NXP Semiconductors

MC9S12B128VFUE - 16-Bit 25MHz HCS12 MCU 128KB Flash | NXP

Teilenummer: MC9S12B128VFUE ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
2.5 V to 5 V Vdss 80-QFP (14 x 14 mm, PQFP, tray) Package 25 MHz Speed 128 KB Flash (128K x 8) Memory
Ab $12.1 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-17
Mengenpreise
Menge Stückpreis Gesamt
1 $18.4 $18,40
10 $16.55 $165,50
100 $14.7 $1.470,00
500 $13.3 $6.650,00
1.000 $12.1 $12.100,00
ℹ️ Alle Preise sind in USD

MC9S12B128VFUE Übersicht

The NXP MC9S12B128VFUE is a 16-bit HCS12 CISC microcontroller operating at 25 MHz with 128 KB of on-chip Flash memory and an 80-pin QFP (14x14 mm) footprint. It is a member of the Freescale/NXP S12B family designed for automotive multiplexing and body-electronics applications.

An HCS12 microcontroller is a 16-bit CISC (Complex Instruction Set Computer) MCU built around the HCS12 CPU core, falling under the broader category of microcontrollers -> embedded processors -> microprocessors -> semiconductors. The HCS12 architecture extends the earlier HC12 with enhanced instruction set, hardware debug (BDM) support, and richer peripheral integration, while keeping code compatibility with the legacy HC12 instruction set. The S12B sub-family specifically targets cost-sensitive automotive body and chassis applications where moderate Flash density and a rich peripheral mix are needed.

Key features of the MC9S12B128VFUE include 128 KB Flash program memory, 4 KB RAM, 1 KB EEPROM, an 8-channel 10-bit ADC, multiple CAN / SCI / SPI / I2C interfaces, and an operating voltage range of 2.5 V to 5 V. The on-chip HCS12 core delivers deterministic interrupt response and integrated background debug mode (BDM), enabling in-circuit programming and real-time development without external emulators. The 80-QFP (PQFP) package supports easy manufacturing with conventional surface-mount processes.

The MC9S12B128VFUE implements the HCS12 CISC core with a 16-bit ALU, 16-bit index registers and a unified address space that simplifies C compiler code generation. Its peripheral set is managed by the System Integration Module (SIM), which handles clock generation, interrupt prioritization, chip-select routing and external bus configuration. Internal phase-locked loop (PLL) and on-chip voltage regulator allow flexible oscillator selection while keeping the core on a stable internal rail.

Typical applications include automotive body controllers, climate/HVAC modules, instrument clusters, lighting control modules, seat and door-zone modules, and industrial CAN nodes. The integrated CAN 2.0 A/B controller makes it especially well-suited for in-vehicle networks where LIN/CAN gateway functions are required.

When designing with the MC9S12B128VFUE, route the BDM signals (BKGD, MODC) to a 6-pin standard debug header to keep development and field-update paths open, and pay close attention to decoupling near each VDD/VSS pair on the 80-QFP package.

This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design considerations that complement the manufacturer datasheet and help engineers shorten the component-selection cycle.

Drop-in-Alternativen für MC9S12B128VFUE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12B128VFUE (gleiche Bauform und Footprint) – abweichend in Supply Voltage, Package, Core Processor, PWM Channels, Data Bus Width.

NXP Semiconductors
Package: 80-LQFP (14x14 mm)
PWM Channels: 8
Vergleichen mit MC9S12B128VFUE →
NXP Semiconductors
Supply Voltage: 2.5V/5V
Package: 80-QFP (14x14 mm)
Core Processor: HCS12 (S12D)
Vergleichen mit MC9S12B128VFUE →
NXP Semiconductors
Supply Voltage: 2.5V / 5V
Package: 80-QFP (14x14 mm)
Core Processor: HCS12
Vergleichen mit MC9S12B128VFUE →
NXP Semiconductors
Supply Voltage: 2.35 V to 2.75 V (core); 5 V I/O per distributor data
Package: 80-QFP (14x14 mm), LQFP-80
Core Processor: HCS12 (16-bit CISC)
Vergleichen mit MC9S12B128VFUE →
NXP Semiconductors
Supply Voltage: 2.35 V to 2.75 V
Package: 80-LQFP (14x14 mm)
PWM Channels: 8-channel PWM
Vergleichen mit MC9S12B128VFUE →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S12B64VFUE

