MC9S08JM32CGT - 8-bit USB MCU, 32KB Flash, 48MHz, QFN-48 | NXP
Teilenummer: MC9S08JM32CGT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.4 | $6,40 |
| 10 | $5.78 | $57,80 |
| 100 | $5.1 | $510,00 |
| 500 | $4.55 | $2.275,00 |
| 1.000 | $4.02 | $4.020,00 |
MC9S08JM32CGT Übersicht
Background: An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data path, an ALU, on-chip program memory (Flash/ROM), data memory (RAM), and a fixed set of peripherals. The HCS08 core is the second-generation HC08 architecture, offering improved instruction efficiency, a background debug module, and up to 48 MHz operation. Within the broader taxonomy, MCUs sit at the lowest level of the computing hierarchy: MCU -> microcontroller -> embedded processor -> semiconductor. The S08JM family specifically adds an integrated USB 2.0 full-speed device controller, eliminating the need for an external PHY and reducing both board area and BOM cost.
Key features include a 48 MHz CPU (24 MHz internal bus), 32 KB Flash, 2 KB RAM, a USB 2.0 full-speed device with on-chip transceiver, SCI (UART), SPI, and IIC interfaces, an 8-channel 12-bit ADC, multiple timers, and an integrated voltage regulator supporting 3.3 V or 5 V operation. The 48-QFN-EP package exposes a thermal pad that must be soldered to the ground plane for thermal dissipation and electrical reference.
Technically, the HCS08 core adds the BGND instruction for non-intrusive background debugging, plus an on-chip ICE debug module with comparators and triggers. The integrated 3.3 V LDO allows single-rail 5 V operation; an external 3.3 V supply can also be used. The USB device includes an internal 1.5 kOhm pull-up that the firmware can enable or disable.
Typical applications include USB-to-UART bridges, HID-class peripherals (mice, keyboards, custom joysticks), industrial USB sensor nodes, point-of-sale terminals, and consumer USB devices. The wide operating voltage and integrated peripherals make it a strong fit when designers want to add USB without external PHY or complex firmware stacks.
When designing with this part, ensure the exposed pad (EP) is soldered to a continuous ground plane for thermal and electrical performance. Use NXP's USB stack templates and verify enumeration with a USB analyzer, since USB compliance failures are common when the D+/D- traces are not 90-ohm differential.
This page synthesizes distributor pricing, drop-in alternatives in the same QFN-48 footprint, and practical design notes for the S08JM USB MCU that go beyond the manufacturer datasheet.
Drop-in-Alternativen für MC9S08JM32CGT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08JM32CGT (gleiche Bauform und Footprint) – abweichend in Package, RoHS Status, Core, RAM, Debug Interface.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S08JM60CGT
✅ Drop-In✓ Auf Lager
$3.94 / Stück
Datenblatt ansehen →MC9S08JM32CLD
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MC9S08JM60CLDR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08AW60CFDE
✅ Drop-In✓ Auf Lager
$7.43 / Stück
Datenblatt ansehen →MC9S08JS16CWJ
✅ Drop-In✓ Auf Lager
$3.85 / Stück
Datenblatt ansehen →MC9S08JM32CGT Grenzwerte & elektrische Eigenschaften
| Core | HCS08 (S08 core, 8-bit) |
| CPU Frequency | 48 MHz |
| Internal Bus Frequency | 24 MHz |
| Program Memory (Flash) | 32 KB (32K x 8) |
| RAM | 2 KB |
| USB | USB 2.0 Full-Speed Device with on-chip transceiver |
| Gehäuse | 48-QFN-EP (7x7 mm, 0.5 mm pitch) |
| Operating Voltage | 3.3 V / 5 V (integrated LDO) |
| ADC | 12-bit, multi-channel |
| Communication Interfaces | USB, SCI (UART), SPI, IIC |
| Timers | Multiple (TPM/MTIM, per datasheet) |
| Debug | Background Debug + on-chip ICE module (2 comparators, triggers) |
| Montageart | Surface Mount |
| RoHS-Status | RoHS Compliant (per QFN-EP package marking MO-220VKKD-2) |
MC9S08JM32CGT 48-qfn-ep (7x7 mm, 0.5 mm pitch) Pinbelegungsleitfaden
Pinbelegung für MC9S08JM32CGT (48-qfn-ep (7x7 mm, 0.5 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC9S08JM32CGT.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC9S08JM32CGT ist geeignet für 6 Anwendungs: USB HID Peripherals (mice, keyboards, custom HID), USB-to-UART (CDC) Bridge, Industrial USB Sensor Nodes, Point-of-Sale (POS) Terminal Accessories, Consumer USB Dongles, Custom USB Vendor-Class Devices.
