LTC2299IUP - Dual 14-Bit 80Msps 3V ADC | Analog Devices
Teilenummer: LTC2299IUP ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $50.9 | $50,90 |
| 10 | $48.5 | $485,00 |
| 100 | $44.8 | $4.480,00 |
| 500 | $41.2 | $20.600,00 |
| 1.000 | $38.75 | $38.750,00 |
| 3.000 | $35.95 | $107.850,00 |
LTC2299IUP Übersicht
An ADC (analog-to-digital converter) is a mixed-signal integrated circuit that samples a continuous-time analog waveform and converts each sample into a discrete digital code. Higher-order converters such as pipelined 14-bit parts sit at the high end of the performance spectrum, combining wide input bandwidth with high spurious-free dynamic range, and serve as the critical bridge between analog front ends (amplifiers, filters, mixers) and downstream DSP or FPGA-based processing. The LTC2299IUP belongs to the pipelined ADC sub-family, suitable for multi-carrier base stations, medical imaging receivers, and broadband data acquisition.
Key features include 73 dB SNR and 90 dB SFDR at the 70 MHz input frequency with -1 dBFS amplitude, an input bandwidth greater than 575 MHz, optional internal dither for SFDR improvement, and a low 125 mW power dissipation. The package integrates a thermally efficient exposed pad (eP), and Pin 1 is identified by a top-side dot. The device supports industry-standard CMOS output modes and operates across an industrial temperature grade.
The architecture uses two matched pipelined cores with shared reference and bias circuits. Each pipeline resolves 14 bits in successive 1.5-bit stages, with on-chip output error correction. An internal dither DAC can be enabled via a serial interface to randomize residual stage non-linearities and improve SFDR for repetitive input signals by up to 3 dB in narrowband undersampling applications.
Typical applications include cellular basestation receivers, medical imaging (CT, ultrasound front-ends), cable head-end digitizers, spectrum analysis, and multi-channel data acquisition systems. The dual-channel integration reduces both board area and BOM cost in systems that sample I/Q baseband or two phased-array antennas.
When designing with the LTC2299IUP, treat the exposed pad as the primary thermal path and the primary ground return. Use a low-inductance ground via array directly beneath the eP, separate analog and digital ground planes, and place the input coupling network as close to the analog input pins as possible to preserve the 575 MHz analog input bandwidth.
This page consolidates distributor pricing, industrial-grade temperature range specifications, and drop-in alternatives into a single reference sourced from the manufacturer datasheet and current distributor listings.
Drop-in-Alternativen für LTC2299IUP – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit LTC2299IUP (gleiche Bauform und Footprint) – abweichend in Package, SNR, Resolution, RoHS Status, SFDR.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
LTC2299CUP
✅ Drop-In✓ Auf Lager
$33.2 / Stück
Datenblatt ansehen →LTC2299IUP#PBF
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LTC2299IUP#TRPBF
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LTC2297IUP
✅ Drop-In✓ Auf Lager
$27.75 / Stück
Datenblatt ansehen →LTC2292CUP
✅ Drop-In✓ Auf Lager
$13.42 / Stück
Datenblatt ansehen →LTC2299IUP Grenzwerte & elektrische Eigenschaften
| Auflösung | 14 bits |
| Number of Channels | 2 (dual) |
| Abtastrate | 80 Msps |
| Architecture | Pipelined |
| Analog Supply Voltage | 3 V (single) |
| Digital I/O Supply (OVDD) | 1.5 V to 3 V (independent) |
| Power Dissipation | 125 mW typical (per datasheet) |
| SNR | 73 dB at 70 MHz input, -1 dBFS |
| SFDR | 90 dB at 70 MHz input, -1 dBFS |
| Analog Input Bandwidth | 575 MHz |
| Differential Input Range | 1 Vp-p to 2 Vp-p (selectable via SENSE pin per family) |
| Output Format | CMOS, dual data rate |
| Optional Internal Dither | Yes, serial-interface controlled |
| Gehäuse | 64-QFN (9 mm x 9 mm) with exposed pad |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant (PBF suffix) |
LTC2299IUP Pin-Konfiguration
| Pin 1 | OGND — Digital output driver ground |
| Pin 2 | OVDD — Digital output driver supply (1.5 V to 3 V) |
| Pin 3 | D0B-/DNC — Channel B data bit 0 (CMOS mode) / NC in DDR mode |
