MC8640DTVJ1067NE - Dual-Core PowerPC SoC, 2x1067MHz | NXP
MPN: MC8640DTVJ1067NE ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $325 | $162,500.00 |
| 1,000 | $295 | $295,000.00 |
MC8640DTVJ1067NE Overview
What is an embedded SoC microprocessor? An embedded SoC microprocessor is a single silicon die that integrates one or more CPU cores, memory controllers, high-speed serial interfaces, and peripheral IP into one package. Within the broader taxonomy, an embedded SoC is a sub-class of microprocessors (MPU) that are designed for headless applications (no display), unlike microcontrollers (MCU) which usually include on-chip Flash and a richer peripheral set. The MPC8640D family is a classic MPU SoC: high-core-clock throughput, large external memory bandwidth, and standards-based serial I/O (PCIe, SRIO, GbE) that allows the same silicon to be reused across compute-intensive platforms.
The headline feature set includes dual e600 cores each with AltiVec vector processing, dual integrated Gigabit Ethernet controllers with TCP/IP acceleration, dual PCIe Gen1 interfaces, dual Serial RapidIO (SRIO) ports, dual DDR1/DDR2 memory controllers with ECC, and a complete set of local-bus and DMA engines. Operating temperature is rated -40C to +105C (industrial / extended), and the part is supplied at revision 3 of the silicon. Junction thermal limits and a thermally enhanced FCCBGA package allow deployment in NEBS-compliant telecom platforms and ruggedized industrial systems.
Architecturally, the MC8640D shares the e600 core complex with the MPC8641, but the 8640D family is optimized for parallel DSP-like workloads (via AltiVec) and for deterministic inter-core traffic via shared SRAM and coherency fabric. Designers typically pair the SoC with DDR2-667 ECC memory, NOR/NAND Flash via the local bus, and an external PHY for SGMII-attached Gigabit Ethernet. Power is delivered via multiple rails (core 1.05V, DDR 1.8V, I/O 2.5V/3.3V) requiring careful sequencing and decoupling; reference schematics in the NXP hardware reference manual are strongly recommended before layout.
Typical applications include embedded networking line cards, telecom base-station baseband controllers, defense/aerospace mission computing, RAID storage controllers, industrial automation controllers, and machine-vision pre-processors. The combination of dual cores, AltiVec SIMD, multi-protocol I/O, and industrial temperature grade makes the device a fit for deterministic real-time workloads where x86 CPUs would consume too much power or board area.
Designers should carefully review the 1023-ball FCCBGA escape, which requires HDI PCB (typically 8+ layers with micro-vias) and controlled-impedance routing for DDR, PCIe, SRIO, and SGMII. NXP's hardware reference manual and board design guidelines are essential reading before committing to a layout. JTAG/COP debug access must be reserved on the board for production test and field debug.
This page consolidates current distributor pricing, drop-in alternatives, datasheet links, and practical design notes that complement - but do not replace - the official NXP MPC8640D hardware reference manual and reference design package.
Drop-in alternatives for MC8640DTVJ1067NE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC8640DTVJ1067NE (same form factor and footprint) — differing in Core Frequency, Ethernet, Memory Controller, PCI Express, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC8640DTVU1067NE
✅ Drop-In📋 Reference alternative (not in catalog)
MC8640DTHJ1067NE
✅ Drop-In📋 Reference alternative (not in catalog)
MC8640DTHX1067NE
✅ Drop-In✓ In Stock
$185.25 / Unit
View Datasheet →MC8640DHX1067NE
✅ Drop-In📋 Reference alternative (not in catalog)
MC8641DVU1333JC
✅ Drop-In📋 Reference alternative (not in catalog)
MC8640DTVJ1067NE Maximum Ratings & Electrical Characteristics
| Product Type | 32-Bit Power Architecture SoC (Dual-Core MPU) |
| Core Architecture | PowerPC e600 (dual-core) |
| Core Frequency | 2 x 1067 MHz (1.067 GHz) |
| SIMD Engine | AltiVec |
| Memory Controller | Dual-channel DDR1/DDR2 with ECC |
| Ethernet | 2 x 10/100/1000 Mbps (GbE, SGMII) |
| PCI Express | 2 x PCIe Gen1 |
| Serial RapidIO | 2 x SRIO |
| Operating Temperature | -40C to +105C |
| Package | 1023-ball FCCBGA, 33 x 33 mm |
| Silicon Revision | Rev 3 |
| Supply Voltages | 1.05V core / 1.8V DDR / 2.5V-3.3V I/O |
| Mounting Type | Surface Mount (BGA) |
| Compliance / Status | End-of-Life per NXP PCN |
| RoHS Status | Compliant |
MC8640DTVJ1067NE 1023-ball fccbga, 33 x 33 mm Pin Configuration Guide
Pin configuration for MC8640DTVJ1067NE (1023-ball fccbga, 33 x 33 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC8640DTVJ1067NE.
