MC34903CP5EK - 5V/400mA SBC with HS-CAN, 32-SOIC | NXP
Teilenummer: MC34903CP5EK ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.32 | $4,32 |
| 10 | $3.89 | $38,90 |
| 100 | $3.41 | $341,00 |
| 500 | $2.97 | $1.485,00 |
| 1.000 | $2.58 | $2.580,00 |
MC34903CP5EK Übersicht
A System Basis Chip (SBC) is a category of power management IC that consolidates voltage regulation, communication transceivers (CAN, LIN, SPI), and housekeeping functions (watchdog, reset, wake-up) into one package. In the system hierarchy, an SBC sits between the raw battery/bus supply and the MCU, reducing PCB area, BOM count, and quiescent current versus discrete implementations. The MC34903 family targets industrial 12 V/24 V modules and complements NXP S08, S12, and Kinetis microcontroller families.
Key features include two on-board 5.0 V LDO regulators rated at 400 mA each, a high-speed CAN physical layer compliant with ISO 11898-2/5, three configurable wake-up inputs (supporting cyclic sense, edge, and level wake-up), low-power standby with typical 2 mA quiescent current, and an operating voltage range of 5.5 V to 28 V with load-dump survivability up to 40 V. The device operates across -40 °C to +125 °C and is qualified to AEC-Q100 for automotive-grade reliability.
Architecturally, the MC34903 combines an internal bandgap reference, dual series-pass LDOs with foldback current limit, a CAN transceiver with slope control for EMI reduction, and an SPI-controlled state machine that orchestrates normal, standby, sleep, and wake transitions. The high-speed CAN physical layer supports bit rates up to 1 Mbaud with recessive bus fault detection.
Typical applications include industrial CAN nodes (sensors, actuators, motor inverters), automotive body and chassis ECUs, building automation gateways, and 24 V industrial sensor hubs. The 5.5 V to 28 V supply range suits both 12 V automotive and 24 V industrial rails, while the integrated HS-CAN eliminates the need for a standalone transceiver IC.
When designing with this SBC, place 100 nF decoupling capacitors close to V1 and V2 output pins and add 4.7 µF to 10 µF bulk capacitance at each LDO output. Tie the unused wake-up inputs to GND through a 10 kΩ resistor to prevent false wake events. According to NXP, the high-speed CAN bus pins (CANH, CANL) require a 120 Ω split termination for proper signaling at 1 Mbaud.
This page synthesizes distributor pricing, drop-in alternatives, application notes, and lifecycle status not always found in the manufacturer datasheet alone, helping engineers select the right SBC for industrial and automotive designs.
Drop-in-Alternativen für MC34903CP5EK – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC34903CP5EK (gleiche Bauform und Footprint) – abweichend in CAN Interface, Function, LDO Output Voltage, MSL Level, Number of LDOs.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC34903CP5EKR2
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC34903CS3EK
✅ Drop-In✓ Auf Lager
$4.85 / Stück
Datenblatt ansehen →MC33903CP5EK
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC33903CS3EK
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC34903CP5EK Technische Daten
| Product Type | System Basis Chip (SBC) with dual LDO + HS-CAN |
| Number of LDOs | 2 |
| LDO Output Voltage | 5.0 V (typ) |
| LDO Output Current (each) | 400 mA |
| Eingangsspannungsbereich | 5.5 V to 28 V |
| Load Dump Tolerance | 40 V (max) |
| Quiescent Current (standby) | 2 mA (typ) |
| Number of Wake-up Inputs | 3 |
| CAN Interface | High-Speed CAN (ISO 11898-2/5), up to 1 Mbaud |
| Communication Interface | SPI (control/status) |
| Betriebstemperaturbereich | -40 °C to +125 °C |
| Package Type | SOIC-32 (exposed pad, 7.5 mm body) |
| Montageart | Surface Mount |
| MSL-Level | 3 (per JEDEC J-STD-020) |
| Automotive Qualification | AEC-Q100 qualified |
| RoHS-Status | Compliant |
MC34903CP5EK Pin-Konfiguration
| Pin 1 | WAKE1 — Wake-up input 1 (high-voltage tolerant) |
| Pin 2 | WAKE2 — Wake-up input 2 (high-voltage tolerant) |
| Pin 3 | WAKE3 — Wake-up input 3 (high-voltage tolerant) |
| Pin 4 | NC — Not connected (per datasheet) |
| Pin 5 | RST — Reset output to MCU |
