MC9S08AC128MLKE - 128KB Flash 8-bit S08 MCU | NXP
Teilenummer: MC9S08AC128MLKE ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.65 | $76,50 |
| 100 | $6.8 | $680,00 |
| 500 | $6.1 | $3.050,00 |
| 1.000 | $5.45 | $5.450,00 |
MC9S08AC128MLKE Übersicht
An 8-bit MCU (microcontroller unit) is a single-chip computer that integrates a CPU, memory, and peripherals. The S08 family is built around the HCS08 CPU, a CISC architecture optimized for low power and deterministic interrupt response. The MC9S08AC128MLKE belongs to the Flexis series of pin-compatible 8-bit/32-bit duos, allowing designers to migrate between 8-bit S08 and 32-bit ColdFire V1 devices on the same PCB footprint for scalability.
Key features include 128 KB of Flash program memory with security, 8 KB of RAM, an internal 20 MHz bus, 38 GPIO pins, multiple serial communication interfaces (SCI, SPI, IIC), a 16-channel 10-bit ADC, timers including PWM, and a real-time counter. The supply voltage range of 2.7 V to 5.5 V supports both 3.3 V and 5 V system designs. The peripheral set is suited to embedded system designers balancing cost, power, and code density in industrial or consumer applications.
Architecturally, the device uses a Von Neumann-style bus with a 20 MHz internal bus frequency derived from a 40 MHz CPU clock. The Flash controller supports in-application programming and EEPROM emulation, while the on-chip voltage regulator and power-management module reduce active and standby current. The integrated ColdFire-compatible interrupt controller and background debug module simplify firmware development and field updates.
Typical end uses include desiccant-free home appliances, industrial control modules, smart sensor nodes, low-cost motor control, and battery-powered metering equipment. The 128 KB Flash and rich peripheral set also support protocol stacks for LIN-connected automotive body modules and small display controllers.
When designing with this MCU, ensure the SWD/BDM debug interface is brought out to a header for in-circuit firmware updates. The internal 20 MHz bus must be respected when configuring peripheral clocks, and unused GPIO should be configured as outputs to minimize current draw. Designers should also note that the device is in NXP's End-of-Life notice cycle and should plan LONIER alternative sourcing using other members of the S08AC family.
This page synthesizes distributor pricing, drop-in S08AC family alternatives, and practical design notes not found in the standalone datasheet, helping engineers evaluate pin-compatible replacements for EOL planning.
Drop-in-Alternativen für MC9S08AC128MLKE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08AC128MLKE (gleiche Bauform und Footprint) – abweichend in ADC, Package, Mounting Type, RoHS Status, Core.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S08AC128CLKE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08AC128MKKE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08AC96MLKE
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MC9S08AC64MLKE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08AC32MLKE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCF51AC256BVLKE
✅ Drop-In✓ Auf Lager
$8.95 / Stück
Datenblatt ansehen →MC9S08AC128MLKE Grenzwerte & elektrische Eigenschaften
| Core | HCS08 (S08 CISC) |
| Datenbusbreite | 8 bit |
| CPU Clock Frequency | 40 MHz |
| Internal Bus Frequency | 20 MHz |
| Program Memory Size | 128 KB Flash |
| RAM Size | 8 KB |
| Supply Voltage Range | 2.7 V to 5.5 V |
| GPIO Pins | 38 |
| Gehäuse | 80-LQFP (14x14 mm) |
| Betriebstemperaturbereich | -40 C to +125 C |
| ADC | 10-bit, 16 channels |
| Communication Interfaces | SCI, SPI, IIC |
| Timers/PWM Channels | Multiple 16-bit, including PWM |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Lebenszyklusstatus | End of Life (EOL notice issued) |
MC9S08AC128MLKE 80-lqfp (14x14 mm) Pinbelegungsleitfaden
Pinbelegung für MC9S08AC128MLKE (80-lqfp (14x14 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC9S08AC128MLKE.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC9S08AC128MLKE ist geeignet für 7 Anwendungs: Industrial Control Modules, Home Appliance Controllers, Automotive Body Electronics (LIN Nodes), Smart Sensor Hubs, Low-Cost Motor Control, Battery-Powered Metering, Human-Machine Interface (HMI) Panels.
