MC9RS08KB12CSG574 - 8-bit RS08 MCU, 12KB Flash, 20MHz | NXP
Teilenummer: MC9RS08KB12CSG574 ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.45 | $3,45 |
| 10 | $2.98 | $29,80 |
| 100 | $2.45 | $245,00 |
| 500 | $2.1 | $1.050,00 |
| 1.000 | $1.85 | $1.850,00 |
MC9RS08KB12CSG574 Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (typically Flash), data RAM, and peripherals such as timers, ADCs, communication interfaces, and GPIO onto one silicon die. The RS08 family is a reduced-instruction-set 8-bit core targeting ultra-low-cost applications, sitting beneath the HCS08 in NXP's 8-bit hierarchy but using a streamlined instruction set optimized for code density and small die area. The RS08KB series specifically integrates a peripheral set tuned for motor control, appliance, lighting, and consumer product designs.
Key features of the MC9RS08KB12CSG574 include 12KB (12K x 8) of on-chip Flash memory, an 8-bit RS08 CPU core with interrupt capability, on-chip peripherals suitable for embedded control, and wide operating voltage support typical of the family. The device is intended for designers who need a Flash-based 8-bit MCU with sufficient code space for small to medium embedded applications, while keeping the bill-of-materials cost low.
The 16-pin SOIC (Small Outline Integrated Circuit) package is a through-hole-replacement-style surface-mount package with 1.27mm pitch, offering a compact 3.9mm body width suitable for hand-solderable prototyping as well as high-volume reflow assembly. SOIC-16 is a broadly available, low-cost package stocked across virtually every distributor, simplifying both initial sampling and production ramp.
Typical applications for the MC9RS08KB12CSG574 include small consumer appliances, white goods sub-modules, low-end remote controls, simple sensor signal conditioning, lighting ballast controls, battery chargers, and educational/development platforms that benefit from a free toolchain and minimal external component count. The Flash-based program memory allows in-system reprogramming via the standard background debug mode (BDM), enabling fast firmware iteration during development.
When designing with this part, evaluate whether the peripheral set (timers, ADC channels, communication interfaces) meets the application's I/O and timing requirements before locking in the design. Designers should also confirm code-size headroom - 12KB accommodates small algorithms but may constrain complex state machines - and verify the available development tools (CodeWarrior for RS08, third-party IDEs) match their team workflow.
This page synthesizes distributor availability across DigiKey, Mouser, Rochester Electronics, LCSC, and Octopart, alongside NXP product documentation, parametric comparison data, and drop-in alternative analysis not consolidated in any single manufacturer datasheet.
Drop-in-Alternativen für MC9RS08KB12CSG574 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9RS08KB12CSG574 (gleiche Bauform und Footprint) – abweichend in Package, Mounting Type, Program Memory Size, Maximum CPU Frequency, Data Bus Width.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9RS08KB12CSG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9RS08KB8CWJ574
✅ Drop-In✓ Auf Lager
$0.74 / Stück
Datenblatt ansehen →MC9RS08KB4CWJ
✅ Drop-In✓ Auf Lager
$1.49 / Stück
Datenblatt ansehen →MC9S08AW32MFGE
✅ Drop-In✓ Auf Lager
$3.15 / Stück
Datenblatt ansehen →S9S08AW60E5MFGE
✅ Drop-In✓ Auf Lager
$6.05 / Stück
Datenblatt ansehen →MC9RS08KB12CSG574 Grenzwerte & elektrische Eigenschaften
| Core | RS08 (8-bit) |
| Program Memory | 12 KB (12K x 8) Flash |
| Maximum CPU Frequency | 20 MHz |
| Gehäuse | 16-SOIC |
| Pin-Anzahl | 16 |
| Montageart | Surface Mount |
| Family | RS08KB |
| Datenbusbreite | 8-bit |
MC9RS08KB12CSG574 Pin-Konfiguration
| Pin 1 | PTB5/KBIP5 — Port B I/O / keyboard interrupt |
| Pin 2 | PTB4/KBIP4 — Port B I/O / keyboard interrupt |
| Pin 3 | PTB3/KBIP3 — Port B I/O / keyboard interrupt |
| Pin 4 | PTB2/KBIP2 — Port B I/O / keyboard interrupt |
| Pin 5 | VDD — Supply voltage |
| Pin 6 | VSS — Ground |
| Pin 7 | PTA2/TCLK — Port A I/O / timer clock input |
| Pin 8 | PTA3/RESET — Port A I/O / reset (shared pin) |
| Pin 9 | PTA4/BKGD — Port A I/O / background debug mode |
| Pin 10 | PTB1/KBIP1 — Port B I/O / keyboard interrupt |
| Pin 11 | PTB0/KBIP0 — Port B I/O / keyboard interrupt |
| Pin 12 | PTA0/TPMCH0 — Port A I/O / TPM channel 0 |
| Pin 13 | PTA1/TPMCH1 — Port A I/O / TPM channel 1 |
| Pin 14 | PTA5/IRQ — Port A I/O / external interrupt |
| Pin 15 | PTA6 — Port A I/O |
| Pin 16 | PTA7 — Port A I/O |
Typische Anwendungen
MC9RS08KB12CSG574 ist geeignet für 6 Anwendungs: Small Consumer Appliance Control, LED Lighting Ballast Controller, Remote Control Transmitter, Battery Charger Controller, Sensor Signal Conditioning Module, Educational / Development Platform.
