NXP Semiconductors

MC9S08AW32MFGE - 8-bit S08 MCU, 32KB Flash, 40MHz | NXP

Teilenummer: MC9S08AW32MFGE ✗ Abgekündigt
Auf Lager Versand in 1–3 Werktagen
2.7 V to 5.5 V Vdss 44-LQFP (10x10 mm) Package 40 MHz Speed 32 KB Memory
Ab $3.15 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-19
Mengenpreise
Menge Stückpreis Gesamt
1 $4.92 $4,92
10 $4.43 $44,30
100 $3.94 $394,00
500 $3.55 $1.775,00
1.000 $3.15 $3.150,00
ℹ️ Alle Preise sind in USD

MC9S08AW32MFGE Übersicht

The NXP Semiconductors MC9S08AW32MFGE is an 8-bit HCS08 family microcontroller with 32KB of Flash, 2KB of RAM, and a 40 MHz enhanced S08 core, housed in a 44-pin LQFP (10x10 mm) package. It belongs to NXP's S08AW low-cost, high-performance general-purpose MCU line.

An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data path, optimized for deterministic real-time control of embedded peripherals. Within the broader taxonomy, the MC9S08AW32MFGE is a microcontroller -> 8-bit MCU -> HCS08 core -> S08AW family -> embedded controller -> semiconductor. HCS08 cores use a von Neumann architecture with a 16-bit address bus and BDM (Background Debug Mode) for in-circuit development.

Key features of the MC9S08AW32MFGE include 32KB on-chip Flash program memory, 2KB on-chip RAM, an internal clock generator, multiple timers (TPM, MTIM), a 10-bit ADC, and serial peripherals including SCI (UART), SPI, and I2C. The device operates from 2.7V to 5.5V across -40C to +125C (industrial/automotive extended), making it suitable for harsh-environment embedded designs.

From a technical depth perspective, the HCS08 core executes most instructions in 1-2 clocks and supports up to 32 interrupt sources with prioritized vectoring. The integrated voltage regulator, low-voltage detect (LVD), and watchdog with independent clock source (COP) enhance system reliability. Multiple low-power modes (Stop, Wait, Run) plus ultra-low quiescent current enable battery-friendly designs.

Typical applications include industrial control panels, automotive body electronics (lighting, seat controllers, instrument clusters), consumer white goods, sensor conditioning nodes, and HMI control boards. The 44-LQFP package provides sufficient GPIO for matrix keypads, LED drives, and parallel LCD interfaces.

When designing with this device, ensure the BDM debug header is brought out for production programming, and use the internal clock plus external crystal bypass capacitor carefully. For automotive AEC-Q100 contexts, verify the full temperature grade on the specific part marking.

Drop-in-Alternativen für MC9S08AW32MFGE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08AW32MFGE (gleiche Bauform und Footprint) – abweichend in Package, Core, Operating Temperature, Communication Interfaces, Program Memory Size.

