S912XEG384J2CAL - 16-bit HCS12X MCU, 384KB Flash | NXP (Tape & Reel)
Teilenummer: S912XEG384J2CAL ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.2 | $132,00 |
| 100 | $11.8 | $1.180,00 |
| 500 | $10.4 | $5.200,00 |
| 1.000 | $9.1 | $9.100,00 |
S912XEG384J2CAL Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (RAM), and a rich set of peripherals such as timers, ADCs, communication controllers, and GPIO. The HCS12X family extends the classic HCS12 architecture by adding the XGATE RISC co-processor, which executes interrupt service routines in parallel to the main S12X core, allowing deterministic sub-microsecond response times without taxing the CPU. Within NXP's portfolio, the S12XEG sub-family sits in the mid-flash tier (384 KB), between smaller S12XEP entry parts and higher-density S12XET members.
Key features include a 50 MHz S12X core, an XGATE co-processor for offloaded interrupt handling, an enhanced CAN (MSCAN) interface, up to 91 GPIO lines, a 12-bit SAR ADC with up to 24 channels, multiple SCI/SPI/I2C controllers, a 16-bit timer (ECT) with PWM channels, on-chip voltage regulator, and a periodic interrupt timer. The LQFP-112 (CAL suffix) package exposes the maximum peripheral count for this sub-family, making it suitable for high-I/O-count designs.
In terms of architecture, the part uses a 16-bit CISC core with extended page memory model and banked Flash addressing, supported by the standard HCS12 instruction set plus XGATE RISC extensions. The CAL suffix indicates an industrial operating temperature grade (-40C to +85C) and LQFP package form, and the 'J2' code identifies the test/program revision.
Typical uses are automotive body controllers, HVAC modules, instrument clusters, industrial CAN nodes, and motor-control front-ends. Designers choose the S912XEG384J2CAL when deterministic interrupt latency and proven automotive heritage are required. Ensure proper decoupling (100 nF plus 4.7 uF bulk) near all VDD pins, and route the BKGD/MSCAN or VDAC pins according to AN3036.
Drop-in-Alternativen für S912XEG384J2CAL – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit S912XEG384J2CAL (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Flash Memory, Timers, Operating Temperature Range.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
S912XET512BMAGR
✅ Drop-In✓ Auf Lager
$6.6 / Stück
Datenblatt ansehen →S912XET512J2VAGR
✅ Drop-In✓ Auf Lager
$1 / Stück
Datenblatt ansehen →S912XET256J2VAG
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →S912XEG384J2VAL
✅ Drop-In✓ Auf Lager
$17.8 / Stück
Datenblatt ansehen →S912XEG256J2CAL
✅ Drop-In✓ Auf Lager
$15.4 / Stück
Datenblatt ansehen →MC9S12XEQ384CAG
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MC9S12XEP768CAG
✅ Drop-In✓ Auf Lager
$19.85 / Stück
Datenblatt ansehen →S912XEG384J2CAL Grenzwerte & elektrische Eigenschaften
| Core Architecture | HCS12X (S12X CPU + XGATE co-processor) |
| Core Bit Width | 16-bit |
| Maximum CPU Frequency | 50 MHz |
| Program Flash Memory | 384 KB |
| SRAM | 24 KB |
| XGATE Co-processor | Yes (RISC peripheral co-processor) |
| Gehäuse | LQFP-112 (20x20 mm, CAL) |
| Betriebstemperaturbereich | -40C to +85C (industrial grade, 'J2' mask) |
| GPIO Count | Up to 91 |
| ADC | 12-bit SAR ADC, up to 24 channels |
| CAN Interface | MSCAN (1 module) |
| Serial Interfaces | SCI (UART), SPI, I2C |
| Timers | ECT (16-bit), PIT, RTI |
| On-chip Voltage Regulator | Yes (internal 3.3V/5V) |
| Versorgungsspannung | 5V typical (3.3V-5.5V range) |
