M321R2GA3PB2-CCP - 16GB DDR5-6400 RDIMM ECC | Samsung
MPN: M321R2GA3PB2-CCP ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89 | $89.00 |
| 10 | $84.55 | $845.50 |
| 100 | $79.2 | $7,920.00 |
| 500 | $74.75 | $37,375.00 |
| 1,000 | $70.35 | $70,350.00 |
Drop-in alternatives for M321R2GA3PB2-CCP — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M321R2GA3EB2-CCP
✅ Drop-In✓ In Stock
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View Datasheet →M321R2GA3PB0-CWM
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →M321R2GA3EB0-CWM
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →M321R2GA3EB2-CWM
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →M321R4GA3PB2-CCP
✅ Drop-In📋 Reference alternative (not in catalog)
M321R6GA3PB2-CCP
✅ Drop-In📋 Reference alternative (not in catalog)
M321R2GA3PB2-CCP Maximum Ratings & Electrical Characteristics
| Memory Type | DDR5 SDRAM |
| Module Type | RDIMM (Registered DIMM with ECC) |
| Capacity | 16 GB |
| Data Rate | 6400 Mbps (PC5-51200) |
| Operating Voltage | 1.1 V |
| Rank x Organization | 1R x 8 |
| Module Configuration | 2G x 72 |
| DRAM Composition | 10 x FBGA 2G x 8 DDR5 DRAM |
| CAS Latency | CL52 |
| Pin Count | 288 |
| ECC | Yes (Registered, 64+8) |
| Product Status | Mass Production |
| Form Factor | 288-pin RDIMM |
| Single Rank | Yes (1R) |
| Application | Server / Workstation |
| JEDEC Standard | DDR5 RDIMM (JEDEC-compliant) |
M321R2GA3PB2-CCP standard Pin Configuration Guide
Complete pinout information for M321R2GA3PB2-CCP (standard package) with 288 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M321R2GA3PB2-CCP.
Refer to the datasheet for full pin configuration.
Estimated pin count: 288 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M321R2GA3PB2-CCP is suitable for 6 applications: Enterprise Server Memory, Cloud and Hyperscale Compute, Virtualization Hosts, High-Performance Workstations, Database and In-Memory Analytics, Storage Controllers and Network Appliances.
Enterprise Server Memory
The M321R2GA3PB2-CCP is purpose-built for enterprise server memory subsystems, where its 6400 Mbps data rate delivers 51.2 GB/s per module of peak bandwidth and its registered topology reduces electrical loading so memory controllers can support higher module counts per channel. The 72-bit ECC-protected interface corrects single-bit errors in always-on workloads, and the 1.1 V DDR5 supply plus on-module PMIC improves power efficiency versus DDR4 RDIMMs. Installed in Dell PowerEdge or HPE ProLiant Gen11-class platforms, it slots into a 288-pin registered channel; single-rank 1Rx8 construction simplifies memory training at full speed in 8-12 DIMM per CPU configurations, sustaining bandwidth under heavy virtualization or database load.
Recommended
Cloud and Hyperscale Compute
In cloud and hyperscale data centers, node cost and power per gigabyte are the dominant metrics, and the M321R2GA3PB2-CCP addresses both. Its single-rank 16 GB 1Rx8 design is the mainstream capacity tier for high-core-count cloud instances, delivering 6400 Mbps (PC5-51200) bandwidth at only 1.1 V, while DDR5's bank-group architecture increases effective parallelism for multi-tenant workloads. On-module ECC plus DDR5 on-die ECC keeps uncorrected error rates low across thousands of operating hours. Deployed two DIMMs per channel in standard 1U/2U servers, the module supports memory-hungry container and VM fleets; single-rank population also helps maximize achievable frequency when all channels are filled.
Recommended
Virtualization Hosts
Virtualization platforms (VMware ESXi, KVM, Hyper-V) benefit directly from the M321R2GA3PB2-CCP's combination of 16 GB density, 6400 Mbps bandwidth, and hardware ECC. Hypervisor memory overcommit and page-sharing amplify the cost of memory errors, so the 64+8 ECC topology and DDR5 on-die ECC are functionally required for production hosts. The registered DIMM interface maintains signal integrity with high DIMM counts per CPU, and the 1.1 V rail keeps the memory subsystem's share of node power low. Populating channels uniformly with these single-rank modules lets the BIOS train the bus at its rated 6400 Mbps speed, maximizing VM consolidation ratios per socket.
Recommended
High-Performance Workstations
Threadripper Pro, Xeon W, and other workstation-class platforms that support registered DDR5 can use the M321R2GA3PB2-CCP for CAD, simulation, and content-creation workloads. Its 6400 Mbps data rate provides 51.2 GB/s of module bandwidth, which shortens solver and render times in memory-bandwidth-bound applications, while ECC protects multi-hour simulations from silent data corruption. The 288-pin RDIMM installs in the platform's registered-DDR5 slots, and the single-rank organization eases memory training when all eight or twelve channels are populated. Note that consumer desktop platforms do not support RDIMMs; this module is strictly for workstation/server chipsets.
