NXP Semiconductors

MC9S12GC16CFUE - HCS12 16-bit MCU, 16KB Flash, 80-QFP | NXP

Teilenummer: MC9S12GC16CFUE ✗ Abgekündigt
Auf Lager Versand in 1–3 Werktagen
2.97 V to 5.5 V (single 5 V supply; internal Vreg generates core VDD) Vdss 80-QFP (14x14 mm) Package 25 MHz Speed 16 KB (16K x 8) Memory
Ab $9.28 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-21
Mengenpreise
Menge Stückpreis Gesamt
1 $14.5 $14,50
10 $13.05 $130,50
100 $11.6 $1.160,00
500 $10.44 $5.220,00
1.000 $9.28 $9.280,00
ℹ️ Alle Preise sind in USD

MC9S12GC16CFUE Übersicht

The NXP MC9S12GC16CFUE is a 16-bit HCS12 CISC microcontroller delivering 25 MHz CPU performance with 16 KB of on-chip Flash and 1 KB of RAM, housed in an 80-pin QFP (14x14 mm) surface-mount package. It is part of the S12GC family designed for automotive body and chassis applications, integrating a 2.97 V to 5.5 V internal voltage regulator, a phase-lock loop (PLL), and 60 general-purpose I/O lines.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (typically Flash), volatile working memory (RAM), and a rich set of peripherals such as timers, ADCs, communication interfaces, and GPIO. Within the broader semiconductor taxonomy, an MCU belongs to the microprocessor-and-microcontroller category, which itself sits inside digital logic ICs and integrated circuits. The HCS12 is NXP's 16-bit CISC architecture, a successor to the HC11, designed for deterministic real-time control in cost-sensitive automotive and industrial systems.

Key features of the MC9S12GC16CFUE include internal oscillator support, on-chip bandgap-based voltage regulation that accepts a single 5 V supply while internally generating the 2.5 V core voltage, a PLL for flexible bus-speed scaling, and the standard S12 peripheral set including timers, PWM channels, an SCI, an SPI, and one or more CAN modules depending on S12GC variant mask set. The 80-QFP package offers generous pin count for body-control applications while remaining compatible with bed-of-nails test fixtures and conventional reflow profiles.

The 16-bit HCS12 architecture retains full 16-bit data paths throughout, simplifying C-language pointer arithmetic and improving code density versus 8-bit cores. The S12 instruction set is largely upward-compatible with the HC11, allowing legacy code to be ported with minimal rewriting, while the on-chip PLL and oscillator trim logic reduce external BOM by eliminating multiple crystals.

Typical applications include automotive body controllers, HVAC control modules, instrument clusters, lighting controllers, simple CAN-connected sensor nodes, and industrial control boards requiring CAN connectivity. The wide supply range (2.97 V to 5.5 V) and integrated 5 V-tolerant I/O also suit it for 12 V automotive battery environments with appropriate external regulation.

When designing with the MC9S12GC16CFUE, leave adequate guard bands on the VDDr and VDDX decoupling capacitors near the package, and ensure the PLL filter network (RFC, CP1, CP2) follows the datasheet layout recommendations. Be aware that NXP has flagged this part NRND; check the latest PCN before committing to a new design.

This page consolidates distributor pricing, NXP datasheet extracts, drop-in compatible alternatives, and practical design notes not found on a single manufacturer page.

Drop-in-Alternativen für MC9S12GC16CFUE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12GC16CFUE (gleiche Bauform und Footprint) – abweichend in Package, ADC, RAM Size, Program Memory Size, Operating Temperature.

NXP Semiconductors
Package: 80-pin LQFP (QFP 80), 14x14 mm
ADC: 8-channel, 10-bit
RAM Size: 4 KB
Vergleichen mit MC9S12GC16CFUE →
NXP Semiconductors
Package: 80-pin plastic LQFP/PQFP, 14 x 14 mm
ADC: Two 8-channel 10-bit ADCs
Operating Temperature: -40 °C to 105 °C
Vergleichen mit MC9S12GC16CFUE →
NXP Semiconductors
Package: 80-pin PQFP, 14 mm x 14 mm
ADC: 2 x 8-channel, 10-bit
Vergleichen mit MC9S12GC16CFUE →
NXP Semiconductors
ADC: 16-channel, 10-bit (per family)
Vergleichen mit MC9S12GC16CFUE →
NXP Semiconductors
RAM Size: 8 KB
Program Memory Size: 128 KB (128K x 8)
Operating Temperature: -40 C to +85 C
Vergleichen mit MC9S12GC16CFUE →
NXP Semiconductors
Package: 80-QFP (PQFP, 14x14 mm)
RAM Size: 2 KB (2K x 8)
Program Memory Size: 32 KB (32K x 8) Flash
Vergleichen mit MC9S12GC16CFUE →
NXP Semiconductors
Package: 81-MAPBGA (10 x 10 mm)
ADC: High-resolution ADC module
RAM Size: 32K x 8
Vergleichen mit MC9S12GC16CFUE →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S12GC32MFUE

