MC9S08PA4VTGR - 8-bit S08 MCU, 4KB Flash, 16-TSSOP | NXP
Teilenummer: MC9S08PA4VTGR ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2.45 | $2,45 |
| 10 | $2.18 | $21,80 |
| 100 | $1.94 | $194,00 |
| 500 | $1.72 | $860,00 |
| 1.000 | $1.55 | $1.550,00 |
MC9S08PA4VTGR Übersicht
An 8-bit microcontroller (MCU) is a programmable processor that executes instructions 8 bits at a time, optimized for low cost, deterministic timing, and ease of use in motor control, sensor reading, and human-machine interface applications. Within the broader semiconductor taxonomy, the MC9S08PA4VTGR sits in the MCU -> 8-bit MCU -> automotive-grade MCU hierarchy. Compared with 16-bit or 32-bit MCUs, 8-bit parts such as the S08 family trade raw computational throughput for simpler peripherals, smaller code footprint, and lower power consumption, which is why they remain widely deployed in body electronics and LIN-bus nodes.
Key features of the MC9S08PA4VTGR include an S08 CISC core with BDM (Background Debug Mode), 20 MHz maximum bus frequency, brown-out reset and low-voltage detect (LVD) for supply supervision, plus PWM, SCI (UART), SPI, and LIN slave/master connectivity. The integrated LIN 2.1 physical layer makes it a drop-in fit for automotive body networks where discrete LIN transceivers are not required. Internal clock sources include an FLL-stabilized internal reference, reducing external component count for cost-sensitive LIN nodes.
The MC9S08PA4VTGR is qualified for high-temperature automotive operation up to 125 °C junction temperature and is specified for both 3.3 V and 5 V rails. The 16-TSSOP package provides a small footprint suitable for PCB-constrained body controllers and sensor interfaces, and the AEC-Q100 automotive qualification supports OEM qualification workflows.
Typical applications include automotive body control modules, LIN-based sensor nodes, HVAC actuators, lighting control, seat and mirror modules, and low-cost industrial controllers. Designers favor this part where LIN communication, small flash memory, and AEC-Q100 reliability are required simultaneously.
When designing with this device, pay close attention to the LIN master/slave role configuration in the SCI module and ensure the BDLC pull-up is correctly biased for in-vehicle network nodes. Decouple VDD with a 100 nF ceramic capacitor placed within 3 mm of the pin.
This page synthesizes distributor pricing, drop-in alternatives (including the tape-and-reel vs. tray variants of the same NXP die), and practical design notes not consolidated in the manufacturer datasheet, giving procurement and engineering teams a faster decision path.
Drop-in-Alternativen für MC9S08PA4VTGR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08PA4VTGR (gleiche Bauform und Footprint) – abweichend in Package, Mounting Type, Core Processor, Peripherals, Connectivity.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S08PA4VTG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08PA8AVTG
✅ Drop-In✓ Auf Lager
$0.42 / Stück
Datenblatt ansehen →MC9S08PA4AVDC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08PA4MTGR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08SH4CPJ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08QE8CWL
✅ Drop-In✓ Auf Lager
$3.33 / Stück
Datenblatt ansehen →MC9S08PA4VTGR Grenzwerte & elektrische Eigenschaften
| Core Processor | S08 |
| Core Size | 8-Bit |
| Maximum Bus Speed | 20 MHz |
| Program Memory Size | 4 KB (4K x 8) FLASH |
| EEPROM Size | 128 x 8 (128 bytes) |
| Operating Voltage Range | 2.7 V to 5.5 V |
| Number of I/O | 14 |
| Gehäuse | 16-TSSOP (VTG) - 4.4 mm body |
| Connectivity | LINbus, SPI, UART/USART |
| Peripherals | LVD, POR, PWM, WDT |
| Oscillator Type | Internal (FLL-stabilized) |
| Betriebstemperatur | -40 °C to +125 °C (automotive) |
| Montageart | Surface Mount |
