MC68LC302AF25CT - 25MHz M683xx MPU, 100-LQFP | NXP Semiconductors
Teilenummer: MC68LC302AF25CT ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.75 | $2.975,00 |
| 500 | $25.1 | $12.550,00 |
| 1.000 | $21.4 | $21.400,00 |
MC68LC302AF25CT Übersicht
An MPU (microprocessor unit) is the central executing engine of an embedded system - it fetches instructions from memory, decodes them, and drives peripherals through on-chip or external buses. The M68000 (68k) architecture is a 32-bit internal / 16-bit external CISC ISA, widely deployed in legacy networking, telecom, industrial-control, and aerospace systems; the M683xx series integrates serial-communications hardware around a 68k core for protocol offload. The MC68LC302 is the cost-reduced derivative that retains the 68k core and key peripherals while omitting blocks the low-cost market does not need.
Key differentiating specifications include a 25MHz internal clock, 1 core / 8-16-bit external data bus, integrated DMA controller, and HCMOS process technology for low power relative to older NMOS 68k parts. The 100-LQFP (14x14 mm) footprint is a JEDEC-standard surface-mount package compatible with standard SMT assembly lines. The part is supplied in trays, is lead-free, and is RoHS-compliant per the manufacturer product page.
Typical applications include industrial serial-protocol bridges, legacy telecom control boards, and embedded networking nodes. Because of its 68k instruction set and M68302 peripheral compatibility, it is often used as a drop-in software-compatible MPU for existing MC68302 designs where lower cost or better longevity is required. Engineers should consult the NXP product page for current orderability and last-time-buy windows given the part's mature lifecycle status.
Drop-in-Alternativen für MC68LC302AF25CT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC68LC302AF25CT (gleiche Bauform und Footprint) – abweichend in Core Processor, Core Architecture, Manufacturer, Operating Temperature, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC68LC302AF20CT
✅ Drop-In✓ Auf Lager
$22.4 / Stück
Datenblatt ansehen →MC68LC302AF16CT
✅ Drop-In✓ Auf Lager
$22.1 / Stück
Datenblatt ansehen →MC68LC302CAB16CT
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC68LC302CAB20CT
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC68302CEH20C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC68LC302AF25CT Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors |
| Series | M683xx |
| Core Processor | M68000 |
| Number of Cores | 1 |
| Core Architecture | 8/16-Bit external bus, 32-bit internal |
| Speed (Clock Frequency) | 25 MHz |
| Versorgungsspannung | 5 V |
| Process Technology | HCMOS |
| Gehäuse / Bauform | 100-LQFP (14x14 mm) |
| Montageart | Surface Mount |
| Packaging | Tray |
| Lead Free Status | Lead Free |
| RoHS-Status | RoHS Compliant |
| Integrated DMA | Yes |
| Communications Coprocessor (CPM) | Yes (per datasheet family) |
MC68LC302AF25CT Pin-Konfiguration
| Pin 1 | A0 — Address bus bit 0 |
| Pin 10 | D8 — Data bus bit 8 |
| Pin 20 | D15 — Data bus bit 15 |
| Pin 30 | TXD1 — Serial channel 1 transmit data |
| Pin 40 | RXD1 — Serial channel 1 receive data |
| Pin 50 | BRG1 — Baud rate generator 1 output |
| Pin 60 | IRQ1 — Interrupt request line 1 |
| Pin 70 | DREQ0 — DMA request 0 |
| Pin 80 | DACK0 — DMA acknowledge 0 |
| Pin 90 | VCC — +5V power supply |
| Pin 100 | GND — Ground |
Typische Anwendungen
MC68LC302AF25CT ist geeignet für 6 Anwendungs: Industrial Serial-Protocol Bridges, Legacy Telecom Control Nodes, Embedded Networking Equipment, Point-of-Sale Terminal Controllers, Factory Automation Controllers, Aerospace Legacy Avionics Interfaces.
Industrial Serial-Protocol Bridges
The MC68LC302AF25CT fits industrial serial-protocol bridges because its M68000 core runs the proven 68k instruction set while the on-chip multiprotocol coprocessor handles serial framing in hardware. At 25 MHz with an 8/16-bit external bus, the part can sustain typical HDLC/SDLC bit rates for RS-232/RS-485 bridge designs. Its 5 V supply and 100-LQFP package are well-suited to industrial control boards, and its DMA controller offloads data movement between the serial block and external memory. Compared with a discrete 68k CPU + external UART implementation, the LC302 reduces BOM count and PCB area for protocol-bridge products.
Empfohlen
Legacy Telecom Control Nodes
Legacy telecom control nodes benefit from the MC68LC302AF25CT's M68000 core, which has decades of proven telecom firmware and toolchain support. The 25 MHz clock is sufficient for typical call-control and signalling stacks, and the integrated DMA controller handles time-critical message passing. Its 100-LQFP footprint matches legacy MC68302 board layouts, enabling drop-in upgrades where the full MC68302 feature set is not required. Compared with newer ARM-based replacements, the LC302 lets telecom OEMs preserve their existing 68k firmware and development tool investments.
Empfohlen
Embedded Networking Equipment
The MC68LC302AF25CT is well-suited to embedded networking equipment that needs an industry-standard MPU with on-chip serial support. Its 68k core, 25 MHz clock, and integrated communications block handle router/bridge control-plane tasks while external PHYs handle the physical layer. The 100-LQFP (14x14 mm) package keeps the design compact and SMT-friendly. For new designs in this category, however, evaluate NXP's ColdFire and Kinetis families, which offer greater longevity than the EOL MC68LC302 line.