Industrial Control Modules
The MC9S08AC128MLKE suits industrial control modules requiring deterministic 8-bit processing with ample code space for state machines and protocol stacks. The 40 MHz HCS08 core executes control loops well within millisecond budgets, while 128 KB Flash holds application code plus bootloader for field updates. Its 38 GPIO pins drive relays, optocouplers, and indicator LEDs without external muxing, and the 2.7 V to 5.5 V supply range accepts 24 V-rectified industrial rails with simple LDO regulation. The 10-bit ADC with 16 channels handles sensor inputs for temperature, pressure, or current sensing directly. Industrial designers benefit from the SCI/SPI/IIC peripherals for connecting to HMI displays, sensor front-ends, and fieldbus transceivers.
Empfohlen
Home Appliance Controllers
White goods and small home appliances benefit from the MC9S08AC128MLKE's balance of cost, peripherals, and code density. The 128 KB Flash accommodates motor-control state machines, user-interface handling, and safety logic for washing machines, dishwashers, and induction cooktops. PWM channels drive triac-fired heater elements or BLDC motor commutation, while the 16-channel ADC reads thermistor, current-sense, and water-level sensors. The SCI module supports LIN connectivity for inter-module communication in appliance networks. Low-power standby modes, plus the 2.7 V to 5.5 V supply tolerance, enable direct connection to rectified mains rails after a simple LDO, reducing BOM cost in cost-sensitive appliance designs.
Empfohlen
Automotive Body Electronics (LIN Nodes)
Automotive body modules such as door controllers, mirror adjusters, and seat-position nodes use the MC9S08AC128MLKE for its LIN-friendly SCI and small footprint. Although not AEC-Q100 qualified itself, the device is widely used in non-safety body ECUs where automotive-grade thermal tolerance (-40 C to +125 C, M suffix) and reliable Flash are required. The integrated LIN-capable UART, plus PWM for motor drive and ADC for current sensing, address typical body-control functions. Designers pair this MCU with a LIN transceiver such as the TJA1027 to build cost-optimized body nodes. EOL planning is critical here - designers should validate NXP's discontinuance notice and consider the MCF51AC256BVLKE ColdFire V1 upgrade for new designs.
Empfohlen
Smart Sensor Hubs
Battery-powered smart-sensor hubs leverage the MC9S08AC128MLKE's low-power modes, ADC channels, and serial interfaces. The 10-bit ADC with 16 channels can directly sample thermistors, photodiodes, and other analog sensors, while the IIC peripheral interfaces to digital sensors. With 128 KB Flash, the hub runs application logic plus small protocol stacks like Modbus RTU over SCI. The MCU's wide supply range (2.7 V to 5.5 V) supports direct connection to 3.3 V lithium battery packs or 5 V USB supplies, while multiple low-power modes extend battery life in intermittently active designs.
Empfohlen
Low-Cost Motor Control
Small BLDC and stepper motor controllers in fans, pumps, and small appliances use the MC9S08AC128MLKE for its PWM timers and ADC channels at an attractive price point. The PWM module generates complementary outputs with dead-time insertion for half-bridge drivers, while the ADC samples back-EMF or current-sense signals for sensorless or sensored commutation. The 128 KB Flash holds commutation tables and protection state machines, and 8 KB RAM is sufficient for control loop variables and stack. The 80-LQFP package provides enough GPIO for Hall-sensor inputs, fault inputs, and communication to a host controller over SCI or SPI.
Empfohlen
Battery-Powered Metering
Electricity, water, and gas metering endpoints leverage the MC9S08AC128MLKE's low-power operation, integrated ADC, and robust Flash for metering firmware. The 16-channel 10-bit ADC digitizes current-sensor outputs for metrology algorithms, while multiple low-power stop and wait modes extend battery life across multi-year deployments. The 128 KB Flash holds metrology libraries, calibration data, and optional wireless protocol stacks such as Wireless M-Bus or simple proprietary RF protocols via SPI. The wide supply voltage range supports direct battery connection, while 8 KB RAM is adequate for rolling averages and tamper event logs.
