M321R2GA3PB2-CCP - 16GB DDR5-6400 RDIMM ECC | Samsung
Teilenummer: M321R2GA3PB2-CCP ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $89 | $89,00 |
| 10 | $84.55 | $845,50 |
| 100 | $79.2 | $7.920,00 |
| 500 | $74.75 | $37.375,00 |
| 1.000 | $70.35 | $70.350,00 |
M321R2GA3PB2-CCP Übersicht
A Registered DIMM (RDIMM) is a server-class memory module that buffers the address and command signals through a register chip, reducing electrical loading on the memory controller and enabling higher-capacity, higher-speed configurations than unbuffered UDIMMs. Within the memory hierarchy, the M321R2GA3PB2-CCP belongs to the DDR5 RDIMM family -> DDR5 SDRAM module -> DRAM memory module -> server memory subsystem, and it is fully JEDEC-compliant for enterprise server and workstation platforms.
Key features include 6400 Mbps data rate (PC5-51200 bandwidth class), CL52 CAS latency at 1.1 V, on-module ECC (72-bit data width = 64 data + 8 ECC bits), and on-die ECC inherent to DDR5 DRAM. The module is built from ten FBGA-packaged 2G x 8 DDR5 DRAM components plus the register and power-management ICs. DDR5 doubles the bank groups and provides an on-module 12 V-to-1.1 V PMIC, improving power integrity versus DDR4.
Typical applications include enterprise servers, cloud and hyperscale compute nodes, virtualization hosts, and high-performance workstations that require registered DDR5 memory at the 6400 Mbps mainstream-performance tier.
When installing, verify that the platform BIOS and CPU memory controller officially support DDR5-6400 RDIMMs; mixing ranks or speeds may cause the bus to train down to a lower common data rate.
This page synthesizes distributor availability data, same-family drop-in variants, and practical deployment notes not found on the manufacturer datasheet alone.
Drop-in-Alternativen für M321R2GA3PB2-CCP – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit M321R2GA3PB2-CCP (gleiche Bauform und Footprint) – abweichend in Form Factor, Module Type, ECC, Speed, Capacity.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
M321R2GA3EB2-CCP
✅ Drop-In✓ Auf Lager
$74 / Stück
Datenblatt ansehen →M321R2GA3PB0-CWM
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$37.5 / Stück
Datenblatt ansehen →M321R2GA3EB0-CWM
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$72 / Stück
Datenblatt ansehen →M321R2GA3EB2-CWM
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$94 / Stück
Datenblatt ansehen →M321R4GA3PB2-CCP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
M321R6GA3PB2-CCP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
M321R2GA3PB2-CCP Grenzwerte & elektrische Eigenschaften
| Speichertyp | DDR5 SDRAM |
| Module Type | RDIMM (Registered DIMM with ECC) |
| Capacity | 16 GB |
| Datenrate | 6400 Mbps (PC5-51200) |
| Operating Voltage | 1.1 V |
| Rank x Organization | 1R x 8 |
| Module Configuration | 2G x 72 |
| DRAM Composition | 10 x FBGA 2G x 8 DDR5 DRAM |
| CAS-Latenz | CL52 |
| Pin-Anzahl | 288 |
| ECC | Yes (Registered, 64+8) |
| Product Status | Mass Production |
| Form Factor | 288-pin RDIMM |
| Single Rank | Yes (1R) |
| Application | Server / Workstation |
| JEDEC Standard | DDR5 RDIMM (JEDEC-compliant) |
M321R2GA3PB2-CCP standard Pinbelegungsleitfaden
Pinbelegung für M321R2GA3PB2-CCP (standard-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für M321R2GA3PB2-CCP.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
M321R2GA3PB2-CCP ist geeignet für 6 Anwendungs: Enterprise Server Memory, Cloud and Hyperscale Compute, Virtualization Hosts, High-Performance Workstations, Database and In-Memory Analytics, Storage Controllers and Network Appliances.
Enterprise Server Memory
The M321R2GA3PB2-CCP is purpose-built for enterprise server memory subsystems, where its 6400 Mbps data rate delivers 51.2 GB/s per module of peak bandwidth and its registered topology reduces electrical loading so memory controllers can support higher module counts per channel. The 72-bit ECC-protected interface corrects single-bit errors in always-on workloads, and the 1.1 V DDR5 supply plus on-module PMIC improves power efficiency versus DDR4 RDIMMs. Installed in Dell PowerEdge or HPE ProLiant Gen11-class platforms, it slots into a 288-pin registered channel; single-rank 1Rx8 construction simplifies memory training at full speed in 8-12 DIMM per CPU configurations, sustaining bandwidth under heavy virtualization or database load.
Empfohlen
Cloud and Hyperscale Compute
In cloud and hyperscale data centers, node cost and power per gigabyte are the dominant metrics, and the M321R2GA3PB2-CCP addresses both. Its single-rank 16 GB 1Rx8 design is the mainstream capacity tier for high-core-count cloud instances, delivering 6400 Mbps (PC5-51200) bandwidth at only 1.1 V, while DDR5's bank-group architecture increases effective parallelism for multi-tenant workloads. On-module ECC plus DDR5 on-die ECC keeps uncorrected error rates low across thousands of operating hours. Deployed two DIMMs per channel in standard 1U/2U servers, the module supports memory-hungry container and VM fleets; single-rank population also helps maximize achievable frequency when all channels are filled.