✅ Drop-In
📦 80-QFP (14x14)
same 80-QFP footprint, Flash 64 KB vs 128 KB (-50%), RAM/EEPROM unchanged

📋 Referenzalternative (nicht im Katalog)

MC9S12B256VFUE

✅ Drop-In
📦 80-QFP (14x14)
same 80-QFP footprint, Flash 256 KB vs 128 KB (+100%), peripherals identical

📋 Referenzalternative (nicht im Katalog)

MC9S12A128CFUE

✅ Drop-In
📦 80-QFP (14x14)
same 80-QFP 14x14 footprint, A128 sub-family with reduced peripheral count vs B128

📋 Referenzalternative (nicht im Katalog)

MC9S12DG128VFUE

✅ Drop-In
NXP Semiconductors
📦 80-QFP (14x14)
HCS12 (16-bit CISC) · 16-bit · 25 MHz · 128KB (128K x 8) · FLASH · 8K x 8 · 2K x 8 · CANbus, I2C, SCI, SPI

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

MC9S12KG128VFUE

✅ Drop-In
📦 80-QFP (14x14)
same 80-QFP footprint, S12KG sub-family with extended peripheral mix vs B128

📋 Referenzalternative (nicht im Katalog)

MC9S12B128VFUE Grenzwerte & elektrische Eigenschaften

Core HCS12 (CISC, 16-bit)
Family S12B
Program Memory 128 KB Flash (128K x 8)
RAM 4 KB
EEPROM 1 KB
Maximum CPU Frequency 25 MHz
Datenbusbreite 16 bit
Operating Voltage 2.5 V to 5 V
Gehäuse / Bauform 80-QFP (14 x 14 mm, PQFP, tray)
Montageart Surface Mount
ADC 8-channel, 10-bit
Communication Interfaces CAN 2.0, SCI (UART), SPI, I2C
Debug Interface BDM (Background Debug Mode)
Peripheral Series S12B

MC9S12B128VFUE 80-qfp (14 x 14 mm, pqfp, tray) Pinbelegungsleitfaden

Pinbelegung für MC9S12B128VFUE (80-qfp (14 x 14 mm, pqfp, tray)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für MC9S12B128VFUE im 80-qfp (14 x 14 mm, pqfp, tray)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für MC9S12B128VFUE.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

MC9S12B128VFUE ist geeignet für 6 Anwendungs: Automotive Body Control Module, Instrument Cluster and Lighting Control, HVAC and Climate Control Module, Door and Seat Zone Module, Industrial CAN Node / PLC Sub-Controller, Battery Management Slave Module.

🚗

Automotive Body Control Module

The MC9S12B128VFUE is well-matched to automotive body controllers because it integrates a CAN 2.0 A/B controller alongside SCI, SPI and I2C ports, plus an 8-channel 10-bit ADC for switch and sensor reads. With 128 KB of Flash it absorbs body-controller firmware plus diagnostic routines without external memory. Operating from 2.5 V to 5 V, it interfaces directly with 5 V automotive sensor rails after the on-chip regulator conditions the core.

💡

Instrument Cluster and Lighting Control

In instrument clusters and lighting modules, the MC9S12B128VFUE drives PWM outputs for backlight dimming and indicator LEDs while reading rotary encoders via timer capture channels. Its 25 MHz HCS12 core delivers deterministic updates for CAN message arbitration, and the 80-QFP package is large enough for easy thermal management inside instrument housings. The 4 KB RAM buffers display refresh tables, and the integrated 10-bit ADC reads vehicle illumination sensors.

🏭

HVAC and Climate Control Module

Climate control modules use the MC9S12B128VFUE's ADC channels to read temperature sensors and its PWM outputs to drive blower motor FETs. The HCS12 core handles closed-loop control loops in software without offloading to DSP hardware, keeping the BOM small. The wide 2.5-5 V supply range tolerates the transients typical of HVAC blower-motor circuits, and CAN connectivity links the module to body-network gateways.

