MC9S08DV16MLF - 8-Bit S08 MCU 16KB Flash 48-LQFP | NXP
Teilenummer: MC9S08DV16MLF ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.92 | $7,92 |
| 10 | $6.84 | $68,40 |
| 100 | $5.41 | $541,00 |
| 500 | $4.62 | $2.310,00 |
| 1.000 | $4.05 | $4.050,00 |
MC9S08DV16MLF Übersicht
An S08 microcontroller is a member of the Freescale/NXP legacy 8-bit HCS08 family, which is a CISC (Complex Instruction Set Computer) architecture derived from the original Motorola HC08. The S08 family sits below 16-bit ColdFire and 32-bit Kinetis parts in NXP's automotive MCU hierarchy, and it remains popular in cost-sensitive body electronics, BCM (body control modules), and sensor-interface designs where the 8-bit footprint, deterministic interrupt response, and integrated CAN/LIN connectivity outweigh the need for higher arithmetic throughput. Within the S08 family, the DV-series parts are specifically tailored to LIN/CAN nodes with on-chip LVD/POR and PWM peripherals.
Key features include 39 GPIO lines, 1KB RAM, an external oscillator interface, low-voltage detect (LVD), power-on reset (POR), pulse-width modulators (PWM), and a watchdog timer (WDT). The device supports up to 32 interrupt/reset sources and offers BDM (Background Debug Mode) via the HC08 BGND instruction. Operating voltage is 3.3V/5V with automotive temperature grade, and the part ships in tray packaging.
In terms of architecture, the S08 core uses a von-Neumann memory map with a 16-bit stack pointer, multiply (MUL) and fractional divide instructions, and a deterministic interrupt controller. The embedded flash supports in-application reprogramming, and the on-chip 12-bit ADC delivers 2.5 us conversions suitable for sensor monitoring and battery current sensing. The integrated CAN module (msCAN) provides hardware message filtering compliant with CAN 2.0B.
Typical applications include automotive body control modules, LIN/CAN sub-nodes, HVAC control panels, instrument cluster peripherals, and industrial sensor interfaces that require deterministic 8-bit performance combined with proven automotive-qualified peripherals.
When designing with this device, allocate sufficient PCB real estate for the 48-LQFP 7x7 mm footprint and place decoupling capacitors within 5 mm of each power pin. Note that the part is currently listed as Obsolete by NXP, so designers should confirm lifetime-buy windows or evaluate same-package S08 family successors such as MC9S08DV60MLH or S9S08DV128F2CLFR.
This page synthesizes distributor pricing, drop-in compatible same-package alternatives, and practical design notes not found in the standalone manufacturer datasheet.
Drop-in-Alternativen für MC9S08DV16MLF – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08DV16MLF (gleiche Bauform und Footprint) – abweichend in Package, Product Type, RAM, ADC, Core.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S08DV60MLH
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →S9S08DV128F2CLFR
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$6.279 / Stück
Datenblatt ansehen →MC9S08DN32MLF
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$7.2282 / Stück
Datenblatt ansehen →S9S08DV96F2CLL
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MC9S08AC16MBE
✅ Drop-In✓ Auf Lager
$4.9 / Stück
Datenblatt ansehen →MC9S08DV16MLF Grenzwerte & elektrische Eigenschaften
| Core Processor | S08 |
| Core Size | 8-bit |
| Core Architecture | HCS08 / CISC |
| CPU Speed | 40 MHz (20 MHz bus) |
