MC9S08AW60CFDE - 8-bit HCS08 MCU, 60KB Flash, 40MHz, QFN-48 | NXP
MPN: MC9S08AW60CFDE ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11.43 | $11.43 |
| 10 | $10.28 | $102.80 |
| 100 | $9.14 | $914.00 |
| 500 | $8 | $4,000.00 |
| 1,000 | $7.43 | $7,430.00 |
MC9S08AW60CFDE Overview
An 8-bit microcontroller (MCU) is a single-chip processor that integrates CPU, Flash program memory, RAM, and peripherals. The HCS08 family sits within the broader 8-bit MCU category, which trades raw compute performance for low cost, simple toolchains, deterministic interrupt latency, and ultra-low static power consumption. MC9S08AW60CFDE belongs to the Freescale/NXP S08AW sub-family, the lowest-cost high-performance HCS08 line optimized for industrial and automotive body applications.
Key features include 60KB Flash (organized as 60K x 8), 4KB RAM, an internal bus frequency of 20MHz derived from the 40MHz CPU clock, multiple communication interfaces (SCI, SPI, I2C), a 10-bit ADC, programmable timers (TPM), and a wide 2.7V-5.5V operating range that supports both 3.3V and 5V rails. The single-wire BDM enables in-circuit programming and debugging with minimal pin overhead, and the QFN-EP exposed pad enhances thermal dissipation for industrial temperature operation.
Architecturally the S08 core is a von Neumann CISC machine using the legacy HC08 instruction set extended with BGND to enter background debug mode. Flash security, a computer-operating-properly (COP) watchdog, low-voltage detect (LVD), and a real-time interrupt (RTI) round out the reliability feature set commonly expected in industrial embedded control. The 7x7mm QFN-48 footprint enables compact PCB designs while still exposing 38 I/Os.
Typical applications include industrial control and sensor interfacing, automotive body and chassis subsystems, white-goods and appliance control, low-end consumer electronics, lighting controllers, and general-purpose embedded platforms replacing older HC08 designs. The wide operating voltage range and rugged -40C to +125C temperature support make it well suited to harsh environments. For designs requiring more memory or CAN connectivity, the AW60 can be migrated within the S08AW sub-family by swapping the MC9S08AW32/AW48/AW16 derivatives.
When designing with this part, ensure the BDM pin is accessible for in-circuit programming or is brought out to a test pad. Decouple VDD with a 100nF ceramic capacitor placed within 5 mm of each supply pin, and solder the exposed pad (EP) to a thermal pad with thermal vias for adequate heat spreading in industrial-temperature designs. Be aware that NXP has marked this part NRND (Not Recommended for New Designs), so consider the related S08AW family members or S08QE/S08AC successors for new product introductions.
Drop-in alternatives for MC9S08AW60CFDE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC9S08AW60CFDE (same form factor and footprint) — differing in Debug Interface, Package, Core, Supply Voltage Range, ADC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC9S08AW48CFDE
✅ Drop-In✓ In Stock
$5.02 / Unit
View Datasheet →MC9S08AW32CFDE
✅ Drop-In✓ In Stock
$3.31 / Unit
View Datasheet →MC9S08AW16MFDE
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S08AW16CFDE
✅ Drop-In✓ In Stock
$3.78 / Unit
View Datasheet →MC9S08AW60CFDE Maximum Ratings & Electrical Characteristics
| Core | HCS08 (S08 enhanced) |
| CPU Bit Width | 8 bit |
| Maximum CPU Clock | 40 MHz |
| Internal Bus Frequency | 20 MHz |
| Program Memory (Flash) | 60 KB (60K x 8) |
| RAM | 4 KB |
| Supply Voltage | 2.7 V to 5.5 V |
| I/O Pins | 38 |
| Package | 48-QFN-EP (7x7 mm, 0.5 mm pitch) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| MSL (Moisture Sensitivity Level) | 3 |
| Operating Temperature | -40C to +85C |
| Debug Interface | Single-wire BDM (Background Debug Mode) |
| Peripheral Set | SCI, SPI, I2C, TPM timers, 10-bit ADC, COP watchdog, LVD, RTI |
| Instruction Set Compatibility | HC08 with added BGND instruction |
MC9S08AW60CFDE 48-qfn-ep (7x7 mm, 0.5 mm pitch) Pin Configuration Guide
Pin configuration for MC9S08AW60CFDE (48-qfn-ep (7x7 mm, 0.5 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC9S08AW60CFDE.
Refer to the datasheet for full pin configuration.
Typical Applications
MC9S08AW60CFDE is suitable for 6 applications: Industrial Sensor Hub / PLC Front-End, Automotive Body and Comfort Electronics, White Goods and Appliance Control, Low-Cost Consumer and Lighting Controllers, General-Purpose Embedded Platform Replacement, HMI Keypad and Display Controllers.
Industrial Sensor Hub / PLC Front-End
The MC9S08AW60CFDE is well-suited to industrial sensor hubs and PLC front-end modules where 38 I/O pins, 60KB Flash, and a 10-bit ADC handle multi-channel analog acquisition with on-chip scaling and filtering. Its 40MHz HCS08 core executes deterministic scan loops at sub-millisecond intervals, and the 2.7V-5.5V supply range lets designers reuse either 24V-derived 5V rails or 3.3V logic supplies without level shifters. Unlike larger 32-bit MCUs, this part draws negligible standby current, making it ideal for always-on sensor aggregators in factory automation racks.
