MC68302CRC16C - 16MHz IMP M683xx MPU | NXP | Networking
Teilenummer: MC68302CRC16C ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $49.5 | $49,50 |
| 10 | $42.75 | $427,50 |
| 100 | $36.95 | $3.695,00 |
| 500 | $31.5 | $15.750,00 |
| 1.000 | $28.2 | $28.200,00 |
MC68302CRC16C Übersicht
An Integrated Multiprotocol Processor (IMP) is a category of VLSI devices that merge a general-purpose microcontroller core with purpose-built communication peripherals, allowing a single chip to handle both host processing and protocol framing for serial protocols like HDLC, UART, and BISYNC. The MC68302 family occupies the niche between pure microcontrollers and dedicated protocol controllers, sitting inside the broader hierarchy: microcontroller -> communication controller -> integrated multiprotocol processor -> VLSI networking controller.
Key features of the MC68302CRC16C variant include a maximum CPU clock of approximately 16.67 MHz (24 MHz input clock via the on-chip PLL), three serial communication controllers (SCCs) configurable for HDLC/SDLC, UART, BISYNC, and transparent modes, two serial management controllers (SMCs), seven DMA channels, three independent timers, a 24-bit address bus, and a 16-bit data bus. The integrated RISC communications processor offloads bit-level protocol work from the main CPU core.
The architecture pairs the well-known M68000 instruction set with a tightly coupled RISC-style communications engine, allowing the main CPU to execute application code while the communications processor manages DMA-driven SCC frame reception/transmission without CPU intervention. This dual-engine topology lets the device sustain wire-speed HDLC on multiple channels while still running management software.
Typical applications include wide-area network routers and bridges, X.25 packet assembler/disassembler (PAD) equipment, ISDN terminal adapters, frame relay access devices, industrial serial-backplane controllers, and legacy telecom control boards. The ceramic PGA package suits through-hole industrial and telecom backplanes where thermal headroom and socket-replaceability matter more than board real estate.
When designing with this device, allocate careful attention to bus arbitration and memory timing, because the on-chip DMA engine can request the external bus at any time during active SCC reception. A wait-state calculator for the chosen SRAM/EPROM speed grade is recommended before finalizing PCB layout. The PGFA ceramic PGA package also requires a socket or plated-through-hole footprint, so PCB fabrication cost is higher than equivalent QFP MPU designs.
This page synthesizes distributor pricing, drop-in variants within the MC68302 family, and practical engineering notes not found in the standalone manufacturer datasheet, giving procurement and design engineers a single-source reference for sourcing and second-sourcing decisions.
Drop-in-Alternativen für MC68302CRC16C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC68302CRC16C (gleiche Bauform und Footprint) – abweichend in Mounting Type, Core Architecture, Data Bus Width, RoHS Status, DMA Channels.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC68302CRC25C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC68302CRC20C
✅ Drop-In✓ Auf Lager
$47.8 / Stück
Datenblatt ansehen →MC68302RC16C
✅ Drop-In✓ Auf Lager
$42.5 / Stück
Datenblatt ansehen →MC68302CEH16C
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$49.9 / Stück
Datenblatt ansehen →MC68302CRC16B
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC68302RC20C
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$27.85 / Stück
Datenblatt ansehen →MC68302CRC16C Grenzwerte & elektrische Eigenschaften
| Product Type | Integrated Multiprotocol Processor (IMP) |
| Core | M68000 (M683xx family) 8/16-bit |
| Operating Frequency | 16 MHz (16.67 MHz) |
| Versorgungsspannung | 5 V |
| Number of Cores | 1 |
| Bit Width | 8/16-bit data bus, 24-bit address bus |
| Serial Communication Controllers (SCC) | 3 channels |
| Serial Management Controllers (SMC) | 2 channels |
| DMA Channels | 7 |
| Timers | 3 |
| Address Bus Width | 24 bit |
| Datenbusbreite | 16 bit |
| Gehäuse | 132-PGA (34.5 x 34.5 mm) |
| Montageart | Through-Hole (Pin Grid Array) |
| Protocols | HDLC/SDLC, UART, BISYNC, Transparent |
MC68302CRC16C 132-pga (34.5 x 34.5 mm) Pinbelegungsleitfaden
Pinbelegung für MC68302CRC16C (132-pga (34.5 x 34.5 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC68302CRC16C.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC68302CRC16C ist geeignet für 7 Anwendungs: Wide-Area Network Router / Bridge, X.25 Packet Assembler/Disassembler (PAD), ISDN Terminal Adapter, Frame Relay Access Device (FRAD), Industrial Serial Backplane Controller, Legacy Telecom Control Board, Serial Protocol Analyzer / Test Equipment.
