NXP Semiconductors

MC9S12XD256VPV - 16-Bit HCS12X MCU 256KB Flash LQFP-112 | NXP

Teilenummer: MC9S12XD256VPV ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
2.35 V to 5.5 V Vdss LQFP-112 (20x20 mm) Package 80 MHz Speed 256 KB Flash Memory
Ab $15.2 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-19
Mengenpreise
Menge Stückpreis Gesamt
1 $24.5 $24,50
10 $22.1 $221,00
100 $19.8 $1.980,00
500 $17.45 $8.725,00
1.000 $15.2 $15.200,00
ℹ️ Alle Preise sind in USD

MC9S12XD256VPV Übersicht

The NXP (formerly Freescale) MC9S12XD256VPV is a 16-bit HCS12X microcontroller with 256 KB of on-chip Flash, 16 KB RAM and 4 KB EEPROM, packaged in a 112-pin LQFP (20x20 mm). It runs an enhanced HCS12X CPU core at up to 80 MHz bus clock with 32-bit internal arithmetic extensions for automotive body and chassis applications.

A microcontroller (MCU) is a single-chip computer integrating a CPU, memory (Flash/RAM/EEPROM), and a rich set of peripherals such as timers, ADC, PWM, CAN and SCI/UART/SPI/I2C. The HCS12X family extends the legacy 16-bit HCS12 with an XGATE co-processor and increased performance, sitting between classic 8-bit MCUs (e.g. HC08, S08) and higher-end 32-bit Power Architecture parts like the MPC56xx and Kinetis families in NXP's automotive hierarchy. The 'XD' derivative in particular doubles the XGATE channels to 80 and is widely adopted for body controllers, gateway nodes and industrial motion control.

Key features include 256 KB Flash with security, 16 KB RAM, 4 KB EEPROM, an XGATE co-processor delivering up to 80 MIPS of offloaded DSP-style I/O processing, dual CAN 2.0A/B controllers, an enhanced capture timer with 8 channels + 8 PWM, 16-channel 10-bit ADC, 8-channel 8-bit PWM and SCI/SPI/I2C interfaces. The part supports industrial-grade -40C to +85C operation and is well-suited to body electronics, instrument clusters, and LIN/CAN sub-nodes.

Typical applications include automotive body control modules, HVAC controllers, instrument cluster slaves, industrial CAN nodes, sensor interfaces and lighting/ECM controllers. Two independent CAN channels plus the XGATE co-processor make the XD256 particularly strong in gateway and network-bridging roles.

When designing with this MCU, ensure the BDM/debug pins are correctly pulled and that VDDR/VSS pair decoupling follows the datasheet reference layout. For low-EMI automotive layouts, place the 4 MHz crystal or resonator within 1 cm of the EXTAL/XTAL pins, and route the XCLKS/OCT route guarded by ground.

This page consolidates real-time distributor pricing, drop-in LQFP-112 alternatives, and engineering design notes not present in the manufacturer datasheet, providing an at-a-glance decision support layer for procurement and design engineers.

Drop-in-Alternativen für MC9S12XD256VPV – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12XD256VPV (gleiche Bauform und Footprint) – abweichend in ADC, Package, RAM, Core, Operating Temperature.

NXP Semiconductors
ADC: 2 x 8-channel, 10-bit
Package: 112-LQFP (20x20 mm)
RAM: 12 KB
Vergleichen mit MC9S12XD256VPV →
NXP Semiconductors
ADC: 12-bit, 3 us conversion time
Package: 144-LQFP (20 x 20 mm)
RAM: 32 KB
Vergleichen mit MC9S12XD256VPV →
NXP Semiconductors
ADC: 16-channel, 10-bit
Package: 144-LQFP (20x20 mm)
RAM: 12 KB
Vergleichen mit MC9S12XD256VPV →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S12XDP512VPV

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 LQFP-112 (20x20)
Flash doubled to 512 KB (+100%); otherwise identical LQFP-112 footprint

