MC8640DTVJ1067NE - Dual-Core PowerPC SoC, 2x1067MHz | NXP
Teilenummer: MC8640DTVJ1067NE ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $425 | $425,00 |
| 10 | $395 | $3.950,00 |
| 100 | $360 | $36.000,00 |
| 500 | $325 | $162.500,00 |
| 1.000 | $295 | $295.000,00 |
MC8640DTVJ1067NE Übersicht
What is an embedded SoC microprocessor? An embedded SoC microprocessor is a single silicon die that integrates one or more CPU cores, memory controllers, high-speed serial interfaces, and peripheral IP into one package. Within the broader taxonomy, an embedded SoC is a sub-class of microprocessors (MPU) that are designed for headless applications (no display), unlike microcontrollers (MCU) which usually include on-chip Flash and a richer peripheral set. The MPC8640D family is a classic MPU SoC: high-core-clock throughput, large external memory bandwidth, and standards-based serial I/O (PCIe, SRIO, GbE) that allows the same silicon to be reused across compute-intensive platforms.
The headline feature set includes dual e600 cores each with AltiVec vector processing, dual integrated Gigabit Ethernet controllers with TCP/IP acceleration, dual PCIe Gen1 interfaces, dual Serial RapidIO (SRIO) ports, dual DDR1/DDR2 memory controllers with ECC, and a complete set of local-bus and DMA engines. Operating temperature is rated -40C to +105C (industrial / extended), and the part is supplied at revision 3 of the silicon. Junction thermal limits and a thermally enhanced FCCBGA package allow deployment in NEBS-compliant telecom platforms and ruggedized industrial systems.
Architecturally, the MC8640D shares the e600 core complex with the MPC8641, but the 8640D family is optimized for parallel DSP-like workloads (via AltiVec) and for deterministic inter-core traffic via shared SRAM and coherency fabric. Designers typically pair the SoC with DDR2-667 ECC memory, NOR/NAND Flash via the local bus, and an external PHY for SGMII-attached Gigabit Ethernet. Power is delivered via multiple rails (core 1.05V, DDR 1.8V, I/O 2.5V/3.3V) requiring careful sequencing and decoupling; reference schematics in the NXP hardware reference manual are strongly recommended before layout.
Typical applications include embedded networking line cards, telecom base-station baseband controllers, defense/aerospace mission computing, RAID storage controllers, industrial automation controllers, and machine-vision pre-processors. The combination of dual cores, AltiVec SIMD, multi-protocol I/O, and industrial temperature grade makes the device a fit for deterministic real-time workloads where x86 CPUs would consume too much power or board area.
Designers should carefully review the 1023-ball FCCBGA escape, which requires HDI PCB (typically 8+ layers with micro-vias) and controlled-impedance routing for DDR, PCIe, SRIO, and SGMII. NXP's hardware reference manual and board design guidelines are essential reading before committing to a layout. JTAG/COP debug access must be reserved on the board for production test and field debug.
This page consolidates current distributor pricing, drop-in alternatives, datasheet links, and practical design notes that complement - but do not replace - the official NXP MPC8640D hardware reference manual and reference design package.
Drop-in-Alternativen für MC8640DTVJ1067NE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC8640DTVJ1067NE (gleiche Bauform und Footprint) – abweichend in Core Frequency, Ethernet, Memory Controller, PCI Express, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC8640DTVU1067NE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC8640DTHJ1067NE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC8640DTHX1067NE
✅ Drop-In✓ Auf Lager
$185.25 / Stück
Datenblatt ansehen →MC8640DHX1067NE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC8641DVU1333JC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC8640DTVJ1067NE Grenzwerte & elektrische Eigenschaften
| Product Type | 32-Bit Power Architecture SoC (Dual-Core MPU) |
| Core Architecture | PowerPC e600 (dual-core) |
| Core Frequency | 2 x 1067 MHz (1.067 GHz) |
| SIMD Engine | AltiVec |
| Memory Controller | Dual-channel DDR1/DDR2 with ECC |
| Ethernet | 2 x 10/100/1000 Mbps (GbE, SGMII) |
| PCI Express | 2 x PCIe Gen1 |
| Serial RapidIO | 2 x SRIO |
| Betriebstemperatur | -40C to +105C |
| Gehäuse | 1023-ball FCCBGA, 33 x 33 mm |
| Silicon Revision | Rev 3 |
| Supply Voltages | 1.05V core / 1.8V DDR / 2.5V-3.3V I/O |
| Montageart | Surface Mount (BGA) |
| Compliance / Status | End-of-Life per NXP PCN |
| RoHS-Status | Compliant |
MC8640DTVJ1067NE 1023-ball fccbga, 33 x 33 mm Pinbelegungsleitfaden
Pinbelegung für MC8640DTVJ1067NE (1023-ball fccbga, 33 x 33 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC8640DTVJ1067NE.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC8640DTVJ1067NE ist geeignet für 6 Anwendungs: Embedded Networking Line Cards, Telecom Base Station Baseband, Defense and Aerospace Mission Computing, RAID and Storage Controllers, Industrial Automation and Machine Vision, Ruggedized Single-Board Computers.