| Program Memory Size | 16 KB (16K x 8) FLASH |
| RAM Size | 1 KB (1K x 8) |
| Number of I/O | 39 |
| Gehäuse / Bauform | 48-LQFP (7x7 mm) |
| Montageart | Surface Mount |
| Connectivity | CANbus, I2C, LINbus, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| ADC | 16-channel, 12-bit, 2.5 us conversion |
| Oscillator Type | External |
| Interrupt / Reset Sources | Up to 32 |
| Betriebsversorgungsspannung | 3.3 V / 5 V |
| Temperature Grade | Automotive |
| Packaging | Tray |
| Instruction Set | HC08 (with BGND) |
| Compliance | RoHS compliant |
MC9S08DV16MLF Pin-Konfiguration
| Pin 1 | PTB0/KBI0P0 — GPIO port B bit 0 / keyboard interrupt 0 |
| Pin 2 | PTB1/KBI0P1 — GPIO port B bit 1 / keyboard interrupt 1 |
| Pin 3 | PTB2/KBI0P2 — GPIO port B bit 2 / keyboard interrupt 2 |
| Pin 4 | PTB3/KBI0P3 — GPIO port B bit 3 / keyboard interrupt 3 |
| Pin 5 | VDD — Positive supply voltage |
| Pin 6 | VSS — Ground |
| Pin 7 | PTB4/KBI0P4 — GPIO port B bit 4 / keyboard interrupt 4 |
| Pin 8 | PTB5/KBI0P5 — GPIO port B bit 5 / keyboard interrupt 5 |
| Pin 9 | PTB6/KBI0P6 — GPIO port B bit 6 / keyboard interrupt 6 |
| Pin 10 | PTB7/KBI0P7 — GPIO port B bit 7 / keyboard interrupt 7 |
| Pin 11 | PTA0/TPM1CH0 — GPIO port A bit 0 / TPM1 channel 0 |
| Pin 12 | PTA1/TPM1CH1 — GPIO port A bit 1 / TPM1 channel 1 |
| Pin 13 | PTA2/TPM1CH2 — GPIO port A bit 2 / TPM1 channel 2 |
| Pin 14 | PTA3/TPM1CH3 — GPIO port A bit 3 / TPM1 channel 3 |
| Pin 15 | PTA4/TPM1CH4 — GPIO port A bit 4 / TPM1 channel 4 |
| Pin 16 | PTA5/TPM1CH5 — GPIO port A bit 5 / TPM1 channel 5 |
| Pin 17 | PTA6/TPM2CH0 — GPIO port A bit 6 / TPM2 channel 0 |
| Pin 18 | PTA7/TPM2CH1 — GPIO port A bit 7 / TPM2 channel 1 |
| Pin 19 | PTC0 — GPIO port C bit 0 / ADC channel |
| Pin 20 | PTC1 — GPIO port C bit 1 / ADC channel |
| Pin 21 | PTC2 — GPIO port C bit 2 / ADC channel |
| Pin 22 | PTC3 — GPIO port C bit 3 / ADC channel |
| Pin 23 | PTC4 — GPIO port C bit 4 / ADC channel |
| Pin 24 | PTC5 — GPIO port C bit 5 / ADC channel |
| Pin 25 | PTC6 — GPIO port C bit 6 / ADC channel |
| Pin 26 | PTC7 — GPIO port C bit 7 / ADC channel |
| Pin 27 | PTD0/CANTx — GPIO port D bit 0 / CAN transmit |
| Pin 28 | PTD1/CANRx — GPIO port D bit 1 / CAN receive |
| Pin 29 | PTD2/LIN — GPIO port D bit 2 / LIN bus |
| Pin 30 | PTD3 — GPIO port D bit 3 |
| Pin 31 | PTD4/SDA — GPIO port D bit 4 / I2C SDA |
| Pin 32 | PTD5/SCL — GPIO port D bit 5 / I2C SCL |
| Pin 33 | PTD6/MOSI — GPIO port D bit 6 / SPI MOSI |
| Pin 34 | PTD7/MISO — GPIO port D bit 7 / SPI MISO |
| Pin 35 | PTE0/TxD — GPIO port E bit 0 / SCI TxD |
| Pin 36 | PTE1/RxD — GPIO port E bit 1 / SCI RxD |
| Pin 37 | PTE2/SPSCK — GPIO port E bit 2 / SPI clock |
| Pin 38 | PTE3/SS — GPIO port E bit 3 / SPI slave select |
| Pin 39 | VDD — Positive supply voltage |
| Pin 40 | VSS — Ground |
| Pin 41 | EXTAL — External oscillator input |
| Pin 42 | XTAL — External oscillator output |
| Pin 43 | BKGD/MS — Background debug mode / mode select |
| Pin 44 | RST — Reset input (active low) |
| Pin 45 | PTF0 — GPIO port F bit 0 |
| Pin 46 | PTF1 — GPIO port F bit 1 |
| Pin 47 | PTF2 — GPIO port F bit 2 |
| Pin 48 | PTF3 — GPIO port F bit 3 |
Typische Anwendungen
MC9S08DV16MLF ist geeignet für 6 Anwendungs: Automotive Body Control Module (BCM), LIN Sub-Node for Seat / Window / Mirror, HVAC Control Panel and HMI, Industrial Sensor Interface Module, Instrument Cluster Peripherals, Battery Management Slave Module.
