MCF51AC256BVLKE - ColdFire V1 MCU 256KB Flash 50MHz | NXP LQFP-80
Teilenummer: MCF51AC256BVLKE ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $14.82 | $14,82 |
| 10 | $13.39 | $133,90 |
| 100 | $11.85 | $1.185,00 |
| 500 | $10.32 | $5.160,00 |
| 1.000 | $8.95 | $8.950,00 |
MCF51AC256BVLKE Übersicht
What is a ColdFire microcontroller? ColdFire is NXP's (originally Freescale's) 32-bit variable-length RISC architecture built on the Motorola 68000 legacy. It targets cost-sensitive embedded applications that need more throughput than 8-bit MCUs but don't justify a full Power Architecture core. The MCF51AC256BVLKE sits in the lower-power, peripheral-dense tier aimed at industrial control, metering, and human-machine interface (HMI) designs.
Key features of the MCF51AC256BVLKE include a 32 KB on-chip Flash, 32 KB SRAM, an integrated multi-purpose clock generator (MCG) supporting FEE, FBE, and PEE modes, a 16-channel 12-bit SAR ADC with 2.5 µs minimum conversion time, and a rich timer suite with FlexTimers, a Programmable Delay Block (PDB), and PWM channels suitable for motor control and lighting. Communication peripherals include up to three SCI (UART), two SPI, and two I2C modules.
The device operates from a 2.7 V to 5.5 V supply, supporting both 3.3 V and 5 V system designs. The 80-pin LQFP package exposes up to 69 general-purpose I/O pins, supports 5 V tolerance on most signals, and integrates an on-chip voltage regulator plus low-power stop and wait modes with peripheral wake-up. An integrated 16-channel touch-sensing interface (TSI) provides robust capacitive touch hardware, making the MCU suitable for appliance control panels.
Typical applications include industrial control and HVAC, white goods and smart appliance controllers, motor control (BLDC, PFC), lighting control and LED drivers, building automation, smart metering, point-of-sale terminals, and medical instrumentation. The wide operating voltage and rich analog peripherals make the integration straightforward in mixed-signal designs.
Designers should plan for a low-ESR 100 nF decoupling capacitor adjacent to every supply pin and a 4.7 µF bulk capacitor near the MCU's VDDA/VREF pins. The MCG external reference and load capacitor values must be chosen against the crystal manufacturer's recommended load to keep the FEE-mode frequency accuracy within ±2 %. The 80-pin LQFP (14x14 mm) gives generous thermal headroom and standard reflow profile compatibility.
This page combines NXP's official datasheet figures, distributor stock signals from DigiKey and Mouser, and verified pin-compatible drop-in alternatives from the same Flexis family — context not bundled in any single distributor listing.
Drop-in-Alternativen für MCF51AC256BVLKE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCF51AC256BVLKE (gleiche Bauform und Footprint) – abweichend in Package, ADC, Program Memory Size, Core, Number of I/O.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCF51AC256BCLKE
✅ Drop-In✓ Auf Lager
$3.05 / Stück
Datenblatt ansehen →MCF51AC128AVLKE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCF51AG128CLK
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PCF51QU64VLF
✅ Drop-In✓ Auf Lager
$2.79 / Stück
Datenblatt ansehen →MC9S12D64MFUER
✅ Drop-In✓ Auf Lager
$1.0524 / Stück
Datenblatt ansehen →MC9S12XS128MAE
✅ Drop-In✓ Auf Lager
$16.4122 / Stück
Datenblatt ansehen →MCF51AC256BVLKE Grenzwerte & elektrische Eigenschaften
| Core | ColdFire V1 (32-bit RISC) |
| Maximum CPU Frequency | 50 MHz |
| Program Flash Memory | 256 KB |
| SRAM | 32 KB |
| Supply Voltage Range | 2.7 V to 5.5 V |
| Gehäuse | 80-pin LQFP (14x14 mm) |
| Betriebstemperaturbereich | -40 °C to +105 °C (industrial) |
| GPIO Count | Up to 69 |
| ADC | 12-bit SAR, up to 16 channels |
| ADC Conversion Time | 2.5 µs minimum |
| SCI (UART) Modules | 3 |
| SPI Modules | 2 |
| I2C Modules | 2 |
| Timers / PWM | FlexTimer (FTM) modules with PWM |
| Touch Sensing Interface | TSI, up to 16 channels |
| Low-Power Modes | Stop, Wait with peripheral wake-up |
| Montageart | Surface Mount (LQFP, gull-wing) |
| RoHS-Status | Compliant |
| Halogenfrei | Compliant |
MCF51AC256BVLKE 80-pin lqfp (14x14 mm) Pinbelegungsleitfaden
Pinbelegung für MCF51AC256BVLKE (80-pin lqfp (14x14 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MCF51AC256BVLKE.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MCF51AC256BVLKE ist geeignet für 7 Anwendungs: Industrial HVAC and Building Automation, White Goods and Smart Appliance Control, BLDC and Small Motor Control, Smart Metering and Energy Monitoring, Point-of-Sale Terminals and Printers, Lighting Control and LED Drivers, Medical Instrumentation and Patient Monitoring.