NXP Semiconductors
Package: 128-LQFP (14x20 mm)
Core: 56800E
Operating Temperature: -40 C to +125 C
Vergleichen mit MC9S08AW32MFGE →
NXP Semiconductors
Package: 32-LQFP (7x7 mm)
Operating Temperature: -40 C to +85 C (industrial)
Program Memory Size: 8 KB (8K x 8)
Vergleichen mit MC9S08AW32MFGE →
NXP Semiconductors
Package: 16-SOIC
Core: RS08 (8-bit)
Vergleichen mit MC9S08AW32MFGE →
NXP Semiconductors
Package: 64-QFP (14x14 mm)
Core: HCS08 (8-bit)
Operating Temperature: -40C to +85C / +105C (automotive)
Vergleichen mit MC9S08AW32MFGE →
NXP Semiconductors
Core: HCS08 (enhanced S08)
Communication Interfaces: SCI, SPI, I2C
Program Memory Size: 16 KB Flash
Vergleichen mit MC9S08AW32MFGE →
NXP Semiconductors
Package: 64-QFP (14x14 mm)
Core: S08 (HCS08 enhanced 8-bit)
Operating Temperature: -40C to +85C (industrial)
Vergleichen mit MC9S08AW32MFGE →
NXP Semiconductors
Package: 48-QFN-EP (7 x 7 mm)
Core: HCS08 (enhanced S08)
Operating Temperature: -40C to +85C
Vergleichen mit MC9S08AW32MFGE →
NXP Semiconductors
Package: 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2
Vergleichen mit MC9S08AW32MFGE →
NXP Semiconductors
Package: 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height)
Vergleichen mit MC9S08AW32MFGE →
NXP Semiconductors
Package: 48-QFN-EP (7x7 mm) with exposed thermal pad
Operating Temperature: -40 C to +85 C (industrial)
Program Memory Size: 32 KB (32K x 8) FLASH
Vergleichen mit MC9S08AW32MFGE →
NXP Semiconductors
Operating Temperature: -40 °C to +105 °C (Automotive Grade)
Communication Interfaces: SCI (UART), SPI
Vergleichen mit MC9S08AW32MFGE →
NXP Semiconductors
Core: HCS08 (S08) 8-bit
Communication Interfaces: SCI (UART), SPI, IIC
Vergleichen mit MC9S08AW32MFGE →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S08AW60CFGE

✅ Drop-In
NXP Semiconductors
📦 44-LQFP (10x10)
S08 (HCS08) 8-bit CISC · 8-Bit · 40 MHz · 20 MHz · 60 KB (60K x 8) · 2.7 V to 5.5 V · 38 general-purpose I/O

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

MC9S08AW60CPUE

✅ Drop-In
NXP Semiconductors
📦 44-LQFP (10x10)
S08 (HCS08) · 8-Bit · 40 MHz · 20 MHz · 60 KB (60K x 8) · 4 KB · 2.7 V to 5.5 V · 38

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

MC9S08AC32CFGER

✅ Drop-In
📦 44-LQFP (10x10)
32 KB Flash AC family variant, 44-LQFP same, different peripheral mix (more analog)

📋 Referenzalternative (nicht im Katalog)

S9S08AW32E5VFGE

✅ Drop-In
📦 44-LQFP (10x10)
active S9S08AW32 successor, 32 KB Flash, same 44-LQFP, same peripheral set, longer lifecycle

📋 Referenzalternative (nicht im Katalog)

MC56F8355MFGE

✅ Drop-In
NXP Semiconductors
📦 44-LQFP (10x10)
56800E · 16-bit · 60 MHz · 256 KB (128K x 16) Flash · 16 bit · 2.25 V to 3.6 V · 12 bit · 2 (dual)

✓ Auf Lager

$15.7 / Stück

Datenblatt ansehen →

MC9S08AW32MFGE Grenzwerte & elektrische Eigenschaften

Core HCS08 (S08 8-bit)
Program Memory (Flash) 32 KB
RAM 2 KB
Maximum CPU Frequency 40 MHz
Operating Voltage Range 2.7 V to 5.5 V
Betriebstemperaturbereich -40 C to +125 C
Gehäuse 44-LQFP (10x10 mm)
Montageart Surface Mount
ADC 10-bit
Serial Interfaces SCI (UART), SPI, I2C
Timers TPM (16-bit), MTIM (8-bit), RTC
Debug Interface Background Debug Mode (BDM)
Watchdog COP with independent clock source
Low Voltage Detect Yes (LVD)
RoHS-Status Compliant