Wide-Area Network Router / Bridge
The MC68302CRC16C fits WAN router and bridge designs because its three SCC channels can each independently run HDLC or X.25 framing at sustained data rates, supported by seven DMA channels that keep frame transfer off the CPU. The 16 MHz M68000 core plus tightly coupled RISC communications engine lets the device act as the system controller for routing decisions while moving packets between serial ports. Estimated: a single MC68302CRC16C running three SCC channels full-duplex can sustain roughly 2-3 Mbps aggregate HDLC throughput before CPU loading becomes a bottleneck.
Empfohlen
X.25 Packet Assembler/Disassembler (PAD)
X.25 PAD equipment benefits from the MC68302CRC16C because the SCC's HDLC mode maps directly to LAPB framing, while an SMC runs the X.3 PAD parameter setup channel as a UART. Each SCC can be assigned to a separate X.25 link with independent DMA, allowing one MC68302CRC16C to terminate multiple X.25 virtual circuits with predictable latency. The 24-bit address bus supports up to 16 MB of buffer RAM for packet reassembly queues, which is essential to absorb WAN-side burstiness without drops.
Empfohlen
ISDN Terminal Adapter
ISDN terminal adapters leverage the MC68302CRC16C's HDLC SCCs for the LAPD signaling channel (D-channel) and the SMC UARTs for terminal-side async data. The 16 MHz core runs the upper-layer protocol stack while the SCC engine handles bit-level LAPD framing under DMA, freeing the M68000 core for call-control and PPP/MLPPP packet processing. The ceramic PGA package supports the telecom-grade thermal envelope required for customer-premises equipment operating in uncontrolled environments.
Empfohlen
Frame Relay Access Device (FRAD)
The MC68302CRC16C serves as the central controller in a Frame Relay Access Device, where each SCC is dedicated to a single 56/64 kbps or N x 64 kbps DLCI trunk and the DMA engine handles frame encapsulation without interrupting the CPU. The RISC communications processor maintains flag-bit timing and zero-insertion transparently, freeing the main CPU to manage LMI signaling and DLCI state machines. The device's parallel I/O ports can directly interface with status LEDs and front-panel switches of a typical FRAD chassis.
Empfohlen
Industrial Serial Backplane Controller
In industrial control backplanes, the MC68302CRC16C can run as the bus master on RS-485 multi-drop networks, using one SCC per RS-485 trunk and another for the host-side serial management channel. The seven DMA channels enable efficient tag-and-token arbitration across multiple trunk masters, while the three on-chip timers handle periodic supervisory polling of remote nodes. The ceramic PGA package's thermal tolerance suits industrial cabinet environments where ambient temperatures reach 60-70C.
Empfohlen
Legacy Telecom Control Board
Legacy telecom control boards deploy the MC68302CRC16C as a redundant CPU core managing E1/T1 trunk signaling, with one SCC handling the HDLC-based signaling channel and another carrying the timeslot-assigned voice/data under HDLC or transparent mode. The M68000's mature toolchain and stable silicon pedigree made it a workhorse for SS7 and ISDN-PRI signaling boards from the 1990s onward. The ceramic PGA package allows socket replacement on field-deployed boards, simplifying MTTR when dealing with legacy installed bases.
