MC9S12B128VFUE - 16-Bit 25MHz HCS12 MCU 128KB Flash | NXP
Référence : MC9S12B128VFUE ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.4 | $18,40 |
| 10 | $16.55 | $165,50 |
| 100 | $14.7 | $1 470,00 |
| 500 | $13.3 | $6 650,00 |
| 1 000 | $12.1 | $12 100,00 |
MC9S12B128VFUE Présentation
An HCS12 microcontroller is a 16-bit CISC (Complex Instruction Set Computer) MCU built around the HCS12 CPU core, falling under the broader category of microcontrollers -> embedded processors -> microprocessors -> semiconductors. The HCS12 architecture extends the earlier HC12 with enhanced instruction set, hardware debug (BDM) support, and richer peripheral integration, while keeping code compatibility with the legacy HC12 instruction set. The S12B sub-family specifically targets cost-sensitive automotive body and chassis applications where moderate Flash density and a rich peripheral mix are needed.
Key features of the MC9S12B128VFUE include 128 KB Flash program memory, 4 KB RAM, 1 KB EEPROM, an 8-channel 10-bit ADC, multiple CAN / SCI / SPI / I2C interfaces, and an operating voltage range of 2.5 V to 5 V. The on-chip HCS12 core delivers deterministic interrupt response and integrated background debug mode (BDM), enabling in-circuit programming and real-time development without external emulators. The 80-QFP (PQFP) package supports easy manufacturing with conventional surface-mount processes.
The MC9S12B128VFUE implements the HCS12 CISC core with a 16-bit ALU, 16-bit index registers and a unified address space that simplifies C compiler code generation. Its peripheral set is managed by the System Integration Module (SIM), which handles clock generation, interrupt prioritization, chip-select routing and external bus configuration. Internal phase-locked loop (PLL) and on-chip voltage regulator allow flexible oscillator selection while keeping the core on a stable internal rail.
Typical applications include automotive body controllers, climate/HVAC modules, instrument clusters, lighting control modules, seat and door-zone modules, and industrial CAN nodes. The integrated CAN 2.0 A/B controller makes it especially well-suited for in-vehicle networks where LIN/CAN gateway functions are required.
When designing with the MC9S12B128VFUE, route the BDM signals (BKGD, MODC) to a 6-pin standard debug header to keep development and field-update paths open, and pay close attention to decoupling near each VDD/VSS pair on the 80-QFP package.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design considerations that complement the manufacturer datasheet and help engineers shorten the component-selection cycle.
Alternatives de remplacement direct pour MC9S12B128VFUE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12B128VFUE (même facteur de forme et même empreinte) — différant par Supply Voltage, Package, Core Processor, PWM Channels, Data Bus Width.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12B64VFUE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12B256VFUE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12A128CFUE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DG128VFUE
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S12KG128VFUE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12B128VFUE Valeurs maximales et caractéristiques électriques
| Core | HCS12 (CISC, 16-bit) |
| Family | S12B |
| Program Memory | 128 KB Flash (128K x 8) |
| RAM | 4 KB |
| EEPROM | 1 KB |
| Maximum CPU Frequency | 25 MHz |
| Largeur du bus de données | 16 bit |
| Operating Voltage | 2.5 V to 5 V |
| Boîtier / Format | 80-QFP (14 x 14 mm, PQFP, tray) |
| Type de montage | Surface Mount |
| ADC | 8-channel, 10-bit |
| Communication Interfaces | CAN 2.0, SCI (UART), SPI, I2C |
| Debug Interface | BDM (Background Debug Mode) |
| Peripheral Series | S12B |
Guide de configuration des broches du MC9S12B128VFUE 80-qfp (14 x 14 mm, pqfp, tray)
Configuration des broches du MC9S12B128VFUE (boîtier 80-qfp (14 x 14 mm, pqfp, tray)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC9S12B128VFUE.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC9S12B128VFUE convient pour 6 applications: Automotive Body Control Module, Instrument Cluster and Lighting Control, HVAC and Climate Control Module, Door and Seat Zone Module, Industrial CAN Node / PLC Sub-Controller, Battery Management Slave Module.
Automotive Body Control Module
The MC9S12B128VFUE is well-matched to automotive body controllers because it integrates a CAN 2.0 A/B controller alongside SCI, SPI and I2C ports, plus an 8-channel 10-bit ADC for switch and sensor reads. With 128 KB of Flash it absorbs body-controller firmware plus diagnostic routines without external memory. Operating from 2.5 V to 5 V, it interfaces directly with 5 V automotive sensor rails after the on-chip regulator conditions the core.
Recommandé
Instrument Cluster and Lighting Control
In instrument clusters and lighting modules, the MC9S12B128VFUE drives PWM outputs for backlight dimming and indicator LEDs while reading rotary encoders via timer capture channels. Its 25 MHz HCS12 core delivers deterministic updates for CAN message arbitration, and the 80-QFP package is large enough for easy thermal management inside instrument housings. The 4 KB RAM buffers display refresh tables, and the integrated 10-bit ADC reads vehicle illumination sensors.