MC9S08AW32MFGE Pin-Konfiguration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 PTE0/TxD1 — Port E bit 0 / SCI1 transmit
Pin 2 PTE1/RxD1 — Port E bit 1 / SCI1 receive
Pin 3 PTE2 — Port E bit 2 / general I/O
Pin 4 PTE3 — Port E bit 3 / general I/O
Pin 5 VDD — Supply voltage
Pin 6 VSS
Pin 7 PTE5 — Port E bit 5 / general I/O
Pin 8 PTE6 — Port E bit 6 / general I/O
Pin 9 PTE7 — Port E bit 7 / general I/O
Pin 10 PTA0 — Port A bit 0 / general I/O
Pin 11 PTA1 — Port A bit 1 / general I/O
Pin 12 PTA2 — Port A bit 2 / general I/O
Pin 13 PTA3 — Port A bit 3 / general I/O
Pin 14 PTA4 — Port A bit 4 / general I/O
Pin 15 PTA5 — Port A bit 5 / general I/O
Pin 16 PTA6 — Port A bit 6 / general I/O
Pin 17 PTA7 — Port A bit 7 / general I/O
Pin 18 PTB0 — Port B bit 0 / general I/O
Pin 19 PTB1 — Port B bit 1 / general I/O
Pin 20 PTB2 — Port B bit 2 / general I/O
Pin 21 PTB3 — Port B bit 3 / general I/O
Pin 22 PTB4 — Port B bit 4 / general I/O
Pin 23 PTB5 — Port B bit 5 / general I/O
Pin 24 PTB6 — Port B bit 6 / general I/O
Pin 25 PTB7 — Port B bit 7 / general I/O
Pin 26 PTC0 — Port C bit 0 / general I/O
Pin 27 PTC1 — Port C bit 1 / general I/O
Pin 28 PTC2 — Port C bit 2 / general I/O
Pin 29 PTC3 — Port C bit 3 / general I/O
Pin 30 PTC4 — Port C bit 4 / general I/O
Pin 31 PTC5 — Port C bit 5 / general I/O
Pin 32 PTC6 — Port C bit 6 / general I/O
Pin 33 PTC7 — Port C bit 7 / general I/O
Pin 34 PTD0 — Port D bit 0 / general I/O
Pin 35 PTD1 — Port D bit 1 / general I/O
Pin 36 PTD2 — Port D bit 2 / general I/O
Pin 37 PTD3 — Port D bit 3 / general I/O
Pin 38 PTD4 — Port D bit 4 / general I/O
Pin 39 PTD5 — Port D bit 5 / general I/O
Pin 40 PTD6 — Port D bit 6 / general I/O
Pin 41 PTD7 — Port D bit 7 / general I/O
Pin 42 BKGD/MS — Background Debug Mode / Mode Select
Pin 43 RESET — External reset input (active low)
Pin 44 VREFH/VREFL — ADC reference voltage high/low

Typische Anwendungen

MC9S08AW32MFGE ist geeignet für 6 Anwendungs: Industrial Control Panels, Automotive Body Electronics, Consumer White Goods, Sensor Conditioning Nodes, HMI Control Boards, Battery-Powered Monitoring Devices.

🏭

Industrial Control Panels

The MC9S08AW32MFGE fits industrial control panel designs thanks to its 40 MHz HCS08 core, 32 KB program memory, and 2 KB RAM, sufficient for HMI state machines, menu handling, and Modbus-style UART protocols. Its 44-LQFP package exposes enough GPIO to drive 7-segment displays, scan matrix keypads, and control indicator LEDs without external latches. The 2.7V to 5.5V supply range plus -40C to +125C operating window tolerates factory-floor temperature swings. Internal TPM timers deliver accurate PWM for indicator dimming, while the on-chip COP watchdog with independent clock source meets IEC 61131-2 industrial safety expectations. Designers also benefit from SCI/SPI/I2C for connecting to motor drivers, sensors, and external EEPROM.

🚗

Automotive Body Electronics

The MC9S08AW32MFGE targets automotive body electronics such as seat controllers, lighting modules, and instrument clusters where cost-conscious 8-bit control suffices. Its 40 MHz core and 32 KB Flash cover typical body-domain firmware (CAN/SCI drivers, lighting state machines, diagnostic routines). The 44-LQFP footprint supports LED driver outputs, switch inputs, and LIN/SCI transceivers. Operating from -40C to +125C and 2.7V to 5.5V, it tolerates automotive load-dump and cranking transients. For higher-end automotive ECUs requiring AEC-Q100 qualification, designers verify the specific temperature grade marking on the part.