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 80-QFP (14x14 mm)
HCS12 (CPU12) · 16-Bit · CISC · 32 KB (32K x 8) Flash · 2 KB (2K x 8) · 25 MHz (PLL up to 50 MHz) · 2.5 V / 5 V (2.97 V to 5.5 V external supply)

✓ Auf Lager

$6.1 / Stück

Datenblatt ansehen →

MC9S12D32MFUE

NXP Semiconductors
📦 80-QFP (14x14 mm)
HCS12 · S12D · 16 bit · 25 MHz · 32 KB (32K x 8) · Flash · 4K x 8 bytes · 1K x 8 bytes

✓ Auf Lager

$26.4032 / Stück

Datenblatt ansehen →

MC9S12C64CFUE

✅ Drop-In
NXP Semiconductors
📦 80-QFP (14x14 mm)
HCS12 (CPU12) · 16 bit · 64 KB Flash · 4 KB · 50 MHz (PLL, internal bus) · 25 MHz · 2.97 V to 5.5 V · -40 C to +85 C

✓ Auf Lager

$8.2 / Stück

Datenblatt ansehen →

MC9S12E128CFUE

✅ Drop-In
NXP Semiconductors
📦 80-QFP (14x14 mm)
HCS12 · 16-Bit · 25 MHz (50 MHz internal bus via PLL) · 128 KB (128K x 8) · FLASH · 8 KB · 60

✓ Auf Lager

$10.65 / Stück

Datenblatt ansehen →

MC9S12DJ128VFUE

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 80-QFP (14x14 mm)
HCS12 16-bit CISC core · 25 MHz per DigiKey; conflicting third-party result states 50 MHz · 16 bit · 128 KB Flash (128K x 8) · 2 KB (2K x 8) · 8 KB · 2.35 V to 2.75 V · 59

✓ Auf Lager

$29.9635 / Stück

Datenblatt ansehen →

MC9S12DJ256MFUE

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 80-QFP (14x14 mm)
16-bit HCS12 CISC · 25 MHz · 256 KB · 12 KB · 16-bit · 8-bit · 2.35 V to 2.75 V · 2 x 8-channel, 10-bit

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

MC9S12DT256MFUE

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 80-QFP (14x14 mm)
HCS12 (CPU12), 16-bit CISC · 25 MHz · 256 KB (256K x 8) · 16-bit · 2.35 V to 2.75 V · 5V-tolerant I/O on VDDR/VSSR

✓ Auf Lager

$19.2 / Stück

Datenblatt ansehen →

MCF51JE256CMB

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 80-QFP (14x14 mm)
32-bit microcontroller · ColdFire V1 · 32-bit RISC · 50 MHz · 256 KB (256K x 8) · 32K x 8 · 48 · 2.5 V or 3.3 V

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

MC9S12GC16CFUE Grenzwerte & elektrische Eigenschaften

Core Architecture HCS12 (16-bit CISC)
CPU Bit Width 16-bit
Maximum CPU Frequency 25 MHz
Program Memory (Flash) 16 KB (16K x 8)
RAM Size 1 KB (1K x 8)
Number of I/O Pins 60
Gehäuse 80-QFP (14x14 mm)
Supply Voltage (external) 2.97 V to 5.5 V (single 5 V supply; internal Vreg generates core VDD)
Oscillator Type Internal (with PLL)
Montageart Surface Mount
Betriebstemperatur -40C to +85C (industrial)
Series S12GC / HCS12
Packaging Tray
Family Automotive body and chassis MCU
On-chip Voltage Regulator Yes (bandgap-based, generates internal VDD)
PLL Yes (allows power/performance scaling)
Data Paths Full 16-bit throughout

MC9S12GC16CFUE 80-qfp (14x14 mm) Pinbelegungsleitfaden

Pinbelegung für MC9S12GC16CFUE (80-qfp (14x14 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für MC9S12GC16CFUE im 80-qfp (14x14 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für MC9S12GC16CFUE.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

MC9S12GC16CFUE ist geeignet für 6 Anwendungs: Automotive Body Control Module, HVAC Control Module, Instrument Cluster Controller, Automotive Lighting Controller, CAN-Connected Sensor Node, Industrial Control Board.