Empfohlen
Virtualization Hosts
Virtualization platforms (VMware ESXi, KVM, Hyper-V) benefit directly from the M321R2GA3PB2-CCP's combination of 16 GB density, 6400 Mbps bandwidth, and hardware ECC. Hypervisor memory overcommit and page-sharing amplify the cost of memory errors, so the 64+8 ECC topology and DDR5 on-die ECC are functionally required for production hosts. The registered DIMM interface maintains signal integrity with high DIMM counts per CPU, and the 1.1 V rail keeps the memory subsystem's share of node power low. Populating channels uniformly with these single-rank modules lets the BIOS train the bus at its rated 6400 Mbps speed, maximizing VM consolidation ratios per socket.
Empfohlen
High-Performance Workstations
Threadripper Pro, Xeon W, and other workstation-class platforms that support registered DDR5 can use the M321R2GA3PB2-CCP for CAD, simulation, and content-creation workloads. Its 6400 Mbps data rate provides 51.2 GB/s of module bandwidth, which shortens solver and render times in memory-bandwidth-bound applications, while ECC protects multi-hour simulations from silent data corruption. The 288-pin RDIMM installs in the platform's registered-DDR5 slots, and the single-rank organization eases memory training when all eight or twelve channels are populated. Note that consumer desktop platforms do not support RDIMMs; this module is strictly for workstation/server chipsets.
Empfohlen
Database and In-Memory Analytics
In-memory databases and analytics engines (SAP HANA-class, Redis, OLAP accelerators) are directly limited by memory capacity and bandwidth. The M321R2GA3PB2-CCP supplies 16 GB per module at 6400 Mbps, and populating 24 DIMMs across dual-socket servers reaches hundreds of gigabytes with multi-hundred-GB/s aggregate bandwidth. The registered interface preserves timing margin at these speeds, and hardware ECC is essential because a single uncorrected bit error can corrupt transactional state. The 1.1 V DDR5 rail and on-module PMIC also reduce per-GB power versus DDR4 solutions, lowering TCO for always-on analytical clusters running 24/7 query workloads.
Empfohlen
Storage Controllers and Network Appliances
Enterprise storage controllers, NVMe-oF gateways, and high-throughput network appliances require small amounts of highly reliable registered memory for firmware, metadata caches, and packet buffers. The M321R2GA3PB2-CCP's 16 GB capacity fits typical appliance memory budgets, its ECC protection guards metadata integrity, and its JEDEC-standard 288-pin RDIMM interface integrates into embedded server-on-chip designs (e.g., Broadcom, AMD EPYC Embedded platforms). At 6400 Mbps the module keeps cache lookups and buffer copies off the bandwidth bottleneck, and the 1.1 V operation suits thermally constrained appliance chassis where cooling headroom is limited by fan acoustics requirements.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für M321R2GA3PB2-CCP – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | M321R2GA3EB2-CCP | M321R2GA3PB0-CWM | M321R4GA3PB2-CCP | M321R6GA3PB2-CCP |
|---|---|---|---|---|---|
| Package | 288-pin RDIMM | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Capacity | 16 GB | 16 GB | 16 GB | 32 GB | 48 GB |
| Rank x Organization | 1R x 8 | 1R x 8 | 1R x 8 | 2R x 8 | 2R x 8 |
| Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| ECC / Registration | ECC Registered (RDIMM) | ECC Registered | ECC Registered | ECC Registered | ECC Registered |
Wichtigste Unterscheidungsmerkmale
- Higher bandwidth than 5600 Mbps alternatives (vs. M323R4GA3PB0-CWM)
- Newer DRAM die generation (vs. M321R2GA3EB2-CCP)
- Single-rank training advantage at full population (vs. M321R4GA3PB2-CCP)
Designhinweise
Do not attempt to install this 288-pin RDIMM in a consumer desktop platform. Registered DDR5 modules have different keying and firmware requirements than unbuffered UDIMMs, and desktop BIOSes will not train registered modules. Similarly, do not mix RDIMMs with LR-DIMMs or UDIMMs in the same channel - JEDEC platform rules prohibit mixed module types. Verify the server OEM qualified vendor list (QVL) before deployment; while the part is JEDEC-compliant, OEM firmware validation is the authoritative compatibility reference for Dell, HPE, and Lenovo platforms.
For maximum bandwidth, populate all channels uniformly with identical single-rank modules (same MPN, rank, and speed bin). Mixed rank or mixed speed populations cause BIOS memory training to fall back to a lower common data rate - for example, pairing this 6400 Mbps module with a 4800 Mbps module forces the entire channel to 4800 Mbps, cutting per-module bandwidth from 51.2 GB/s to 38.4 GB/s. Follow the platform manual's DIMM population order (typically white-slots-first) to ensure correct channel mapping.
DDR5 modules include on-module PMIC and thermal sensors accessible via sideband bus; enable BIOS-level thermal throttling (typically triggering near 85 C per JEDEC convention) so workloads degrade gracefully rather than failing. In dense 1U chassis with limited airflow, ensure memory channel heatsinks or directed airflow across DIMMs; single-rank 1.1 V modules like the M321R2GA3PB2-CCP dissipate relatively little heat, but fully populated 24-DIMM servers still benefit from verified airflow paths across the memory banks.
DDR5 moves voltage regulation from the motherboard to the module itself: each RDIMM carries an on-module 12 V-to-1.1 V PMIC. Estimated: a single-rank 16 GB module at full bandwidth typically draws on the order of 3-5 W, so a 24-DIMM dual-socket server allocates roughly 75-120 W to memory. Ensure the server platform's 12 V memory rail budget accommodates the populated module count; this is factory-configured in OEM servers but must be validated in custom/embedded designs.
Compliance-Informationen
Compliance data not explicitly stated in the retrieved web sources. Samsung server memory modules are typically RoHS-compliant; confirm on the official Samsung product page before procurement.