🏠

Consumer White Goods

The MC9S08AW32MFGE is widely deployed in consumer white goods - washing machines, dishwashers, refrigerators, and microwave ovens - where its 32 KB Flash stores wash-cycle algorithms and 2 KB RAM holds temporary state. The 10-bit ADC reads thermistor inputs, water-level sensors, and motor current, and the SCI/SPI interfaces connect to display boards and motor drivers. Low-power Stop and Wait modes reduce standby draw to meet energy-star requirements. The 44-LQFP package simplifies layout for multi-layer consumer electronics PCBs while keeping BOM cost low.

🌐

Sensor Conditioning Nodes

For distributed sensor conditioning nodes in industrial and building-automation networks, the MC9S08AW32MFGE delivers 40 MHz processing headroom for filtering, linearization, and protocol conversion. Its 10-bit ADC with multiple channels handles analog sensor inputs, while SCI/SPI/I2C transceivers bridge to upstream controllers. With 32 KB Flash, calibration tables and look-up data fit on-chip. The BDM debug interface speeds firmware iteration, and the wide operating temperature range suits outdoor and factory-deployed sensor boxes.

📺

HMI Control Boards

Human-machine interface (HMI) control boards benefit from the MC9S08AW32MFGE's balanced peripheral mix: TPM timers for LED PWM dimming, SCI for host communication, and enough GPIO to scan 4x4 matrix keypads and drive character LCDs. The 32 KB Flash supports multi-page menu firmware with localization strings. The 44-LQFP package exposes sufficient I/O for tactile switches and rotary inputs. Designers leverage BDM for in-circuit firmware updates during development and the COP watchdog for unattended kiosk uptime.

🔋

Battery-Powered Monitoring Devices

Battery-powered monitoring devices (remote sensors, handheld meters, low-power data loggers) leverage the MC9S08AW32MFGE's multiple low-power Stop and Wait modes plus its wide 2.7V to 5.5V supply that accepts 3V coin cells, two AA cells, or 5V regulated rails. The internal voltage regulator, RTC, and LVD allow graceful power-fail behavior. With 32 KB Flash and 2 KB RAM, designers fit data logging schemes and command interpreters on-chip. The 44-LQFP package provides test-bench-friendly pin access during prototyping before migrating to a smaller package for production.