Recommandé
HVAC and Climate Control Module
Climate control modules use the MC9S12B128VFUE's ADC channels to read temperature sensors and its PWM outputs to drive blower motor FETs. The HCS12 core handles closed-loop control loops in software without offloading to DSP hardware, keeping the BOM small. The wide 2.5-5 V supply range tolerates the transients typical of HVAC blower-motor circuits, and CAN connectivity links the module to body-network gateways.
Recommandé
Door and Seat Zone Module
Door-zone and seat-control modules use the MC9S12B128VFUE to multiplex mirror, window and seat-position switches across a single CAN/LIN segment. The part's multiple SCI channels serve LIN master duties for peripheral actuators, while the EEPROM block stores seat-position memory without external storage. The 80-QFP package's generous lead pitch simplifies through-hole rework during service.
Recommandé
Industrial CAN Node / PLC Sub-Controller
Industrial CAN nodes adopt the MC9S12B128VFUE because it provides a hardware CAN 2.0 stack on-chip, freeing the application CPU from bit-banging. The 128 KB Flash holds protocol stacks plus custom control logic, and the 10-bit ADC is sufficient for most sensor interfaces on the factory floor. Operating temperature behaviour inherited from the S12B family suits cabinet-mounted equipment.
Recommandé
Battery Management Slave Module
As a slave cell-monitoring MCU in a battery management system, the MC9S12B128VFUE aggregates cell voltages via its ADC and forwards them over CAN to the master BMS controller. The 5 V tolerant ADC inputs pair directly with typical cell-sense resistor dividers, while the HCS12 BDM port supports field firmware updates without pack disassembly. EEPROM provides non-volatile storage for cell-balancing parameters and lifetime counters.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12B128VFUE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12B64VFUE | MC9S12B256VFUE | MC9S12A128CFUE | MC9S12DG128VFUE | MC9S12KG128VFUE |
|---|---|---|---|---|---|---|
| Package | 80-QFP (14x14) | 80-QFP (14x14) - same | 80-QFP (14x14) - same | 80-QFP (14x14) - same | 80-QFP (14x14) - same | 80-QFP (14x14) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12 CISC 16-bit | HCS12 CISC 16-bit | HCS12 CISC 16-bit | HCS12 CISC 16-bit | HCS12 CISC 16-bit | HCS12 CISC 16-bit |
| Maximum Clock Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Memory | 128 KB | 64 KB (-50%) | 256 KB (+100%) | 128 KB (same) | 128 KB (same) | 128 KB (same) |
| Sub-family | S12B | S12B | S12B | S12A | S12DG | S12KG |
| Integrated CAN 2.0 Controller | Yes | Yes | Yes | Yes | Yes (extended) | Yes (extended) |
| ADC | 8-ch 10-bit | 8-ch 10-bit | 8-ch 10-bit | 8-ch 10-bit | 8-ch 10-bit | 8-ch 10-bit |
| Operating Voltage | 2.5 V to 5 V | 2.5 V to 5 V | 2.5 V to 5 V | 2.5 V to 5 V | 2.5 V to 5 V | 2.5 V to 5 V |
Principaux différenciateurs
- Higher Flash density than B64 sibling (vs MC9S12B64VFUE)
- Cost-optimised S12B sub-family vs richer S12DG (vs MC9S12DG128VFUE)
- Pin-compatible with A128CFUE for footprint reuse (vs MC9S12A128CFUE)
Notes de conception
Place a 100 nF decoupling capacitor on every VDD/VSS pair of the 80-QFP, plus a single 10 uF bulk tantalum or ceramic close to the package. The HCS12 core draws short current spikes at bus-clock edges, so keep the loop between each VDD/VSS pair and its bypass cap to a minimum - typical guidance is below 3 mm trace length to keep high-frequency impedance low.
Route BKGD and MODC signals to a 6-pin standard BDM header (BKGD, MODC, GND, VDD, RESET, NC) using short, parallel traces to preserve signal integrity during background debug operations. Place the BDM header at the board edge to keep the in-circuit programming clip accessible, and avoid routing noisy switching signals across the BDM header footprint.
Do not leave the MODC pin floating during reset - its sampled logic level selects between single-chip and expanded modes. A floating MODC can cause unpredictable boot behaviour. Tie MODC to GND through a 10 kohm resistor for single-chip mode or directly to VDD for expanded mode, and verify the level with the datasheet's reset mode selection table.
When using the integrated CAN 2.0 controller, always pair it with an external transceiver such as the TJA1050 or MC33662. The on-chip CAN module only handles the protocol layer; the physical bus requires a transceiver for differential drive, dominant/recessive arbitration and bus fault tolerance. Keep the CANH/CANL traces as a 100 ohm differential pair on the PCB.
Informations de conformité
RoHS / REACH / AEC-Q100 / lead-free / halogen-free status was not present in the Verified Web Data and is therefore marked 'unknown'. Please verify with the manufacturer's declaration before designing into regulated automotive or RoHS-only bills of materials.