Recommended
Database and In-Memory Analytics
In-memory databases and analytics engines (SAP HANA-class, Redis, OLAP accelerators) are directly limited by memory capacity and bandwidth. The M321R2GA3PB2-CCP supplies 16 GB per module at 6400 Mbps, and populating 24 DIMMs across dual-socket servers reaches hundreds of gigabytes with multi-hundred-GB/s aggregate bandwidth. The registered interface preserves timing margin at these speeds, and hardware ECC is essential because a single uncorrected bit error can corrupt transactional state. The 1.1 V DDR5 rail and on-module PMIC also reduce per-GB power versus DDR4 solutions, lowering TCO for always-on analytical clusters running 24/7 query workloads.
Recommended
Storage Controllers and Network Appliances
Enterprise storage controllers, NVMe-oF gateways, and high-throughput network appliances require small amounts of highly reliable registered memory for firmware, metadata caches, and packet buffers. The M321R2GA3PB2-CCP's 16 GB capacity fits typical appliance memory budgets, its ECC protection guards metadata integrity, and its JEDEC-standard 288-pin RDIMM interface integrates into embedded server-on-chip designs (e.g., Broadcom, AMD EPYC Embedded platforms). At 6400 Mbps the module keeps cache lookups and buffer copies off the bandwidth bottleneck, and the 1.1 V operation suits thermally constrained appliance chassis where cooling headroom is limited by fan acoustics requirements.
Recommended
Recommended Products Summary
Engineering reference data for M321R2GA3PB2-CCP — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M321R2GA3EB2-CCP | M321R2GA3PB0-CWM | M321R4GA3PB2-CCP | M321R6GA3PB2-CCP |
|---|---|---|---|---|---|
| Package | 288-pin RDIMM | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Capacity | 16 GB | 16 GB | 16 GB | 32 GB | 48 GB |
| Data Rate | 6400 Mbps (PC5-51200) | 6400 Mbps | [DATA_NEEDED] | 6400 Mbps | 6400 Mbps |
| Rank x Organization | 1R x 8 | 1R x 8 | 1R x 8 | 2R x 8 | 2R x 8 |
| Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| ECC / Registration | ECC Registered (RDIMM) | ECC Registered | ECC Registered | ECC Registered | ECC Registered |
| Module Configuration | 2G x 72 | 2G x 72 | 2G x 72 | 4G x 72 | [DATA_NEEDED] |
| Lifecycle Status | Mass Production (active) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Higher bandwidth than 5600 Mbps alternatives (vs M323R4GA3PB0-CWM)
- Newer DRAM die generation (vs M321R2GA3EB2-CCP)
- Single-rank training advantage at full population (vs M321R4GA3PB2-CCP)
Design Notes
Do not attempt to install this 288-pin RDIMM in a consumer desktop platform. Registered DDR5 modules have different keying and firmware requirements than unbuffered UDIMMs, and desktop BIOSes will not train registered modules. Similarly, do not mix RDIMMs with LR-DIMMs or UDIMMs in the same channel - JEDEC platform rules prohibit mixed module types. Verify the server OEM qualified vendor list (QVL) before deployment; while the part is JEDEC-compliant, OEM firmware validation is the authoritative compatibility reference for Dell, HPE, and Lenovo platforms.
For maximum bandwidth, populate all channels uniformly with identical single-rank modules (same MPN, rank, and speed bin). Mixed rank or mixed speed populations cause BIOS memory training to fall back to a lower common data rate - for example, pairing this 6400 Mbps module with a 4800 Mbps module forces the entire channel to 4800 Mbps, cutting per-module bandwidth from 51.2 GB/s to 38.4 GB/s. Follow the platform manual's DIMM population order (typically white-slots-first) to ensure correct channel mapping.
DDR5 modules include on-module PMIC and thermal sensors accessible via sideband bus; enable BIOS-level thermal throttling (typically triggering near 85 C per JEDEC convention) so workloads degrade gracefully rather than failing. In dense 1U chassis with limited airflow, ensure memory channel heatsinks or directed airflow across DIMMs; single-rank 1.1 V modules like the M321R2GA3PB2-CCP dissipate relatively little heat, but fully populated 24-DIMM servers still benefit from verified airflow paths across the memory banks.
DDR5 moves voltage regulation from the motherboard to the module itself: each RDIMM carries an on-module 12 V-to-1.1 V PMIC. Estimated: a single-rank 16 GB module at full bandwidth typically draws on the order of 3-5 W, so a 24-DIMM dual-socket server allocates roughly 75-120 W to memory. Ensure the server platform's 12 V memory rail budget accommodates the populated module count; this is factory-configured in OEM servers but must be validated in custom/embedded designs.
Compliance Information
Compliance data not explicitly stated in the retrieved web sources. Samsung server memory modules are typically RoHS-compliant; confirm on the official Samsung product page before procurement.
