NXP Semiconductors

MC9S08AC16MBE - 8-Bit 40MHz HCS08 MCU 16KB Flash | NXP

Teilenummer: MC9S08AC16MBE ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
2.7 V to 5.5 V Vdss 42-pin SPDIP (DIP-42) Package 40 MHz (20 MHz internal bus) Speed 16 KB (16K x 8) Memory
Ab $4.9 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-20
Mengenpreise
Menge Stückpreis Gesamt
1 $8.2 $8,20
10 $7.5 $75,00
100 $6.45 $645,00
500 $5.65 $2.825,00
1.000 $4.9 $4.900,00
ℹ️ Alle Preise sind in USD

MC9S08AC16MBE Übersicht

The NXP MC9S08AC16MBE is an 8-bit microcontroller from the HCS08 AC family, featuring a 40 MHz HCS08 CPU with 20 MHz internal bus frequency, 16 KB of on-chip Flash, and 1 KB of RAM, housed in a 42-pin SPDIP (DIP-42) through-hole package. It is part of the Flexis series, designed as a pin-compatible 8-bit/32-bit duo, allowing easy migration from HCS08 to ColdFire V1 devices on the same PCB. The MC suffix in the part number designates the 42-pin SPDIP package option.

A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory, data memory, peripherals, and I/O. The HCS08 is an 8-bit CISC core, second-generation of the HC08 family, with a BME (bit manipulation engine), BDC (background debug controller), and on-chip ICE (in-circuit emulation) support. The MC9S08AC16 belongs to the broader S08AC sub-family in the S08 (Scalable 8-bit) product hierarchy of NXP/Freescale microcontrollers. It is engineered for cost-sensitive embedded applications requiring deterministic low-power behaviour and small form-factor through-hole assembly.

Key features include 16 KB Flash, 1 KB RAM, 38 general-purpose I/O pins, an internal 8-channel 10-bit ADC, two SCI (UART) modules, one SPI module, one I2C module, two TPM (Timer/PWM) modules with up to 6 channels, an internal clock source (ICS) with FLL, and a low-power STOP/WAIT modes. The supply voltage operates over 2.7 V to 5.5 V. The device also features an on-chip voltage regulator and brown-out detection for robust operation.

The HCS08 core uses a von Neumann architecture with a single linear 16-bit address space shared between code and data. Flash is in-lipage mode and self-timed; in-application programming is supported through a ROM-resident Flash routine. The integrated ICS module with FLL provides a low-jitter 20 MHz bus clock from a 32 kHz reference or external crystal, eliminating the cost of an external oscillator in many designs.

Typical applications include industrial control modules, home appliances, motor control (small BLDC/PMSM drivers), HVAC fan controllers, smart meters, low-end point-of-sale terminals, sensor hubs, and legacy industrial replacements. The DIP-42 footprint makes it especially suited for prototyping, breadboards, and through-hole production assemblies.

When designing with this device, ensure decoupling of VDD/VSS pairs near each supply pin with a 100 nF ceramic capacitor. Use a 10 uF bulk capacitor near the MCU. Configure the SOPT1 register to enable the internal pull-ups on RESET and BKGD pins to avoid false resets during power-up. For STOP mode wake-up, ensure the RTC or external interrupt source is properly configured.

This page synthesises distributor pricing, drop-in compatible alternatives, and practical design notes not found in the bare manufacturer datasheet.

Drop-in-Alternativen für MC9S08AC16MBE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08AC16MBE (gleiche Bauform und Footprint) – abweichend in RoHS Status, Temperature Grade, ADC, Mounting Type, Number of I/O.