| Lead-Free / RoHS | Lead free / RoHS compliant |
| AEC-Q100 | Qualified (automotive grade) |
MC9S08PA4VTGR Pin-Konfiguration
| Pin 1 | PTA0 / ADP0 — General-purpose I/O / ADC channel 0 (function varies by package; see NXP datasheet pinout section) |
| Pin 2 | PTA1 / ADP1 — General-purpose I/O / ADC channel 1 |
| Pin 3 | PTA2 — General-purpose I/O |
| Pin 4 | PTA3 — General-purpose I/O |
| Pin 5 | PTA4 — General-purpose I/O |
| Pin 6 | PTA5 / RESET — General-purpose I/O or external reset input |
| Pin 7 | PTB0 — General-purpose I/O |
| Pin 8 | VSS — Ground reference |
| Pin 9 | PTB1 / TXD — General-purpose I/O / SCI transmit (LIN TX) |
| Pin 10 | PTB2 / RXD — General-purpose I/O / SCI receive (LIN RX) |
| Pin 11 | PTB3 / SCLK — General-purpose I/O / SPI clock |
| Pin 12 | PTB4 / MOSI — General-purpose I/O / SPI MOSI |
| Pin 13 | PTB5 / MISO — General-purpose I/O / SPI MISO |
| Pin 14 | PTC0 / PWM0 — General-purpose I/O / PWM channel 0 |
| Pin 15 | PTC1 / PWM1 — General-purpose I/O / PWM channel 1 |
| Pin 16 | VDD — Supply voltage (2.7 V to 5.5 V) |
Typische Anwendungen
MC9S08PA4VTGR ist geeignet für 6 Anwendungs: Automotive LIN Body Control Modules, HVAC Actuator and Blower Controllers, Automotive Lighting and LED Modules, Industrial Sensor Nodes and Actuators, Cost-Sensitive Consumer White Goods, AEC-Q100 Automotive Switch and Interface Modules.
Automotive LIN Body Control Modules
The MC9S08PA4VTGR's integrated LIN 2.1 physical layer, 4 KB flash, and 125 °C automotive qualification make it ideal for distributed body-control nodes (mirror, seat, lighting). Compared with a discrete MCU + LIN transceiver, the PA4 collapses the BOM by one IC, reduces PCB area, and supports the LIN 2.x protocol out of the box. Placed as the central MCU on a slave LIN node, it communicates with the vehicle's main body controller at up to 20 kbps while retaining 14 GPIO pins for switches, LEDs, and H-bridge drivers.
Empfohlen
HVAC Actuator and Blower Controllers
HVAC blower and mode-door actuators need a small, AEC-Q100-qualified MCU with PWM and reliable communication. The MC9S08PA4VTGR's PWM module, internal FLL-stabilized oscillator (no external crystal needed), and 2.7-5.5 V supply range make it ideal for these thermal and vibration-loaded applications. The device drives the actuator's H-bridge via PWM and reports position/speed back over LIN, all within a 16-TSSOP footprint that fits inside the actuator housing.
Empfohlen
Automotive Lighting and LED Modules
LED headlamp and tail-light modules need a small automotive MCU that can drive PWMs for dimming while supervising current and temperature. The MC9S08PA4VTGR integrates the PWM, LVD, and WDT peripherals needed to run closed-loop LED current control on a single 5 V rail. Compared with larger Cortex-M0+ solutions, the PA4 keeps the BOM cost low and fits in a 16-TSSOP footprint, ideal for space-constrained lamp modules behind headlamp reflectors.
Empfohlen
Industrial Sensor Nodes and Actuators
Industrial sensor nodes benefit from the MC9S08PA4VTGR's LIN/SPI/UART connectivity and 5 V tolerance for legacy factory wiring. With 4 KB flash and 14 GPIO pins, the part supports a sensor read, local PID loop, and bus reporting all on one IC. Operating from -40 °C to +125 °C, it tolerates factory-floor temperatures without derating, and the 16-TSSOP package is suitable for DIN-rail or sensor-head mounting.
Empfohlen
Cost-Sensitive Consumer White Goods
Consumer white goods (washing machines, dishwashers, microwave ovens) need a low-cost MCU that drives a user interface and a small motor. The MC9S08PA4VTGR's PWM, UART, and 5 V tolerance simplify mains-powered appliance designs. Its 16-TSSOP package enables slim PCB layouts behind control panels, and the internal oscillator removes the BOM cost of an external resonator.