Recommended
Automotive Body and Comfort Electronics
Body controllers for window lifts, seat adjusters, mirror modules, lighting, and HVAC flaps benefit from the MC9S08AW60CFDE's wide 2.7V-5.5V supply and -40C to +85C operation, which tolerate automotive cold-crank and load-dump transients after external clamping. The HC08-compatible instruction set provides code reuse from older Freescale automotive platforms, and the integrated SCI/SPI/I2C set links to body-net transceivers and actuator drivers. For new automotive designs, however, an AEC-Q100-qualified successor should be evaluated since this part is currently marked NRND by NXP.
Recommended
White Goods and Appliance Control
Washing machines, dishwashers, induction cooktops, refrigerators, and microwave ovens require low-cost microcontrollers with enough peripherals for motor drives, user interfaces, and safety timers. The MC9S08AW60CFDE's 60KB Flash allows integration of fuzzy-logic motor-control firmware, capacitive-touch UI drivers, and sensor-fusion routines in a single chip. Its 38 I/O pins connect directly to LED indicators, keypad matrices, and triac-fired loads while the TPM timers generate precisely timed PWM for inverter-driven compressors - a practical replacement for older HC908 designs.
Recommended
Low-Cost Consumer and Lighting Controllers
Connected LED drivers, smart-plug controllers, and decorative-lighting systems need a low-BOM MCU with enough Flash to hold Zigbee or BLE application stacks - or at least the housekeeping logic around a separate radio. The MC9S08AW60CFDE's 60KB Flash accommodates lighting-engine firmware, dimming curve tables, and DMX-style command parsers, while the SCI and SPI peripherals bridge to radio modules and analog dimmers. Its QFN-EP 7x7mm footprint stays out of tight bulb-form-factor PCBs but fits standard downlight and strip-driver housings comfortably.
Recommended
General-Purpose Embedded Platform Replacement
Designers maintaining legacy HC08 firmware can drop the MC9S08AW60CFDE into existing footprints and reuse the complete instruction set, peripheral driver code, and BDM toolchain. The HCS08 core preserves HC08 object code compatibility while adding the BGND instruction to ease breakpoint-driven debugging, and the 60KB Flash plus 4KB RAM comfortably hold modernized versions of legacy control loops. This makes the part a low-risk replacement or feature-extension path for retrofits of installed industrial and appliance systems.
Recommended
HMI Keypad and Display Controllers
Human-machine interface (HMI) panels for industrial equipment, vending machines, and security keypads benefit from the MC9S08AW60CFDE's 38 I/O pins which easily drive 4x4 scan matrices, status LEDs, and character-LCD interfaces. Its 4KB RAM accommodates modest UI buffers, and the 60KB Flash holds multi-page menu trees plus i18n string tables in 8-bit ASCII or UTF-8. The SPI peripheral talks directly to dot-matrix LCD or OLED modules, while the SCI handles diagnostic port output - a strong fit for small standalone HMIs without touching a 32-bit part.
Recommended
Recommended Products Summary
Engineering reference data for MC9S08AW60CFDE — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC9S08AW48CFDE | MC9S08AW32CFDE | MC9S08AW16MFDE | MC9S08AW16CFDE |
|---|---|---|---|---|---|
| Package | 48-QFN-EP (7x7 mm) | 48-QFN-EP (7x7 mm) | 48-QFN-EP (7x7 mm) | 48-QFN-EP (7x7 mm) | 48-QFN-EP (7x7 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Program Flash | 60 KB | 48 KB | 32 KB | 16 KB | 16 KB |
| RAM | 4 KB | 4 KB | 4 KB | 1 KB to 2 KB | 1 KB to 2 KB |
| CPU Max Clock | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Pins | 38 | 38 | 38 | 38 | 38 |
| Core | HCS08 (S08 enhanced) | HCS08 (S08 enhanced) | HCS08 (S08 enhanced) | HCS08 (S08 enhanced) | HCS08 (S08 enhanced) |
Key Differentiators
- Largest Flash within the S08AW 48-QFN-EP sub-family (vs MC9S08AW32CFDE)
- Generous 4 KB SRAM for an 8-bit MCU (vs MC9S08AW16MFDE)
- Wide 2.7V-5.5V supply supports both 3.3V and 5V rails without level shifters (vs MC9S08QG8 series)
Design Notes
Decouple every VDD pin with a 100nF ceramic capacitor placed within 5 mm of the package pin, plus a bulk 10uF tantalum or ceramic reservoir on the regulator rail. The exposed pad (EP) on the 48-QFN-EP must be soldered to a copper thermal pad no smaller than the package footprint, with at least four thermal vias stitching to the inner-plane ground for heat spreading. According to NXP QFN PCB layout recommendations, bypassing the EP reduces thermal resistance from ~50 C/W to ~25 C/W for industrial-temperature designs.
MC9S08AW60CFDE is marked NRND by NXP, so designing it into a new long-lifecycle product creates supply-chain risk. Plan a migration path to active HCS08AC, HCS08QE, or 32-bit Kinetis E series parts before committing to production tooling. For existing HC08 designs being ported to HCS08, remember that BGND replaces the old SWI instruction in the new core, so assembler-level code needs a substitution pass; otherwise most HC08 code ports unchanged.
Route the BDM (background debug mode) signals to a 2x5 or 1x6 header with BKGD, GND, VDD, and RESET exposed so firmware can be updated in-circuit without rework. Keep the BDM traces short and away from high-noise sources such as triac drivers and switching regulators. According to NXP application notes on HCS08 BDM hardware, the BKGD pin requires a 4.7k pull-up to VDD and a series resistor near the MCU pin to limit in-rush current during programming.
Compliance Information
RoHS compliant per DigiKey product listing. AEC-Q100 not formally qualified per NXP S08AW family documentation; suitable for industrial and non-critical automotive body applications.