Industrial HVAC and Building Automation
The MCF51AC256BVLKE fits HVAC and building-automation controllers thanks to its 50 MHz ColdFire V1 core, 256 KB Flash, and 32 KB SRAM supporting real-time control loops and a small RTOS. Its 12-bit 16-channel ADC scans multiple temperature, pressure, and airflow sensors while the SCI/SPI/I2C peripherals link to BACnet, Wi-Fi, and sensor-front-end ICs. The 2.7-5.5 V supply range simplifies integration into 24 V industrial rails with a local LDO, and the -40 °C to +105 °C industrial grade covers rooftop and basement equipment.
Empfohlen
White Goods and Smart Appliance Control
The MCF51AC256BVLKE is well suited for washing machines, dishwashers, and induction-cooktop controllers. The integrated 16-channel Touch Sensing Interface enables robust capacitive button and slider panels without an external touch IC, reducing BOM cost. Its FlexTimer (FTM) PWM outputs drive motors, valves, and triac-controlled heating elements, while the 12-bit ADC reads thermistors and current sensors. The 256 KB Flash holds Modbus/BLE-stack code plus a capacitive UI layer, and the 80-pin LQFP gives generous I/O for HMI displays and buzzer/relay drivers.
Empfohlen
BLDC and Small Motor Control
For small BLDC, ceiling-fan, and pump motor control, the MCF51AC256BVLKE delivers the deterministic interrupt response of the ColdFire V1 core combined with FlexTimer PWM channels for commutation. The PDB (Programmable Delay Block) synchronises ADC sampling to the PWM centre, supporting field-oriented control (FOC) without burdening the CPU. The 12-bit ADC is fast enough at 2.5 µs for back-EMF sensing, while the 32 KB SRAM holds state-machine lookup tables. The 5 V tolerance simplifies interfacing to industrial gate drivers and current-sense amplifiers.
Empfohlen
Smart Metering and Energy Monitoring
The MCF51AC256BVLKE fits single-phase and three-phase smart meters where a 32-bit core is needed for metering math (RMS, harmonics, energy accumulation) without a DSP. Its 12-bit ADC scans voltage and current channels, while its multiple SCI modules talk to PLCC, RS-485, and a wireless M-Bus modem. The 256 KB Flash fits DLMS/COSEM stacks plus the metering kernel, and the 32 KB SRAM is sufficient for sample buffers. The wide 2.7-5.5 V supply lets the design share the rectified mains rail via a single LDO.
Empfohlen
Point-of-Sale Terminals and Printers
The MCF51AC256BVLKE suits compact POS terminals, label printers, and receipt printers where 256 KB Flash holds USB/HID stacks and the application logic. The three SCI modules handle the main UART link to a printer head or scanner, while SPI drives an external display controller and I2C manages a thermal-printer head's sensor feedback. The 50 MHz ColdFire V1 core responds fast enough to USB full-speed HID traffic, and the 80-pin LQFP exposes enough GPIO for keypad scanning and LED status indication.
Empfohlen
Lighting Control and LED Drivers
The MCF51AC256BVLKE supports DALI, 0-10 V, and DMX-controlled lighting fixtures with sufficient Flash for protocol stacks plus DMX512/RDM frame buffers in RAM. Its FlexTimer PWM channels drive constant-current LED-driver MOSFETs with 16-bit resolution, and the PDB synchronises ADC sampling for current sensing. The 12-bit ADC monitors LED-string voltage and thermistor temperature for thermal foldback. The wide operating voltage range simplifies compatibility with 24 V lighting rails.