📋 Referenzalternative (nicht im Katalog)

MC9S12XD128VPV

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 LQFP-112 (20x20)
Flash halved to 128 KB (-50%); same LQFP-112 footprint, same XGATE

📋 Referenzalternative (nicht im Katalog)

MC9S12DT256VPVE

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 LQFP-112 (20x20)
HCS12 (16-bit CISC) · 25 MHz · 256 KB · 12 KB · 4 KB · 112-LQFP (20x20 mm) · 2.5 V core / 5.0 V I/O (typical) · 2 x 8-channel, 10-bit

✓ Auf Lager

$25.87 / Stück

Datenblatt ansehen →

MC9S12XHZ256VAG

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 LQFP-112 (20x20)
HCS12X (16-bit) · 80 MHz · 256 KB (256K x 8) · 12 KB · 144-LQFP (20x20 mm) · -40C to +105C (Automotive) · 144 · 4

✓ Auf Lager

$15.2 / Stück

Datenblatt ansehen →

MC9S12XEQ512CAG

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 LQFP-144
HCS12X (16-bit CISC) · XGATE (RISC, 2x bus speed) · 50 MHz · 512 KB (512K x 8) · 32 KB · 12-bit, 3 us conversion time · 1.8 V / 2.8 V / 5 V (multi-supply I/O)

✓ Auf Lager

$14.4 / Stück

Datenblatt ansehen →

MC9S12XD256VPV Grenzwerte & elektrische Eigenschaften

Core HCS12X (16-bit, XGATE co-processor)
Program Memory 256 KB Flash
RAM 128 KB
EEPROM 4 KB
Maximum Bus Frequency 80 MHz
Versorgungsspannung 2.35 V to 5.5 V
Betriebstemperatur -40C to +85C (industrial)
Gehäuse LQFP-112 (20x20 mm)
Montageart Surface Mount
CAN 2 x CAN 2.0A/B
Timers ECT (Enhanced Capture Timer, 8-ch)
PWM 8-channel 8-bit PWM
ADC 16-channel 10-bit ADC
Serial Interfaces SCI, SPI, I2C
RoHS-Status Compliant
MSL-Level 3 (168 hours)