🚗

Automotive Body Control Module

The MC9S12GC16CFUE fits automotive body control modules where multiple LIN/CAN sub-nets must be coordinated with deterministic real-time response. The HCS12 core at 25 MHz delivers ample throughput for body-state machines controlling door locks, interior lighting, and wiper logic, while 16 KB Flash holds the application plus a small bootloader. Integrated 5 V-tolerant I/O, the internal 5 V regulator that generates the 2.5 V core rail, and the 80-QFP footprint with 60 user I/O pins allow it to land directly on mainstream BCM PCB layouts. The S12 peripheral set provides PWM channels for motor control and SCI/SPI for body peripherals, making it a typical NXP choice in cost-sensitive body-electronics programs.

🏭

HVAC Control Module

The MC9S12GC16CFUE is well suited to HVAC control modules that drive blower motors, mode doors, and temperature blending without requiring the throughput of a 32-bit MCU. The 16-bit HCS12 core at 25 MHz, combined with the on-chip PWM channels, supports closed-loop motor control and PWM-driven valve actuators typical in automotive climate control. Internal bandgap regulator accepting 2.97 V to 5.5 V supply allows direct connection to the 12 V vehicle rail after a simple external regulator. The 80-QFP package and 60 I/O lines give designers ample headroom for I2C temperature sensors, SPI display drivers, and SCI body-network links, while 16 KB Flash fits typical HVAC firmware including calibration tables and diagnostic routines.

📺

Instrument Cluster Controller

For simple instrument clusters that drive stepper-motor gauges and LED backlights, the MC9S12GC16CFUE delivers the right balance of compute, peripherals, and cost. The HCS12 16-bit core handles gauge calculations and warning logic, while the integrated PWM and timer modules drive stepper motors for speedometer and tachometer needles. 60 user I/O pins in the 80-QFP package map neatly to backlight drivers, telltale LEDs, and switch inputs. Internal 5 V regulator simplifies the power tree, and 1 KB RAM is sufficient for gauge arithmetic and CAN message buffers. Designers needing larger memory for richer displays should evaluate the MC9S12E128CFUE as a pin-compatible upgrade.

💡

Automotive Lighting Controller

The MC9S12GC16CFUE is a common choice for headlamp-leveling modules, adaptive lighting controllers, and interior LED drivers. Its 16-bit HCS12 core computes PWM patterns for LED strings and DC-motor actuators with deterministic timing, and the integrated PWM channels generate the precise duty cycles needed for flicker-free dimming. The 80-QFP footprint exposes 60 I/O pins, easily accommodating multiple LED strings, LIN/CAN links to the BCM, and analog feedback inputs for closed-loop current control. With 16 KB Flash holding lighting-pattern firmware and diagnostic routines, plus 1 KB RAM for run-time state, the GC16 comfortably fits typical headlamp or tail-lamp controller designs.

🌐

CAN-Connected Sensor Node

The MC9S12GC16CFUE serves as a low-cost CAN node for distributed sensor modules such as seat-occupancy detectors, rain-light sensors, or battery-current monitors. Its on-chip CAN interface, HCS12 16-bit core at 25 MHz, and 60 I/O pins let it read analog and digital sensor inputs, perform local filtering, and publish results over the body CAN bus. The internal 5 V regulator allows direct operation from the vehicle battery rail after a simple external pre-regulator. Compact 16 KB Flash holds sensor-calibration tables and the CAN transport layer, while 1 KB RAM buffers CAN message objects. Designers adding more protocols can move up the family to MC9S12DJ128VFUE for dual CAN.

🔧

Industrial Control Board

Although optimized for automotive, the MC9S12GC16CFUE also serves industrial control boards such as small PLCs, motor-control reference designs, and CAN-based factory nodes. Its 16-bit HCS12 core, 25 MHz CPU clock, and on-chip PWM channels support basic variable-frequency drive loops and stepper sequencing. The wide 2.97 V to 5.5 V supply range, internal voltage regulator, and 80-QFP package with 60 user I/O lines simplify integration into 24 V industrial systems with appropriate external conditioning. 16 KB Flash holds ladder-logic or sequencing firmware, while CAN and SCI peripherals connect to factory networks. For high-noise industrial environments, evaluate the part's ESD and EMC ratings against IEC 61000-4 family standards during design.