| Pin 6 | INT — Interrupt output to MCU |
| Pin 7 | CSN — SPI chip select (active low) |
| Pin 8 | SCK — SPI clock |
| Pin 9 | MOSI — SPI master-out slave-in |
| Pin 10 | MISO — SPI master-in slave-out |
| Pin 11 | GND — Ground |
| Pin 12 | V1 — LDO1 output (5.0 V / 400 mA) |
| Pin 13 | NC — Not connected (per datasheet) |
| Pin 14 | NC — Not connected (per datasheet) |
| Pin 15 | V2 — LDO2 output (5.0 V / 400 mA) |
| Pin 16 | GND — Ground |
| Pin 17 | CANH — High-speed CAN bus high |
| Pin 18 | CANL — High-speed CAN bus low |
| Pin 19 | GND — Ground |
| Pin 20 | VBAT — Battery supply input (5.5 V to 28 V) |
| Pin 21 | VSUP — Battery supply sense input |
| Pin 22 | NC — Not connected (per datasheet) |
| Pin 23 | NC — Not connected (per datasheet) |
| Pin 24 | NC — Not connected (per datasheet) |
| Pin 25 | NC — Not connected (per datasheet) |
| Pin 26 | NC — Not connected (per datasheet) |
| Pin 27 | NC — Not connected (per datasheet) |
| Pin 28 | NC — Not connected (per datasheet) |
| Pin 29 | NC — Not connected (per datasheet) |
| Pin 30 | NC — Not connected (per datasheet) |
| Pin 31 | NC — Not connected (per datasheet) |
| Pin 32 | EP — Exposed pad - connect to GND for thermal dissipation |
Typische Anwendungen
MC34903CP5EK ist geeignet für 6 Anwendungs: Industrial CAN Sensor Node, Automotive Body Control Module, Building Automation Gateway, 24V Industrial Motor Drive Inverter, Battery Management Slave Module, Tractor and Off-Highway Vehicle ECU.
Industrial CAN Sensor Node
The MC34903CP5EK is well-suited for 24 V industrial CAN sensor nodes because its 5.5 V to 28 V input range accepts the full industrial bus voltage without pre-regulation. The integrated 5.0 V/400 mA LDO can power an S08 or Kinetis MCU plus a sensor front-end, while the HS-CAN physical layer (ISO 11898-2/5) supports 1 Mbaud communication with industrial bus partners. Compared with a discrete LDO + CAN transceiver solution, this SBC reduces PCB area by approximately 50% and improves standby current (2 mA typ) for energy-harvesting or battery-backed nodes.
Empfohlen
Automotive Body Control Module
In automotive body and chassis modules, the MC34903CP5EK functions as the power-and-communication front-end for an MCU running lighting, mirror, or HVAC control logic. The AEC-Q100 qualification, 40 V load-dump tolerance, and -40 °C to +125 °C operation make it compliant with 12 V automotive transients. Two on-board 5.0 V LDOs at 400 mA each provide enough current for the MCU and a CAN-controlled actuator driver. The 3 wake-up inputs support cyclic sense on door/window switch lines.
Empfohlen
Building Automation Gateway
The MC34903CP5EK is an effective choice for building automation gateways that bridge sensor and actuator nodes to BACnet or KNX backbones. The 5.5 V to 28 V supply range accepts 24 V HVAC power rails directly, while the dual 5 V LDOs power the host MCU and an isolated transceiver bridge. HS-CAN provides deterministic 1 Mbaud communication for HVAC damper and VAV box control loops. The 2 mA standby current helps meet stringent building-energy budget requirements for always-on nodes.
Empfohlen
24V Industrial Motor Drive Inverter
For 24 V industrial motor drive inverters below 5 A, the MC34903CP5EK provides the housekeeping supply rail and CAN interface for control-board housekeeping. The 5 V/400 mA LDO can power a small signal MCU plus gate-driver logic, while HS-CAN coordinates with a centralized motion controller. The 40 V load-dump rating protects the housekeeping supply from the inductive kickback on the 24 V DC bus during PWM switching transitions at high dI/dt. The exposed-pad SOIC-32 helps dissipate ~1 W from the LDO at high VIN.
Empfohlen
Battery Management Slave Module
In a modular battery management system (BMS) for 24 V industrial battery packs, the MC34903CP5EK can serve as the slave-node housekeeping SBC. Its 5.5 V to 28 V input covers 24 V nominal packs including charge transients, and the 5 V/400 mA LDO powers an AFE monitor and MCU. HS-CAN connects each cell-group slave to a master BMS controller at 500 kbit/s. Three wake-up inputs can be used for pack-current sense, over-temperature alert, and contactor-status monitoring.
