MAX14806CCM+T - 16-Channel 200V Ultrasound Switch | Analog Devices
Teilenummer: MAX14806CCM+T ✓ AktivMAX14806CCM+T Übersicht
A high-voltage analog switch is an integrated semiconductor device that routes high-voltage analog signals while isolating sensitive receiver or transmitter circuits when a channel is not selected. Within the signal-chain hierarchy, the MAX14806 belongs to the analog switch family, interface IC category, and broader semiconductor category. Its primary role in an ultrasound probe is selecting groups of piezoelectric elements without introducing excessive charge injection or allowing residual voltage to accumulate.
The MAX14806CCM+T offers 16 SPST channels arranged as two banks of eight. Each terminal includes a 40 kΩ bleed resistor that helps reduce voltage buildup in capacitive loads such as piezoelectric elements. Digital controls DIN1 and DIN2 select the two eight-channel banks, while the 200 V switch process supports high-voltage analog signal routing. The specified extended operating range of -40°C to +85°C suits industrial and medical imaging equipment with controlled ambient conditions.
Internally, the switch architecture uses separate high-voltage channels with integrated discharge paths. The bleed resistors provide a defined leakage route after deselection, which is particularly valuable when connecting capacitive transducers that can otherwise retain charge between transmit and receive cycles. Because switched nodes can develop substantial voltage, PCB creepage, clearance, exposed-pad treatment, and high-voltage routing require careful implementation.
Typical uses include bank selection in biplane and triplane ultrasound probes, replacement of discrete high-voltage relays, and switching networks for piezoelectric imaging arrays. The 48-terminal surface-mount package supports compact probe electronics, while the integrated bleed resistors reduce the external component count needed for charge management.
Designers should verify that every high-voltage trace has adequate spacing, avoid placing sensitive receiver paths beneath or beside switched nodes, and use the manufacturer pin-description table when assigning PCB connections. The digital interface operates from 2.7 V to 5.5 V, but control signals must not be treated as high-voltage lines because the 200 V rating applies to the switched analog nodes.
This product page consolidates the device architecture, verified electrical attributes, package information, application guidance, and the documented Supertex HV2731 drop-in relationship into an engineering-oriented reference for ultrasound probe and high-voltage switching designs.
Drop-in-Alternativen für MAX14806CCM+T – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
HV2731
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MAX14806CCM+T Grenzwerte & elektrische Eigenschaften
| Number of Channels | 16 channels |
| Switch Configuration | 2 banks of 8 SPST switches |
| High-Voltage Process | 200 V |
| On Resistance | 16 ohm |
| Bleed Resistance | 40 kOhm per switch terminal |
| Logic Supply Voltage Range | 2.7 V to 5.5 V |
| Betriebstemperaturbereich | -40°C to +85°C |
| Gehäuse | 48-LQFP, 7 mm x 7 mm |
| Terminal Count | 48 terminals |
| Package Type | QFP, square surface-mount package |
| Montageart | Surface mount |
| Temperature Grade | Industrial |
| Digital Control Inputs | 2 inputs: DIN1 and DIN2 |
| Lead-Free Status | Lead free |
| RoHS-Status | RoHS compliant |
| Primary Application | High-voltage switching for ultrasonic imaging |
MAX14806CCM+T qfp, square surface-mount package Pinbelegungsleitfaden
Pinbelegung für MAX14806CCM+T (qfp, square surface-mount package-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für MAX14806CCM+T.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MAX14806CCM+T ist geeignet für 6 Anwendungs: Biplane Ultrasound Probe Bank Selection, Triplane Ultrasound Probe Bank Selection, Piezoelectric Transducer Charge Management, High-Voltage Relay Replacement, Medical Ultrasound Receive-Select Networks, Compact High-Voltage Probe Electronics.
Biplane Ultrasound Probe Bank Selection
The MAX14806CCM+T fits biplane ultrasound probes because it routes 16 high-voltage analog channels as two independently selected eight-channel banks. A 200 V switch process supports the voltage excursions encountered in piezoelectric imaging systems, while DIN1 and DIN2 provide bank control from a 2.7 V to 5.5 V logic supply. Each terminal includes a 40 kΩ bleed resistor to help reduce residual voltage on capacitive transducer elements after deselection. The 48-LQFP, 7 mm by 7 mm package also allows the switching array to be placed close to the probe connector and transducer elements, reducing sensitive high-voltage trace lengths.
Triplane Ultrasound Probe Bank Selection
The MAX14806CCM+T can serve as the bank-selection network in a triplane probe, where separate element groups require controlled high-voltage switching. Its two eight-channel SPST banks let the imaging system choose the active transducer group through DIN1 and DIN2, while the 16-channel architecture limits the number of discrete switch positions needed in the probe. The integrated 40 kΩ bleed resistors are particularly relevant when the selected elements present substantial capacitance to ground. Engineers should preserve adequate creepage and clearance around all switched nodes and review the pin-description table before laying out the 48-LQFP footprint.