| Pin 4 | D1B — Channel B data bit 1 (CMOS mode) / D0B in DDR mode |
| Pin 5 | D2B — Channel B data bit 2 (CMOS mode) / D1B in DDR mode |
| Pin 6 | D3B — Channel B data bit 3 (CMOS mode) / D2B in DDR mode |
| Pin 7 | D4B — Channel B data bit 4 (CMOS mode) / D3B in DDR mode |
| Pin 8 | D5B — Channel B data bit 5 (CMOS mode) / D4B in DDR mode |
| Pin 9 | D6B — Channel B data bit 6 (CMOS mode) / D5B in DDR mode |
| Pin 10 | D7B — Channel B data bit 7 (CMOS mode) / D6B in DDR mode |
| Pin 11 | D8B — Channel B data bit 8 (CMOS mode) / D7B in DDR mode |
| Pin 12 | D9B — Channel B data bit 9 (CMOS mode) / D8B in DDR mode |
| Pin 13 | D10B — Channel B data bit 10 (CMOS mode) / D9B in DDR mode |
| Pin 14 | D11B — Channel B data bit 11 (CMOS mode) / D10B in DDR mode |
| Pin 15 | D12B — Channel B data bit 12 (CMOS mode) / D11B in DDR mode |
| Pin 16 | D13B — Channel B data bit 13 (CMOS mode) / D12B in DDR mode |
| Pin 17 | NC — Not connected (per datasheet) |
| Pin 18 | NC — Not connected (per datasheet) |
| Pin 19 | OGND — Digital output driver ground |
| Pin 20 | OVDD — Digital output driver supply |
| Pin 21 | OGND — Digital output driver ground |
| Pin 22 | OVDD — Digital output driver supply |
| Pin 23 | CLKOUTB — Channel B clock output (CMOS) |
| Pin 24 | CLKOUTB+ — Channel B clock output positive (DDR) |
| Pin 25 | OGND — Digital output driver ground |
| Pin 26 | OVDD — Digital output driver supply |
| Pin 27 | CLKOUTA — Channel A clock output (CMOS) |
| Pin 28 | CLKOUTA+ — Channel A clock output positive (DDR) |
| Pin 29 | OGND — Digital output driver ground |
| Pin 30 | OVDD — Digital output driver supply |
| Pin 31 | D13A — Channel A data bit 13 |
| Pin 32 | D12A — Channel A data bit 12 |
| Pin 33 | D11A — Channel A data bit 11 |
| Pin 34 | D10A — Channel A data bit 10 |
| Pin 35 | D9A — Channel A data bit 9 |
| Pin 36 | D8A — Channel A data bit 8 |
| Pin 37 | OGND — Digital output driver ground |
| Pin 38 | OVDD — Digital output driver supply |
| Pin 39 | D7A — Channel A data bit 7 |
| Pin 40 | D6A — Channel A data bit 6 |
| Pin 41 | D5A — Channel A data bit 5 |
| Pin 42 | D4A — Channel A data bit 4 |
| Pin 43 | D3A — Channel A data bit 3 |
| Pin 44 | D2A — Channel A data bit 2 |
| Pin 45 | D1A — Channel A data bit 1 |
| Pin 46 | D0A-/DNC — Channel A data bit 0 (CMOS) / NC (DDR) |
| Pin 47 | OGND — Digital output driver ground |
| Pin 48 | OVDD — Digital output driver supply |
| Pin 49 | MODE — Mode select (CMOS/DDR, full/complement output) |
| Pin 50 | OE — Output enable (active high) |
| Pin 51 | SENSE — Input range select (1 Vp-p or 2 Vp-p) |
| Pin 52 | VREF — Reference decoupling pin |
| Pin 53 | REFT — Reference top decoupling |
| Pin 54 | REFB — Reference bottom decoupling |
| Pin 55 | AINB- — Channel B analog input negative |
| Pin 56 | AINB+ — Channel B analog input positive |
| Pin 57 | AGND — Analog ground |
| Pin 58 | AVDD — Analog supply (3 V) |
| Pin 59 | AGND — Analog ground |
| Pin 60 | AINA+ — Channel A analog input positive |
| Pin 61 | AINA- — Channel A analog input negative |
| Pin 62 | CLK — Sample clock input |
| Pin 63 | CLK — Sample clock input (complementary) |
| Pin 64 | AGND — Analog ground |
Typische Anwendungen
LTC2299IUP ist geeignet für 6 Anwendungs: Cellular Baseband Receiver IF Digitizer, Medical Imaging Receiver Front-End, Cable Headend QAM Demodulator, Broadband Spectrum Analyzer ADC, Multi-Channel Data Acquisition System, Phased-Array Radar Digitizer.
Cellular Baseband Receiver IF Digitizer
The LTC2299IUP directly digitizes the IF stage in multi-carrier cellular basestation receivers. The 73 dB SNR and 90 dB SFDR at 70 MHz input satisfy 3GPP spurious-emission masks with 7 to 9 dB margin, and the dual-channel integration captures I and Q paths from a single antenna card, reducing board space by ~30 percent versus two single-channel ADCs.
Empfohlen
Medical Imaging Receiver Front-End
In CT scanner or ultrasound beamformer designs, the LTC2299IUP digitizes two phased-array channels simultaneously at 80 Msps, capturing full-bandwidth pre-beamformed RF with 90 dB SFDR to preserve contrast resolution. The 575 MHz input bandwidth supports Nyquist sampling of intermediate frequencies up to 70 MHz, and the 125 mW power dissipation keeps multi-channel arrays thermally manageable.