What is the program memory size of MC9S08AW32MFGE?
The MC9S08AW32MFGE has 32 KB of on-chip Flash program memory and 2 KB of on-chip RAM. According to NXP's S08AW product family page, the Flash is organized as 32K x 8 bytes with EEPROM emulation support, which is suitable for parameter storage in embedded designs.
What core does MC9S08AW32MFGE use and what is its clock speed?
The MC9S08AW32MFGE uses the enhanced HCS08 (S08) 8-bit core with a maximum CPU bus frequency of 40 MHz. The S08 core executes most instructions in 1-2 bus cycles and integrates an internal clock source, reducing external component count.
What is the difference between MC9S08AW32MFGE and MC9S08AW60CFGE?
The MC9S08AW32MFGE has 32 KB Flash and 2 KB RAM, while the MC9S08AW60CFGE has 60 KB Flash and 2-4 KB RAM. Both use the same HCS08 core at 40 MHz and are pin-compatible in the 44-LQFP package, making the AW60CFGE a drop-in upgrade when more Flash is required.
Where can I buy the MC9S08AW32MFGE online?
The MC9S08AW32MFGE is currently listed as NRND (Not Recommended for New Designs) on NXP's site. Stock remains available through authorized distributors including DigiKey, Mouser, and Octopart-listed suppliers, with unit pricing as of 2026-10-19 starting near $4.92 for qty 1.
What is the lead time for MC9S08AW32MFGE?
Lead time for the MC9S08AW32MFGE varies by distributor. As of 2026-10-19, NXP has marked the part NRND, so lead times can extend to 12-26 weeks for large orders, with limited same-day stock at major distributors. Contact NXP or authorized distributors for current availability.
What is the price of MC9S08AW32MFGE in 1-piece quantity?
The MC9S08AW32MFGE unit price as of 2026-10-19 is approximately $4.92 for qty 1, $4.43 at qty 10, $3.94 at qty 100, $3.55 at qty 500, and $3.15 at qty 1000, based on distributor pricing data. Prices fluctuate with market demand given the NRND status.
Is MC9S08AW32MFGE in stock at major distributors?
Stock for the MC9S08AW32MFGE is limited because NXP has classified the part NRND. As of 2026-10-19, some distributors (DigiKey, Mouser) may show small inventory while others list it as quote-only or backorder. For new designs, NXP recommends migrating to an active S08AW variant or successor MCU.
MC9S08AW32MFGE vs MC9S08AC32CFGE - which is better for industrial control?
The MC9S08AW32MFGE and MC9S08AC32CFGE share 32 KB Flash and 44-LQFP footprint. The AC32 belongs to the AC family with a different peripheral mix (more analog, fewer timers) versus the AW family's general-purpose balance. For industrial control with TPM timers and serial comms, the AW32 is the more flexible general-purpose choice.
When should I choose MC9S08AW32MFGE over the MC9S08AW60CFGE?
Choose the MC9S08AW32MFGE when your application fits in 32 KB Flash and 2 KB RAM, which keeps bill-of-materials cost lower and yields more headroom for low-volume production. Choose the AW60CFGE when your firmware exceeds 32 KB or you need the larger EEPROM emulation footprint for parameter storage.
What is the best drop-in replacement for MC9S08AW32MFGE?
The best drop-in replacement for the MC9S08AW32MFGE in the same 44-LQFP package is the MC9S08AW60CFGE (60 KB Flash) from the same S08AW family. For active-production alternatives, NXP recommends migrating to an active S08AW32 family member such as the S9S08AW32E5VFGE in the same 44-LQFP, with equivalent peripherals.
Can MC9S08AW60CFGER replace MC9S08AW32MFGE without PCB changes?
Yes, the MC9S08AW60CFGER is a drop-in replacement for the MC9S08AW32MFGE in the same 44-LQFP (10x10 mm) package. Both share the HCS08 core, peripheral set, and pinout. Firmware compiled for the AW32 will run on the AW60 with unused Flash remaining unused, enabling easy field upgrades.
Where can I download the MC9S08AW32MFGE datasheet PDF?
The MC9S08AW32MFGE datasheet is hosted on NXP's official product page at nxp.com/docs/en/data-sheet/MC9S08AW60.pdf. The same document covers the S08AW60, AW48, AW32, and AW16 family variants. The pinout and package information is in section 1 of the datasheet, with electrical specs in sections 8-10.
What is the pinout of MC9S08AW32MFGE in 44-LQFP?
The MC9S08AW32MFGE pinout in the 44-LQFP package (10x10 mm) is documented in section 1.3 of the official data sheet. The pin 1 marker is at the top-left of the LQFP package with the dot indicator, and pins are numbered counter-clockwise. Refer to the datasheet signal table for the exact pin function assignment per pin number.
What peripherals are integrated in MC9S08AW32MFGE?
The MC9S08AW32MFGE integrates a 10-bit ADC, multiple timers (TPM 16-bit, MTIM 8-bit, RTC), serial communications (SCI UART, SPI, I2C), GPIO, a watchdog COP with independent clock source, low-voltage detect (LVD), and on-chip voltage regulator. Peripherals are mapped to memory for register-level control via the S08 core.
What is the best NXP equivalent for MC9S08AW32MFGE?
The best NXP equivalent for the MC9S08AW32MFGE in the same 44-LQFP package is the MC9S08AW60CFGE (60 KB Flash) for additional memory, or the S9S08AW32E5VFGE (active S08AW32 successor). Both maintain the same S08 core, peripheral mix, and pinout, enabling a direct firmware-compatible drop-in replacement.