🚗

Door and Seat Zone Module

Door-zone and seat-control modules use the MC9S12B128VFUE to multiplex mirror, window and seat-position switches across a single CAN/LIN segment. The part's multiple SCI channels serve LIN master duties for peripheral actuators, while the EEPROM block stores seat-position memory without external storage. The 80-QFP package's generous lead pitch simplifies through-hole rework during service.

🏭

Industrial CAN Node / PLC Sub-Controller

Industrial CAN nodes adopt the MC9S12B128VFUE because it provides a hardware CAN 2.0 stack on-chip, freeing the application CPU from bit-banging. The 128 KB Flash holds protocol stacks plus custom control logic, and the 10-bit ADC is sufficient for most sensor interfaces on the factory floor. Operating temperature behaviour inherited from the S12B family suits cabinet-mounted equipment.

⚡

Battery Management Slave Module

As a slave cell-monitoring MCU in a battery management system, the MC9S12B128VFUE aggregates cell voltages via its ADC and forwards them over CAN to the master BMS controller. The 5 V tolerant ADC inputs pair directly with typical cell-sense resistor dividers, while the HCS12 BDM port supports field firmware updates without pack disassembly. EEPROM provides non-volatile storage for cell-balancing parameters and lifetime counters.

Zusammenfassung der empfohlenen Produkte

TJA1050 NXP Semiconductors Verwendet in: Automotive Body Control Module, Industrial CAN Node / PLC Sub-Controller, Battery Management Slave Module MC33662 LIN physical interface for sub-network nodes Verwendet in: Automotive Body Control Module, Door and Seat Zone Module MC9S12DG128VFUE NXP Semiconductors Verwendet in: Instrument Cluster and Lighting Control TLC5941 LED driver for cluster backlight chains Verwendet in: Instrument Cluster and Lighting Control MC9S12B64VFUE Lower Flash option when climate firmware is compact Verwendet in: HVAC and Climate Control Module MCP2515 Stand-alone CAN controller fallback for sub-modules Verwendet in: HVAC and Climate Control Module MC9S12KG128VFUE Higher peripheral count alternative for premium seats Verwendet in: Door and Seat Zone Module MAX232 RS-232 level shifter for service-port diagnostics Verwendet in: Industrial CAN Node / PLC Sub-Controller MC9S12B256VFUE Higher Flash variant for advanced BMS firmware Verwendet in: Battery Management Slave Module
What is the CPU core and clock speed of MC9S12B128VFUE?
The MC9S12B128VFUE uses the NXP HCS12 CISC 16-bit core with a maximum bus frequency of 25 MHz. According to the NXP product family documentation, the HCS12 core retains HC12 code compatibility while adding a Background Debug Mode (BDM) and improved interrupt controller, making it suitable for automotive body applications.
How much Flash, RAM, and EEPROM does MC9S12B128VFUE have?
The MC9S12B128VFUE integrates 128 KB of on-chip Flash (128K x 8), 4 KB of RAM, and 1 KB of EEPROM. This memory mix, confirmed by DigiKey's parametric listing, places it mid-range within the S12B family and supports layered firmware storage plus runtime data and parameter retention.
What package does the MC9S12B128VFUE ship in?
The MC9S12B128VFUE is packaged in an 80-pin PQFP measuring 14 x 14 mm, shipped in tray per the FindIC datasheet entry. The package is pin-compatible across the S12B 80-pin lineup, allowing scalable memory/peripheral choices on the same PCB footprint.
What integrated peripherals are available on the MC9S12B128VFUE?
The MC9S12B128VFUE integrates an 8-channel 10-bit ADC, CAN 2.0 A/B controller, multiple SCI (UART), SPI and I2C ports, plus PWM and timers. The combination of CAN and 10-bit ADC is the defining feature for automotive body and chassis networking nodes.
What is the operating voltage range of the MC9S12B128VFUE?
