SPC5605BK0MLL6R - 32-bit 768KB Flash 64MHz MCU | NXP
Teilenummer: SPC5605BK0MLL6R ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $14.9 | $14,90 |
| 10 | $13.6 | $136,00 |
| 100 | $12.25 | $1.225,00 |
| 500 | $11.4 | $5.700,00 |
| 1.000 | $10.6 | $10.600,00 |
SPC5605BK0MLL6R Übersicht
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, program memory, data RAM, and a rich set of peripherals into one chip. MCUs sit at the lowest level of the embedded-computing hierarchy - below microprocessors and system-on-chip devices - and within the broader powertrain and body-electronics semiconductor category. Automotive MCUs like this one are qualified to operate across the harsh temperature, voltage, and EMC conditions found in vehicles.
Key features include the 768 KB (768K x 8) Flash program memory, a 64 MHz e200z0h Power Architecture core, automotive-qualified AEC-grade operation from -40C to +125C, and flexible 3V to 5.5V supply operation. The device integrates CAN/FlexRay-oriented communication peripherals that make it suitable for in-vehicle networking nodes.
The MPC560xB/C/D family represents NXP (formerly Freescale) integrated devices for automotive body electronics and industrial applications. The e200z0h core executes Power Architecture instructions, providing a mature tool ecosystem including NXP SPC5 Studio and third-party compilers. The 100-pin LQFP with 0.5 mm lead pitch offers a gull-wing, hand-solderable footprint that eases inspection and rework compared with BGA alternatives.
Typical applications include automotive gateway modules, body control modules (BCM), lighting control, seat and door control units, HVAC controllers, and industrial nodes that require CAN/LIN connectivity with flash-rich firmware storage.
For design, note that the 3V-5.5V supply range allows direct operation from automotive 5V rails, reducing the need for a dedicated 3.3V regulator; however, decoupling and EMC layout on the 100-pin LQFP must follow the manufacturer hardware design guidelines.
This page synthesizes distributor pricing, drop-in alternatives within the SPC5605BK family, and practical design notes not found in the manufacturer datasheet, with data verified as of 2026-10-10.
Drop-in-Alternativen für SPC5605BK0MLL6R – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit SPC5605BK0MLL6R (gleiche Bauform und Footprint) – abweichend in Operating Temperature, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
SPC5605BK0MLL6
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SPC5605BK0CLL6
✅ Drop-In✓ Auf Lager
$9.12 / Stück
Datenblatt ansehen →SPC5606BK0VLU6R
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SPC5605BK0VLQ6R
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SPC560B54L3B6E0X
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SPC5605BK0MLL6R Grenzwerte & elektrische Eigenschaften
| Core Processor | e200z0h (Power Architecture, MPC56xx Qorivva) |
| Core Size | 32-bit |
| Maximale Taktfrequenz | 64 MHz |
| Flash Memory | 768 KB (768K x 8) |
| Supply Voltage Range | 3 V to 5.5 V |
| Betriebstemperatur | -40C to +125C |
| Gehäuse | 100-LQFP (14x14 mm) |
| Number of Pins / Terminals | 100 |
| Montageart | Surface Mount |
| Grade | Automotive Grade |
| Communication Interfaces | CAN, LIN, FlexRay-oriented family peripherals |
| ADC Resolution | 10-bit, 12-bit (per family data) |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 |
| Peak Reflow Temperature | 260 C |
| Terminal Finish | Tin (JESD-609 code e3) |
| Packaging | Tape and Reel (R suffix) |
| RoHS-Status | RoHS Compliant |
SPC5605BK0MLL6R 100-lqfp (14x14 mm) Pinbelegungsleitfaden
Pinbelegung für SPC5605BK0MLL6R (100-lqfp (14x14 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für SPC5605BK0MLL6R.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
SPC5605BK0MLL6R ist geeignet für 6 Anwendungs: Automotive Gateway Module, Body Control Module (BCM), Exterior Lighting Control, Door and Seat Control Modules, HVAC Blower and Climate Control, Industrial CAN Network Node.
