MC68302CRC16C - 16MHz IMP M683xx MPU | NXP | Networking
料号： MC68302CRC16C ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $49.5 | $49.50 |
| 10 | $42.75 | $427.50 |
| 100 | $36.95 | $3,695.00 |
| 500 | $31.5 | $15,750.00 |
| 1,000 | $28.2 | $28,200.00 |
MC68302CRC16C 概述
An Integrated Multiprotocol Processor (IMP) is a category of VLSI devices that merge a general-purpose microcontroller core with purpose-built communication peripherals, allowing a single chip to handle both host processing and protocol framing for serial protocols like HDLC, UART, and BISYNC. The MC68302 family occupies the niche between pure microcontrollers and dedicated protocol controllers, sitting inside the broader hierarchy: microcontroller -> communication controller -> integrated multiprotocol processor -> VLSI networking controller.
Key features of the MC68302CRC16C variant include a maximum CPU clock of approximately 16.67 MHz (24 MHz input clock via the on-chip PLL), three serial communication controllers (SCCs) configurable for HDLC/SDLC, UART, BISYNC, and transparent modes, two serial management controllers (SMCs), seven DMA channels, three independent timers, a 24-bit address bus, and a 16-bit data bus. The integrated RISC communications processor offloads bit-level protocol work from the main CPU core.
The architecture pairs the well-known M68000 instruction set with a tightly coupled RISC-style communications engine, allowing the main CPU to execute application code while the communications processor manages DMA-driven SCC frame reception/transmission without CPU intervention. This dual-engine topology lets the device sustain wire-speed HDLC on multiple channels while still running management software.
Typical applications include wide-area network routers and bridges, X.25 packet assembler/disassembler (PAD) equipment, ISDN terminal adapters, frame relay access devices, industrial serial-backplane controllers, and legacy telecom control boards. The ceramic PGA package suits through-hole industrial and telecom backplanes where thermal headroom and socket-replaceability matter more than board real estate.
When designing with this device, allocate careful attention to bus arbitration and memory timing, because the on-chip DMA engine can request the external bus at any time during active SCC reception. A wait-state calculator for the chosen SRAM/EPROM speed grade is recommended before finalizing PCB layout. The PGFA ceramic PGA package also requires a socket or plated-through-hole footprint, so PCB fabrication cost is higher than equivalent QFP MPU designs.
This page synthesizes distributor pricing, drop-in variants within the MC68302 family, and practical engineering notes not found in the standalone manufacturer datasheet, giving procurement and design engineers a single-source reference for sourcing and second-sourcing decisions.
直接替换替代料： MC68302CRC16C ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MC68302CRC16C （相同外形与封装尺寸） ——差异在于 Mounting Type, Core Architecture, Data Bus Width, RoHS Status, DMA Channels.
快速对比工具——选择替代料号进行并排对比：
MC68302CRC25C
✅ 直接替换📋 参考替代料（不在目录中）
MC68302CRC20C
✅ 直接替换✓ 有现货
$47.8 / 个
查看数据手册 →MC68302RC16C
✅ 直接替换✓ 有现货
$42.5 / 个
查看数据手册 →MC68302CEH16C
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$49.9 / 个
查看数据手册 →MC68302CRC16B
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC68302RC20C
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$27.85 / 个
查看数据手册 →MC68302CRC16C 最大额定值与电气特性
| Product Type | Integrated Multiprotocol Processor (IMP) |
| Core | M68000 (M683xx family) 8/16-bit |
| Operating Frequency | 16 MHz (16.67 MHz) |
| 电源电压 | 5 V |
| Number of Cores | 1 |
| Bit Width | 8/16-bit data bus, 24-bit address bus |
| Serial Communication Controllers (SCC) | 3 channels |
| Serial Management Controllers (SMC) | 2 channels |
| DMA Channels | 7 |
| Timers | 3 |
| Address Bus Width | 24 bit |
| 数据总线宽度 | 16 bit |
| 封装 | 132-PGA (34.5 x 34.5 mm) |
| 安装类型 | Through-Hole (Pin Grid Array) |
| Protocols | HDLC/SDLC, UART, BISYNC, Transparent |
MC68302CRC16C 132-pga (34.5 x 34.5 mm) 引脚配置指南
MC68302CRC16C（132-pga (34.5 x 34.5 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MC68302CRC16C.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MC68302CRC16C 适用于 7 应用s: Wide-Area Network Router / Bridge, X.25 Packet Assembler/Disassembler (PAD), ISDN Terminal Adapter, Frame Relay Access Device (FRAD), Industrial Serial Backplane Controller, Legacy Telecom Control Board, Serial Protocol Analyzer / Test Equipment.