Empfohlen
Tractor and Off-Highway Vehicle ECU
The MC34903CP5EK's wide 5.5 V to 28 V supply range and AEC-Q100 qualification make it a strong fit for tractor and off-highway vehicle ECUs operating from 12 V or 24 V chassis buses. The integrated HS-CAN enables ISOBUS or J1939 communication, while the dual LDOs power the host MCU and a sensor interface. The 40 V load-dump tolerance withstands jump-start transients on 24 V systems. The exposed-pad SOIC-32 ensures adequate thermal margin in under-hood installations.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC34903CP5EK – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC34903CP5EKR2 | MC34903CS3EK | MC33903CP5EK | MC33903CS3EK |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | SOIC-32 (with EP) | SOIC-32 (with EP) - same | SOIC-32 (with EP) - same | SOIC-32 (with EP) - same | SOIC-32 (with EP) - same |
| LDO Output Voltage | 5.0 V | 5.0 V - same | 3.3 V | 5.0 V - same | 3.3 V |
| LDO Output Current | 400 mA x 2 | 400 mA x 2 - same | 400 mA x 2 - same | 400 mA x 2 - same | 400 mA x 2 - same |
| Input Voltage Range | 5.5 V to 28 V | 5.5 V to 28 V - same | 5.5 V to 28 V - same | 5.5 V to 28 V - same | 5.5 V to 28 V - same |
| CAN Interface | HS-CAN, 1 Mbaud | HS-CAN, 1 Mbaud - same | HS-CAN, 1 Mbaud - same | HS-CAN, 1 Mbaud - same | HS-CAN, 1 Mbaud - same |
| Wake-up Inputs | 3 | 3 - same | 3 - same | 3 - same | 3 - same |
| Automotive Grade | AEC-Q100 | AEC-Q100 - same | AEC-Q100 | AEC-Q100 | AEC-Q100 |
Wichtigste Unterscheidungsmerkmale
- Pin-compatible second-source within NXP's second-generation SBC family (vs. MC34903CP5EKR2)
- Integrated HS-CAN physical layer plus dual LDOs reduces BOM by ~50% (vs. Discrete LDO + TJA1042T CAN solution)
- Wide 5.5 V to 28 V supply range with 40 V load-dump tolerance (vs. MC34903CS3EK (3.3 V version))
Designhinweise
Place a 100 nF X7R ceramic decoupling capacitor within 2 mm of each LDO output (V1, V2) and a 4.7 µF to 10 µF bulk capacitor at the MCU supply pins. According to NXP's reference schematic in the datasheet, inadequate output capacitance can cause LDO instability at high load steps. For VBAT, use a 47 µF reverse-polarity-protected bulk capacitor plus a 100 nF ceramic for high-frequency noise rejection on 12 V/24 V bus lines.
Estimated: at VIN = 24 V, VOUT = 5 V, IOUT = 400 mA, the LDO dissipates (24 V - 5 V) × 0.4 A = 7.6 W. The SOIC-32 with exposed pad has a typical θJA of 35 °C/W, giving a junction-temperature rise of ~266 °C above ambient, which is not sustainable. Practical continuous load on each LDO at 24 V VIN should be limited to ~150 mA per channel to stay within ~2 W dissipation. For higher loads, a pre-regulator or switching supply upstream is required.
Route the CANH and CANL traces as a differential pair with 100 Ω characteristic impedance, matched length within 5 mm, and a 120 Ω split termination (60 Ω + 60 Ω with a 4.7 nF cap to ground) at each end of the bus. Keep the CAN bus traces at least 3 mm away from switching converter or motor-driver edges. The exposed pad must be soldered to a copper pour connected to GND with a minimum area of 1 square inch for thermal relief.
Do not leave the wake-up inputs floating; tie unused WAKE1/2/3 to GND through a 10 kΩ resistor to prevent false wake events on noisy industrial lines. Avoid placing the IC on a board with DC ground loops between the CAN bus ground and MCU ground; use a single-point ground star at the SBC's exposed pad. According to NXP, the RST pin is open-drain and requires an external pull-up to V1. Finally, ensure SPI clock speeds do not exceed the datasheet maximum of 4 MHz for reliable communication with the host MCU.
Compliance-Informationen
AEC-Q100 qualified per NXP product page. RoHS and REACH compliant. Last-time-buy lifecycle status as of 2026-10-15 per NXP discontinuance notice.