Automotive Gateway Module
The SPC5605BK0MLL6R fits gateway ECUs because NXP explicitly optimized the SPC5605BK family for automotive gateway and body applications with FlexRay, CAN, and CAN FD-class communication support. Its 64 MHz e200z0h Power Architecture core provides the headroom to run message routing, protocol translation, and diagnostic stacks (UDS) concurrently, while 768 KB of Flash accommodates growing routing tables and OTA-style firmware payloads. Operating from a 3V to 5.5V supply lets the MCU sit directly on a regulated 5V board rail, and the -40C to +125C automotive grade survives under-hood-adjacent environments. Placed as the central node between CAN segments with external transceivers, the device deterministically forwards frames while the 100-LQFP (14x14) footprint keeps routing of multiple bus ports manageable on a two-layer-per-bus ECU layout.
Empfohlen
Body Control Module (BCM)
In a body control module, the SPC5605BK0MLL6R serves as the main controller handling door locks, lighting, wipers, and seat functions. The 768 KB Flash stores feature-rich firmware tables, while the integrated 10-bit and 12-bit ADCs read analog inputs such as switch stacks and potentiometer position sensors. The automotive -40C to +125C rating covers cabin and near-engine mounting locations, and the 3V-5.5V supply tolerance permits direct 5V operation with load-dump-hardened upstream regulation. On a typical BCM board, the MCU drives high-side switches over SPI and reads LIN/CAN traffic for network-managed body functions; the 64 MHz core latency is sufficient for millisecond-class control loops. Its LQFP gull-wing leads simplify AOI inspection, important in high-volume BCM production lines.
Empfohlen
Exterior Lighting Control
Adaptive headlamp and rear-light controllers benefit from the SPC5605BK0MLL6R's combination of PWM-capable timers, 12-bit ADC feedback, and LIN/CAN connectivity for receiving light-command messages from the central body controller. The 64 MHz e200z0h core executes closed-loop LED current regulation and diagnostic routines (open-load, short-circuit detection) without an external co-processor, and 768 KB Flash holds dimming curves, thermal fold-back tables, and regional lighting-regulation profiles. The -40C to +125C automotive grade tolerates lamp-housing temperatures, while the 5V-capable supply range simplifies power-tree design in lamp ECUs. The 100-LQFP (14x14 mm) package provides enough I/O to drive multiple LED channels plus step-motor aiming controls in a single footprint.
Empfohlen
Door and Seat Control Modules
Door and seat ECUs use the SPC5605BK0MLL6R to manage DC-motor positioning for windows, mirrors, and seat tracks with Hall-sensor or potentiometer feedback into its 10-bit/12-bit ADCs. The 64 MHz core runs per-channel PI position loops and anti-pinch algorithms, while 768 KB Flash retains calibration and end-stop learning data across power cycles via emulated EEPROM. LIN connectivity links each door module to the BCM, and the wide 3V to 5.5V input range tolerates battery-voltage fluctuation during cranking. The -40C to +125C grade covers door-mounted environments exposed to solar heating, and the family's low-power modes reduce quiescent draw when the vehicle is parked - important for key-off battery-drain budgets in body electronics designs.
Empfohlen
HVAC Blower and Climate Control
Climate-control nodes pair the SPC5605BK0MLL6R with blower motor drivers and temperature sensor networks. Its 12-bit ADC digitizes NTC sensor arrays for zone temperature feedback, and PWM timers regulate blower speed through an external MOSFET pre-driver. The 768 KB Flash stores look-up tables mapping cabin temperature, external temperature, and sunload inputs to actuator positions, while the 64 MHz core executes the control loop and CAN diagnostics concurrently. Automotive qualification to +125C suits under-dash locations near heat exchangers, and the 3V-5.5V supply tolerance rides through alternator ripple on the conditioned 5V rail. The 100-LQFP footprint accommodates the many actuator and feedback lines a climate ECU multiplexes, keeping the PCB a cost-effective two- to four-layer design.