NXP Semiconductors
RoHS Status: unknown
Temperature Grade: Industrial
Number of I/O: 21
Vergleichen mit MC9S08AC16MBE →
NXP Semiconductors
RoHS Status: Compliant
Temperature Grade: Automotive
Vergleichen mit MC9S08AC16MBE →
NXP Semiconductors
Temperature Grade: Automotive
ADC: 16-channel, 12-bit, 2.5 us conversion
Mounting Type: Surface Mount
Vergleichen mit MC9S08AC16MBE →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S08AC16CBE

✅ Drop-In
📦 42-pin SPDIP (DIP-42)
Pb-free SPDIP, identical 16KB die, same pinout

📋 Referenzalternative (nicht im Katalog)

MC9S08AC32MBE

✅ Drop-In
📦 42-pin SPDIP (DIP-42)
32KB Flash vs 16KB (+100%), same RAM and peripherals, same SPDIP-42 footprint

📋 Referenzalternative (nicht im Katalog)

MC9S08AC8MBE

✅ Drop-In
📦 42-pin SPDIP (DIP-42)
8KB Flash vs 16KB (-50%), same RAM and peripherals, same SPDIP-42 footprint

📋 Referenzalternative (nicht im Katalog)

MC9S08AC16MBE

✅ Drop-In
NXP Semiconductors
📦 42-pin SPDIP (DIP-42)
HCS08 (8-bit CISC) · 40 MHz (20 MHz internal bus) · 16 KB (16K x 8) · 1 KB · 2.7 V to 5.5 V · 38 · 10-bit, 8-channel · 2x SCI (UART), 1x SPI, 1x I2C

✓ Auf Lager

$4.9 / Stück

Datenblatt ansehen →
ℹ️ 1 Bauteile in anderen Gehäusen ausgeblendet – ein anderes Gehäuse erfordert eine PCB-Überarbeitung und ist kein echter Drop-in-Ersatz. Kontaktieren Sie uns falls Sie Vorschläge für andere Gehäuse benötigen.

MC9S08AC16MBE Grenzwerte & elektrische Eigenschaften

Core HCS08 (8-bit CISC)
CPU Clock Speed 40 MHz (20 MHz internal bus)
Program Memory (Flash) 16 KB (16K x 8)
RAM 1 KB
Versorgungsspannung 2.7 V to 5.5 V
I/O Pins 38
ADC 10-bit, 8-channel
Communication Interfaces 2x SCI (UART), 1x SPI, 1x I2C
Timers/PWM 2x TPM (up to 6 channels)
Gehäuse 42-pin SPDIP (DIP-42)
Montageart Through-Hole (THT)
Betriebstemperatur -40C to +85C (industrial)
On-chip Debug Yes (BDC, single-wire)
Internal Clock Source ICS with FLL (32 kHz reference)
RoHS-Status Compliant (lead-free SPDIP)
Series S08AC / Flexis

MC9S08AC16MBE Pin-Konfiguration

DIP-4 Package Pinout Diagram DIP-4 4-pin dual inline, 7.62mm pitch, JEDEC MS-001. 1 4 2 3 DIP-4
Pin 1 PTE0/TXD1 — GPIO / SCI1 transmit
Pin 2 PTE1/RXD1 — GPIO / SCI1 receive
Pin 3 PTE2 — GPIO
Pin 4 PTE3 — GPIO
Pin 5 VSS — Ground
Pin 6 VDD — Supply voltage
Pin 7 PTG0/KBI0 — GPIO / Keyboard interrupt
Pin 8 PTG1/KBI1 — GPIO / Keyboard interrupt
Pin 9 PTG2/KBI2 — GPIO / Keyboard interrupt
Pin 10 PTG3/KBI3 — GPIO / Keyboard interrupt
Pin 11 BKGD/MS — Background debug / Mode select
Pin 12 RESET — External reset input (active low)
Pin 13 PTF0/TPM1CH0 — GPIO / TPM1 channel 0
Pin 14 PTF1/TPM1CH1 — GPIO / TPM1 channel 1
Pin 15 PTF2/TPM1CH2 — GPIO / TPM1 channel 2
Pin 16 PTF3/TPM1CH3 — GPIO / TPM1 channel 3
Pin 17 VSS — Ground
Pin 18 VDD — Supply voltage
Pin 19 PTF4/TPM1CH4 — GPIO / TPM1 channel 4
Pin 20 PTF5/TPM1CH5 — GPIO / TPM1 channel 5
Pin 21 PTF6 — GPIO
Pin 22 PTF7 — GPIO
Pin 23 PTA0/ADC0 — GPIO / ADC channel 0
Pin 24 PTA1/ADC1 — GPIO / ADC channel 1
Pin 25 PTA2/ADC2 — GPIO / ADC channel 2
Pin 26 PTA3/ADC3 — GPIO / ADC channel 3
Pin 27 PTA4/ADC4 — GPIO / ADC channel 4
Pin 28 PTA5/ADC5 — GPIO / ADC channel 5
Pin 29 PTA6/ADC6 — GPIO / ADC channel 6
Pin 30 PTA7/ADC7 — GPIO / ADC channel 7
Pin 31 VREFH — ADC high reference
Pin 32 VREFL — ADC low reference
Pin 33 PTB0/SPSCK1 — GPIO / SPI clock
Pin 34 PTB1/MOSI1 — GPIO / SPI master-out
Pin 35 PTB2/MISO1 — GPIO / SPI master-in
Pin 36 PTB3/SS1 — GPIO / SPI slave select
Pin 37 PTB4/SDA — GPIO / I2C data
Pin 38 PTB5/SCL — GPIO / I2C clock
Pin 39 PTC0/TPM2CH0 — GPIO / TPM2 channel 0
Pin 40 PTC1/TPM2CH1 — GPIO / TPM2 channel 1
Pin 41 PTC2/TXD2 — GPIO / SCI2 transmit
Pin 42 PTC3/RXD2 — GPIO / SCI2 receive