Wide-Area Network Router / Bridge
The MC68302CRC16C fits WAN router and bridge designs because its three SCC channels can each independently run HDLC or X.25 framing at sustained data rates, supported by seven DMA channels that keep frame transfer off the CPU. The 16 MHz M68000 core plus tightly coupled RISC communications engine lets the device act as the system controller for routing decisions while moving packets between serial ports. Estimated: a single MC68302CRC16C running three SCC channels full-duplex can sustain roughly 2-3 Mbps aggregate HDLC throughput before CPU loading becomes a bottleneck.
推荐
X.25 Packet Assembler/Disassembler (PAD)
X.25 PAD equipment benefits from the MC68302CRC16C because the SCC's HDLC mode maps directly to LAPB framing, while an SMC runs the X.3 PAD parameter setup channel as a UART. Each SCC can be assigned to a separate X.25 link with independent DMA, allowing one MC68302CRC16C to terminate multiple X.25 virtual circuits with predictable latency. The 24-bit address bus supports up to 16 MB of buffer RAM for packet reassembly queues, which is essential to absorb WAN-side burstiness without drops.
推荐
ISDN Terminal Adapter
ISDN terminal adapters leverage the MC68302CRC16C's HDLC SCCs for the LAPD signaling channel (D-channel) and the SMC UARTs for terminal-side async data. The 16 MHz core runs the upper-layer protocol stack while the SCC engine handles bit-level LAPD framing under DMA, freeing the M68000 core for call-control and PPP/MLPPP packet processing. The ceramic PGA package supports the telecom-grade thermal envelope required for customer-premises equipment operating in uncontrolled environments.
推荐
Frame Relay Access Device (FRAD)
The MC68302CRC16C serves as the central controller in a Frame Relay Access Device, where each SCC is dedicated to a single 56/64 kbps or N x 64 kbps DLCI trunk and the DMA engine handles frame encapsulation without interrupting the CPU. The RISC communications processor maintains flag-bit timing and zero-insertion transparently, freeing the main CPU to manage LMI signaling and DLCI state machines. The device's parallel I/O ports can directly interface with status LEDs and front-panel switches of a typical FRAD chassis.
推荐
Industrial Serial Backplane Controller
In industrial control backplanes, the MC68302CRC16C can run as the bus master on RS-485 multi-drop networks, using one SCC per RS-485 trunk and another for the host-side serial management channel. The seven DMA channels enable efficient tag-and-token arbitration across multiple trunk masters, while the three on-chip timers handle periodic supervisory polling of remote nodes. The ceramic PGA package's thermal tolerance suits industrial cabinet environments where ambient temperatures reach 60-70C.
推荐
Legacy Telecom Control Board
Legacy telecom control boards deploy the MC68302CRC16C as a redundant CPU core managing E1/T1 trunk signaling, with one SCC handling the HDLC-based signaling channel and another carrying the timeslot-assigned voice/data under HDLC or transparent mode. The M68000's mature toolchain and stable silicon pedigree made it a workhorse for SS7 and ISDN-PRI signaling boards from the 1990s onward. The ceramic PGA package allows socket replacement on field-deployed boards, simplifying MTTR when dealing with legacy installed bases.