Empfohlen
Industrial CAN Network Node
Beyond vehicles, the MPC560xB/C/D family is documented by NXP for industrial applications, and the SPC5605BK0MLL6R fits industrial CAN nodes such as motor-control satellites, I/O concentrators, and machine controllers. The industrial temperature requirement is easily met by the -40C to +125C automotive grade, which exceeds typical industrial ratings and improves field reliability margins. The 64 MHz Power Architecture core, 768 KB Flash, and CAN peripherals support CANopen-style stacks and firmware update mechanisms, while the 3V-5.5V supply range matches standard industrial 5V logic rails. The 100-LQFP (14x14 mm, 0.5 mm pitch) package is hand-reworkable, valuable for low-volume industrial equipment, and tin (e3) lead finish plus RoHS compliance satisfy industrial environmental regulations.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für SPC5605BK0MLL6R – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | SPC5605BK0MLL6 | SPC5605BK0CLL6 | SPC5606BK0VLU6R | SPC5605BK0VLQ6R | SPC560B54L3B6E0X |
|---|---|---|---|---|---|---|
| Package | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-pin family package - verify outline | 100-pin family package - verify outline | LQFP - verify pin count |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Architecture | e200z0h Power Architecture, 32-bit | e200z0h Power Architecture - same die | e200z0h Power Architecture | e200z0h Power Architecture | e200z0h Power Architecture | Power Architecture (SPC560B family) |
Wichtigste Unterscheidungsmerkmale
- Identical die available in tray packaging for prototyping (vs. SPC5605BK0MLL6)
- Full 768 KB Flash in the 100-pin footprint (vs. SPC560B54L3B6E0X)
- Wide 3V-5.5V supply range (vs. SPC5606BK0VLU6R)
Designhinweise
The SPC5605BK0MLL6R accepts 3V to 5.5V, so a single automotive-grade 5V regulator can feed the MCU directly, eliminating a 3.3V point-of-load converter. Place a bulk 10 uF ceramic at the regulator output plus 100 nF ceramic capacitors at each supply pin pair, following the NXP MPC560xB hardware design guidelines. Include reverse-polarity and load-dump protection upstream (TVS diode plus series protection) because automotive 5V rails see transients far beyond the MCU absolute maximum ratings. Verify core-voltage regulator external component requirements in the datasheet.
For the 100-LQFP (14x14 mm, 0.5 mm pitch) footprint, follow IPC-recommended gull-wing land patterns and route decoupling capacitors on the component side as close to supply pins as possible. Give the JTAG/Nexus debug connector a direct, daisy-chain-free route to the MCU to guarantee reliable flash programming on the production line. Keep CAN and FlexRay transceiver loops short and place the crystal/resonator with guard ground. Because MSL is 3, respect floor-life limits (168 hours) and bake per J-STD-033 if exceeded before reflow at 260C peak.
Pin functions on the SPC5605BK are software-multiplexed - do not assume a pinout from older MPC55xx designs; verify the pad-configuration tables in the SPC5605BK reference manual before routing. Confirm the ordering suffix when purchasing: the 'R' suffix means tape and reel, and non-R (tray) parts are electrically identical but ship in different handling quantities. Finally, when substituting SPC5606 or VLQ/VLU suffix family members, re-verify package outline and memory map; family similarity does not guarantee footprint identity.
Compliance-Informationen
RoHS compliant per JLCPCB and Vyrian distributor listings; terminal finish Tin, JESD-609 code e3 (lead-free). Marketed as Automotive Grade with -40C to +125C operation. REACH, halogen-free, and conflict-minerals declarations not present in provided data - obtain current certificates from NXP.