MC9S12XD256VPV Pin-Konfiguration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 PE0/XADDR0 — Port E bit 0 / XADDR0 (external address)
Pin 2 PE1/XADDR1 — Port E bit 1 / XADDR1
Pin 3 PE2/XADDR2 — Port E bit 2 / XADDR2
Pin 4 PE3/XADDR3 — Port E bit 3 / XADDR3
Pin 5 VDDR — Voltage regulator power supply
Pin 6 VDD — Digital supply voltage
Pin 7 VSS — Ground
Pin 8 PE4/ECLKX — Port E bit 4 / ECLKX output
Pin 9 PE5 — Port E bit 5
Pin 10 PE6 — Port E bit 6
Pin 11 PE7 — Port E bit 7
Pin 12 BKGD — Background Debug Mode pin
Pin 13 MODC — Mode Select pin
Pin 14 RESET — External reset input, active low
Pin 15 TEST — Test mode pin (must be tied to VSS in normal operation)
Pin 16 VDDX — I/O supply voltage (5V tolerant)
Pin 17 VSSX — I/O ground
Pin 18 EXTAL — External crystal/oscillator input
Pin 19 XTAL — External crystal output
Pin 20 VSSPLL — PLL ground
Pin 21 VDDPLL — PLL supply
Pin 22 PAD0/AN0 — Port AD bit 0 / ADC analog input 0
Pin 23 PAD1/AN1 — Port AD bit 1 / ADC analog input 1
Pin 24 PAD2/AN2 — Port AD bit 2 / ADC analog input 2
Pin 25 PAD3/AN3 — Port AD bit 3 / ADC analog input 3
Pin 26 PAD4/AN4 — Port AD bit 4 / ADC analog input 4
Pin 27 PAD5/AN5 — Port AD bit 5 / ADC analog input 5
Pin 28 PAD6/AN6 — Port AD bit 6 / ADC analog input 6
Pin 29 PAD7/AN7 — Port AD bit 7 / ADC analog input 7
Pin 30 PAD8/AN8 — Port AD bit 8 / ADC analog input 8
Pin 31 PAD9/AN9 — Port AD bit 9 / ADC analog input 9
Pin 32 PAD10/AN10 — Port AD bit 10 / ADC analog input 10
Pin 33 PAD11/AN11 — Port AD bit 11 / ADC analog input 11
Pin 34 PAD12/AN12 — Port AD bit 12 / ADC analog input 12
Pin 35 PAD13/AN13 — Port AD bit 13 / ADC analog input 13
Pin 36 PAD14/AN14 — Port AD bit 14 / ADC analog input 14
Pin 37 PAD15/AN15 — Port AD bit 15 / ADC analog input 15
Pin 38 VDDA — ADC analog supply
Pin 39 VSSA — ADC analog ground
Pin 40 VRH — ADC high reference voltage
Pin 41 VRL — ADC low reference voltage
Pin 42 PM0 — Port M bit 0
Pin 43 PM1 — Port M bit 1
Pin 44 PM2 — Port M bit 2
Pin 45 PM3 — Port M bit 3
Pin 46 PM4 — Port M bit 4
Pin 47 PM5 — Port M bit 5
Pin 48 PM6 — Port M bit 6
Pin 49 PM7 — Port M bit 7
Pin 50 PJ0/KWUJ0 — Port J bit 0 / Key wake-up J0
Pin 51 PJ1/KWUJ1 — Port J bit 1 / Key wake-up J1
Pin 52 PJ2/KWUJ2 — Port J bit 2 / Key wake-up J2
Pin 53 PJ3/KWUJ3 — Port J bit 3 / Key wake-up J3
Pin 54 PJ4/KWUJ4 — Port J bit 4 / Key wake-up J4
Pin 55 PJ5/KWUJ5 — Port J bit 5 / Key wake-up J5
Pin 56 PJ6/KWUJ6 — Port J bit 6 / Key wake-up J6
Pin 57 PJ7/KWUJ7 — Port J bit 7 / Key wake-up J7
Pin 58 PP0/KWP0 — Port P bit 0 / Key wake-up P0
Pin 59 PP1/KWP1 — Port P bit 1 / Key wake-up P1
Pin 60 PP2/KWP2 — Port P bit 2 / Key wake-up P2
Pin 61 PP3/KWP3 — Port P bit 3 / Key wake-up P3
Pin 62 PP4/KWP4 — Port P bit 4 / Key wake-up P4
Pin 63 PP5/KWP5 — Port P bit 5 / Key wake-up P5
Pin 64 PP6/KWP6 — Port P bit 6 / Key wake-up P6
Pin 65 PP7/KWP7 — Port P bit 7 / Key wake-up P7
Pin 66 PK0 — Port K bit 0
Pin 67 PK1 — Port K bit 1
Pin 68 PK2 — Port K bit 2
Pin 69 PK3 — Port K bit 3
Pin 70 PK4 — Port K bit 4
Pin 71 PK5 — Port K bit 5
Pin 72 PK6 — Port K bit 6
Pin 73 PK7 — Port K bit 7
Pin 74 PA0 — Port A bit 0
Pin 75 PA1 — Port A bit 1
Pin 76 PA2 — Port A bit 2
Pin 77 PA3 — Port A bit 3
Pin 78 PA4 — Port A bit 4
Pin 79 PA5 — Port A bit 5
Pin 80 PA6 — Port A bit 6
Pin 81 PA7 — Port A bit 7
Pin 82 PB0 — Port B bit 0
Pin 83 PB1 — Port B bit 1
Pin 84 PB2 — Port B bit 2
Pin 85 PB3 — Port B bit 3
Pin 86 PB4 — Port B bit 4
Pin 87 PB5 — Port B bit 5
Pin 88 PB6 — Port B bit 6
Pin 89 PB7 — Port B bit 7
Pin 90 PC0 — Port C bit 0
Pin 91 PC1 — Port C bit 1
Pin 92 PC2 — Port C bit 2
Pin 93 PC3 — Port C bit 3
Pin 94 PC4 — Port C bit 4
Pin 95 PC5 — Port C bit 5
Pin 96 PC6 — Port C bit 6
Pin 97 PC7 — Port C bit 7
Pin 98 PS0/RXD0 — Port S bit 0 / SCI0 RXD
Pin 99 PS1/TXD0 — Port S bit 1 / SCI0 TXD
Pin 100 PS2/RXD1 — Port S bit 2 / SCI1 RXD
Pin 101 PS3/TXD1 — Port S bit 3 / SCI1 TXD
Pin 102 PS4/MISO0 — Port S bit 4 / SPI0 MISO
Pin 103 PS5/MOSI0 — Port S bit 5 / SPI0 MOSI
Pin 104 PS6/SCK0 — Port S bit 6 / SPI0 SCK
Pin 105 PS7/SS0 — Port S bit 7 / SPI0 SS
Pin 106 PT0/IOC0C — Port T bit 0 / IOC channel 0
Pin 107 PT1/IOC1C — Port T bit 1 / IOC channel 1
Pin 108 PT2/IOC2C — Port T bit 2 / IOC channel 2
Pin 109 PT3/IOC3C — Port T bit 3 / IOC channel 3
Pin 110 PT4/IOC4C — Port T bit 4 / IOC channel 4
Pin 111 PT5/IOC5C — Port T bit 5 / IOC channel 5
Pin 112 PT6/IOC6C — Port T bit 6 / IOC channel 6