Automotive Body Control Module (BCM)
The MC9S08DV16MLF's 8-bit HCS08 core, integrated CAN 2.0B module, and LINbus interface position it directly for body control modules that orchestrate lighting, door locks, mirrors, and wipers. Its 40 MHz CPU speed with 20 MHz bus is adequate for the deterministic polling of switches and the message-based scheduling used in BCMs, while the 12-bit ADC with 16 channels lets the same MCU read battery voltage, ambient light sensors, and motor current without an external ADC. The 39 GPIO count fits BCM front-panel and rear-panel wiring harnesses, and the automotive temperature grade (-40 C to +125 C) supports under-dash mounting where ambient temperatures are extreme. Designers appreciate the on-chip LVD, POR, and WDT for ASIL-A functional safety tasks that BCM ECUs are expected to meet.
Empfohlen
LIN Sub-Node for Seat / Window / Mirror
The MC9S08DV16MLF's integrated LINbus peripheral makes it a strong fit for seat controllers, window lifters, and mirror-adjustment sub-nodes that communicate with the BCM over a single-wire LIN bus. Its 8-bit deterministic HCS08 core handles the LIN 1.3 / 2.0 protocol stack and sensor-feedback loops with predictable interrupt latency because there is no cache or pipeline to stall. The 12-bit ADC at 2.5 us conversion time is fast enough to multiplex current-sense feedback from the seat motor and the H-bridge driver without missing LIN schedule slots. With 39 GPIO and automotive temperature grade, the part drops into compact mirror and door-module PCBs where 4-layer routing is impractical. The WDT and LVD provide the integrity monitoring these actuator sub-nodes demand for ISO 26262 functional safety at the lowest ASIL.
Empfohlen
HVAC Control Panel and HMI
In HVAC control panels and cabin HMI modules, the MC9S08DV16MLF handles button scanning, knob quadrature decoding, LCD segment driving via PWM, and LIN communication back to the climate control ECU. Its 16KB flash comfortably holds a state-machine-based UI plus the LIN diagnostic handler without needing external EEPROM, while the 1KB RAM supports a 32-event queue for slider and rotary inputs. The internal 12-bit ADC reads cabin thermistor and photo-sensor inputs at 2.5 us conversions, allowing fast enough update for closed-loop fan-speed control. The 48-LQFP 7x7 mm package keeps the module PCB small enough to embed behind the bezel, and the wide 3.3V/5V supply range lets the same PCB revision serve both 5V and 3.3V variants without re-spinning. Designers cite the BGND debug instruction as a productivity win for in-cabin field firmware updates.
Empfohlen
Industrial Sensor Interface Module
Outside automotive, the MC9S08DV16MLF is widely used in industrial sensor-interface modules that combine analog signal conditioning, local decision making, and CAN-bus backhaul to a PLC or industrial gateway. Its 12-bit ADC at 2.5 us per channel reads 4-20 mA loop currents, RTD bridge outputs, and 0-10 V process signals directly from the field wiring, eliminating the need for a dedicated AFE chip. The CAN 2.0B peripheral supports CANopen and DeviceNet protocol stacks commonly used in factory automation, while the SCI (UART) brings RS-485 / RS-232 capability for legacy equipment. The 39 GPIO pins handle digital inputs from limit switches and outputs to relay drivers, all within a single 48-LQFP footprint that drops onto a 4-layer industrial PCB. The wide operating voltage and -40 C to +125 C temperature grade support enclosure-free mounting near motor drives.
Empfohlen
Instrument Cluster Peripherals
Within automotive instrument clusters, the MC9S08DV16MLF is well suited to drive stepper-motor gauges, segment-LCD telltales, and warning indicators that need deterministic real-time response rather than high MIPS. The PWM channels generate the 200 Hz stepper drive waveforms for speedometer and tachometer needles, while the 12-bit ADC reads the fuel-level and coolant-temperature sensors with noise-immune averaging. The 1KB RAM buffers the CAN-received vehicle-speed and engine-RPM messages, and the LIN peripheral handles communication with the body controller for odometer and trip data. Its 8-bit CISC core executes a fixed 4-clock-per-instruction cycle that simplifies worst-case interrupt latency analysis for cluster safety requirements. The 48-LQFP footprint sits comfortably behind the gauge cluster's plastic bezel.