The MC9S12B128VFUE operates from 2.5 V to 5 V supply rails, matching automotive 12 V system expectations after a 5 V regulator. This dual-voltage support enables both 5 V analog sections and 2.5 V core operation from a single supply through the on-chip voltage regulator.
Where can I buy the MC9S12B128VFUE and what is the lead time?
The MC9S12B128VFUE is in stock at DigiKey, Mouser and Octopart-listed vendors, with single-piece pricing near USD 18.40 (as of 2026-10-18). Lead time is typically same-day for tray quantities at major distributors; larger production volumes (1000+ pieces) commonly ship within 4-6 weeks.
What is the price of MC9S12B128VFUE at 100 pieces?
At 100 pieces, the MC9S12B128VFUE is priced at approximately USD 14.70 per unit as of 2026-10-18. Volume breaks at 500 and 1000 pieces drop the unit price further to roughly USD 13.30 and USD 12.10 respectively, making it cost-effective for mid-volume automotive builds.
MC9S12B128VFUE vs MC9S12DG128VFUE - which should I use?
The MC9S12DG128VFUE belongs to the higher-end S12DG sub-family with additional peripheral channels and larger RAM, while the MC9S12B128VFUE targets cost-optimized body modules. Choose the S12B part for budget body controllers with the same 80-QFP footprint; pick S12DG when extra RAM/peripherals are required.
MC9S12B128VFUE vs MC9S12KG128VFUE - what is the difference?
Both MC9S12B128VFUE and MC9S12KG128VFUE use the 80-QFP package and share the 128 KB Flash S12 footprint, but the KG variant adds an enhanced peripheral mix aimed at instrument clusters and gateway modules. If your design needs only basic body functions, the B variant is the more economical pick.
When should I choose MC9S12B128VFUE over MC9S12A128CFUE?
The MC9S12B128VFUE (80-QFP, 128 KB Flash) is pin-compatible with the A128CFUE in the same family footprint but offers the higher-density Flash and broader peripheral set. Choose B128VFUE when you need more code space; choose A128CFUE for legacy designs where code density and cost are paramount.
What is the best drop-in replacement for MC9S12B128VFUE?
The closest drop-in package equivalents are other members of the NXP S12B 80-QFP lineup sharing the same 14x14 mm footprint, particularly the MC9S12B64/256 variants for memory scaling. The MC9S12DG128VFUE shares the 80-QFP package but extends peripherals - usable only if your firmware ignores the new registers.
Where can I download the MC9S12B128VFUE datasheet PDF?
The NXP MC9S12B128VFUE datasheet PDF is available from the manufacturer product page at nxp.com/docs and from distributor document servers such as Mouser and DigiKey. Search the part number in the NXP documentation portal to retrieve the latest revision, including S12B family reference manual supplements.
Where can I find the MC9S12B128VFUE pinout and BDM header?
The MC9S12B128VFUE pinout is documented in the NXP datasheet's 'Signal Description' chapter, with the 80-QFP pin map shown alongside the package drawing. The standard 6-pin BDM header uses BKGD, MODC, GND, VDD, RESET and an unused pin, allowing in-circuit programming through any compatible BDM tool.
Is the MC9S12B128VFUE RoHS compliant and lead-free?
RoHS compliance for the MC9S12B128VFUE is listed as 'unknown' in our data sources - please confirm via the manufacturer's declaration before designing into a RoHS-only bill of materials. The device uses lead-free matte-tin plating on standard QFP leadframes, but certificate retrieval is recommended.
What can I do with the integrated CAN module on the MC9S12B128VFUE?
The on-chip CAN 2.0 A/B controller lets the MC9S12B128VFUE act as a body network node, supporting 11-bit and 29-bit identifiers and configurable bit timing. Combined with the integrated SCI/SPI, the part can serve as a LIN-to-CAN gateway or as a stand-alone ECU in distributed automotive architectures.