Typische Anwendungen

MC9S12XD256VPV ist geeignet für 6 Anwendungs: Automotive Body Control Module, Industrial CAN Gateway / Bridge, Instrument Cluster Slave Controller, HVAC Climate Controller, Lighting and ECM Controller, Industrial Sensor Interface Node.

🚗

Automotive Body Control Module

The MC9S12XD256VPV is widely used in body control modules (BCMs) that manage lights, door locks, wipers, mirrors and HVAC actuators across a CAN/LIN sub-network. The dual CAN 2.0A/B controllers allow the BCM to act as a gateway between the high-speed powertrain CAN and the low-speed body CAN, while the XGATE co-processor off-loads CAN message processing, freeing the main CPU to run application logic. With 256 KB Flash and 128 KB RAM, the XD256 comfortably fits J1939 and AUTOSAR light implementations. Industrial temperature grade (-40C to +85C) supports the harsh thermal environment under the dashboard. Compared with smaller S12G sub-nodes, the XD256 provides the throughput required for gateway and diagnostic services, ensuring high-throughput CAN handling under BCM workloads.

🏭

Industrial CAN Gateway / Bridge

The MC9S12XD256VPV's two independent CAN 2.0A/B controllers plus XGATE co-processor make it an ideal CAN-to-CAN or CAN-to-UART gateway in industrial automation and CANopen networks. The XGATE can service incoming CAN frames at up to 1 Mbit/s with deterministic latency, allowing the gateway to filter, ID-map and forward frames without consuming main-thread bandwidth. Designers use the SPI and SCI channels to bridge to RS-485 or Ethernet transceivers, while the 16-channel 10-bit ADC handles analog sensor inputs from industrial cabinets. With 256 KB Flash and industrial temperature grade, this part is well-suited to PLCs, distributed I/O nodes and CANopen master/slave bridges, particularly in deterministic CAN handling at gateway boundaries.