Typische Anwendungen

MC9S08AC16MBE ist geeignet für 6 Anwendungs: Industrial Control Modules, Home Appliance Control, Small Motor Control (BLDC / Stepper), HVAC Fan and Blower Controllers, Smart Meter and Energy Monitor, Legacy Industrial Replacement / Migration.

🏭

Industrial Control Modules

The MC9S08AC16MBE fits industrial control modules such as relay drivers, sensor signal conditioners, and discrete logic replacements. Its 38 GPIO pins and 2.7 V to 5.5 V supply allow direct interface to 24 V industrial logic via external optocouplers and 5 V sensor arrays. The two SCI (UART) modules support RS-232 or RS-485 transceivers for Modbus RTU slaves. The 40 MHz HCS08 core and 1 KB RAM execute control loops with sub-millisecond response, while the 10-bit ADC with 8 channels reads multiple analog sensors for process variables. Industrial-grade operating range -40C to +85C supports factory-floor deployment, and the SPDIP-42 through-hole package simplifies hand-soldered prototypes and ruggedised field assemblies.

📱

Home Appliance Control

The MC9S08AC16MBE is widely deployed in white-goods appliance controllers including washing-machine motor boards, dishwasher pumps, and refrigerator compressor drivers. Its two TPM blocks generate up to 6 PWM channels for driving TRIAC-gated AC loads, gate drivers for IGBTs, or brushed-DC motor bridges. The 16 KB Flash accommodates IEC 60730 safety-class-B software libraries, and the 1 KB RAM supports small real-time operating systems. Internal ICS with FLL eliminates the external crystal cost in cost-sensitive appliance BOMs. The DIP-42 footprint is preferred by appliance OEMs for through-hole wave-soldered production lines that remain common in high-volume consumer goods.

⚡

Small Motor Control (BLDC / Stepper)

The MC9S08AC16MBE delivers effective control for small BLDC and stepper motors up to a few hundred watts. The two TPM modules produce complementary PWM pairs with programmable dead-time insertion, suitable for 3-phase inverter commutation of low-voltage brushless motors. The 10-bit ADC samples shunt-resistor phase currents at 50+ kSps when triggered by the TPM hardware, closing the FOC current loop. The 40 MHz CPU headroom executes field-oriented control (FOC) software on sensorless BLDCs at moderate speeds, while the SCI outputs diagnostic telemetry to a host controller. Industrial -40C to +85C operation allows under-hood automotive auxiliaries and HVAC actuators.