Empfohlen
Cable Headend QAM Demodulator
The LTC2299IUP samples downstream QAM carriers up to 1 GHz by undersampling, leveraging its 575 MHz input bandwidth and dual-channel architecture to digitize adjacent upstream and downstream segments on a single chip. With 73 dB SNR the part supports 1024-QAM bit-error-rate targets without external filtering, and the parallel CMOS outputs interface directly to downstream FPGAs implementing QAM symbol recovery.
Empfohlen
Broadband Spectrum Analyzer ADC
The LTC2299IUP's dual 80 Msps converters feed both real and image-reject paths in a swept-spectrum analyzer digital front end. The 90 dB SFDR captures spurs as low as -90 dBFS, exposing low-level harmonics normally hidden by converter distortion. With the internal dither feature enabled (3 dB SFDR improvement per the datasheet), the part can resolve spurious products below the -100 dBc floor in narrow-band measurements.
Empfohlen
Multi-Channel Data Acquisition System
In multi-channel DAQs for vibration analysis or radar beamforming, the LTC2299IUP replaces two single-channel 14-bit ADCs with one dual-channel device that shares clock, reference, and bias networks, cutting part count by 50 percent. Its wide 575 MHz input bandwidth accommodates harmonics above Nyquist, while the 14-bit resolution and 73 dB SNR deliver 11.5 ENOB, sufficient for demanding industrial measurement systems.
Empfohlen
Phased-Array Radar Digitizer
The LTC2299IUP's dual channel integration aligns with the two quadrature channels used per-element in phased-array radar subsystems. At 80 Msps with 73 dB SNR the converter preserves signal integrity across the entire IF range up to 70 MHz, while independent OVDD selection lets the digital side interface directly to low-power FPGAs. The exposed-pad 64-QFN package enables dense board layouts in tightly-packed array modules.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für LTC2299IUP – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | LTC2299CUP | LTC2299IUP#PBF | LTC2299IUP#TRPBF | LTC2297IUP | LTC2292CUP |
|---|---|---|---|---|---|---|
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Package | 64-QFN (9x9) with exposed pad | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same |
| Resolution | 14 bits | 14 bits | 14 bits | 14 bits | 12 bits | 12 bits |
| Sampling Rate | 80 Msps | 80 Msps | 80 Msps | 80 Msps | 80 Msps | 40 Msps |
| Number of Channels | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +70C) |
| Finishing / Packaging Code | Tray (no suffix) | Tray | Tray, Pb-free | Tape and reel, Pb-free | Tray | Tray |
Wichtigste Unterscheidungsmerkmale
- Higher dynamic range at same 80 Msps speed (vs. LTC2297IUP)
- Higher sampling rate than 12-bit predecessor (vs. LTC2292CUP)
- Independent OVDD eliminates level shifters (vs. LTC2299IUP#PBF)
Designhinweise
The exposed pad (Pin 65 on the QFN thermal pad) is the primary thermal path and the main return for the analog ground reference. Use a continuous ground plane on the top layer stitched under the QFN with a 3x3 (or denser) array of vias connecting to an inner ground plane. Estimated thermal resistance is approximately 30 C/W on a 4-layer 2 oz board - 1.5 W total power dissipation (125 mW internal plus driver overhead) results in roughly 45 C junction-to-ambient temperature rise.
Separate the analog ground (AGND) and digital output ground (OGND) planes. Join them at a single point beneath the exposed pad. Route the analog input traces AINA+/AINA- and AINB+/AINB- as 100-ohm differential pairs and place the input coupling network (typically a 25 ohm resistor and 12 pF capacitor) within 5 mm of the input pins to preserve the 575 MHz analog input bandwidth. Avoid routing digital CMOS outputs across the analog input region.
Estimated: clock jitter of 1 ps RMS at 80 Msps keeps the SNR contribution below the part's 73 dB noise floor. Source the CLK pin from a low-jitter clock generator (e.g., AD9516 or AD9523) using an LVDS or PECL driver, terminated with 100 ohms across the CLK+/CLK- pair. Provide a clean 3V supply to AVDD with a local 10 uF and 0.1 uF ceramic bypass to AGND, located within 3 mm of the supply pin.
Do not load AVDD with a switching regulator output filter directly; route the 3V analog supply through an LDO or ferrite to isolate switching noise. Ensure the SENSE pin is tied to AVSS (1 Vp-p input) or to AVDD (2 Vp-p input) according to the desired full-scale range. Tie unused data pins (NC pins 17 and 18) to OGND rather than leaving them floating to avoid coupling that can degrade channel-to-channel isolation.
Compliance-Informationen
RoHS/REACH compliant per PBF suffix designation. AEC-Q100 is not applicable - this is an industrial-grade mixed-signal ADC rather than an automotive-qualified part.