推荐
Serial Protocol Analyzer / Test Equipment
The MC68302CRC16C appears in test-and-measurement gear that decodes HDLC, SDLC, BISYNC, and UART traffic in real time, because the SCC's transparent mode plus on-chip DMA can capture arbitrary bit patterns from a monitored line without protocol interference. The 16 MHz core timestamps incoming frames for latency analysis while the parallel I/O drives a front-panel display. Designers prize the ceramic PGA socketed package for bench-instrument builds where rapid chip swap simplifies firmware A/B comparison tests.
推荐
推荐产品汇总
工程参考数据： MC68302CRC16C ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MC68302CRC25C | MC68302CRC20C | MC68302RC16C | MC68302CEH16C | MC68302CRC16B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 132-PGA (34.5 x 34.5 mm, ceramic) | 132-PGA (34.5 x 34.5 mm, ceramic) - same | 132-PGA (34.5 x 34.5 mm, ceramic) - same | 132-PGA (34.5 x 34.5 mm, plastic) | 132-PGA (34.5 x 34.5 mm, ceramic) - same | 132-PGA (34.5 x 34.5 mm, ceramic) - same |
| CPU Clock | 16 MHz | 25 MHz | 20 MHz | 16 MHz | 16 MHz | 16 MHz |
| Core | M68000 8/16-bit | M68000 8/16-bit | M68000 8/16-bit | M68000 8/16-bit | M68000 8/16-bit | M68000 8/16-bit |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| SCC Channels | 3 | 3 | 3 | 3 | 3 | 3 |
| DMA Channels | 7 | 7 | 7 | 7 | 7 | 7 |
| Package Material | Ceramic PGA | Ceramic PGA | Ceramic PGA | Plastic PGA | Ceramic PGA | Ceramic PGA |
| Lifecycle Status | obsolete | obsolete | obsolete | obsolete | obsolete | obsolete |
关键差异点
- Direct same-family speed-grade upgrade path within ceramic PGA package （对比 MC68302CRC25C)
- Industrial-screened variant available with identical pinout （对比 MC68302CEH16C)
- Ceramic PGA package material vs plastic PGA sibling （对比 MC68302RC16C)
设计说明
The 132-PGA footprint requires plated-through-hole pads on 2.54 mm (0.1 inch) pitch in a 14 x 14 grid with internal rows/columns depopulated. Use a PGA socket (e.g., 3M Textool or AMP pile-up type) if board replacement is anticipated; otherwise solder the ceramic package directly to the PCB for best thermal conduction. Allow 1.5 mm minimum pad-to-pad clearance to account for solder bridging in field-rework scenarios.
Estimated: at 5V supply, 16 MHz CPU clock, and full SCC/DMA activity, the MC68302CRC16C dissipates approximately 1.5 W typical, 2.0 W peak. The ceramic PGA package's thermal resistance to ambient is in the 30-35 C/W range, giving roughly 50-70C junction-to-ambient at typical industrial ambient temperatures. For sealed telecom enclosures without airflow, derate by 20% or specify MC68302CRC25C for thermal margin at higher clock rates.
Do not confuse the MC68302 family with the MC68360 (QUICC) or MC68EN302 - the QUICC adds a separate CPM and reuses SCC peripherals but is in a different QFP package, while the EN302 adds an Ethernet MAC. All three are FUNCTIONAL equivalents but NONE are pin-compatible drop-ins for the MC68302CRC16C PGA package. Verify socket compatibility before substitution, especially with respect to pin 1 orientation (chamfered corner on PGA package).
The 16 MHz external clock feeds the on-chip PLL to generate the internal CPU clock; the EXTAL and XTAL pins require a fundamental-mode crystal with series resistance below 30 ohms and load capacitance matching the crystal manufacturer's specification. Keep traces from the crystal to EXTAL/XTAL short and shielded by a ground ring; long traces invite EMI and clock-jitter that degrades SCC bit-timing accuracy. Place a parallel termination of 33 ohms at the clock-driver output if routing more than 25 mm to the chip.
合规信息
Operating temperature range, RoHS, and REACH data were not in the verified sources (DigiKey/Mouser/NXP product page) and are marked [DATA_NEEDED]. This part is older-generation ceramic PGA packaging that predates most modern compliance programs; assume non-RoHS unless manufacturer documentation explicitly states otherwise.