USB HID Peripherals (mice, keyboards, custom HID)
The MC9S08JM32CGT's integrated USB 2.0 full-speed device controller and 32 KB Flash fit HID-class devices where the on-chip USB transceiver eliminates the external PHY and the HCS08 core's HC08 instruction set simplifies HID report handling. In a typical design the part sits between a USB Type-B connector and the user I/O (buttons, sensors, LEDs); its 48 MHz CPU runs the HID report loop with ample headroom, while 2 KB RAM handles interrupt-driven HID input reports. Unlike MCUs that require an external USB PHY or a separate voltage regulator, this single-chip solution reduces BOM and PCB area to two layers.
Empfohlen
USB-to-UART (CDC) Bridge
The MC9S08JM32CGT has both USB 2.0 full-speed device and SCI (UART) peripherals on-chip, making it ideal for USB-to-serial adapters that emulate a COM port on a host PC. In a CDC bridge design the part enumerates as a virtual COM port and transparently forwards data between USB endpoints and the SCI pins, supporting standard baud rates up to 115.2 kbps without external crystals. The integrated 3.3 V LDO simplifies single-rail 5 V or USB-bus-powered designs. Compared to discrete FTDI bridges, this part is significantly cheaper in volume and removes the dependency on a third-party IC.
Empfohlen
Industrial USB Sensor Nodes
The MC9S08JM32CGT fits industrial sensor modules that stream measurement data over USB to a host PC or embedded gateway. Its 12-bit ADC captures analog sensor signals; the SCI/SPI/IIC peripherals connect to digital sensors; and the integrated USB device replaces expensive industrial fieldbuses for low-cost data-acquisition use cases. The HCS08's industrial operating temperature (per NXP datasheet) and the QFN-48 EP's solid thermal performance make it suitable for factory-floor enclosures. Compared to RS-485-based sensor nodes, USB reduces cabling complexity at the cost of a shorter cable-length budget (5 m for full-speed).
Empfohlen
Point-of-Sale (POS) Terminal Accessories
The MC9S08JM32CGT supports USB peripherals commonly used in POS systems, including barcode scanners, magnetic-stripe readers, and customer displays. Its on-chip USB device enumerates as HID or vendor-class; 32 KB Flash fits scanner firmware, decoder tables, and USB command sets; and the HCS08 core handles real-time decoding without an external DSP. The QFN-48 EP package is small enough to embed inside a handheld scanner handle. Designers should add an external 16-bit address/data latch for older POS host compatibility, though most modern hosts accept the standard HID class directly.
Empfohlen
Consumer USB Dongles
The MC9S08JM32CGT is small enough (QFN-48 EP, 7x7 mm) to fit inside USB dongles for wireless transceivers, software licenses, or authentication tokens. Its integrated USB device removes the external PHY, and the integrated LDO lets the part run directly from the USB 5 V bus rail with a single bypass capacitor. The HCS08 core's low active current extends powered operation under suspend conditions. Compared to larger 80-pin MCUs in this role, JM32CGT achieves the same functionality in roughly one-quarter the PCB area.