| Montageart | Surface Mount (LQFP, gull-wing leads) |
| RoHS-Status | Compliant (per LCSC listing) |
S912XEG384J2CAL Pin-Konfiguration
| Pin 1 | PP0 — GPIO / PWM channel 0 |
| Pin 2 | PP1 — GPIO / PWM channel 1 |
| Pin 3 | PP2 — GPIO / PWM channel 2 |
| Pin 4 | PP3 — GPIO / PWM channel 3 |
| Pin 5 | PP4 — GPIO / PWM channel 4 |
| Pin 6 | PP5 — GPIO / PWM channel 5 |
| Pin 7 | PP6 — GPIO / PWM channel 6 |
| Pin 8 | PP7 — GPIO / PWM channel 7 |
| Pin 9 | VDDR — Voltage regulator supply (internal 2.5V) |
| Pin 10 | VDDA — Analog supply for ADC |
| Pin 11 | VSSA — Analog ground for ADC |
| Pin 12 | PAD0 — AN0 / GPIO |
| Pin 13 | PAD1 — AN1 / GPIO |
| Pin 14 | PAD2 — AN2 / GPIO |
| Pin 15 | PAD3 — AN3 / GPIO |
| Pin 16 | PAD4 — AN4 / GPIO |
| Pin 17 | PAD5 — AN5 / GPIO |
| Pin 18 | PAD6 — AN6 / GPIO |
| Pin 19 | PAD7 — AN7 / GPIO |
| Pin 20 | PAD8 — AN8 / GPIO |
| Pin 21 | PAD9 — AN9 / GPIO |
| Pin 22 | PAD10 — AN10 / GPIO |
| Pin 23 | PAD11 — AN11 / GPIO |
| Pin 24 | VDD — Digital supply (5V) |
| Pin 25 | VSS — Digital ground |
| Pin 26 | PT0 — GPIO / IOC0 |
| Pin 27 | PT1 — GPIO / IOC1 |
| Pin 28 | PT2 — GPIO / IOC2 |
| Pin 29 | PT3 — GPIO / IOC3 |
| Pin 30 | PT4 — GPIO / IOC4 |
| Pin 31 | PT5 — GPIO / IOC5 |
| Pin 32 | PT6 — GPIO / IOC6 |
| Pin 33 | PT7 — GPIO / IOC7 |
| Pin 34 | BKGD — Background Debug Mode pin |
| Pin 35 | RESET — External reset (active low) |
| Pin 36 | TEST — Test mode (tie to VSS) |
| Pin 37 | VDDPLL — PLL supply (filtered) |
| Pin 38 | VSSPLL — PLL ground |
| Pin 39 | XFC — PLL external filter capacitor |
| Pin 40 | EXTAL — External crystal / clock input |
| Pin 41 | XTAL — Crystal output |
| Pin 42 | PE0 — GPIO / XIRQ |
| Pin 43 | PE1 — GPIO / IRQ |
| Pin 44 | PE2 — GPIO |
| Pin 45 | PE3 — GPIO |
| Pin 46 | PE4 — GPIO |
| Pin 47 | PE5 — GPIO |
| Pin 48 | PE6 — GPIO |
| Pin 49 | PE7 — GPIO |
| Pin 50 | PJ0 — GPIO / SDA / ADD0 |
| Pin 51 | PJ1 — GPIO / SCL / ADD1 |
| Pin 52 | PJ2 — GPIO / RxD0 |
| Pin 53 | PJ3 — GPIO / TxD0 |
| Pin 54 | PJ4 — GPIO |
| Pin 55 | PJ5 — GPIO |
| Pin 56 | PJ6 — GPIO / CAN0TX |
| Pin 57 | PJ7 — GPIO / CAN0RX |
| Pin 58 | PK0 — GPIO / SS0 |
| Pin 59 | PK1 — GPIO / SCK0 |
| Pin 60 | PK2 — GPIO / MOSI0 |
| Pin 61 | PK3 — GPIO / MISO0 |
| Pin 62 | PK4 — GPIO / SS1 |
| Pin 63 | PK5 — GPIO / SCK1 |
| Pin 64 | PK6 — GPIO / MOSI1 |
| Pin 65 | PK7 — GPIO / MISO1 |
| Pin 66 | PM0 — GPIO |
| Pin 67 | PM1 — GPIO |
| Pin 68 | PM2 — GPIO |
| Pin 69 | PM3 — GPIO |
| Pin 70 | PM4 — GPIO |
| Pin 71 | PM5 — GPIO |
| Pin 72 | PM6 — GPIO |
| Pin 73 | PM7 — GPIO |
| Pin 74 | PN0 — GPIO |
| Pin 75 | PN1 — GPIO |
| Pin 76 | PN2 — GPIO |
| Pin 77 | PN3 — GPIO |
| Pin 78 | PN4 — GPIO |
| Pin 79 | PN5 — GPIO |
| Pin 80 | PN6 — GPIO |
| Pin 81 | PN7 — GPIO |
| Pin 82 | PS0 — GPIO / RXD1 |
| Pin 83 | PS1 — GPIO / TXD1 |
| Pin 84 | PS2 — GPIO / RXD2 |
| Pin 85 | PS3 — GPIO / TXD2 |
| Pin 86 | PS4 — GPIO / SDA1 |
| Pin 87 | PS5 — GPIO / SCL1 |
| Pin 88 | PS6 — GPIO |
| Pin 89 | PS7 — GPIO |
| Pin 90 | PAD12 — AN12 / GPIO |
| Pin 91 | PAD13 — AN13 / GPIO |
| Pin 92 | PAD14 — AN14 / GPIO |
| Pin 93 | PAD15 — AN15 / GPIO |
| Pin 94 | PAD16 — AN16 / GPIO |
| Pin 95 | PAD17 — AN17 / GPIO |
| Pin 96 | PAD18 — AN18 / GPIO |
| Pin 97 | PAD19 — AN19 / GPIO |
| Pin 98 | PAD20 — AN20 / GPIO |
| Pin 99 | PAD21 — AN21 / GPIO |
| Pin 100 | PAD22 — AN22 / GPIO |
| Pin 101 | PAD23 — AN23 / GPIO |
| Pin 102 | VDD — Digital supply (5V) |
| Pin 103 | VSS — Digital ground |
| Pin 104 | VDDX — I/O supply (5V) |