Zusammenfassung der empfohlenen Produkte

MC9S12GC32MFUE NXP Semiconductors Verwendet in: Automotive Body Control Module, HVAC Control Module, Automotive Lighting Controller MC9S12E128CFUE NXP Semiconductors Verwendet in: Automotive Body Control Module, Instrument Cluster Controller, Industrial Control Board MC33660 LIN transceiver companion IC Verwendet in: Automotive Body Control Module, Automotive Lighting Controller TJA1050 NXP Semiconductors Verwendet in: Automotive Body Control Module, CAN-Connected Sensor Node MC9S12C64CFUE NXP Semiconductors Verwendet in: HVAC Control Module MCP9700 Temperature sensor companion Verwendet in: HVAC Control Module, CAN-Connected Sensor Node MC9S12DJ128VFUE NXP Semiconductors Verwendet in: Instrument Cluster Controller, CAN-Connected Sensor Node A3950 Stepper driver companion Verwendet in: Instrument Cluster Controller TPS92661 LED matrix driver companion Verwendet in: Automotive Lighting Controller MC33035 BLDC motor controller companion Verwendet in: Industrial Control Board SN65HVD230 Industrial CAN transceiver Verwendet in: Industrial Control Board
What is the core architecture of the MC9S12GC16CFUE?
The MC9S12GC16CFUE is built around NXP's HCS12 16-bit CISC core, a successor to the popular HC11 that retains full 16-bit data paths throughout. According to NXP product documentation, the S12 family targets automotive body and chassis applications. The 16-bit instruction set allows tight C-code pointer handling and better code density than 8-bit cores when handling CAN message buffers and table-driven state machines typical in body controllers.
How much Flash and RAM does the MC9S12GC16CFUE have?
The MC9S12GC16CFUE integrates 16 KB of Flash program memory (organized as 16K x 8) and 1 KB of RAM (1K x 8) on-chip. This memory size targets compact CAN nodes and small body controllers; for higher-end designs with larger protocol stacks, consider the S12E or S12X families. The Flash is in-application programmable, allowing firmware updates over CAN in production vehicles per the S12 standard.
What is the operating supply voltage of the MC9S12GC16CFUE?
The MC9S12GC16CFUE operates from a single external supply of 2.97 V to 5.5 V (typically 5 V in automotive body networks). Per the NXP datasheet, an internal bandgap-based voltage regulator generates the 2.5 V core VDD, simplifying board design by removing the need for an external core-voltage LDO. The 5 V tolerance on I/O pins enables direct interfacing with 5 V sensors and actuators.
What is the difference between the MC9S12GC16CFUE and the MC9S12E128CFUE?
The MC9S12GC16CFUE has 16 KB of Flash and 1 KB of RAM, while the MC9S12E128CFUE has 128 KB of Flash and additional RAM plus an enhanced E-Series peripheral set. Both share the same 80-QFP (14x14 mm) package and HCS12 core, making the GC variant a drop-in option when lower memory density is acceptable. Choose the E128 variant for richer protocol stacks or larger application firmware, the GC16 for cost-sensitive compact nodes.
Where can I download the MC9S12GC16CFUE datasheet PDF?
The official MC9S12GC16CFUE datasheet is available from the NXP product page at https://www.nxp.com/part/MC9S12GC16CFUE under the Data Sheet tab. NXP also publishes the S12GC family reference manual covering core, memory map, and peripheral programming. Both documents are required for firmware development; the datasheet contains electrical characteristics while the reference manual covers the S12 instruction set and module registers.
What is the pin count and package of the MC9S12GC16CFUE?
The MC9S12GC16CFUE is supplied in an 80-pin QFP (Quad Flat Package) measuring 14 mm x 14 mm with a 0.65 mm typical lead pitch. The 80-QFP footprint provides 60 general-purpose I/O pins after accounting for power, ground, oscillator, and JTAG/bdm signals. This package remains popular for automotive body controllers due to its inspectability and compatibility with bed-of-nails production test fixtures.
Is the MC9S12GC16CFUE suitable for automotive body controllers?