📺

Instrument Cluster Slave Controller

The MC9S12XD256VPV serves as a slave MCU in instrument cluster designs where a host processor drives the display, but the MC9S12XD256VPV handles analog gauge sensing, switch debouncing, and warning lamp logic. Its enhanced capture timer (ECT) with 8 channels drives PWM dimming for backlight LEDs, while the 16-channel 10-bit ADC reads fuel level, oil pressure and temperature sensors. The XGATE off-loads time-critical PWM and ADC sequencing so the main CPU stays responsive to SPI messages from the host. Industrial temperature grade is required for under-dash thermal conditions. Compared with simpler S08 MCUs, the XD256 adds dual CAN, more Flash and XGATE for higher I/O density in clusters, providing high-resolution sensing and PWM dimming for instrument cluster subsystems.

❄️

HVAC Climate Controller

In automotive HVAC climate control modules, the MC9S12XD256VPV reads cabin NTC thermistors, ambient sensors and humidity sensors via the 16-channel ADC, drives the blend/air-mode stepper motors via PWM channels, and communicates with the BCM over CAN. The XGATE co-processor handles the multi-channel ADC scan sequence and PWM update without burdening the main CPU, enabling smooth air-mix transitions. The 256 KB Flash supports advanced control algorithms (PI loops, learned comfort settings) and CAN diagnostics. Industrial temperature grade ensures reliability in the dashboard thermal environment where ambient electric cost is a constant concern, supporting accurate closed-loop HVAC control across a wide temperature range.

💡

Lighting and ECM Controller

The MC9S12XD256VPV is used in lighting control modules (LCMs) and electronic control modules (ECMs) for body electronics. Its 8-channel 8-bit PWM drives LED strings for tail lamps, indicators and daytime running lights, while the ECT handles PWM dimming curves and turn-signal feedback. The XGATE can sequence multi-channel PWM without main CPU load, enabling smooth fading and animated lighting patterns. Dual CAN support allows the LCM to participate in both body CAN and diagnostic CAN. Compared with discrete PWM ICs, the XD256 integrates diagnostics, CAN and Flash in one package, reducing BOM cost for body-electronics modules, supporting synchronized multi-channel PWM for advanced lighting signatures.

🌐

Industrial Sensor Interface Node

Distributed industrial sensor nodes often use the MC9S12XD256VPV as a CANopen or DeviceNet slave controller, aggregating analog and digital sensor data and forwarding it upstream over CAN. The 16-channel 10-bit ADC reads analog sensors (pressure, flow, level), while the ECT captures pulses from flow meters or encoders. Industrial CANopen stacks (e.g. CANopenNode) fit within the 256 KB Flash with room for application logic. The dual CAN controllers allow redundant CAN channels for safety-critical nodes. Compared with low-end 8051-based sensor nodes, the XD256 adds deterministic flash execution and dual CAN for fail-safe industrial sensor networks, supporting redundant CAN for safety-critical industrial nodes.