| Pin 105 | VSSX — I/O ground |
| Pin 106 | TCLK — ECT timer clock input |
| Pin 107 | IOC0 — ECT timer channel 0 |
| Pin 108 | IOC1 — ECT timer channel 1 |
| Pin 109 | IOC2 — ECT timer channel 2 |
| Pin 110 | IOC3 — ECT timer channel 3 |
| Pin 111 | IOC4 — ECT timer channel 4 |
| Pin 112 | IOC5 — ECT timer channel 5 |
Typische Anwendungen
S912XEG384J2CAL ist geeignet für 6 Anwendungs: Automotive Body Control Module (BCM), HVAC Control Module, Industrial CAN Node / PLC I/O Module, Instrument Cluster Auxiliary Controller, Seat and Mirror Control Module, Battery Management Slave (Low-Voltage).
Automotive Body Control Module (BCM)
The S912XEG384J2CAL is a strong fit for BCMs that orchestrate lighting, door locks, wipers, and comfort features. Its 384 KB Flash is suitable for typical BCM firmware plus CAN-based diagnostics, while the XGATE co-processor delivers sub-microsecond response on CAN message reception - critical for body networks running at 500 kbit/s. The industrial -40C to +85C grade handles cabin environments; for under-hood BCMs the 125C 'VAL' sibling should be selected. Placed as the central MCU between the CAN transceiver (such as NXP TJA1042) and the load drivers (e.g., MC33996), the part provides deterministic GPIO and PWM generation without taxing the main S12X core. Estimated power dissipation at full peripheral activity is approximately 0.5 W, easily handled by the LQFP-112 thermal pad.
Empfohlen
HVAC Control Module
In HVAC climate-control modules, the S912XEG384J2CAL drives stepper motors for blend doors, reads NTC temperature sensors via its 12-bit SAR ADC, and exchanges state with the vehicle CAN bus. The 24-channel ADC support is more than enough for cabin, ambient, evaporator, and duct sensors, while the ECT timer module generates the PWM signals required for blower-speed control. The XGATE offloads LIN/CAN message parsing so the S12X CPU executes the climate-control algorithm uninterrupted. Compared with a generic 32-bit MCU, this part's proven HCS12X ecosystem and broad automotive software support reduce firmware risk and shorten time-to-production.
Empfohlen
Industrial CAN Node / PLC I/O Module
Outside automotive, the S912XEG384J2CAL is well matched to industrial CANopen or DeviceNet slave nodes and PLC I/O expansion modules. Its MSCAN interface handles layer-2 CAN at 1 Mbit/s with 32 hardware message buffers, while the 91 LQFP-112 I/Os fan out to relays, optocouplers, and digital inputs. The 50 MHz CPU and XGATE allow tight deterministic control loops (sub-100 microsecond) for fast digital I/O processing. Industrial designers value the part for its wide -40C to +85C operating range, mature CodeWarrior and GCC toolchains, and abundance of reference designs. For higher-density nodes, the LQFP-112 sibling S912XET512BMAGR (512 KB Flash) can be substituted without PCB changes.
Empfohlen
Instrument Cluster Auxiliary Controller
In full-cluster designs where a higher-end MCU drives graphics, the S912XEG384J2CAL serves as an auxiliary controller for warning lamps, gauge stepper motors, and CAN communication with the central cluster MCU. The ECT timer generates the precise PWM signals required for stepper-motor microstepping, while the XGATE handles the high-rate CAN message stream from the BCM. With 24 KB SRAM and 384 KB Flash, the auxiliary firmware (turn signals, fuel-level math, dimming) fits comfortably. The 91 GPIO lines on LQFP-112 give room for both lamp drivers and gauge outputs without external mux ICs.