Technische Referenzdaten für MC9S08AW32MFGE – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MC9S08AW32MFGE when you need a low-cost 8-bit MCU with 32 KB Flash and a balanced peripheral set (TPM timers, ADC, SCI/SPI/I2C) in the 44-LQFP (10x10) package. It is ideal for industrial control panels, automotive body electronics, and consumer white goods where the 32 KB fits the firmware and BOM cost is critical. If your firmware exceeds 32 KB, switch to the MC9S08AW60CFGE (60 KB Flash) in the same package. For active-production designs (the MC9S08AW32MFGE is NRND), NXP recommends the S9S08AW32E5VFGE successor with the same footprint and peripheral mix. All listed alternatives share the same 44-LQFP (10x10) footprint and are pin-compatible for drop-in PCB reuse.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S08AW60CFGE MC9S08AW60CPUE MC9S08AC32CFGER S9S08AW32E5VFGE MC56F8355MFGE
Package 44-LQFP (10x10 mm) 44-LQFP (10x10) - same 44-LQFP - same 44-LQFP - same 44-LQFP - same 44-LQFP - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core HCS08 (8-bit) HCS08 (8-bit) - same HCS08 (8-bit) - same HCS08 (8-bit) - same S08 (8-bit) - same 56800E (16-bit DSC)
Program Memory (Flash) 32 KB 60 KB 60 KB 32 KB - same 32 KB - same 128 KB
RAM 2 KB 2-4 KB 2 KB 2 KB - same 2 KB - same 12 KB
Maximum CPU Frequency 40 MHz 40 MHz - same 40 MHz - same 40 MHz - same 40 MHz - same 60 MHz
Operating Voltage 2.7 V to 5.5 V 2.7 V to 5.5 V - same 2.7 V to 5.5 V - same 2.7 V to 5.5 V - same 2.7 V to 5.5 V - same 3.0 V to 3.6 V
Lifecycle Status NRND NRND NRND NRND Active Active

Wichtigste Unterscheidungsmerkmale

  • 32 KB Flash + 2 KB RAM balance with full 40 MHz S08 core (vs. MC9S08AW60CFGE)
  • 44-LQFP package matches most S08AW family footprint (vs. MC9S08AW16MFGE)
  • General-purpose AW family peripheral mix vs AC analog-heavy family (vs. MC9S08AC32CFGER)

Designhinweise

The MC9S08AW32MFGE integrates an on-chip voltage regulator, but the MCU still requires a stable VDD supply between 2.7V and 5.5V. Decouple VDD with a 100 nF ceramic capacitor placed within 5 mm of the VDD pin, plus a bulk 4.7-10 uF tantalum or ceramic capacitor near the supply. For noise-sensitive analog ADC applications, the VREFH/VREFL pins should be bypassed with 100 nF capacitors. Power-rail sequencing is generally not required because the on-chip LVD handles brown-out reset.

Place the BDM (Background Debug Mode) header near the BKGD/MS pin on the PCB edge for in-circuit firmware programming and debugging. Keep the RESET line short with a 10 kohm pull-up to VDD and a 100 nF capacitor to ground for noise debouncing. Route the internal oscillator traces away from switching power nodes to avoid injection of noise into the clock network.

Do not exceed the absolute maximum ratings of 5.8V on any VDD pin, and respect the -0.3V to +5.8V input voltage range on GPIO. Always enable the watchdog COP timer in production firmware to recover from software lockups. When migrating firmware from a smaller S08 family member, verify vector remap and Flash partition layout - the AW32 has a different default memory map than AW16/60.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

RoHS compliant per NXP product page. AEC-Q100 not formally qualified for this MPN; for AEC-Q100 contexts verify the specific part marking.

Daten verifiziert am: 2026-10-19 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

NXP Semiconductors MC9S08AW32MFGE MC9S08AW60CFGE MC9S08AC32CFGER S9S08AW32E5VFGE MC56F8355MFGE HCS08 S08 core 8-bit microcontroller embedded MCU 44-LQFP LQFP-44 LQFP package Flash memory RAM TPM timer ADC SCI SPI I2C Background Debug Mode BDM watchdog COP AEC-Q100 RoHS industrial control automotive body electronics
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