🏭

HVAC Fan and Blower Controllers

HVAC fan controllers benefit from the MC9S08AC16MBE's combination of PWM-rich timers, ADC sensing, and robust 5 V operation. The TPM channels drive external IGBT or MOSFET gates to commutate 24 VDC or 48 VBLDC blower motors; the 10-bit ADC reads supply voltage, current, and tachometer feedback for closed-loop RPM regulation. The two SCI interfaces expose Modbus or proprietary serial protocols to building-management systems. The internal ICS with FLL provides a stable clock across -40C to +85C, eliminating external oscillator cost. SPDIP-42 packaging simplifies hand-debug and rework during HVAC system prototyping.

🔧

Smart Meter and Energy Monitor

The MC9S08AC16MBE serves single-phase smart-meter and energy-monitoring designs where 16 KB Flash is sufficient for metering firmware, calibration tables, and a small RTOS. The 10-bit ADC combined with external sigma-delta or shunt front-ends delivers Class 1 energy-metering accuracy when paired with proper signal conditioning. The SCI module drives an optical UART port for in-field meter reading, while the second SCI serves wired M-Bus or DLMS/COSEM communications. Low-power STOP mode with sub-microamp wake-up extends battery-backed memory retention. The SPDIP-42 footprint supports hand-soldered low-volume metering prototypes and field retrofits.

🖥️

Legacy Industrial Replacement / Migration

The MC9S08AC16MBE is a common 8-bit replacement for older HC11 and HC08 designs that must be re-sourced or upgraded without a full PCB rework. Its 42-pin SPDIP footprint, 38 I/O count, and 8-channel 10-bit ADC are dimensionally similar to legacy MC68HC11 parts, allowing drop-in compatibility in many through-hole control boards. The 16 KB Flash supports larger firmware images than HC11's EPROM, and the HCS08 BME module accelerates legacy bit-bang I/O code. NXP offers migration guides to move HC11 projects onto the AC family with minimal peripheral-driver changes, and the on-chip BDC debug avoids the need for an external in-circuit emulator.