What is the operating temperature range of MC9S12XD256VPV?
The MC9S12XD256VPV operates from -40C to +85C, meeting industrial temperature grade requirements per NXP product specifications. This range is suitable for automotive under-hood and industrial cabinet environments. The 'V' in the suffix marks industrial-grade; an automotive 'M' variant (MC9S12XD256MPV) supports -40C to +125C for under-hood or AEC-Q100 contexts.
How much Flash memory does MC9S12XD256VPV have?
The MC9S12XD256VPV includes 256 KB of on-chip Flash program memory, 4 KB of EEPROM for non-volatile data, and 128 KB of RAM. The Flash is organized as 256K x 8 with security and EEPROM emulation features. This memory hierarchy is well-matched to body-control and gateway firmware that needs both persistent configuration and fast working memory.
What package does MC9S12XD256VPV use?
The MC9S12XD256VPV is housed in a 112-pin LQFP package measuring 20x20 mm with gull-wing leads. The package code from the manufacturer is LQFP, terminal pitch 0.5 mm. The same die is also offered in 80-QFP (VAA) for lower-pin-count designs; the VPV is the highest-pin-count variant and exposes the full peripheral set.
Does MC9S12XD256VPV have a CAN interface?
Yes, the MC9S12XD256VPV integrates two independent CAN 2.0A/B controllers (MSCAN modules), making it ideal for automotive body networks, gateway nodes and industrial CANopen/J1939 stacks. Combined with the XGATE co-processor, the two CAN channels can be serviced without burdening the main CPU, freeing CPU cycles for application logic.
What is the difference between HCS12 and HCS12X in this MC?
HCS12X extends the classic HCS12 16-bit CPU by providing an XGATE co-processor that delivers up to 80 MIPS of offloaded I/O and DSP-style processing. The 'X' parts are pin-compatible with classic HCS12 in most packages but add the XGATE, additional RAM, and an enhanced interrupt controller. The XD256 specifically doubles the XGATE channel count over the XB family.
Where can I download the MC9S12XD256VPV datasheet PDF?
The official MC9S12XD256VPV datasheet is hosted by NXP at https://www.nxp.com/docs/en/data-sheet/MC9S12XD256.pdf (also referenced via alldatasheet). The reference manual and application notes are listed on NXP's product page under the HCS12X family documentation tree. Designers should also obtain the device errata document before finalizing firmware.
What is the best drop-in replacement for MC9S12XD256VPV?
The closest drop-in replacements are other S12XD-family derivatives in the LQFP-112 (PV) package. The MC9S12XDP512VPV is a higher-memory upgrade in the same package; the MC9S12XD128VPV is a lower-memory variant; the MC9S12XEQ512VPV is an XE-family part in the same footprint. All are NXP-manufactured and pin-to-pin compatible.
What is the difference between MC9S12XD256VPV and MC9S12XDP512VPV?
The MC9S12XDP512VPV doubles the Flash to 512 KB and increases RAM to 32 KB while remaining in the same LQFP-112 package and same XGATE architecture. The XD256 has 256 KB Flash and 128 KB RAM. For applications needing more code space without changing the PCB, the XDP512 is a drop-in upgrade; firmware can be migrated using the same S12X toolchain.
What development tools support MC9S12XD256VPV?
NXP provides CodeWarrior for S12X (legacy) and the current S32 Design Studio IDE (S12X) toolchain, plus the P&E Multilink and Cyclone programmers for BDM and JTAG debug. Third-party toolchains such as Cosmic Software, IAR and HCS12 work, also support this MCU. The XGATE requires the special 'XGATE' build target in CodeWarrior.
How do I find the pinout of MC9S12XD256VPV?
The LQFP-112 pinout is documented on page 2 of the NXP MC9S12XD256 datasheet (document MC9S12XD256.pdf). Pin 1 is identified by the dot marker at the top-left of the package. The pin map covers power pins (VDDR, VDDX, VDD, VSS), BDM (BKGD, MODC), XTAL/EXTAL, RESET, plus all GPIO/peripheral alternate functions.
Is MC9S12XD256VPV RoHS compliant?
Yes, the MC9S12XD256VPV is RoHS compliant per NXP's product declaration. It is also lead-free (Pb-free) and is supplied on tape-and-reel in compliance with IPC-7531 standards. For REACH and conflict-minerals status, refer to NXP's environmental compliance page; this part does not contain SVHC substances above threshold limits.
What is the lead time for MC9S12XD256VPV?
Lead time for MC9S12XD256VPV is typically 8-12 weeks when ordered from NXP directly. As of 2026-10-19, distributor stock exists at DigiKey Marketplace via Rochester Electronics and at LCSC Electronics (C5669220). For urgent order quantities, Rochester Electronics is authorized to supply legacy and active NXP/Freescale parts.
What is the price of MC9S12XD256VPV as of 2026-10-19?
As of 2026-10-19, MC9S12XD256VPV prices start around USD 24.50 at qty-1 from authorized distributors, with volume breaks near USD 15.20 at qty-1000. LCSC (C5669220) lists competitive pricing for prototype quantities. Final pricing depends on contract; for OEM volumes, request a quote directly from NXP authorized distributors.
Can MC9S12XEQ512CAG replace MC9S12XD256VPV?
The MC9S12XEQ512CAG uses the LQFP-144 package, not the LQFP-112 of the MC9S12XD256VPV, so it is NOT a pin-to-pin drop-in replacement. It is functionally similar (HCS12X core, 512 KB Flash, XGATE), but PCB rework is required. For a same-footprint upgrade within the XD family, use MC9S12XDP512VPV or MC9S12XD512VPV (LQFP-112).
Which NXP equivalent is best for a body-control application?
For body-control modules in automotive networks, the MC9S12XD256VPV itself is a strong choice because it offers dual CAN plus XGATE for offloaded I/O. If more Flash is needed, the MC9S12XDP512VPV is a drop-in upgrade in the same LQFP-112 package. For lower-cost sub-nodes, the MC9S12XB256 or MC9S12G128 in QFP packages offer reduced peripheral sets.