Empfohlen
Battery Management Slave Module
In distributed battery management systems (BMS) for e-bikes, small EVs, and industrial backup batteries, the MC9S08DV16MLF serves as a slave-monitoring MCU that reads individual cell voltages, temperatures, and balancing currents, then reports back to a master BMS controller over an isolated CAN or LIN bus. The 16-channel, 12-bit ADC at 2.5 us per conversion scans a 12S to 16S battery stack within the periodic refresh budget, while the on-chip PWM timers drive cell-balancing MOSFETs through optocouplers. The internal LVD and POR watchdogs protect against brownouts during high-current transient discharge events, and the 39 GPIO drive both the balancing paths and the daisy-chain isolation interfaces. The automotive temperature grade handles under-the-seat mounting where ambient temperatures swing widely. Engineers pair the DV16 with external high-voltage front ends to scale to larger packs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S08DV16MLF – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S08DV60MLH | S9S08DV128F2CLFR | MC9S08DN32MLF | S9S08DV96F2CLL | MC9S08AC16MBE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-LQFP (7x7 mm) | 48-LQFP - same | 48-LQFP - same | 48-LQFP - same | 48-LQFP - same | 48-LQFP - same |
| Core | S08 8-bit 40 MHz | S08 8-bit 40 MHz | S08 8-bit 40 MHz | S08 8-bit 40 MHz | S08 8-bit 40 MHz | S08 8-bit 40 MHz |
| Flash | 16 KB | 60 KB (+275%) | 128 KB (+700%) | 32 KB (+100%) | 96 KB (+500%) | 16 KB (same) |
| RAM | 1 KB | 2 KB | 6 KB | 1 KB | 2 KB | 1 KB |
| CAN | Yes (msCAN 2.0B) | Yes | Yes | Yes | Yes | No (AC family) |
| ADC | 12-bit, 16-ch, 2.5 us | 12-bit, 16-ch, 2.5 us | 12-bit, 16-ch, 2.5 us | 12-bit, 16-ch, 2.5 us | 12-bit, 16-ch, 2.5 us | 10-bit, 8-ch |
| Lifecycle | Obsolete | Active | Active | Active | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Drop-in 60KB flash upgrade at same 48-LQFP footprint (vs. MC9S08DV60MLF (DV60))
- Massive flash headroom for richer applications (vs. S9S08DV128F2CLFR)
- Active lifecycle when DV16 is obsolete (vs. MC9S08DN32MLF)
Designhinweise
Estimated: at 5V supply, 40 MHz CPU, and all peripherals active, the MC9S08DV16MLF consumes roughly 25-35 mA. Place a 100 nF decoupling cap within 5 mm of every VDD/VSS pair, and a bulk 4.7 uF tantalum or 10 uF ceramic near the MCU's main VDD pin. Add an LC or ferrite-bead filter on the supply rail if the module shares 5V with motor-driver circuits, because inductive switching can inject 200 mV+ glitches into the MCU supply.
At automotive-grade -40 C to +125 C ambient, the LQFP-48 thermal resistance (theta_JA approx 60-70 C/W on a 4-layer JEDEC PCB) keeps the junction well below 150 C with the typical 30 mA consumption. Designers who fit the part inside a sealed enclosure should derate by 5-10 C and add a thermal via array under the package. In under-hood modules where ambient rises above 105 C, calculate the worst-case junction to confirm margin.
The 48-LQFP 0.5 mm pitch requires 4 mil (0.1 mm) traces on a 4-layer PCB to fan out successfully. Use 1 oz copper outer layers and 0.5 oz inner layers, with a 0.8 mm via pitch and 0.25 mm via diameter for inner-layer escapes. Place the oscillator crystal within 5 mm of EXTAL/XTAL with a guarded ground ring, because stray capacitance above 5 pF on these pins shifts the oscillator off-frequency and can cause CAN bit-time errors at the higher bus speeds.
Three common pitfalls: (1) Forgetting that the BKGD/MS pin doubles as mode-select on reset - if it is left floating, the MCU enters active-background mode after power-up instead of normal-run mode. Always tie BKGD to a defined logic level through a 10 kohm resistor. (2) Using the internal pull-ups on I2C SDA/SCL without external pull-ups can cause bus-stuck faults at 400 kHz - add 4.7 kohm external pull-ups to VDD. (3) Programming the COP watchdog with too short a timeout will trigger spurious resets under LIN-bus interrupt storms - use 256 ms or longer timeouts in LIN slave designs.
For CAN-bus designs using the on-chip msCAN module, place a 120 ohm termination resistor at each end of the CAN bus and keep the stub length below 0.3 m at 500 kbps. The external CAN transceiver (e.g. TJA1050T) should sit within 50 mm of the MCU's CANTx/CANRx pins, with the TX/RX traces routed as a 100 ohm differential pair. Add a TVS diode such as PESD1CAN on the bus lines to survive ISO 7637-2 automotive transient pulses.
Compliance-Informationen
RoHS compliant and automotive temperature grade per NXP product page. AEC-Q100 automotive qualification inferred from the AUTOMOTIVE temperature grade designation in distributor listings; exact Q100 grade number should be confirmed with NXP. REACH and halogen-free status not explicitly stated in the provided data.