Yes, the MC9S12GC16CFUE is designed for automotive body and chassis applications such as body control modules, HVAC controllers, instrument clusters, and lighting modules. Its 16-bit HCS12 core, integrated 5 V-tolerant I/O, internal voltage regulator accepting a 5 V supply, CAN interface, and 80-QFP package with 60 I/O pins make it well-suited to nodes requiring deterministic real-time control at a cost-competitive price point compared with 32-bit MCUs.
What is the lifecycle status of the MC9S12GC16CFUE?
According to the NXP product page, the MC9S12GC16CFUE is marked NRND (Not Recommended for New Designs), meaning NXP does not recommend committing it to new programs but continues limited support for existing customers. Buyers planning new designs should evaluate the newer S12 MagniV or S32K families as successors. Distributors such as DigiKey and Mouser may still carry inventory for legacy and aftermarket use as of 2026-10-21.
What are the key specifications of the MC9S12GC16CFUE that engineers should know?
Engineers evaluating the MC9S12GC16CFUE should focus on four headline specifications: 16-bit HCS12 CISC core running at 25 MHz maximum CPU frequency, 16 KB Flash and 1 KB RAM on-chip, 60 general-purpose I/O lines, and an 80-QFP (14x14 mm) package. The 2.97 V to 5.5 V single-supply input with internal core-voltage regulator, integrated PLL, and CAN-ready peripheral set make it a compact solution for cost-sensitive automotive body nodes.
Can the MC9S12E128CFUE replace the MC9S12GC16CFUE?
Yes, in many applications the MC9S12E128CFUE is a drop-in upgrade for the MC9S12GC16CFUE because both share the same 80-QFP (14x14 mm) footprint and the HCS12 core at 25 MHz. The E128 variant offers 128 KB Flash versus 16 KB on the GC16. If the existing firmware fits comfortably within 16 KB and uses only GC-family peripherals, the swap is safe; for larger code or richer peripherals, the E128 is the better choice.
What is the best drop-in replacement for the MC9S12GC16CFUE?
The strongest drop-in replacement candidates for the MC9S12GC16CFUE come from within NXP's S12 family due to identical 80-QFP (14x14 mm) packaging and HCS12 core compatibility: MC9S12GC32MFUE (32 KB Flash upgrade), MC9S12D32MFUE (same Flash size but D-family peripheral set), and MC9S12C64CFUE (64 KB Flash with C-family peripherals). All share the same HCS12 core at 25 MHz and pin-compatibility, allowing firmware migration with minimal board rework.
What is the price of the MC9S12GC16CFUE in production quantities?
As of 2026-10-21, the MC9S12GC16CFUE lists for approximately USD 14.50 at qty 1, scaling to roughly USD 13.05 at qty 10, USD 11.60 at qty 100, USD 10.44 at qty 500, and USD 9.28 at qty 1000 per XAIPART distributor-snapshot pricing. NRND parts often see price inflation as inventory tightens; request a quote for full reels or trays to confirm current volume pricing from authorized distributors.
Is the MC9S12GC16CFUE in stock at distributors?
Based on distributor snapshots retrieved on 2026-10-21, DigiKey shows limited stock of the MC9S12GC16CFUE, with Rochester Electronics also listed as an authorized aftermarket source for legacy Freescale/NXP inventory. Because the part is marked NRND, lead times can vary; place orders through authorized channels and confirm availability before committing to a new design in production.
MC9S12GC16CFUE vs MC9S12GC32MFUE - which is better for my application?
Choose the MC9S12GC32MFUE if your firmware exceeds 16 KB Flash or you want headroom for future feature additions, because it doubles Flash to 32 KB while keeping the same HCS12 core at 25 MHz. Choose the MC9S12GC16CFUE if your application fits comfortably within 16 KB and you are optimizing cost per unit. Both share the same 80-QFP footprint, enabling PCB reuse between designs.
What is the operating temperature range of the MC9S12GC16CFUE?
The MC9S12GC16CFUE supports an operating temperature range of -40C to +85C (industrial grade) per the NXP S12GC family datasheet. For under-hood or extreme-environment automotive applications requiring -40C to +125C, look at AEC-Q100-qualified S12 derivatives with extended temperature grades. The 80-QFP package is rated for the standard JEDEC surface-mount reflow profile suitable for automotive PCB assembly.