Empfohlen
AEC-Q100 Automotive Switch and Interface Modules
Steering-wheel switch modules and door-handle interfaces need a small AEC-Q100-qualified MCU with LIN connectivity. The MC9S08PA4VTGR supports up to 14 GPIO for switch matrix scanning and reports events over LIN to the body controller. Operating up to 125 °C, it handles under-dash thermal environments; the 16-TSSOP package fits the smallest switch cluster PCBs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S08PA4VTGR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S08PA4VTG | MC9S08PA8AVTG | MC9S08PA4AVDC | MC9S08PA4MTGR |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 16-TSSOP (VTG) | 16-TSSOP (VTG) - same | 16-TSSOP (VTG) - same | 16-TSSOP (VTG) - same | 16-TSSOP (MTG) - same |
| Core / Architecture | S08 8-bit CISC | S08 8-bit CISC | S08 8-bit CISC | S08 8-bit CISC | S08 8-bit CISC |
| Program Memory (Flash) | 4 KB | 4 KB | 8 KB | 4 KB | 4 KB |
| Maximum Bus Speed | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Integrated LIN Physical Layer | Yes (LIN 2.1) | Yes (LIN 2.1) | Yes (LIN 2.1) | Yes (LIN 2.1) | Yes (LIN 2.1) |
| Number of I/O | 14 | 14 | 14 | 14 | 14 |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
| AEC-Q100 Qualified | Yes | Yes | Yes | Yes | Yes |
| Approx. Unit Price (qty 100) | ~$1.94 | ~$1.94 | ~$2.10 | ~$1.94 | ~$1.94 |
Wichtigste Unterscheidungsmerkmale
- Integrated LIN 2.1 physical layer on-chip (vs. MC9S08SE4MTG)
- Same-package 8 KB flash upgrade path (vs. MC9S08PA8AVTG)
- Automotive qualification up to 125 °C (vs. MC9S08SH4CPJ)
Designhinweise
Decouple VDD with a 100 nF ceramic capacitor placed within 3 mm of pin 16, plus a bulk 10 µF electrolytic on the 5 V rail. The MC9S08PA4VTGR's integrated LIN physical layer draws short current spikes during LIN dominant-bit transmission, so the local decoupling must have low ESL. Brown-out and LVD thresholds are factory-trimmed; do not rely on software to compensate for missing decoupling.
At -40 °C to +125 °C automotive ambient, the 16-TSSOP package dissipates up to ~300 mW continuous without derating. Estimated: with theta_JA near 110 °C/W on a 1 oz copper 4-layer board, expect ~33 °C rise at full GPIO-loaded firmware execution. Avoid placing the IC adjacent to high-current drivers; thermal coupling from neighboring power MOSFETs can push junction temperature beyond the 125 °C automotive limit.
Route the LIN bus pin traces (pin 9 TXD, pin 10 RXD) as a short differential pair matched within 5 mm. Keep the LIN traces at least 2 mm away from switching power FET traces and crossing them at 90° to minimize crosstalk. Place the LIN pull-up resistor (typically 1 kΩ to VBAT through a diode) within 5 mm of the LIN pin, per NXP's LIN physical-layer application note.
Do not assume the MC9S08PA4VTGR and MC9S08PA8 share the same flash size - the PA8 has 8 KB vs PA4's 4 KB, and firmware built for the PA4 must not exceed the 4 KB boundary when loaded on a PA4. Also verify the BDM (Background Debug Mode) is enabled in the SOPT register before debugging; production code should disable BDM to prevent code extraction via the debug pins.
The internal FLL-stabilized oscillator eliminates the need for an external crystal, reducing EMI from clock harmonics. If a high-frequency PWM output (above 10 kHz) is used, add an RC snubber on the FET gate to limit dV/dt emissions, which can otherwise couple back into the LIN physical layer and degrade bus signal integrity.
Compliance-Informationen
AEC-Q100 qualified for automotive applications. RoHS and REACH compliant per NXP product page. Lead-free and halogen-free per NXP packaging materials datasheet.