Small Consumer Appliance Control
The MC9RS08KB12CSG574 fits small consumer appliance control boards where 12KB Flash accommodates menu state machines, sensor reading routines, and motor-timing logic without external memory. Its 20MHz RS08 core handles button-debounce loops, LED indicators, and triac/relay drive signals in real time. Placed as the main MCU on the appliance's main PCB, it replaces discrete logic with programmable behavior while keeping BOM cost low. The 16-SOIC footprint allows single-sided PCB assembly, and the Flash-based program memory enables last-minute firmware tweaks via BDM without retooling. For cost-driven appliance production runs of tens of thousands of units, this part's price-per-unit at qty 1000 makes it economical versus higher-end Cortex-M0 alternatives.
Empfohlen
LED Lighting Ballast Controller
The MC9RS08KB12CSG574 serves as a ballast/driver controller in LED lighting fixtures, where 12KB Flash holds PWM schedules, dimming curves, and thermal foldback algorithms. The RS08 core's interrupt-driven design efficiently services ADC readings from current-sense amplifiers while generating PWM outputs at kHz rates. Designers pair it with a constant-current LED driver IC and use its GPIO to control brightness levels. The 16-SOIC package's compact footprint fits inside small driver housings, and the wide operating voltage typical of the family supports direct connection to rectified mains-derived rails. For commercial lighting products requiring 50,000-hour lifetimes, the Flash memory's reprogrammability supports field firmware updates for new dimming protocols.
Empfohlen
Remote Control Transmitter
The MC9RS08KB12CSG574 is well-matched to handheld remote control transmitters where 12KB Flash stores button-mapping tables, IR/RF protocol encoders, and battery-saving sleep routines. The RS08 core's low-power modes extend battery life by sleeping between button presses, waking on interrupt to transmit and returning to sleep within milliseconds. Placed alongside an IR LED driver or sub-GHz transmitter IC, the MCU handles all protocol encoding in software. The 16-SOIC package fits within the tight interior of a remote-control housing, and the low unit cost supports consumer price points. Compared to discrete encoder ICs, this part enables custom protocols without tooling fees and supports late-stage firmware changes for protocol revisions.
Empfohlen
Battery Charger Controller
For low-power battery charger applications, the MC9RS08KB12CSG574 provides 12KB of Flash for charge-profile state machines (CC/CV algorithms), ADC-based voltage/current monitoring, and safety timer logic. The 20MHz RS08 core executes ADC sampling and PID-style charge regulation in real time, replacing discrete charger ASICs with flexible firmware. Its GPIO drives MOSFET gate signals for synchronous rectification or linear pass-element control. Designers integrate it on charger PCBs alongside current-sense amplifiers and protection circuits; the 16-SOIC package fits into compact wall-cube form factors. The Flash-based memory allows late-stage customization of charge profiles for different battery chemistries without hardware redesign.