Technische Referenzdaten für MC9S12GC16CFUE – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MC9S12GC16CFUE when designing a cost-sensitive automotive body-electronics node that fits within 16 KB Flash and 1 KB RAM - typical examples include lighting controllers, simple HVAC modules, instrument clusters without graphics, and distributed CAN sensor nodes. Its internal 5 V regulator and 60 user I/O pins in the 80-QFP package cover most body-network requirements without external regulation or extra IO expanders. Prefer the GC32MFUE if your firmware exceeds 16 KB Flash, choose the E128CFUE if you need richer peripherals and 128 KB Flash, and select the DJ128VFUE if dual-CAN is mandatory. Avoid committing new designs to any NRND S12 part without an NXP PCN review; migrate to S12 MagniV or S32K for production programs starting after 2025.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S12GC32MFUE MC9S12D32MFUE MC9S12C64CFUE MC9S12E128CFUE MC9S12DJ128VFUE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 80-QFP (14x14 mm) 80-QFP (14x14 mm) - same 80-QFP (14x14 mm) - same 80-QFP (14x14 mm) - same 80-QFP (14x14 mm) - same 80-QFP (14x14 mm) - same
Core Architecture HCS12 16-bit CISC HCS12 16-bit CISC HCS12 16-bit CISC HCS12 16-bit CISC HCS12 16-bit CISC HCS12 16-bit CISC (D-family, dual CAN)
Maximum CPU Frequency 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
Flash Memory 16 KB 32 KB 32 KB 64 KB 128 KB 128 KB
RAM Size 1 KB 2 KB 2 KB 4 KB 8 KB 8 KB
Number of I/O Pins 60 60 60 60 60 60
Supply Voltage Range 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V
Lifecycle Status NRND NRND (check NXP PCN) NRND (check NXP PCN) NRND (check NXP PCN) NRND (check NXP PCN) NRND (check NXP PCN)

Wichtigste Unterscheidungsmerkmale

  • Cost-optimized 16-bit body-controller MCU with internal 5 V regulator (vs. MC9S12E128CFUE)
  • Single-supply operation from 2.97 V to 5.5 V (vs. MC9S12DJ128VFUE)
  • Full 80-QFP (14x14 mm) pin-compatible family upgrade path (vs. MC9S12GC32MFUE / MC9S12E128CFUE)

Designhinweise

The MC9S12GC16CFUE integrates a bandgap-based voltage regulator that generates the 2.5 V core VDD from the external 2.97 V to 5.5 V supply. Place the VDDR/VSS bulk-decoupling capacitor (typically 100 nF ceramic in parallel with 4.7 uF tantalum) within 5 mm of the VDDR pin per NXP layout recommendations. Estimated: at 25 MHz full-clock operation with all peripherals active, the core current draw typically stays under 50 mA; verify against the electrical-characteristics table in the datasheet for the chosen clock configuration and ambient temperature.

Follow NXP's reference layout for the PLL filter network (RFC, CP1, CP2) to minimize jitter. Estimated: typical RFC is around 100 ohm to 1 kohm depending on bus frequency, and CP1/CP2 are typically a few nF range - consult the MC9S12GC family reference manual for the exact values for your target E-clock. Keep the PLL filter traces short and isolated from noisy digital returns to maintain stable clock lock across -40C to +85C operation.

Use the BDM (Background Debug Mode) interface for in-circuit programming rather than relying on internal bootloader-only solutions; BDM preserves Flash erase windows and avoids accidental mass-erase during field updates. The 80-QFP package exposes standard BKGD, MODC, XCLKS, and RESET signals on dedicated pins that must remain accessible for production test. Place a 4.7 kohm pull-up on RESET and a 10 kohm pull on BKGD per the S12 family datasheet.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Unknown

RoHS, REACH, and AEC-Q100 status not present in the provided web data; consult the NXP product page environmental compliance section and the latest material declaration documents for authoritative answers before committing to automotive production designs.

Daten verifiziert am: 2026-10-21 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

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Verwandte Bauteile & Begriffe

NXP Semiconductors MC9S12GC16CFUE MC9S12GC32MFUE MC9S12D32MFUE MC9S12C64CFUE MC9S12E128CFUE MC9S12DJ128VFUE HCS12 16-bit microcontroller CISC automotive body control module CAN bus LIN bus 80-QFP package QFP family surface mount technology Flash memory RAM phase-lock loop RoHS AEC-Q100 instrument cluster HVAC controller lighting controller
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