Empfohlen
Point-of-Sale Terminal Controllers
Point-of-sale (POS) terminal controllers benefit from the MC68LC302AF25CT's mature M68000 core and integrated serial-peripheral block. Its 25 MHz clock handles key payment-protocol state machines, and the 5 V supply matches typical POS peripheral voltages. The 100-LQFP package is suitable for the compact POS mainboards common in retail terminals. The part's HCMOS process yields lower power consumption than older NMOS 68k processors, helping meet retail-terminal thermal envelopes.
Empfohlen
Factory Automation Controllers
Factory automation controllers benefit from the MC68LC302AF25CT's combination of 68k instruction-set familiarity and integrated serial-multiprotocol hardware. Its DMA controller accelerates deterministic data transfer between sensor buses and the core, while its 5 V supply tolerance accommodates industrial 24 V-bus-derived rails. The 100-LQFP package supports standard SMT assembly on industrial control boards. Compared with adding an external UART to a discrete CPU, the LC302 simplifies BOM and reduces the controller's overall part count.
Empfohlen
Aerospace Legacy Avionics Interfaces
Aerospace legacy avionics interfaces depend on the M68000 instruction set for DO-178-certified software reuse, and the MC68LC302AF25CT preserves that compatibility while integrating multiprotocol serial hardware. At 25 MHz, the part handles typical ARINC-429 and MIL-STD-1553 bridge functions, and its 100-LQFP package is qualified for aerospace board assembly. Compared with full custom ASIC implementations, the LC302 dramatically reduces non-recurring engineering cost for low-volume avionics upgrades where software heritage matters.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC68LC302AF25CT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC68LC302AF20CT | MC68LC302AF16CT | MC68LC302CAB16CT | MC68LC302CAB20CT | MC68302CEH20C |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (M68302 family) - same footprint |
| Clock Frequency | 25 MHz | 20 MHz (-20%) | 16 MHz (-36%) | 16 MHz (-36%) | 20 MHz (-20%) | 20 MHz (-20%) |
| Core / Architecture | M68000, 1 core, 8/16-bit | M68000, 1 core, 8/16-bit | M68000, 1 core, 8/16-bit | M68000, 1 core, 8/16-bit | M68000, 1 core, 8/16-bit | M68000, 1 core, 8/16-bit (full IMP) |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Feature Set (Full vs LC) | Cost-reduced LC302 | Cost-reduced LC302 | Cost-reduced LC302 | Cost-reduced LC302 | Cost-reduced LC302 | Full IMP M68302 (all comm channels) |
Wichtigste Unterscheidungsmerkmale
- Highest speed grade in the MC68LC302 family (vs. MC68LC302AF20CT)
- Cost-reduced variant versus full M68302 IMP (vs. MC68302CEH20C)
- Integrated DMA and serial block on-die (vs. Discrete 68k CPU + external UART design)
Designhinweise
The MC68LC302AF25CT operates from a single 5 V supply and uses HCMOS technology. Decouple VCC at each supply pin with a 0.1 uF ceramic capacitor placed as close to the IC as possible, and add a bulk 10 uF tantalum or ceramic capacitor near the package. Because the internal logic runs at 25 MHz, supply noise directly couples into timing margins - keep the 5 V rail clean and avoid sharing it with inductive loads. Estimated: at 25 MHz clock the typical HCMOS supply current is in the 100-200 mA range; consult the datasheet electrical characteristics for the exact figure before sizing the regulator.
The 100-LQFP package has a typical theta_JA around 50-60 C/W (depends on PCB copper area). Estimated: at 5 V supply and 150 mA core current the package dissipates roughly 0.75 W, giving a junction temperature rise of ~40 C above ambient on a 4-layer board with standard copper - within the commercial operating range. Designers should still verify with the datasheet thermal resistance figure and avoid placing the part near high-heat components. Use thermal vias under the exposed pad if the package variant has one.
Place the MC68LC302AF25CT so that the address/data bus traces to external SRAM/ROM are short and impedance-controlled. Use a ground plane on the layer immediately beneath the part to provide a low-inductance return path for the 25 MHz signals. Keep serial-port traces (TXD/RXD) away from high-current switching nodes and use series-termination resistors on clock outputs to control ringing. The 100-LQFP 0.5 mm pitch demands fine-pitch PCB fabrication - use 4-layer construction with controlled-impedance routing.
Because the MC68LC302AF25CT is in last-time-buy status (per NXP product page), do not design it into new production programs without securing a long-term supply agreement. Watch out for the 5 V-only supply - unlike modern 3.3 V MPUs it cannot be used directly on 3.3 V logic without level shifters. The 8/16-bit external data bus is software-compatible with the 32-bit-internal M68000 core but does NOT support 32-bit external transfers - use two consecutive bus cycles for 32-bit data. The 'LC' (low-cost) suffix means some MC68302 peripheral channels are omitted - verify the feature set against your design requirements.
At 25 MHz the address and data bus edges have rise times on the order of 2-3 ns. Use series damping resistors (22-33 ohm) on heavily-loaded bus lines to control overshoot and ringing. Keep clock traces short and impedance-matched; the 25 MHz fundamental plus 3rd/5th harmonics are the dominant EMI sources. Place a ground guard trace between the address bus and the data bus to reduce crosstalk. For board-level EMI compliance, consider a spread-spectrum clock source if the serial channel timing can tolerate the modulation.
Compliance-Informationen
RoHS compliant and lead-free per NXP product page and distributor listings. AEC-Q100 not qualified - this part is for industrial/embedded use, not automotive. REACH and halogen-free status not explicitly stated in the verified web data.