Embedded Networking Line Cards
The MC8640DTVJ1067NE's dual e600 cores at 1.067 GHz with AltiVec SIMD deliver 2.13 GHz aggregate compute, ideal for parallel packet-processing on router line cards. Its dual GbE controllers with TCP/IP acceleration offload checksum and segmentation, while dual PCIe and SRIO links connect to look-aside crypto and fabric ASICs. The -40C to +105C industrial temperature rating suits outdoor cabinet deployments and NEBS-compliant chassis. Placing the SoC between PHY and forwarding engine, with DDR2-667 ECC for routing tables, lets designers reuse the same silicon across 1G, 10G, and 100G platforms, and the 1023-ball FCCBGA keeps board area comparable to single-core alternatives.
Empfohlen
Telecom Base Station Baseband
For LTE and small-cell baseband processing, the MC8640DTVJ1067NE's dual cores with AltiVec accelerate turbo-decoding, FFT/iFFT, and channel estimation in software-defined radio (SDR) baseband chains. Dual SRIO links aggregate baseband data from RF front-end cards at low latency, and dual PCIe connects to DSP co-processors or accelerators. Industrial temperature rating (-40C to +105C) tolerates outdoor small-cell enclosures. The 1023-ball FCCBGA and HDI PCB allow the SoC to be co-located with RFICs on compact baseband boards, while multi-rail power (1.05V core, 1.8V DDR) supports standard PMIC solutions.
Empfohlen
Defense and Aerospace Mission Computing
The MC8640DTVJ1067NE's deterministic dual-core architecture, extended temperature range, and ruggedized FCCBGA package fit avionics mission-computing and defense signal-processing platforms. AltiVec SIMD accelerates radar pulse-compression, EO/IR image processing, and electronic-warfare algorithms. Dual SRIO ports provide low-latency interconnect to FPGA sensor front-ends, while GbE handles mission-data upload to display subsystems. The EOL status requires last-time-buy planning for long-lifecycle defense programs, and the NXP hardware reference manual provides the radiation/ruggedness guidance needed for MIL-spec qualification.
Empfohlen
RAID and Storage Controllers
The MC8640DTVJ1067NE's dual GbE, dual PCIe, and AltiVec acceleration make it a strong controller-class CPU for RAID subsystems, SAN arrays, and storage area network switches. Dual DDR2 channels with ECC provide ample bandwidth for cache memory, while PCIe Gen1 connects to SAS/SATA controllers and SRIO provides backplane interconnect for clustered storage. Industrial temperature rating suits JBOD-attached storage in data-center environments where inlet temperatures vary. The 1023-ball FCCBGA package keeps the controller board footprint compact while leaving room for high-pin-count PCIe switching on the same board.
Empfohlen
Industrial Automation and Machine Vision
For factory automation controllers and machine-vision pre-processors, the MC8640DTVJ1067NE combines deterministic dual-core compute with industrial-grade peripherals. AltiVec accelerates pixel-processing kernels (filtering, thresholding, FFT) at frame rates required by automated optical inspection lines. Dual GbE provides deterministic network connectivity to PLC backbones (PROFINET/EtherCAT gateways), while PCIe connects to camera frame-grabbers. The -40C to +105C rating tolerates cabinet environments without derating, and the FCCBGA package supports compact DIN-rail and panel-mount form factors common in industrial controllers.