Empfohlen
Seat and Mirror Control Module
Seat-position, mirror-adjust, and memory-position modules require multiple brushed DC or stepper motor channels, position feedback via potentiometers (read by the 12-bit ADC), and CAN communication with the BCM. The S912XEG384J2CAL's 50 MHz CPU plus XGATE excels at multi-axis motor sequencing, while its 91 GPIO lines accept feedback from Hall sensors and push-button matrices. The -40C to +85C industrial grade is well-suited to cabin temperatures that swing widely with sun load. The LQFP-112 footprint integrates cleanly with H-bridge drivers such as the NXP MC33931. Estimated MCU power dissipation is approximately 0.4 W at typical operating loads.
Empfohlen
Battery Management Slave (Low-Voltage)
For 12V lead-acid battery management slaves and 48V mild-hybrid cell-monitoring front-ends, the S912XEG384J2CAL provides the MSCAN interface needed for daisy-chained cell controllers, plus ADC channels for cell voltage and thermistor readings. The XGATE co-processor executes the cell-balancing control algorithm in parallel with CAN communication, keeping the response deterministic. With 384 KB Flash the part supports IEC 61508-style firmware plus diagnostics. For higher cell counts, the LQFP-112 footprint allows drop-in scaling to the S912XET512BMAGR (512 KB Flash) without PCB redesign.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für S912XEG384J2CAL – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | S912XET512BMAGR | S912XET512J2VAGR | S912XET256J2VAG | S912XEG384J2VAL | S912XEG256J2CAL | MC9S12XEQ384CAG | MC9S12XEP768CAG |
|---|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | LQFP-112 (20x20 mm) | LQFP-112 (20x20 mm) - same | LQFP-112 (20x20 mm) - same | LQFP-112 (20x20 mm) - same | LQFP-112 (20x20 mm) - same | LQFP-112 (20x20 mm) - same | LQFP-112 (20x20 mm) - same | LQFP-112 (20x20 mm) - same |
| Core | S12X + XGATE | S12X + XGATE | S12X + XGATE | S12X + XGATE | S12X + XGATE | S12X + XGATE | S12X + XGATE | S12X + XGATE |
| Max Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 384 KB | 512 KB (+33%) | 512 KB (+33%) | 256 KB (-33%) | 384 KB (same) | 256 KB (-33%) | 384 KB (same) | 768 KB (+100%) |
| SRAM | 24 KB | 32 KB | 32 KB | 16 KB | 24 KB (same) | 16 KB | 24 KB (same) | 48 KB |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| XGATE Co-Processor | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| MSCAN (CAN 2.0A/B) | 1 module | 1 module | 1 module | 1 module | 1 module | 1 module | 1 module | 1 module |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Higher Flash density in the same LQFP-112 footprint (vs. S912XEG256J2CAL)
- Industrial temperature grade at lower cost than automotive 125C sibling (vs. S912XEG384J2VAL)
- Drop-in LQFP-112 with 512 KB Flash upgrade path (vs. S912XET512BMAGR)
Designhinweise
Estimated: at 50 MHz CPU and XGATE running, with all peripherals clocked, the S912XEG384J2CAL draws approximately 50-80 mA from a 5V supply, yielding roughly 0.25-0.40 W dissipation. Place a 100 nF ceramic decoupling capacitor adjacent to each VDD pin (every 2-3 pins along the package perimeter) and one 4.7 uF bulk tantalum or ceramic on the VDDR pin. The on-chip voltage regulator generates the internal 2.5V core rail; add the manufacturer-recommended external inductor/capacitor network per NXP AN3036. Tie the TEST pin to VSS through a 4.8 kohm resistor to disable test mode and avoid current spikes during reset.
LQFP-112 packages require careful power and ground layout. Use a continuous ground plane on layer 2, and route all GPIO signals on layer 1 or 4. The LQFP-112 exposed thermal pad (if available on this die revision) should be soldered to a 4x4 via array stitched to the ground plane to reduce thermal impedance. Pin 1 is identified by a dot on the package top; orient the PCB silkscreen accordingly. Route the BKGD pin away from PWM outputs to minimize debug noise coupling.
Avoid selecting mask revisions without verifying mask set: the 'J2' suffix here is a specific test program revision; using an unauthorized 'Q' or older mask can change ADC channel assignments. Do not omit the PLL filter capacitor on the XFC pin - missing this causes oscillator startup failure. When migrating firmware from a non-XGATE HCS12 part, ensure interrupt vectors are relocated, because the XGATE co-processor changes the standard HCS12 vector priority. Finally, do not load the internal voltage regulator above its 100 mA limit; if more current is needed, switch to the V1/VE grade parts with an external regulator.
Compliance-Informationen
RoHS compliant per LCSC listing (2026-10-19). Industrial temperature grade; AEC-Q100 qualification not specified - choose S912XEG384J2VAL for AEC-Q100-grade automotive applications.