Technische Referenzdaten für MC9S12XD256VPV – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MC9S12XD256VPV when you need a 16-bit HCS12X MCU with XGATE co-processor and dual CAN in a 112-pin LQFP for automotive body control, gateway, lighting, HVAC or industrial CAN nodes. The 256 KB Flash and 128 KB RAM balance code size, CAN buffering and RTOS usage without external memory. For higher code density in the same footprint, upgrade to MC9S12XDP512VPV (512 KB Flash). For lower-cost sub-nodes without XGATE, the MC9S12DT256VPVE is pin-compatible but lacks XGATE. For cost-sensitive clusters or lighting, the MC9S12XD128VPV (128 KB Flash) or MC9S12G128 (QFP) provide reduced memory and pin count. The MC9S12XEQ512CAG is a higher-pin-count variant (LQFP-144) with 5 MSCAN channels; use it for complex gateways, but it requires PCB rework since the footprint differs.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S12XDP512VPV MC9S12XD128VPV MC9S12DT256VPVE MC9S12XHZ256VAG MC9S12XEQ512CAG
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package LQFP-112 (20x20) LQFP-112 (20x20) - same LQFP-112 (20x20) - same LQFP-112 (20x20) - same LQFP-112 (20x20) - same LQFP-144 - different
Flash Memory 256 KB 512 KB 128 KB 256 KB 256 KB 512 KB
RAM 128 KB 32 KB 16 KB 12 KB 16 KB 32 KB
EEPROM 4 KB 4 KB 4 KB 4 KB 4 KB 4 KB
CPU Core HCS12X + XGATE HCS12X + XGATE HCS12X + XGATE HCS12 (no XGATE) HCS12X + XGATE HCS12X + XGATE
CAN Channels 2 x MSCAN 3 x MSCAN 2 x MSCAN 2 x MSCAN 2 x MSCAN 5 x MSCAN
Maximum Bus Frequency 80 MHz 80 MHz 80 MHz 25 MHz 80 MHz 80 MHz
Operating Temperature -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C

Wichtigste Unterscheidungsmerkmale

  • XGATE co-processor for offloaded I/O processing (vs. MC9S12DT256VPVE)
  • Higher RAM for XC0-grade memory architecture (vs. MC9S12XD128VPV)
  • Same LQFP-112 footprint with Flash upgrade path (vs. MC9S12XDP512VPV)
  • Dual MSCAN for gateway/CAN-bridging (vs. MC9S12G128 (single MSCAN))

Designhinweise

The MC9S12XD256VPV requires careful power decoupling. Place a 100 nF ceramic capacitor on each VDD/VSS pair as close as possible to the pins (within 2 mm). Add bulk 4.7 uF to 10 uF tantalum or ceramic capacitors on the main VDD rail. The on-chip voltage regulator (VDDR) requires a 1 uF to 4.7 uF decoupling cap on the VDDR pin for PLL noise rejection. Separate VDDX/VSSX (I/O supply) and VDDA/VSSA (analog supply) decoupling is critical for ADC accuracy; route VDDA through a ferrite bead from VDDX if a common supply is used.

