MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP
Teilenummer: MC9S12DT256MFUE ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $26.1 | $261,00 |
| 100 | $23.75 | $2.375,00 |
| 500 | $21.4 | $10.700,00 |
| 1.000 | $19.2 | $19.200,00 |
MC9S12DT256MFUE Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash/ROM, RAM), and programmable peripherals. The HCS12 family belongs to the broader category of 16-bit embedded microcontrollers, sitting between 8-bit legacy MCUs (68HC11/HC08) and 32-bit ARM Cortex-M devices in NXP's automotive roadmap. Within the power-management and embedded hierarchy, the MC9S12DT256MFUE functions as an embedded processor and controller, integrating computation, non-volatile storage, and on-chip peripherals in a single package.
Key features of the MC9S12DT256MFUE include 256KB on-chip Flash, 12KB RAM, 4KB EEPROM, an HCS12 CPU12 core running up to 25MHz (some sources cite 50MHz core clock with 25MHz bus), up to 91 I/O ports, CAN 2.0 interface, SCI/SPI/IIC serial interfaces, 8-channel 16-bit PWM, 16-channel 10-bit ADC, and an integrated 4-channel BDLC (Byte Data Link Communication) module for LIN/J1850 body-comfort networking. The wide 2.35V-2.75V core supply (with 5V-tolerant I/O via VDDR/VSSR) supports automotive 12V-battery transient environments through external regulators.
Architecturally, the HCS12 core uses a CISC instruction set with background-debug mode (BDM), making in-circuit flash programming and on-chip debug straightforward. The die combines EEPROM emulation-friendly Flash, configurable timer modules (ECT, TIM), and an MSCAN module that simplifies Class B networking nodes such as body control modules (BCMs), instrument clusters, and door/seat/lighting nodes.
Typical applications include automotive body and chassis multiplexing (BCM, door modules, instrument clusters, HVAC, seat controllers), industrial CAN nodes, and LIN-mastered sub-networks. The wide operating temperature range and AEC-Q100-equivalent qualification tier make it suitable for under-hood and passenger-compartment deployments.
Designers should note that the 80-pin QFP package requires careful PCB layout for the exposed-pad thermal connection; decoupling must follow NXP's AN2.1B-style reference design with bulk + bypass capacitors on both core and I/O rails. The part is rated mature for endurance and is widely second-sourced through the Freescale-NXP legacy portfolio.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes beyond the standard manufacturer datasheet for engineers evaluating the MC9S12DT256MFUE in legacy automotive and industrial CAN designs.
Drop-in-Alternativen für MC9S12DT256MFUE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12DT256MFUE (gleiche Bauform und Footprint) – abweichend in Package, ADC, Supply Voltage, Operating Temperature, Debug Interface.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S12DT256CPVE
✅ Drop-In✓ Auf Lager
$20.85 / Stück
Datenblatt ansehen →MC9S12DT256VPVE
✅ Drop-In✓ Auf Lager
$25.87 / Stück
Datenblatt ansehen →MC9S12C64MFUE
✅ Drop-In✓ Auf Lager
$10.2 / Stück
Datenblatt ansehen →MC9S12B64CFUE
✅ Drop-In✓ Auf Lager
$10.1 / Stück
Datenblatt ansehen →MC9S12D64MFUER
✅ Drop-In✓ Auf Lager
$1.0524 / Stück
Datenblatt ansehen →MC9S12DT256MFUE Grenzwerte & elektrische Eigenschaften
| Core Architecture | HCS12 (CPU12), 16-bit CISC |
| Maximum CPU Frequency | 25 MHz |
| Flash Memory | 256 KB (256K x 8) |
| Datenbusbreite | 16-bit |
| Operating Supply Voltage (Core) | 2.35 V to 2.75 V |
| I/O Supply Voltage | 5V-tolerant I/O on VDDR/VSSR |
| Number of I/O Pins | 91 |
| Package Type | 80-QFP (PQFP/LQFP-80, 14x14 mm) |
| Montageart | Surface Mount |
| Terminal Form | GULL WING |
| Number of Terminals | 80 |
| Temperature Grade | Automotive |
| On-chip CAN Module | MSCAN (CAN 2.0A/B) |
| ADC | 16-channel, 10-bit (per family) |
| PWM Module | 8-channel 16-bit PWM |
| Communication Peripherals | SCI, SPI, IIC, BDLC |
MC9S12DT256MFUE 80-qfp (pqfp/lqfp-80, 14x14 mm) Pinbelegungsleitfaden
Pinbelegung für MC9S12DT256MFUE (80-qfp (pqfp/lqfp-80, 14x14 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC9S12DT256MFUE.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC9S12DT256MFUE ist geeignet für 7 Anwendungs: Automotive Body Control Module (BCM), Instrument Cluster Display Controller, CAN/LIN Gateway Node, HVAC Climate Control Module, Door Module / Seat Controller, Industrial CAN Sensor Hub, Battery Management Slave Module.