Refer to the datasheet for full pin configuration.
Typical Applications
MC8640DTVJ1067NE is suitable for 6 applications: Embedded Networking Line Cards, Telecom Base Station Baseband, Defense and Aerospace Mission Computing, RAID and Storage Controllers, Industrial Automation and Machine Vision, Ruggedized Single-Board Computers.
Embedded Networking Line Cards
The MC8640DTVJ1067NE's dual e600 cores at 1.067 GHz with AltiVec SIMD deliver 2.13 GHz aggregate compute, ideal for parallel packet-processing on router line cards. Its dual GbE controllers with TCP/IP acceleration offload checksum and segmentation, while dual PCIe and SRIO links connect to look-aside crypto and fabric ASICs. The -40C to +105C industrial temperature rating suits outdoor cabinet deployments and NEBS-compliant chassis. Placing the SoC between PHY and forwarding engine, with DDR2-667 ECC for routing tables, lets designers reuse the same silicon across 1G, 10G, and 100G platforms, and the 1023-ball FCCBGA keeps board area comparable to single-core alternatives.
Recommended
Telecom Base Station Baseband
For LTE and small-cell baseband processing, the MC8640DTVJ1067NE's dual cores with AltiVec accelerate turbo-decoding, FFT/iFFT, and channel estimation in software-defined radio (SDR) baseband chains. Dual SRIO links aggregate baseband data from RF front-end cards at low latency, and dual PCIe connects to DSP co-processors or accelerators. Industrial temperature rating (-40C to +105C) tolerates outdoor small-cell enclosures. The 1023-ball FCCBGA and HDI PCB allow the SoC to be co-located with RFICs on compact baseband boards, while multi-rail power (1.05V core, 1.8V DDR) supports standard PMIC solutions.
Recommended
Defense and Aerospace Mission Computing
The MC8640DTVJ1067NE's deterministic dual-core architecture, extended temperature range, and ruggedized FCCBGA package fit avionics mission-computing and defense signal-processing platforms. AltiVec SIMD accelerates radar pulse-compression, EO/IR image processing, and electronic-warfare algorithms. Dual SRIO ports provide low-latency interconnect to FPGA sensor front-ends, while GbE handles mission-data upload to display subsystems. The EOL status requires last-time-buy planning for long-lifecycle defense programs, and the NXP hardware reference manual provides the radiation/ruggedness guidance needed for MIL-spec qualification.
Recommended
RAID and Storage Controllers
The MC8640DTVJ1067NE's dual GbE, dual PCIe, and AltiVec acceleration make it a strong controller-class CPU for RAID subsystems, SAN arrays, and storage area network switches. Dual DDR2 channels with ECC provide ample bandwidth for cache memory, while PCIe Gen1 connects to SAS/SATA controllers and SRIO provides backplane interconnect for clustered storage. Industrial temperature rating suits JBOD-attached storage in data-center environments where inlet temperatures vary. The 1023-ball FCCBGA package keeps the controller board footprint compact while leaving room for high-pin-count PCIe switching on the same board.
Recommended
Industrial Automation and Machine Vision
For factory automation controllers and machine-vision pre-processors, the MC8640DTVJ1067NE combines deterministic dual-core compute with industrial-grade peripherals. AltiVec accelerates pixel-processing kernels (filtering, thresholding, FFT) at frame rates required by automated optical inspection lines. Dual GbE provides deterministic network connectivity to PLC backbones (PROFINET/EtherCAT gateways), while PCIe connects to camera frame-grabbers. The -40C to +105C rating tolerates cabinet environments without derating, and the FCCBGA package supports compact DIN-rail and panel-mount form factors common in industrial controllers.