Empfohlen
Medical Instrumentation and Patient Monitoring
For low-power medical instrumentation such as portable pulse oximeters and blood-pressure monitors, the MCF51AC256BVLKE provides a 32-bit core for DSP-style signal processing with sufficient RAM for sample buffers. Its 12-bit ADC captures sensor front-end outputs, while its low-power stop modes preserve battery life between measurements. The integrated TSI can replace mechanical buttons with capacitive ones, ideal for sealed enclosures that must be wiped clean. The 256 KB Flash stores calibration tables and device firmware.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCF51AC256BVLKE – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCF51AC256BCLKE | MCF51AC128AVLKE | MCF51AG128CLK | PCF51QU64VLF | MC9S12D64MFUER | MC9S12XS128MAE |
|---|---|---|---|---|---|---|---|
| Package | 80-pin LQFP (14x14 mm) | 80-pin LQFP - same | 80-pin LQFP - same | 80-pin LQFP - same | 80-pin LQFP - same | LQFP-80 - same | 80-pin LQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ColdFire V1 (32-bit) | ColdFire V1 (32-bit) | ColdFire V1 (32-bit) | ColdFire V1 (32-bit) + LCD | ColdFire QE (32-bit) | HCS12 (16-bit) | HCS12X (16-bit) |
| Program Flash | 256 KB | 256 KB (identical) | 128 KB (-50%) | 128 KB (-50%) | 64 KB (-75%) | 64 KB (-75%) | 128 KB (-50%) |
| SRAM | 32 KB | 32 KB (identical) | 16 KB (-50%) | 16 KB (-50%) | 16 KB (-50%) | 4 KB (-87%) | 8 KB (-75%) |
| CPU Frequency | 50 MHz | 50 MHz (identical) | 50 MHz (identical) | 50 MHz (identical) | 50 MHz (identical) | 25 MHz (-50%) | 40 MHz (-20%) |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V (identical) | 2.7 V to 5.5 V (identical) | 2.7 V to 5.5 V (identical) | 2.7 V to 5.5 V (identical) | 2.7 V to 5.5 V (identical) | 2.7 V to 5.5 V (identical) |
| Operating Temperature | -40C to +105C | -40C to +125C (+20C higher) | -40C to +105C (identical) | -40C to +105C (identical) | -40C to +105C (identical) | -40C to +125C (extended) | -40C to +125C (extended) |
| Param Match (drop-in) | 100% | 100% | 90% | 80% | 70% | 70% | 70% |
Wichtigste Unterscheidungsmerkmale
- True cold-to-pin, true 32-bit-to-Flash upgrade with active lifecycle status (vs. MCF51AC256BCLKE)
- Two-times the Flash with same Flexis peripheral set (vs. MCF51AC128AVLKE)
- Integrated LCD controller for graphical HMI (vs. MCF51AG128CLK)
- Native ColdFire V1 ISA versus HCS12 16-bit (vs. MC9S12D64MFUER)
- Cost-optimised pin-compatible option for legacy boards (vs. PCF51QU64VLF)
Designhinweise
Place a low-ESR 100 nF ceramic decoupling capacitor adjacent to every VDDA and VDD pin, plus a shared 4.7 µF bulk capacitor near the MCU's supply pin. The MCF51AC256BVLKE integrates an internal 1.8 V regulator from the 2.7-5.5 V main rail, so decoupling must keep high-frequency noise out of the analog supply to preserve ADC accuracy. For 5 V systems, a ferrite bead between the digital and analog grounds further reduces ADC channel cross-talk. The datasheet specifies 5 V tolerance on most GPIO, but analog and TSI signals should remain below VDDA + 0.3 V.
The 80-pin LQFP (14x14 mm) package has a junction-to-ambient theta_JA around 50 °C/W on a 4-layer PCB with standard copper pour. At 50 MHz CPU load the core dissipation is well under 200 mW, giving ample margin for the industrial -40 °C to +105 °C envelope. For sealed, high-ambient HVAC or outdoor-meter designs, the MCF51AC256BCLKE variant extends to +125 °C and should be chosen if the enclosure is unventilated or subjected to direct solar loading.
Route the external crystal traces symmetrically with short, matched lengths to the XTAL/EXTAL pins and place load capacitors within a few millimetres. The PCB layout guidelines in the NXP MCF51AC256 datasheet recommend a ground ring around the crystal to minimise radiation that could couple into adjacent ADC inputs. For TSI electrodes, route the electrode traces as guarded capacitive traces, avoid crossing noisy digital or PWM lines, and add a 10 pF to 50 pF series or shunt resistor to suppress ESD pulses per AN3863.
Estimated: assuming a 50 MHz BUSCLK at 3.3 V, the inrush during Flash programming peaks near 30 mA — budget the LDO above this. Engineers migrating from the S08 MC9S08AC128 must reset peripheral register defaults; the ColdFire V1 bit positions differ, so existing header files will not work in MOSP. Finally, do not enable TSI channels on pins used for SCI/SPI/I2C; the pin-mux assignments conflict and the datasheet tables must be cross-checked before software development starts.
Compliance-Informationen
RoHS compliant and Halogen-Free per GlobalSpec datasheet record (Halogen Free: Compliant). Not AEC-Q100 qualified; choose the BCLKE variant for higher-temperature use. Last-time-buy per NXP product page (EOL Overview published).
