MC68302CAG16VC - 16MHz M683xx MPU, 144-LQFP | NXP Semiconductors
Teilenummer: MC68302CAG16VC ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $109.55 | $109,55 |
| 10 | $98.6 | $986,00 |
| 100 | $87.65 | $8.765,00 |
| 500 | $76.7 | $38.350,00 |
| 1.000 | $65.75 | $65.750,00 |
MC68302CAG16VC Übersicht
An integrated multiprotocol processor (IMP) is a system-on-chip that merges a general-purpose microprocessor core with dedicated communication controllers such as HDLC, UART, and timers. In the broader IC taxonomy, the MC68302 belongs to the MPU -> embedded processor -> microcontroller family of semiconductor devices. Its tightly coupled architecture reduces external glue logic and is typically used in designs that need multiple serial channels orchestrated by a 68000-class CPU without paying for a full ASIC.
Key features include a 16 MHz clock rate, on-chip DMA, three independent serial communications controllers (SCCs) supporting HDLC/SDLC/UART protocols, two serial management controllers (SMCs), a 4-channel general-purpose timer, and a system integration module (SIM60). The 144-LQFP package provides ample I/O for parallel ports, chip selects, and the external address/data bus. The part operates from a 5V supply per legacy M68000-system convention, and is specified over the industrial temperature range.
The MC68302 is fabricated on a mature CMOS process and supports an 8- or 16-bit external data bus with a 32-bit internal architecture. This 8/16-bit external bus allows designers to use lower-cost memory and peripherals while still benefiting from 32-bit internal register and ALU operations. The chip integrates dedicated RISC-like DMA engines, freeing the CPU from low-level data movement across serial channels.
Typical applications include ISDN terminal adapters, industrial routers, protocol bridges, factory automation controllers, and legacy telecom equipment that requires HDLC framing. Designers often pair the MC68302 with external SRAM and EPROM plus a PHY/transceiver for serial line interfaces such as RS-232, RS-485, or V.35.
When designing with this part, plan memory map and chip-select configuration early because the SIM60 module hard-wires boot and chip-select behavior at reset. The non-multiplexed external bus simplifies PCB layout but consumes more pins than an address/data-multiplexed alternative.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for legacy M68000-system engineers that are not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für MC68302CAG16VC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC68302CAG16VC (gleiche Bauform und Footprint).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC68302CAG25VC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC68302CAG20VC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC68302CAG16C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC68302CAG10VC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC68302AG16VC
✅ Drop-In✓ Auf Lager
$53.16 / Stück
Datenblatt ansehen →MC68302CAG16VC Grenzwerte & elektrische Eigenschaften
| Processor Core | M68000 (M68302 family) |
| External Data Bus | 8/16-Bit |
| Internal Architecture | 32-Bit |
| Maximale Taktfrequenz | 16 MHz |
| Versorgungsspannung | 5 V |
| Gehäuse | 144-LQFP (20x20 mm) |
| Montageart | Surface Mount |
| Serial Communications Controllers (SCC) | 3 |
| Serial Management Controllers (SMC) | 2 |
| DMA Channels | On-chip DMA controller |
| General-Purpose Timers | 4 channels |
| Packaging | Tray |
MC68302CAG16VC 144-lqfp (20x20 mm) Pinbelegungsleitfaden
Pinbelegung für MC68302CAG16VC (144-lqfp (20x20 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC68302CAG16VC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC68302CAG16VC ist geeignet für 6 Anwendungs: ISDN Terminal Adapter, Industrial Multi-Channel Router, X.25 / HDLC Protocol Bridge, Point-of-Sale Terminal Controller, Legacy Telecom Equipment (PBX / Channel Bank), Factory Automation Controller.
ISDN Terminal Adapter
The MC68302CAG16VC is a strong fit for ISDN terminal adapters because three independent SCCs can drive the D-channel and two B-channels simultaneously while the M68000 core runs the upper-layer protocol stack. At 16 MHz the CPU sustains X.25/LAPD framing tasks without DMA starvation, and the integrated DMA engine offloads HDLC bit stuffing from the core. Place the MC68302CAG16VC between an ISDN transceiver (e.g., Motorola MC145574) and an external SRAM/EPROM bank; unlike a discrete MPU+UART/HDLC solution, this single chip reduces BOM cost by 30-40%. The 144-LQFP package provides ample address space for boot ROM plus 512 KB of working RAM. Trade-off: the 5 V supply and non-multiplexed bus mean larger PCB footprint than modern 3.3 V alternatives.
Empfohlen
Industrial Multi-Channel Router
In industrial router designs that bridge RS-232, RS-485, and V.35 links, the MC68302CAG16VC delivers three SCCs that can be software-configured for HDLC, asynchronous, or bisync protocols on a per-channel basis. Its 16 MHz CPU plus DMA supports routing throughput comparable to the original 68302 design point (typically 1-2 Mbps aggregate), adequate for legacy factory-floor networks. The non-multiplexed 8/16-bit external data bus simplifies the PCB layout and lets engineers use low-cost SRAM/EPROM. Unlike newer 32-bit Cortex-M SoCs, the MC68302CAG16VC is widely understood by long-tenured embedded engineers and has decades of stable firmware availability. Designers should plan for industrial-temperature screening because the part is End of Life.
Empfohlen
X.25 / HDLC Protocol Bridge
The MC68302CAG16VC was designed specifically for multi-channel X.25 and HDLC bridging, with each SCC supporting hardware CRC generation, flag detection, and zero-bit insertion/deletion at line speeds up to the bus clock divided by 4. At 16 MHz the chip sustains full-duplex HDLC at 2 Mbps on multiple channels concurrently, which is exactly the throughput envelope of legacy packet-switched networks. The on-chip DMA controller moves frame data to/from external buffers without CPU intervention, leaving the M68000 core free for routing table lookups. The 144-LQFP footprint gives designers enough parallel I/O for status LEDs, configuration DIP switches, and front-panel diagnostics. Pair the part with external RAM for packet buffers and an HDLC transceiver such as the MC68160.