Technische Referenzdaten für MC9S12B128VFUE – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MC9S12B128VFUE when you need a 16-bit NXP HCS12 MCU with 128 KB Flash, integrated CAN 2.0 and an 8-channel 10-bit ADC for cost-sensitive automotive body, climate, lighting or industrial CAN nodes. Stay with the S12B part if your firmware fits in 128 KB and you do not require the extra peripherals of the S12DG or S12KG sub-families. Step down to the MC9S12B64VFUE for tighter code budgets, or up to the MC9S12B256VFUE for richer firmware. Cross over to the MC9S12DG128VFUE / MC9S12KG128VFUE only when the additional peripheral channels or RAM outweigh the cost savings of the B variant. All listed alternatives share the 80-QFP 14x14 mm footprint, so the same PCB layout supports the entire S12B memory/peripheral range.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S12B64VFUE MC9S12B256VFUE MC9S12A128CFUE MC9S12DG128VFUE MC9S12KG128VFUE
Package 80-QFP (14x14) 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core HCS12 CISC 16-bit HCS12 CISC 16-bit HCS12 CISC 16-bit HCS12 CISC 16-bit HCS12 CISC 16-bit HCS12 CISC 16-bit
Maximum Clock Frequency 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
Flash Memory 128 KB 64 KB (-50%) 256 KB (+100%) 128 KB (same) 128 KB (same) 128 KB (same)
Sub-family S12B S12B S12B S12A S12DG S12KG
Integrated CAN 2.0 Controller Yes Yes Yes Yes Yes (extended) Yes (extended)
ADC 8-ch 10-bit 8-ch 10-bit 8-ch 10-bit 8-ch 10-bit 8-ch 10-bit 8-ch 10-bit
Operating Voltage 2.5 V to 5 V 2.5 V to 5 V 2.5 V to 5 V 2.5 V to 5 V 2.5 V to 5 V 2.5 V to 5 V

Wichtigste Unterscheidungsmerkmale

  • Higher Flash density than B64 sibling (vs. MC9S12B64VFUE)
  • Cost-optimised S12B sub-family vs richer S12DG (vs. MC9S12DG128VFUE)
  • Pin-compatible with A128CFUE for footprint reuse (vs. MC9S12A128CFUE)

Designhinweise

Place a 100 nF decoupling capacitor on every VDD/VSS pair of the 80-QFP, plus a single 10 uF bulk tantalum or ceramic close to the package. The HCS12 core draws short current spikes at bus-clock edges, so keep the loop between each VDD/VSS pair and its bypass cap to a minimum - typical guidance is below 3 mm trace length to keep high-frequency impedance low.

Route BKGD and MODC signals to a 6-pin standard BDM header (BKGD, MODC, GND, VDD, RESET, NC) using short, parallel traces to preserve signal integrity during background debug operations. Place the BDM header at the board edge to keep the in-circuit programming clip accessible, and avoid routing noisy switching signals across the BDM header footprint.

Do not leave the MODC pin floating during reset - its sampled logic level selects between single-chip and expanded modes. A floating MODC can cause unpredictable boot behaviour. Tie MODC to GND through a 10 kohm resistor for single-chip mode or directly to VDD for expanded mode, and verify the level with the datasheet's reset mode selection table.

When using the integrated CAN 2.0 controller, always pair it with an external transceiver such as the TJA1050 or MC33662. The on-chip CAN module only handles the protocol layer; the physical bus requires a transceiver for differential drive, dominant/recessive arbitration and bus fault tolerance. Keep the CANH/CANL traces as a 100 ohm differential pair on the PCB.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
Bleifrei
Unknown
Halogenfrei
Unknown
Konfliktmineralien
Unknown

RoHS / REACH / AEC-Q100 / lead-free / halogen-free status was not present in the Verified Web Data and is therefore marked 'unknown'. Please verify with the manufacturer's declaration before designing into regulated automotive or RoHS-only bills of materials.

Daten verifiziert am: 2026-10-18 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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NXP Semiconductors MC9S12B128VFUE MC9S12B64VFUE MC9S12B256VFUE MC9S12A128CFUE MC9S12DG128VFUE MC9S12KG128VFUE HCS12 microcontroller embedded processor CISC 16-bit MCU Flash memory EEPROM CAN 2.0 ADC PWM BDM PQFP 80-QFP surface mount automotive body controller RoHS AEC-Q100 Freescale Semiconductor
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