Automotive Body Control Module (BCM)
The MC9S12DT256MFUE's 256 KB Flash and 91 I/O pins make it ideal for body control modules that orchestrate lighting, door locks, mirrors, wipers, and accessory relays. Its 16-bit HCS12 core at 25MHz executes BCM firmware in real-time while the MSCAN module bridges chassis-CAN and body-CAN networks. The 80-QFP package provides enough pins to directly drive dozens of high-side/low-side FET drivers. Compared to lower-density D32 or C64 variants, the DT256's 256KB Flash supports full BCM diagnostic, CAN stack, and bootloader coexisting on-chip.
Empfohlen
Instrument Cluster Display Controller
The MC9S12DT256MFUE drives instrument clusters with stepper-motor gauges, LCD segments, and warning indicators. Its 8-channel 16-bit PWM module generates the precise waveforms needed for stepper-motor gauge drives, while the 16-channel 10-bit ADC reads fuel level, coolant temperature, and oil pressure sensors. The 256KB Flash stores graphics tables, gauge calibration curves, and diagnostic trouble code (DTC) logs. Designers select the DT256 over smaller C64 or D32 variants when cluster firmware plus CAN J1939 stacks exceeds 128KB code density.
Empfohlen
CAN/LIN Gateway Node
The MC9S12DT256MFUE's integrated MSCAN, SCI, SPI, and IIC peripherals enable it to function as a CAN-to-LIN gateway between body and comfort networks. With 256KB Flash, it holds the gateway translation table, network management firmware, and diagnostic UDS/KWP2000 stack. The 80-QFP package allows direct connection to multiple transceivers like TJA1050 (CAN) and TJA1027 (LIN). Compared to the MC9S12C64MFUE which has only 64KB Flash, the DT256 supports a full OBD-II UDS stack alongside gateway logic.
Empfohlen
HVAC Climate Control Module
The MC9S12DT256MFUE manages HVAC systems with multiple temperature sensors (via 16-channel 10-bit ADC), blower-motor PWM control (via 16-bit PWM module), and CAN/LIN communication with the BCM. The 256KB Flash stores cabin-temperature algorithms, blend-door actuator control loops, and zone-control calibration. Designers pick the DT256 over D32 or C64 variants when the climate firmware plus diagnostics plus CAN stack exceeds 128KB. The automotive -40C to +125C rating supports under-dash thermal environments.
Empfohlen
Door Module / Seat Controller
Distributed door and seat modules in modern vehicles use the MC9S12DT256MFUE to control window lifts, mirror actuators, seat-position motors, and memory functions. The 91 I/O pins connect directly to multiple relay drivers and H-bridge FET gates, while the MSCAN module handles body-CAN communication. The 256KB Flash supports seat-memory position tables, anti-pinch algorithms, and LIN sub-networking to local switches. The 80-QFP (14x14) is small enough to fit inside a door-cavity PCB.
Empfohlen
Industrial CAN Sensor Hub
Outside automotive, the MC9S12DT256MFUE functions as a robust CAN-attached sensor hub in industrial automation. The wide 2.35-2.75V core with 5V-tolerant I/O tolerates 24V industrial bus transients when paired with external regulators. The MSCAN module implements CANopen or DeviceNet stacks in 256KB Flash, while the 16-channel ADC reads multi-sensor arrays (temperature, pressure, vibration). Compared to consumer-grade 8-bit MCUs, the DT256's HCS12 core offers deterministic interrupt response critical for industrial control loops.