Empfohlen
Custom USB Vendor-Class Devices
The MC9S08JM32CGT supports vendor-class USB devices for proprietary protocols where HID or CDC is not sufficient. The 32 KB Flash holds a custom USB stack with control, interrupt, and bulk endpoints, and the HCS08 core sustains full-speed bulk transfers (up to 64 bytes/frame) with low interrupt latency. The 2 KB RAM provides buffering for short bulk transfers without DMA. Designers using vendor-class for high-throughput data should benchmark first, since full-speed USB tops out at 12 Mbps and the 48 MHz HCS08 core cannot sustain higher throughput without DMA.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S08JM32CGT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S08JM60CGT | MC9S08JM32CLD | MC9S08JM60CLDR | MC9S08AW60CFDE | MC9S08JS16CWJ |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-QFN-EP (7x7 mm) | 48-QFN-EP (7x7 mm) - same | 44-LQFP - different | 44-LQFP - different | QFP-64 - different | S08JS family QFN equivalent |
| Core | HCS08 (8-bit, 48 MHz) | HCS08 (8-bit, 48 MHz) - same | HCS08 (8-bit, 48 MHz) - same | HCS08 (8-bit, 48 MHz) - same | HCS08 (8-bit, 48 MHz) - same | HCS08 (8-bit, 48 MHz) - same |
| Flash Memory | 32 KB | 60 KB | 32 KB | 60 KB | 60 KB | 16 KB |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 1 KB |
| USB | USB 2.0 Full-Speed Device (on-chip transceiver) | USB 2.0 Full-Speed Device - same | USB 2.0 Full-Speed Device - same | USB 2.0 Full-Speed Device - same | No integrated USB | USB 2.0 Full-Speed Device - same |
| Operating Voltage | 3.3 V / 5 V (integrated LDO) | 3.3 V / 5 V - same | 3.3 V / 5 V - same | 3.3 V / 5 V - same | 3.3 V / 5 V - same | 3.3 V / 5 V - same |
| Lifecycle Status | Active (per NXP product page; check for EOL notice) | Active | Active | Active | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Integrated USB 2.0 full-speed transceiver eliminates external PHY (vs. MC9S08AW60CFDE)
- 32 KB Flash strikes cost/feature balance for HID and CDC stacks (vs. MC9S08JS16CWJ)
- Same QFN-48 EP footprint as MC9S08JM60CGT enables field upgrades (vs. MC9S08JM60CGT)
Designhinweise
The 48-QFN-EP exposed thermal pad (EP) must be soldered to a continuous ground plane to meet the datasheet's thermal and electrical specifications. Use an array of thermal vias under the EP to conduct heat into inner ground layers; this is critical because the part dissipates up to ~250 mW under full USB load. Maintain a 90-ohm differential impedance on the D+/D- traces, keep them matched within 150 mil, and route them away from any high-frequency switching nodes to avoid USB enumeration failures.
The MC9S08JM32CGT includes an integrated 3.3 V LDO that allows single-rail 5 V operation from the USB VBUS rail. Place a 4.7 uF bulk capacitor close to VDD and a 100 nF decoupling cap on each VDD pin per the datasheet reference design. For USB bus-powered designs, ensure the 5 V VBUS rail can supply 500 mA peak (USB 2.0 spec); the part itself draws less than 50 mA but downstream peripherals may consume more. Add a power-on reset (POR) capacitor on RESET if long rise-time rails are used.
A common mistake is forgetting to enable the internal 1.5 kOhm pull-up on D+ via firmware during USB enumeration; without it, the host will not detect the device. Another pitfall is omitting the BKGD/MS pull-up resistor (typically 4.7 kOhm to VDD) - without it, in-circuit debugging fails. Finally, do not route D+/D- over plane splits or near oscillators; keep differential pair length matched within 150 mil per USB 2.0 specification.
USB full-speed signals require 90-ohm differential impedance with common-mode choke placement near the connector for EMI compliance. The MC9S08JM32CGT's internal transceiver handles USB signaling up to 12 Mbps; for designs requiring 480 Mbps (high-speed), this part is insufficient - move to an MPU-class solution. Place a common-mode choke (e.g., USBLC6-2SC6) within 5 mm of the USB connector and ensure the upstream ferrite bead is rated for 500 mA continuous current.
Compliance-Informationen
RoHS compliant per QFN-EP package marking MO-220VKKD-2 (per digchip datasheet record). Reach, halogen-free, and conflict-mineral status not published in the provided data. Not AEC-Q100 qualified - this part is for industrial/consumer, not automotive.