Empfohlen
Sensor Signal Conditioning Module
The MC9RS08KB12CSG574 is suited for sensor signal conditioning modules that aggregate analog inputs, apply digital filtering, and output processed readings via UART/I2C/SPI. Its 12KB Flash accommodates lookup tables for sensor linearization, moving-average filters, and threshold-detection algorithms. The RS08 core's deterministic interrupt latency makes it predictable for time-critical sensor sampling, while GPIO and on-chip peripherals handle multiple sensor interfaces. Placed on a small sensor PCB near the analog front-end, it converts raw sensor outputs into calibrated digital readings for a host processor. The 16-SOIC package supports hand-prototyping and reflow production alike, and Flash reprogrammability allows calibration tables to be updated per sensor batch.
Empfohlen
Educational / Development Platform
The MC9RS08KB12CSG574 is a practical target for educational microcontroller courses and entry-level developer kits, where its 12KB Flash holds student-written firmware for basic I/O, ADC, and communication exercises. The 16-SOIC package is hand-solderable on breakout boards, allowing students to build and rework circuits without specialized reflow equipment. CodeWarrior for RS08 provides a free-tier IDE with simulator and BDM debugging, lowering the barrier to entry. Universities and training centers adopt this part for embedded-systems curricula because the RS08 core's simplicity teaches fundamentals without overwhelming beginners. As an active teaching tool, it bridges the gap between discrete logic and modern ARM Cortex-M designs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9RS08KB12CSG574 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9RS08KB12CSG | MC9RS08KB8CWJ | MC9RS08KB4CWJ | MC9S08AW32MFGE | S9S08AW60E5MFGE |
|---|---|---|---|---|---|---|
| Package | 16-SOIC | 16-SOIC - same | 16-SOIC - same | 16-SOIC - same | 16-SOIC - same | 16-SOIC - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | RS08 (8-bit) | RS08 (8-bit) | RS08 (8-bit) | RS08 (8-bit) | S08 (8-bit) | S08 (8-bit) |
| Program Memory | 12 KB Flash | 12 KB Flash | 8 KB Flash | 4 KB Flash | 32 KB Flash | 60 KB Flash |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Active | Active |
| Drop-in Compatibility | Reference part | Drop-in (suffix variant) | Drop-in (Flash reduced) | Drop-in (Flash reduced) | Drop-in (firmware rewrite) | Drop-in (firmware rewrite) |
Wichtigste Unterscheidungsmerkmale
- Higher Flash density within RS08KB family in same 16-SOIC footprint (vs. MC9RS08KB8CWJ (8KB) and MC9RS08KB4CWJ (4KB))
- Drop-in alternate for MC9RS08KB12CSG with same electrical characteristics (vs. MC9RS08KB12CSG)
- Lowest-cost active footprint for legacy NXP 8-bit designs (vs. S9S08AW60E5MFGE (active S08 upgrade))
Designhinweise
Place decoupling capacitors (typically 0.1uF ceramic) as close as possible to the VDD pin (pin 5) and VSS pin (pin 6) of the 16-SOIC package. Keep the BKGD/reset trace short to minimize noise pickup; if the reset pin is shared with PTA3, ensure external reset circuitry does not conflict with GPIO usage. Route crystal or external clock traces (if used) away from high-current switching signals to avoid injection of switching noise into the clock reference. A solid ground pour under the MCU improves both thermal dissipation and EMI performance.
Verify that the application firmware fits within the 12KB Flash limit before committing to this part - the RS08KB family does not support external memory expansion. If the design is nearing the Flash ceiling, consider migrating to MC9RS08KB16 (16KB) or to S08 family devices like MC9S08AW32MFGE which offer 32KB at the same package. Also confirm that the required peripherals (ADC channels, timers, communication interfaces) are present in the specific 16-SOIC pinout - larger packages in the RS08KB family expose more peripheral pins than the 16-pin variant.
The 16-SOIC package has a 1.27mm pin pitch and 3.9mm body width, making it suitable for hand-soldering on breakout boards and for reflow on standard 2-layer PCBs. Reserve at least 0.5mm clearance between SOIC pins and adjacent traces for assembly tolerance. If using the BDM (background debug mode) interface during development, route the BKGD pin (pin 9) to a header or test point for in-circuit programming access. For production designs, the BDM pins can be left as no-connect or used as GPIO to save board space.
Compliance-Informationen
Compliance status not confirmed in the provided data - all compliance fields set to 'unknown'. The MC9RS08KB12 family is a legacy NXP/Freescale part without explicit compliance certification in retrieved web data; verify RoHS/REACH status directly with NXP or Rochester Electronics before use in regulated markets.