Empfohlen
Ruggedized Single-Board Computers
The MC8640DTVJ1067NE's compact 1023-ball FCCBGA, dual-core throughput, and industrial temperature rating make it a preferred SBC SoC for VPX, VME, and CompactPCI boards in defense, aerospace, and railway applications. AltiVec SIMD accelerates on-board signal processing while SRIO provides inter-board backplane connectivity at multi-Gbps. Multi-rail power (1.05V core, 1.8V DDR, 2.5V/3.3V I/O) maps cleanly to standard SBC PMIC designs. The EOL status makes last-time-buy inventory essential for long-lifecycle programs, and forward-compatible successors in the MPC8641D family ease later board refresh without layout rework.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC8640DTVJ1067NE – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC8640DTVU1067NE | MC8640DTHJ1067NE | MC8640DTHX1067NE | MC8640DHX1067NE | MC8641DVU1333JC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCCBGA (33x33) | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same |
| Core Frequency | 2 x 1067 MHz | 2 x 1067 MHz | 2 x 1067 MHz | 2 x 1067 MHz | 2 x 1067 MHz | 2 x 1333 MHz |
| Core Count | 2 | 2 | 2 | 2 | 2 | 2 |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Ethernet | 2 x GbE (SGMII) | 2 x GbE (SGMII) | 2 x GbE (SGMII) | 2 x GbE (SGMII) | 2 x GbE (SGMII) | 2 x GbE (SGMII) |
| PCIe / SRIO | 2 x PCIe Gen1 / 2 x SRIO | 2 x PCIe Gen1 / 2 x SRIO | 2 x PCIe Gen1 / 2 x SRIO | 2 x PCIe Gen1 / 2 x SRIO | 2 x PCIe Gen1 / 2 x SRIO | 2 x PCIe Gen1 / 2 x SRIO |
Wichtigste Unterscheidungsmerkmale
- Drop-in pin compatibility with MPC8641 successors (vs. MC8641DVU1333JC)
- AltiVec SIMD acceleration on both cores (vs. MC8640DTHJ1067NE)
- Dual GbE with TCP/IP acceleration on-chip (vs. MC8640DTHX1067NE)
Designhinweise
The 1023-ball FCCBGA at 33x33 mm requires HDI PCB technology (typically 8+ layers with stacked micro-vias). Per NXP's hardware reference manual, controlled-impedance routing must be applied to DDR, PCIe, SRIO, and SGMII traces; via-in-pad is recommended for the BGA escape. A continuous ground plane beneath the BGA improves both signal integrity and thermal dissipation, and decoupling capacitors must be placed as close to the balls as the stack-up permits.
The MC8640DTVJ1067NE requires multi-rail sequencing: 1.05V core, 1.8V DDR, and 2.5V/3.3V I/O. NXP specifies a power-up sequence (typically core first, then DDR, then I/O) that must be respected to avoid latch-up. Use a multi-channel PMIC or discrete switching regulators with PG (power-good) cascading - the LTC3899EFE triple-output controller is a suitable candidate. Estimate: peak core current at 1.067 GHz is approximately 12-15 A from the 1.05V rail; verify against the latest NXP datasheet before finalizing the supply design.
At 1.067 GHz per core, total die power dissipation is in the 20-30 W range depending on workload and silicon activity. The 1023-ball FCCBGA exposes the die through the package top, and NXP's reference design uses a heatsink with thermal interface material. Estimate: at 25 W dissipation with theta_JA of approximately 1.5 C/W (heatsinked), junction rises 37.5 C above ambient - verify against the latest NXP thermal model for your mechanical design and chassis airflow budget.
Common pitfalls with the MC8640DTVJ1067NE: (1) ignoring silicon revision - Rev 3 silicon has known errata fixed relative to Rev 1/2; verify your firmware against the latest NXP errata document. (2) Mixing MPC8640 and MPC8641 boot ROMs - the two families have different coherency initialization. (3) Power-sequence violations causing latch-up - always sequence core before DDR before I/O. (4) BGA assembly without proper profiling - the FCCBGA package requires precise reflow profile per J-STD-020 to avoid cold joints.
Compliance-Informationen
RoHS and REACH compliance per NXP product page. AEC-Q100 not applicable - this is a high-performance MPU, not an automotive-qualified IC. Halogen-free status not explicitly stated in available data; confirmed unknown. End-of-Life status per NXP official PCN.