Empfohlen
Battery Management Slave Module
In 12V/48V mild-hybrid battery management, the MC9S12DT256MFUE acts as a Cell Monitoring Unit (CMU) slave. Its 16-channel 10-bit ADC reads individual cell voltages, while SPI links to a higher-voltage front-end AFE. The 256KB Flash holds cell-balancing algorithms, state-of-health (SoH) tables, and CAN diagnostics. The HCS12's deterministic BDM debug simplifies in-line firmware updates during battery-pack assembly. Compared to 32-bit ARM CM0 alternatives, the DT256's lower cost per node fits multi-cell arrays where many CMUs are deployed.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S12DT256MFUE – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S12DT256CPVE | MC9S12DT256VPVE | MC9S12C64MFUE | MC9S12B64CFUE | MC9S12D64MFUER |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 80-QFP (14x14 mm) | 112-LQFP (differ) | 112-LQFP (differ) | 80-QFP (14x14) - same | 80-QFP - same | 80-QFP - same |
| Core Architecture | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) |
| CPU Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 64 KB | 64 KB | 64 KB |
| CAN Module | MSCAN (CAN 2.0A/B) | MSCAN | MSCAN | MSCAN | MSCAN | MSCAN |
| Operating Voltage (Core) | 2.35 V to 2.75 V | 2.35 V to 2.75 V | 2.35 V to 2.75 V | 2.35 V to 2.75 V | 2.35 V to 2.75 V | 2.35 V to 2.75 V |
| Temperature Grade | Automotive (-40C to +125C) | Automotive | Automotive | Automotive | Automotive | Automotive (AEC-Q100) |
| Approx Unit Price (USD, qty 1) | 28.50 | 30.00 (est.) | 30.00 (est.) | 15.00 (est.) | 12.00 (est.) | 16.00 (est.) |
Wichtigste Unterscheidungsmerkmale
- Highest Flash density in 80-QFP HCS12 family (vs. MC9S12C64MFUE)
- Same-package footprint as smaller Flash variants (vs. MC9S12DT256CPVE)
- Automotive temperature grade (-40C to +125C) over industrial-only HCS12 variants (vs. MC9S12D64MFUER)
- On-chip MSCAN + BDLC for multi-bus automotive networking (vs. MC9S12B64CFUE)
Designhinweise
The MC9S12DT256MFUE requires two separate supply rails: a 2.5V core rail (VDD/VSSX) capable of delivering ~50mA peak, and a 5V I/O rail (VDDR/VSSR) capable of ~30mA plus the sourcing current of all driven I/O pins. Use a low-dropout regulator such as NXP's MC33761 or TLE4275 fed from the 12V automotive bus. Place 100nF X7R bypass capacitors within 5mm of every VDD/VDDR pin pair, plus a 4.7uF bulk tantalum or ceramic on each rail. Failure to decouple the I/O rail separately from the core rail causes MSCAN bit errors and ADC noise pickup per the NXP AN2.1B reference design.
Do not assume the on-chip voltage regulator (VREG) can drive the I/O ring directly. Many HCS12 derivatives have separate VDDR/VSSR that must be tied to 5V even when the core runs at 2.5V. Also, the BKGD (Background Debug Mode) pin is non-5V-tolerant in some revisions - confirm with the device errata before connecting to a 5V BDM pod. Finally, the BDLC module shares pins with the timer and PWM modules in some package variants - verify pin multiplexing in the Pinout section of the datasheet before assigning peripheral functions in firmware.
Lay out the 80-QFP (14x14) on a 4-layer PCB with a continuous ground plane beneath the package to provide both thermal dissipation and a low-impedance return for the high-frequency MSCAN and PWM signals. Place the CAN transceiver (TJA1050 or similar) within 25mm of the MSCAN pins to keep stub lengths short. Route the 16MHz or 8MHz external crystal traces symmetrically with ground guard traces on both sides, and keep the crystal within 10mm of the EXTAL/XTAL pins. Provide a 4.7k pull-up on the RESET pin per the NXP reference design.
Estimated: at maximum CPU activity on the 80-QFP package with theta_JA of approximately 50 C/W on a 4-layer JEDEC test board, the MC9S12DT256MFUE dissipates roughly 0.6W (Vdd=2.5V x 240mA active). Junction temperature rise above ambient is about 30C - well within the 125C limit. However, in sealed under-dash enclosures with limited airflow, derate by adding copper pours or thermal vias under the exposed die pad if available in your package variant.
The MC9S12DT256MFUE's MSCAN module requires a 1Mbps-capable CAN transceiver (e.g., TJA1050) and a twisted-pair bus with 120 ohm termination at each end. Keep the CANH/CANL trace length matched within 5mm to avoid common-mode noise. For LIN sub-nets using the BDLC or SCI, use a TJA1027 transceiver with the standard 1NBS master pull-up. If your design mixes CAN and LIN, isolate the two bus segments through separate transceiver rails to prevent cross-bus fault propagation.
Compliance-Informationen
RoHS/REACH/lead-free status not explicitly stated in verified web snippets - default to unknown. AEC-Q100 automotive qualification inferred from E suffix in ordering code and automotive temperature grade per NXP MC9S12DB-Family classification. Confirm with NXP compliance certificate at order time.
