M2GL010-1VF400 - 12K-LUT IGLOO2 FPGA | Microchip Technology
Teilenummer: M2GL010-1VF400 ✓ AktivM2GL010-1VF400 Übersicht
An FPGA is a programmable semiconductor whose logic, routing, and I/O resources can be configured after manufacture. Within the product hierarchy, an FPGA is a programmable logic device, a digital integrated circuit, and a semiconductor used to implement parallel processing, interface conversion, control logic, and system-management functions. The IGLOO2 family combines flash-programmable configuration, embedded memory, and user I/O in a single device.
The M2GL010-1VF400 provides 12 KLEs of logic resources, 933,888 RAM bits, and 195 I/O according to the Microchip product listing. Its 400-VFBGA surface-mount package supports dense board-level integration while exposing substantially more I/O than lower-ball-count package options. The identified -1 device is offered in tray packaging for production assembly.
The IGLOO2 architecture is suitable for general-purpose functions such as bridging, I/O expansion, signal conversion, system management, and secure connectivity. Its embedded SRAM enables data buffering, protocol handling, and custom digital pipelines without requiring external memory. The configurable I/O structure allows multiple logic interfaces to be consolidated on one board, reducing component count and simplifying system integration.
Typical designs include industrial control modules, communication interfaces, sensor aggregation equipment, embedded gateways, and compact control systems. The large I/O count is especially useful for parallel sensor collection, multi-channel digital conversion, custom peripheral bridging, and system-bus expansion. The device's operating-temperature grade extends from 0°C to 85°C junction temperature.
PCB implementation requires careful attention to the 400-ball land pattern, power distribution, decoupling, and high-speed routing. Because this package contains many power and ground balls, follow the manufacturer's pin-description guide when assigning every ball and use the recommended power and ground-plane arrangement. Program the device through a compatible programming interface and confirm the configuration scheme before production release.
This product page combines the exact ordering information, core IGLOO2 resource details, package constraints, application guidance, and same-footprint comparison information. It also highlights the distinction between the -1 ordering code, industrial suffix, and other IGLOO2 variants so engineers can verify speed, temperature, package, and lifecycle requirements before placing a part in a BOM.
Drop-in-Alternativen für M2GL010-1VF400 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit M2GL010-1VF400 (gleiche Bauform und Footprint) – abweichend in Package, RoHS Status.
M2GL010-1VFG400
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
M2GL010-VF400
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →M2GL010T-1VF400
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
M2GL010-1VF400I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
M2GL010-1VFG400I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
M2GL010-1VF400 Grenzwerte & elektrische Eigenschaften
| Device Type | IGLOO2 low-density FPGA |
| Logic Cells | 12,084 cells |
| Logic Capacity | 12 KLEs |
| Total RAM | 933,888 bits |
| User I/O Count | 195 I/O |
| Supply Voltage Range | 1.14 V to 2.625 V |
| Betriebstemperatur | 0°C to 85°C (TJ) |
| Gehäuse | 400-LFBGA, 17 x 17 mm |
| Manufacturer Package Designation | 400-VFBGA |
| Montageart | Surface Mount |
| Shipping Packaging | Tray |
| Product Status | Active |
| Manufacturer Lead Time | 20 weeks |
| RoHS-Status | RoHS non-compliant |
| Configuration Memory | Flash FPGA device |
| Embedded SRAM | 32 KB |
| Programmable Logic | 12 KLEs |
| Device Family | IGLOO2 |
| Product Classification | FPGA - Field Programmable Gate Array |
M2GL010-1VF400 400-vfbga Pinbelegungsleitfaden
Pinbelegung für M2GL010-1VF400 (400-vfbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für M2GL010-1VF400.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
M2GL010-1VF400 ist geeignet für 6 Anwendungs: Industrial Control and System Management, Sensor Aggregation and I/O Expansion, Communication Interface Bridging, Secure Connectivity Gateways, Custom Signal Conversion, Compact Data-Acquisition Equipment.
Industrial Control and System Management
The M2GL010-1VF400 fits industrial control modules that require flexible parallel logic, embedded data handling, and numerous digital interfaces. Its 12,084 logic cells can implement state machines, timing controls, interlocks, and communication protocol engines, while 933,888 RAM bits support buffering and state retention. The 195 I/O provide ample connections for sensors, actuators, field buses, and status indicators. Operating from 1.14 V to 2.625 V and a 0°C to 85°C junction-temperature range, the device suits controlled industrial environments when the enclosure temperature and power design preserve those limits.
Empfohlen
Sensor Aggregation and I/O Expansion
The M2GL010-1VF400 is well suited to concentrating parallel sensors and digital peripheral signals in compact industrial equipment. Its 195 I/O can accommodate multiple digital inputs, outputs, counters, and interrupt-capable interfaces, while the 12 KLE fabric can perform filtering, edge detection, debouncing, and data packing. The 933,888 RAM bits provide local storage for short acquisition and transfer windows. Unlike a fixed microcontroller, the programmable logic can be partitioned among acquisition, control, and communication functions while maintaining deterministic parallel operation in the 400-VFBGA package.