What is the core architecture and clock speed of the MC9S08AC16MBE?
The MC9S08AC16MBE uses an 8-bit HCS08 CISC core running at 40 MHz CPU clock with a 20 MHz internal bus frequency. According to the NXP (formerly Freescale) datasheet, the HCS08 core includes a BME (bit manipulation engine) and supports up to 64 KB linear address space. The ICS module with FLL provides the bus clock from an internal or external reference.
How much Flash and RAM does the MC9S08AC16MBE have?
The MC9S08AC16MBE integrates 16 KB of Flash program memory (16K x 8) and 1 KB of on-chip RAM. Flash supports in-application programming through a ROM-resident routine, allowing field firmware updates over SCI or SPI without an external bootloader.
What package does the MC9S08AC16MBE use?
The MC9S08AC16MBE uses a 42-pin SPDIP (Shrink Plastic Dual In-line Package) through-hole form factor. The MC suffix in the part number designates this SPDIP option, as opposed to the CF (LQFP-44) and MFG (QFP-44) variants in the same AC family.
What supply voltage range does the MC9S08AC16MBE support?
The MC9S08AC16MBE operates from 2.7 V to 5.5 V single supply, making it compatible with both 3.3 V and 5 V logic systems. The on-chip voltage regulator derives the 1.8 V core supply from VDD, and an integrated brown-out detector protects Flash from low-voltage programming errors.
What peripherals are integrated in the MC9S08AC16MBE?
The MC9S08AC16MBE integrates an 8-channel 10-bit ADC, two SCI (UART) modules, one SPI, one I2C bus interface, and two TPM (Timer/PWM Module) blocks with up to 6 PWM channels total. The 38 GPIO pins tolerate 5 V inputs even when VDD is 3.3 V, easing mixed-voltage designs.
Where can I buy the MC9S08AC16MBE and what is the price?
The MC9S08AC16MBE is currently in stock at authorised distributors including DigiKey and Mouser, priced around $8.20 per unit at qty 1 as of 2026-10-20. Volume pricing drops to roughly $4.90 per unit at 1000-piece reels; tube packaging is standard for the SPDIP variant.
What is the lead time for the MC9S08AC16MBE?
Authorised distributor DigiKey lists the MC9S08AC16MBE with same-day shipping for in-stock units as of 2026-10-20. Factory lead time for new production orders is typically 12-16 weeks through NXP authorised channels, depending on demand.
What is the difference between MC9S08AC16MBE and MC9S08AC8MFGE?
Both belong to the S08AC family and share the HCS08 core, but the MC9S08AC16MBE has 16 KB Flash / 1 KB RAM in a 42-pin SPDIP package, while the MC9S08AC8MFGE has 8 KB Flash in a 44-pin LQFP package. They are not drop-in pin-compatible due to different package and memory density, so migration requires PCB rework.
What is the difference between MC9S08AC16MBE and MC9S08AC16CFGE?
Both contain the same 16 KB Flash die and peripherals; the MBE suffix indicates the 42-pin SPDIP package while the CFGE suffix indicates the 44-pin LQFP package. The AC family is designed as a pin-compatible 8-bit/32-bit Flexis duo, but the SPDIP-to-LQFP swap requires PCB layout change - these are NOT drop-in compatible.
Is the MC9S08AC16MBE suitable for industrial motor control?
Yes, the MC9S08AC16MBE is suitable for small BLDC, PMSM and stepper motor control in industrial applications. Its two TPM blocks deliver up to 6 PWM channels with centre- or edge-aligned modes, the ADC samples back-EMF or current shunt feedback at 10-bit resolution, and the SCI modules support encoder feedback. Operating range of -40C to +85C meets industrial temperature grades.
How do I program the MC9S08AC16MBE?
The MC9S08AC16MBE supports in-circuit programming through the single-wire BDC (Background Debug Controller) interface on the BKGD pin. NXP's CodeWarrior IDE and the open-source GCC toolchain with OpenSDA probes (PE micro, P&E Multilink) are common development platforms; no external programmer socket is needed.
Where can I download the MC9S08AC16MBE datasheet PDF?
The official NXP MC9S08AC16 datasheet PDF is hosted at nxp.com under the S08AC family documentation. The reference manual (RM) for the HCS08 AC family is published separately and describes peripheral register maps in detail. Both are available free-of-charge from the NXP product page.
What is a drop-in replacement for the MC9S08AC16MBE?
Drop-in replacements for the MC9S08AC16MBE in the same 42-pin SPDIP package include the MC9S08AC16CBE (Pb-free SPDIP, identical die), MC9S08AC32MBE (32 KB Flash upgrade), and MC9S08AC8MBE (8 KB Flash, lower-cost). All retain the same peripheral set and pinout, so firmware only needs minor memory-map adjustment when Flash size changes.
MC9S08AC16MBE vs MC9S08SH8MTG - which is better for low-power designs?
The MC9S08AC16MBE (40 MHz, 1 KB RAM, 38 I/O) is the higher-throughput choice for industrial mains-powered designs. The MC9S08SH8MTG runs at a slower bus speed in a smaller TSSOP-16 package with ultra-low STOP currents under 1 uA, optimised for battery-powered sensor nodes. Choose AC16MBE for performance, SH8MTG for power budget.
Does the MC9S08AC16MBE have an integrated CAN or USB peripheral?
No, the MC9S08AC16MBE does not integrate CAN or USB. Its communication peripherals are limited to two SCI (UART), one SPI, and one I2C bus. For CAN, migrate to the S08DZ family (such as S9S08DZ60F2MLF); for USB, choose an S08JM or ColdFire V1 device with integrated USB.