Empfohlen
Serial Protocol Analyzer / Test Equipment
The MC68302CRC16C appears in test-and-measurement gear that decodes HDLC, SDLC, BISYNC, and UART traffic in real time, because the SCC's transparent mode plus on-chip DMA can capture arbitrary bit patterns from a monitored line without protocol interference. The 16 MHz core timestamps incoming frames for latency analysis while the parallel I/O drives a front-panel display. Designers prize the ceramic PGA socketed package for bench-instrument builds where rapid chip swap simplifies firmware A/B comparison tests.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC68302CRC16C – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC68302CRC25C | MC68302CRC20C | MC68302RC16C | MC68302CEH16C | MC68302CRC16B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 132-PGA (34.5 x 34.5 mm, ceramic) | 132-PGA (34.5 x 34.5 mm, ceramic) - same | 132-PGA (34.5 x 34.5 mm, ceramic) - same | 132-PGA (34.5 x 34.5 mm, plastic) | 132-PGA (34.5 x 34.5 mm, ceramic) - same | 132-PGA (34.5 x 34.5 mm, ceramic) - same |
| CPU Clock | 16 MHz | 25 MHz | 20 MHz | 16 MHz | 16 MHz | 16 MHz |
| Core | M68000 8/16-bit | M68000 8/16-bit | M68000 8/16-bit | M68000 8/16-bit | M68000 8/16-bit | M68000 8/16-bit |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| SCC Channels | 3 | 3 | 3 | 3 | 3 | 3 |
| DMA Channels | 7 | 7 | 7 | 7 | 7 | 7 |
| Package Material | Ceramic PGA | Ceramic PGA | Ceramic PGA | Plastic PGA | Ceramic PGA | Ceramic PGA |
| Lifecycle Status | obsolete | obsolete | obsolete | obsolete | obsolete | obsolete |
Wichtigste Unterscheidungsmerkmale
- Direct same-family speed-grade upgrade path within ceramic PGA package (vs. MC68302CRC25C)
- Industrial-screened variant available with identical pinout (vs. MC68302CEH16C)
- Ceramic PGA package material vs plastic PGA sibling (vs. MC68302RC16C)
Designhinweise
The 132-PGA footprint requires plated-through-hole pads on 2.54 mm (0.1 inch) pitch in a 14 x 14 grid with internal rows/columns depopulated. Use a PGA socket (e.g., 3M Textool or AMP pile-up type) if board replacement is anticipated; otherwise solder the ceramic package directly to the PCB for best thermal conduction. Allow 1.5 mm minimum pad-to-pad clearance to account for solder bridging in field-rework scenarios.
Estimated: at 5V supply, 16 MHz CPU clock, and full SCC/DMA activity, the MC68302CRC16C dissipates approximately 1.5 W typical, 2.0 W peak. The ceramic PGA package's thermal resistance to ambient is in the 30-35 C/W range, giving roughly 50-70C junction-to-ambient at typical industrial ambient temperatures. For sealed telecom enclosures without airflow, derate by 20% or specify MC68302CRC25C for thermal margin at higher clock rates.
Do not confuse the MC68302 family with the MC68360 (QUICC) or MC68EN302 - the QUICC adds a separate CPM and reuses SCC peripherals but is in a different QFP package, while the EN302 adds an Ethernet MAC. All three are FUNCTIONAL equivalents but NONE are pin-compatible drop-ins for the MC68302CRC16C PGA package. Verify socket compatibility before substitution, especially with respect to pin 1 orientation (chamfered corner on PGA package).
The 16 MHz external clock feeds the on-chip PLL to generate the internal CPU clock; the EXTAL and XTAL pins require a fundamental-mode crystal with series resistance below 30 ohms and load capacitance matching the crystal manufacturer's specification. Keep traces from the crystal to EXTAL/XTAL short and shielded by a ground ring; long traces invite EMI and clock-jitter that degrades SCC bit-timing accuracy. Place a parallel termination of 33 ohms at the clock-driver output if routing more than 25 mm to the chip.
Compliance-Informationen
Operating temperature range, RoHS, and REACH data were not in the verified sources (DigiKey/Mouser/NXP product page) and are marked [DATA_NEEDED]. This part is older-generation ceramic PGA packaging that predates most modern compliance programs; assume non-RoHS unless manufacturer documentation explicitly states otherwise.
