security configuration. The verified cross-reference search did not identify a different drop-in MPN, so any redesign alternative should be treated as a new platform until the manufacturer datasheet and mechanical data prove otherwise.
Compliance-Informationen
The supplied verified web data does not explicitly state compliance or automotive qualification. Obtain current NXP material-compliance and quality documentation for the ordered MPN.