Empfohlen
Point-of-Sale Terminal Controller
POS terminals in the 1990s and early 2000s frequently used the MC68302CAG16VC because its combination of M68000 CPU and multi-channel serial made it ideal for connecting mag-stripe readers, thermal printers, cashier keypads, and back-office modems on a single chip. The 16 MHz clock and on-chip DMA keep transaction latency low, and the system integration module handles chip-select generation for boot ROM, working RAM, and I/O peripherals without external glue logic. The 144-LQFP package fits in the back of a POS terminal mainboard. Unlike newer ARM-based POS controllers, the MC68302CAG16VC retains long-term software support from existing firmware libraries; for greenfield POS designs, however, a modern ARM Cortex-A SoC with integrated crypto is recommended.
Empfohlen
Legacy Telecom Equipment (PBX / Channel Bank)
PBX line cards and T1/E1 channel banks built on the MC68302CAG16VC use the SCCs for TDM trunk aggregation while the M68000 core runs call-processing firmware. The 16 MHz CPU is well-matched to 64 kbps DS0 channel handling across all three SCCs, and the four on-chip timers generate precise framing pulses. The 144-LQFP package and 5 V supply make this part drop-in compatible with decades of installed telecom infrastructure. Compared to a soft-core on an FPGA, the MC68302CAG16VC delivers lower BOM cost, deterministic real-time behavior, and a battle-tested toolchain (GNU m68k-elf GCC, DBug ROM monitor). Replace it with the 25 MHz MC68302CAG25VC only if firmware timing budgets demand extra headroom.
Empfohlen
Factory Automation Controller
Factory automation controllers (PLCs, motion controllers, distributed I/O nodes) used the MC68302CAG16VC for its rugged M68000 architecture, multi-channel serial support for fieldbus protocols, and deterministic interrupt response. Each SCC can run Profibus, Interbus, or custom RS-485 protocols while the CPU executes ladder-logic or motion-control loops. The four on-chip timers drive stepper/servo pulse generation, and the parallel I/O bank interfaces to opto-isolated 24 V industrial I/O. The 144-LQFP package and industrial-temperature screening make it viable for factory floor deployment. Trade-off: the 16 MHz clock limits loop rates to a few kHz, so high-end motion control benefits from the 25 MHz MC68302CAG25VC drop-in.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC68302CAG16VC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC68302CAG25VC | MC68302CAG20VC | MC68302CAG16C | MC68302CAG10VC | MC68302AG16VC |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Clock Frequency | 16 MHz | 25 MHz | 20 MHz | 16 MHz | 10 MHz | 16 MHz |
| SCC Channels | 3 | 3 | 3 | 3 | 3 | 3 |
| External Data Bus | 8/16-bit | 8/16-bit | 8/16-bit | 8/16-bit | 8/16-bit | 8/16-bit |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Temperature Grade | VC suffix (industrial) | VC suffix (industrial) | VC suffix (industrial) | C suffix (commercial) | VC suffix (industrial) | VC suffix (industrial) |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL |
Wichtigste Unterscheidungsmerkmale
- Pin-compatible 25 MHz speed grade exists as a drop-in upgrade (vs. MC68302CAG25VC)
- Industry-standard M68000 core preserves software compatibility with 30+ years of firmware (vs. MC68340AG16E (general-purpose M683xx MPU))
- Versus CPU32-based MC68332ACAG16, the MC68302CAG16VC has more serial channels (vs. MC68332ACAG16)
Designhinweise
Estimated: the 144-LQFP package has a body size of 20x20 mm with 0.5 mm pitch. Place 4-layer PCB with continuous ground plane directly under the device to provide a low-impedance return path for the 16 MHz bus. Keep trace lengths on the address and data buses matched within 5 mm to prevent bus skew at full-speed operation; add 33 ohm series termination on the data bus if the trace length exceeds 50 mm.
The MC68302CAG16VC requires a stable 5 V supply; add a 100 uF bulk capacitor near the VCC pins plus 0.1 uF ceramic decoupling on every VCC/GND pair. The SIM60 module draws significant current during DMA bursts, so the 5 V regulator must have at least 20% headroom above the worst-case ICC. Use a linear regulator (e.g., LM7805) rather than a switching regulator if the application is noise-sensitive, because switching ripple couples into the analog supply of the serial transceivers.
Do not assume the 'C' suffix denotes RoHS or lead-free; in legacy Motorola/Freescale naming, 'C' typically indicates commercial temperature grade. Verify RoHS status from the supplier's compliance documentation. Also, beware that some distributors list MC68302 variants at 3.3 V (erroneously); the canonical NXP MC68302 specification is 5 V, and 3.3 V operation requires a different mask set. Always cross-reference the datasheet before designing the power tree.
Estimated: at 16 MHz the MC68302CAG16VC typical ICC is on the order of 100-150 mA at 5 V, yielding 0.5-0.75 W dissipation. The 144-LQFP package has a theta_JA of roughly 40-50 C/W on a 4-layer JEDEC board, so junction temperature rise above ambient is 20-40 C. For industrial enclosures up to 70 C ambient, no heatsink is required, but derate clock frequency if ambient exceeds 85 C. Verify against the NXP MC68302UM thermal characterization for your specific PCB layout.
Compliance-Informationen
Compliance status not explicitly stated in verified distributor data. The part is EOL per NXP product page; original Motorola/Freescale-era parts in this family often predate RoHS mandates. Request compliance documentation directly from the supplier when sourcing.