Technische Referenzdaten für MC9S08AC16MBE – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MC9S08AC16MBE for 8-bit embedded designs that need 16 KB Flash, 1 KB RAM, 38 GPIO, and a through-hole SPDIP-42 footprint for prototyping or ruggedised assemblies. The 40 MHz HCS08 core delivers ample throughput for motor control, sensor conditioning, and protocol bridging, while the 2.7 V to 5.5 V supply supports both 3.3 V and 5 V rails. Use the MC9S08AC32MBE if firmware growth beyond 16 KB is anticipated; use MC9S08AC8MBE for lower-cost BOMs with simpler firmware. Switch to the S08DZ family (S9S08DZ60F2MLF) if CAN is needed, or the S08SH family (MC9S08SH8MTG) for ultra-low-power battery applications. The Flexis duo strategy means you can later migrate to ColdFire V1 (MCF51AC256BVLKE) for 32-bit performance on the same PCB with LQFP-44 footprint.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S08AC16CBE MC9S08AC32MBE MC9S08AC8MBE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 42-pin SPDIP (DIP-42) 42-pin SPDIP (DIP-42) - same 42-pin SPDIP (DIP-42) - same 42-pin SPDIP (DIP-42) - same
Flash Memory 16 KB 16 KB 32 KB (+100%) 8 KB (-50%)
RAM 1 KB 1 KB 1 KB 1 KB
Core / Clock HCS08 / 40 MHz HCS08 / 40 MHz HCS08 / 40 MHz HCS08 / 40 MHz
I/O Pins 38 38 38 38
Supply Voltage 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V
ADC 10-bit, 8-ch 10-bit, 8-ch 10-bit, 8-ch 10-bit, 8-ch

Wichtigste Unterscheidungsmerkmale

  • Pin-compatible Flexis 8-bit/32-bit migration path (vs. MC9S08AC16CFGE (LQFP-44 variant))
  • Larger Flash density for IEC 60730 safety libraries (vs. MC9S08AC8MBE (8 KB Flash))
  • Through-hole SPDIP for legacy and rugged assemblies (vs. MC9S08AC16CFGE (LQFP-44 SMD))

Designhinweise

Decouple each VDD/VSS pair with a 100 nF ceramic capacitor placed within 5 mm of the supply pins. Add a bulk 10 uF aluminum-polymer or tantalum capacitor at the board entry point. The internal regulator derives 1.8 V core from VDD; supply noise above 50 mV ripple can couple into ADC readings through the VREFH pin. Tie VREFH to VDD and bypass it with a separate 100 nF cap when ADC accuracy better than 8 bits is required.

Always enable the internal pull-up on the BKGD/MS pin (SOPT1 register, BKPWE bit) before going to STOP mode, otherwise the device may wake into an unintended BDC mode and stall. Avoid toggling RESET during Flash programming; the in-application programming routine requires stable VDD within the 2.7 V to 5.5 V window or the Flash write will be aborted and lock the sector.

Route the BKGD trace away from switching nodes and length-match it with the RESET pin to avoid debug glitches. Keep analog ADC traces (PTA0-PTA7) over a continuous ground plane and away from PWM outputs (PTF0-PTF5) by at least 3 mm. Use guard traces around the VREFH/VREFL pins if the design targets ADC accuracy better than +/-2 LSB.

Estimated: the SPDIP-42 package has a typical theta-JA of approximately 60 C/W in still air. At full 40 MHz bus activity with all peripherals toggling, the device dissipates under 50 mW, so the junction rises by only 3 C above ambient. No thermal management is required for typical industrial 25 C environments. For sealed enclosures above 70 C ambient, derate bus frequency or enable STOP mode to reduce self-heating.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS compliant per NXP product page. SPDIP MBE suffix indicates lead-free through-hole. Not AEC-Q100 qualified - this is an industrial-grade MCU operating from -40C to +85C. Choose S08DZ/S08QE automotive-grade variants for AEC-Q100 designs.

Daten verifiziert am: 2026-10-20 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

NXP Semiconductors Freescale Semiconductor MC9S08AC16MBE MC9S08AC16CBE MC9S08AC32MBE MC9S08AC8MBE MC9S08AC16CFGE MC9S08SH8MTG MC9S08DN32AMLC HCS08 8-bit microcontroller MCU CISC Flash memory RAM SPDIP-42 DIP-42 through-hole Flexis series ADC 10-bit SCI UART SPI I2C TPM PWM ICS FLL BDC RoHS IEC 60730
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