Empfohlen
Communication Interface Bridging
The M2GL010-1VF400 can bridge dissimilar digital interfaces in communications equipment by converting bus formats, buffering packets, and coordinating asynchronous transfers. Its programmable logic supports parallel-to-serial behavior, clock-domain separation, and protocol-specific state machines, while the embedded RAM accommodates FIFOs and packet buffers. The large 195-I/O count leaves additional capacity for control signals and diagnostics. The 1.14 V to 2.625 V core range and surface-mount 400-VFBGA package make it appropriate for compact embedded networking modules where low logic latency and flexible interface assignment are important.
Empfohlen
Secure Connectivity Gateways
The M2GL010-1VF400 can serve as a hardware-assisted secure-connectivity block in embedded gateways by implementing protocol transformations, packet filtering, cryptographic control, and peripheral bridging. The 12 KLE programmable fabric allows security-specific logic to coexist with data-path functions, while 933,888 RAM bits support session buffers and working queues. Its 195 I/O provides connectivity to network processors, secure elements, storage, and status interfaces. The active lifecycle status and 20-week manufacturer lead time make it suitable for planned industrial and communications programs, subject to long-term sourcing and qualification review.
Empfohlen
Custom Signal Conversion
The M2GL010-1VF400 is appropriate for custom signal-conversion modules that translate between parallel buses, serialized interfaces, counters, and timing formats. Its 12,084 logic cells can host multiple conversion pipelines and control blocks, and the embedded SRAM can support line buffers or sample storage. With 195 I/O, designers can expose substantial connector density without adding multiple bridge packages. The device also permits field-updatable logic through its flash FPGA architecture, enabling product revisions to be implemented primarily through configuration rather than PCB changes.
Empfohlen
Compact Data-Acquisition Equipment
The M2GL010-1VF400 fits compact data-acquisition systems that need deterministic parallel sampling, trigger logic, local buffering, and control interfaces. The 12 KLE fabric can implement counters, trigger selection, timestamp pipelines, and test-sequence control, while 933,888 RAM bits can absorb short bursts before transfer. Its 195 I/O supports simultaneous digital channels, status LEDs, and host communications. The 17 x 17 mm 400-VFBGA package conserves board area relative to larger leaded packages, although its 400 balls require careful escape routing and dense power delivery.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für M2GL010-1VF400 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | M2GL010-1VFG400 | M2GL010-VF400 | M2GL010T-1VF400 | M2GL010-1VF400I | M2GL010-1VFG400I |
|---|---|---|---|---|---|---|
| Package | 400-VFBGA, 17 x 17 mm | 400-VFBGA | 400-VFBGA | 400-VFBGA | 400-VFBGA | 400-VFBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| User I/O | 195 I/O | 195 I/O | 195 I/O | 195 I/O | 195 I/O | 195 I/O |
| Ordering Suffix | -1VF400 | -1VFG400 | -VF400 | T-1VF400 | -1VF400I | -1VFG400I |
| Special Feature | Flash-programmable IGLOO2 FPGA | Flash-programmable IGLOO2 FPGA | Flash-programmable IGLOO2 FPGA | Flash-programmable IGLOO2 FPGA | Flash-programmable IGLOO2 FPGA | Flash-programmable IGLOO2 FPGA |
Wichtigste Unterscheidungsmerkmale
- High I/O density in a 17 x 17 mm surface-mount package (vs. M2GL010-1VFG400)
- Substantial embedded data-handling capacity (vs. M2GL010-VF400)
- Active production status with defined tray packaging (vs. M2GL010T-1VF400)
Designhinweise
Implement the 400-VFBGA land pattern directly from Microchip's IGLOO2 packaging and pin-descriptions guide. The package contains 195 user I/O in addition to power, ground, configuration, and clock balls, so every ball must be assigned before fabrication. Preserve the recommended ball-pitch geometry and land pattern rather than adapting it from a lower-count BGA. Verify the assembled pad dimensions against the current package drawing and inspect the board under magnification.
Use the manufacturer's recommended power architecture for the 1.14 V to 2.625 V operating range, including the required supply rails, sequencing, and decoupling network. Place high-frequency bypass capacitors close to the corresponding device balls and provide low-impedance planes for the numerous power and ground connections. Do not infer the number or value of capacitors from general FPGA practice; use the exact circuit and layout recommendations in the IGLOO2 datasheet and pin guide.
Assign user I/O by bank according to voltage compatibility and intended interface type, then check whether high-speed I/O requires particular VCCI rails or dedicated clock pins. Route clocks and high-fanout nets with short return paths and avoid switching aggressors beneath sensitive inputs. Because the device offers 195 I/O, a complete bank and pin audit helps prevent accidental voltage incompatibility or configuration conflicts before the design reaches prototype fabrication.
Do not substitute an ordering-code variant solely because it uses a 400-VFBGA package. Confirm the speed identifier, temperature grade, package suffix, RoHS status, configuration compatibility, and device marking for every alternative. Also verify the programming interface, configuration memory requirements, and power-up behavior in the selected variant. A footprint match alone does not establish functional interchangeability.
Compliance-Informationen
The product listing identifies RoHS status as non-compliant. No qualification or material-compliance claims beyond that statement were established.