Piezoelectric Transducer Charge Management
The MAX14806CCM+T is suitable for switching networks that connect to capacitive piezoelectric transducers and need a defined discharge path after a channel is deselected. Every switch terminal incorporates a 40 kΩ bleed resistor, helping reduce voltage buildup in the connected capacitive load. The device’s 16 SPST channels allow multiple transducer elements or groups to share a controlled interface, and the 200 V process is appropriate for high-voltage ultrasound switching. The design should still account for switch transition effects, external protection, leakage paths, and the time required for each transducer node to discharge before the next acquisition or transmit phase.
High-Voltage Relay Replacement
The MAX14806CCM+T can replace multiple discrete high-voltage relays in ultrasound imaging and similar analog-routing systems. Sixteen SPST switches are integrated into one 48-LQFP device, reducing component count and providing a compact alternative to a bank of mechanical or discrete solid-state relays. The integrated 40 kΩ bleed resistors provide a defined discharge route on every terminal, while DIN1 and DIN2 independently select two eight-channel groups. Before conversion, verify relay isolation voltage, contact capacitance, switching lifetime, and fail-safe behavior against the requirements of the original circuit; a smaller package alone does not guarantee equivalent system reliability.
Medical Ultrasound Receive-Select Networks
The MAX14806CCM+T fits receive-select networks that route selected elements of a high-voltage ultrasound probe while isolating other channels. Its 16 ohm on resistance and 200 V process provide the core switching function, while the two-bank organization simplifies group selection across probe elements. The bleed resistors help capacitive nodes return toward a defined state after switching, which is useful in phased-array and receive multiplexing systems. Layout should keep the sensitive receive path away from high-voltage switching nodes, and the manufacturer’s complete application circuit should be used as the basis for decoupling, protection, and routing decisions.
Compact High-Voltage Probe Electronics
The MAX14806CCM+T supports compact probe electronics by integrating 16 high-voltage SPST switches and their bleed resistors into a 7 mm by 7 mm surface-mount package. That integration can shorten connections to a multi-element piezoelectric connector while maintaining controlled bank selection through two digital inputs. The 2.7 V to 5.5 V logic interface is compatible with common embedded control systems, and the -40°C to +85°C rating covers industrial-temperature equipment. Thermal performance still depends on the PCB land pattern and copper area, while high-voltage safety depends on spacing, cleanliness, insulation, and the final enclosure or probe construction.
Technische Referenzdaten für MAX14806CCM+T – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | HV2731 |
|---|---|---|
| Brand | Analog Devices | Supertex |
| Package | 48-LQFP, 7 mm x 7 mm | 48-pin TQFP |
| Operating Temperature Range | -40°C to +85°C | -40°C to +85°C |
| Drop-In Relationship | Analog Devices device | Documented drop-in replacement for MAX14806CCM+ |
Wichtigste Unterscheidungsmerkmale
- Documented cross-manufacturer drop-in path (vs. HV2731)
- Integrated charge-management resistors (vs. HV2731)
- Two independently controlled high-voltage banks (vs. HV2731)
Designhinweise
Route every switched high-voltage node with the clearance and creepage required by the maximum working voltage, contamination conditions, board material, and applicable product safety standard. Keep the 200 V process rating separate from the 2.7 V to 5.5 V logic supply. Place the switching IC close to the probe connector or transducer interface where practical, but preserve guarded spacing around high-voltage pins and avoid routing sensitive receiver traces directly beneath them.
Do not assume that the integrated 40 kΩ bleed resistor discharges every external transducer network instantaneously. The effective discharge time also depends on capacitance, leakage, switch behavior, and connected circuitry. Check the voltage remaining on each node before the next transmit or receive phase. Also verify DIN1 and DIN2 logic levels against the 2.7 V to 5.5 V supply range instead of applying the high-voltage switch rating to the control inputs.
Use the manufacturer package drawing and pin-description table for the 48-LQFP land pattern, exposed-pad treatment, and pin numbering. If the PCB design uses thermal vias or exposed copper under the device, confirm that the mechanical and electrical land pattern matches the manufacturer guidance. Add local decoupling according to the reference circuit and provide a low-impedance ground path so high-current return currents do not flow through sensitive transducer return traces.
Compliance-Informationen
The device is identified as RoHS compliant and lead free. AEC-Q100 is not applicable to this ordering option, while REACH, halogen-free, and conflict-minerals status are not established in the cited material.