Place the 4-16 MHz crystal or resonator within 1 cm of the EXTAL/XTAL pins, with the load capacitors (typically 10-22 pF) co-located. Guard the XTAL traces with a ground pour and avoid routing signal traces under the crystal to avoid EMC issues. For BDM debug, route the BKGD and MODC pins to a 2x5 header with proper ESD protection. The LQFP-112 thermal pad (if exposed) should be soldered to a ground copper pour with thermal vias for heat dissipation.

Common pitfalls: (1) Forgetting to tie TEST pin to VSS - leaving it floating causes unpredictable behavior or test mode entry. (2) Missing reset pull-up on RESET pin - the internal pull-up is weak; add an external 4.7 kohm to VDDR. (3) Not configuring the PLL filter capacitor on the VDDPLL/VSSPLL pair - PLL jitter causes bus errors. (4) Using BDM in secure mode without unlocking - firmware may be locked inadvertently if security bits are set early. (5) Exceeding 5.5V on VDDX will damage the I/O; if using a 12V automotive supply, add a 5V regulator upstream.

For long CAN bus stubs, terminate with 120 ohm at each end of the bus. Use a twisted pair and keep stubs shorter than 0.3 m to avoid reflections. The MC9S12XD256VPV's MSCAN bit timing must be configured to match the bus length and baud rate; use NXP's CAN timing calculator tool. For SPI buses above 4 MHz, use series 33 ohm resistors near the MCU pins to dampen ringing on long PCB traces.

Estimated: at typical automotive body-control workloads (CPU + XGATE at 50% utilization), the MC9S12XD256VPV draws ~80 mA from 5V, dissipating ~400 mW. The LQFP-112 with a standard 4-layer PCB has theta_JA ~ 35 C/W, producing a 14C junction rise at 25C ambient - well within limits. For sealed enclosures with limited airflow, derate the supply voltage to 3.3V where possible to reduce dissipation by 56%.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

RoHS and lead-free per NXP product declaration. The VPV suffix is industrial-grade (-40C to +85C); for AEC-Q100 automotive qualification, choose the MC9S12XD256MPV variant with M-suffix. REACH SVHC and conflict-minerals status compliant per NXP environmental disclosure.

Daten verifiziert am: 2026-10-19 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

MC9S12XD256VPV MC9S12XD256VPV datasheet NXP HCS12X 256KB flash MCU S12XD LQFP-112 microcontroller 16-bit MCU dual CAN XGATE MC9S12XD256VPV body control module MC9S12XD256VPV vs MC9S12XDP512VPV MC9S12XD256VPV drop-in replacement MC9S12XD256VPV buy online what is XGATE co-processor MC9S12XD256VPV pinout LQFP-112 Freescale HCS12X automotive MCU MC9S12XD256VPV price 1pcs

Verwandte Bauteile & Begriffe

NXP Semiconductors Freescale Semiconductor MC9S12XD256VPV MC9S12XDP512VPV MC9S12XD128VPV MC9S12DT256VPVE MC9S12XHZ256VAG MC9S12XEQ512CAG HCS12X HCS12 XGATE microcontroller MCU 16-bit MCU automotive body control module CAN 2.0 MSCAN LQFP-112 LQFP-144 RoHS REACH AEC-Q100 BDM (Background Debug Mode) PLL Flash memory
Schnellangebot-RFQ
Geben Sie alle Details an – unser Vertriebsteam antwortet innerhalb von 24 Stunden
Teilenummer Hersteller Gehäuse QTY Zielpreis Gesamt
Gesamt: $0.00 USD
✓
Angebotsanfrage gesendet!

Wir antworten innerhalb von 24 Stunden auf Ihre E-Mail

1
RFQ gesendet
2
Angebot erhalten
3
Bestellung aufgegeben
4
Zahlung
5
Versandt
6
Geliefert
RFQ-Details ansehen