Recommended
Ruggedized Single-Board Computers
The MC8640DTVJ1067NE's compact 1023-ball FCCBGA, dual-core throughput, and industrial temperature rating make it a preferred SBC SoC for VPX, VME, and CompactPCI boards in defense, aerospace, and railway applications. AltiVec SIMD accelerates on-board signal processing while SRIO provides inter-board backplane connectivity at multi-Gbps. Multi-rail power (1.05V core, 1.8V DDR, 2.5V/3.3V I/O) maps cleanly to standard SBC PMIC designs. The EOL status makes last-time-buy inventory essential for long-lifecycle programs, and forward-compatible successors in the MPC8641D family ease later board refresh without layout rework.
Recommended
Recommended Products Summary
Engineering reference data for MC8640DTVJ1067NE — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC8640DTVU1067NE | MC8640DTHJ1067NE | MC8640DTHX1067NE | MC8640DHX1067NE | MC8641DVU1333JC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCCBGA (33x33) | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same |
| Core Frequency | 2 x 1067 MHz | 2 x 1067 MHz | 2 x 1067 MHz | 2 x 1067 MHz | 2 x 1067 MHz | 2 x 1333 MHz |
| Core Count | 2 | 2 | 2 | 2 | 2 | 2 |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Ethernet | 2 x GbE (SGMII) | 2 x GbE (SGMII) | 2 x GbE (SGMII) | 2 x GbE (SGMII) | 2 x GbE (SGMII) | 2 x GbE (SGMII) |
| PCIe / SRIO | 2 x PCIe Gen1 / 2 x SRIO | 2 x PCIe Gen1 / 2 x SRIO | 2 x PCIe Gen1 / 2 x SRIO | 2 x PCIe Gen1 / 2 x SRIO | 2 x PCIe Gen1 / 2 x SRIO | 2 x PCIe Gen1 / 2 x SRIO |
Key Differentiators
- Drop-in pin compatibility with MPC8641 successors (vs MC8641DVU1333JC)
- AltiVec SIMD acceleration on both cores (vs MC8640DTHJ1067NE)
- Dual GbE with TCP/IP acceleration on-chip (vs MC8640DTHX1067NE)
Design Notes
The 1023-ball FCCBGA at 33x33 mm requires HDI PCB technology (typically 8+ layers with stacked micro-vias). Per NXP's hardware reference manual, controlled-impedance routing must be applied to DDR, PCIe, SRIO, and SGMII traces; via-in-pad is recommended for the BGA escape. A continuous ground plane beneath the BGA improves both signal integrity and thermal dissipation, and decoupling capacitors must be placed as close to the balls as the stack-up permits.
The MC8640DTVJ1067NE requires multi-rail sequencing: 1.05V core, 1.8V DDR, and 2.5V/3.3V I/O. NXP specifies a power-up sequence (typically core first, then DDR, then I/O) that must be respected to avoid latch-up. Use a multi-channel PMIC or discrete switching regulators with PG (power-good) cascading - the LTC3899EFE triple-output controller is a suitable candidate. Estimate: peak core current at 1.067 GHz is approximately 12-15 A from the 1.05V rail; verify against the latest NXP datasheet before finalizing the supply design.
At 1.067 GHz per core, total die power dissipation is in the 20-30 W range depending on workload and silicon activity. The 1023-ball FCCBGA exposes the die through the package top, and NXP's reference design uses a heatsink with thermal interface material. Estimate: at 25 W dissipation with theta_JA of approximately 1.5 C/W (heatsinked), junction rises 37.5 C above ambient - verify against the latest NXP thermal model for your mechanical design and chassis airflow budget.
Common pitfalls with the MC8640DTVJ1067NE: (1) ignoring silicon revision - Rev 3 silicon has known errata fixed relative to Rev 1/2; verify your firmware against the latest NXP errata document. (2) Mixing MPC8640 and MPC8641 boot ROMs - the two families have different coherency initialization. (3) Power-sequence violations causing latch-up - always sequence core before DDR before I/O. (4) BGA assembly without proper profiling - the FCCBGA package requires precise reflow profile per J-STD-020 to avoid cold joints.
Compliance Information
RoHS and REACH compliance per NXP product page. AEC-Q100 not applicable - this is a high-performance MPU, not an automotive-qualified IC. Halogen-free status not explicitly stated in available data; confirmed unknown. End-of-Life status per NXP official PCN.