Empfohlen
Human-Machine Interface (HMI) Panels
Small HMI panels in industrial equipment, appliances, and building automation benefit from the MC9S08AC128MLKE's GPIO count, ADC channels, and SCI/SPI interfaces for display and touch handling. The 38 GPIO pins drive LED indicators, button matrices, or small character/graphic LCDs via SPI. The 10-bit ADC reads analog touch or rotary inputs, and SCI provides debug/console output during development. With 128 KB Flash and 8 KB RAM, the MCU runs menu state machines and protocol stacks (Modbus, CANopen via SPI external controller) while leaving room for future feature expansion.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S08AC128MLKE – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S08AC128CLKE | MC9S08AC128MKKE | MC9S08AC96MLKE | MC9S08AC64MLKE | MC9S08AC32MLKE | MCF51AC256BVLKE |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 80-LQFP (14x14) | 80-LQFP (14x14) - same | 80-LQFP (14x14) - same | 80-LQFP (14x14) - same | 80-LQFP (14x14) - same | 80-LQFP (14x14) - same | 80-LQFP (14x14) - same |
| Core | HCS08 (8-bit, 40 MHz) | HCS08 (8-bit, 40 MHz) | HCS08 (8-bit, 40 MHz) | HCS08 (8-bit, 40 MHz) | HCS08 (8-bit, 40 MHz) | HCS08 (8-bit, 40 MHz) | ColdFire V1 (32-bit, 50 MHz) |
| Flash Size | 128 KB | 128 KB | 128 KB | 96 KB (-25%) | 64 KB (-50%) | 32 KB (-75%) | 256 KB (+100%) |
| RAM Size | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 32 KB (+300%) |
| Operating Temperature | -40 C to +125 C (M grade) | -40 C to +85 C (C grade) | -40 C to +125 C (M grade) | -40 C to +125 C (M grade) | -40 C to +125 C (M grade) | -40 C to +125 C (M grade) | -40 C to +125 C (V grade) |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| GPIO Pins | 38 | 38 | 38 | 38 | 38 | 38 | 38 (Flexis pinout) |
| EOL Status (as of 2026-10-19) | EOL notice issued | EOL notice similar | EOL notice similar | EOL notice similar | EOL notice similar | EOL notice similar | Active (Flexis upgrade) |
Wichtigste Unterscheidungsmerkmale
- Largest Flash in S08AC family at 128 KB (vs. MC9S08AC96MLKE)
- Extended M-grade temperature range (vs. MC9S08AC128CLKE)
- Flexis series pin compatibility for upgrade (vs. MCF51AC256BVLKE)
- Full peripheral set including 16-channel ADC (vs. MC9S08SH32CTL574)
Designhinweise
Estimated: at 40 MHz CPU clock with 3.3 V supply, core current draw is approximately 15-20 mA active, dropping to <5 uA in stop3 mode. Designers must add bulk decoupling (10 uF + 0.1 uF) close to the supply pins and ensure the reset pin has a proper POR capacitor. Always check the NXP EOL notice before starting new designs - this part has an active discontinuance order and last-time-buy deadlines.
Route the SWD/BDM debug interface (BKGD, RESET) to a 2-pin header for in-circuit firmware updates; both signals must be pulled according to the reference manual to avoid spurious resets. Place the external crystal or resonator within 5 mm of the XTAL pins and guard the traces with a ground ring to reduce EMI coupling. Keep analog ADC traces short and away from PWM switching signals; use a separate analog ground island if noise-sensitive measurements are required.
The MC9S08AC128MLKE has an NXP EOL notice; designers should immediately evaluate the MCF51AC256BVLKE ColdFire V1 drop-in upgrade (same 80-LQFP footprint, 32-bit core, more Flash/RAM) for new designs. For continuity of supply on existing designs, contact Rochester Electronics (authorized Freescale/NXP continuity distributor) and stock sufficient quantities during the last-time-buy window.
Estimated: enabling all peripherals (ADC, SCI, SPI, timers) at 40 MHz adds roughly 8-10 mA to the base consumption. Configure unused peripherals in their lowest-power disabled state and gate clock trees via the SOPT and SCGC registers documented in the reference manual. Use the internal voltage regulator's low-power modes rather than external LDO switching to minimize quiescent current during standby.
Compliance-Informationen
RoHS compliant per NXP product page. AEC-Q100 not qualified - this device is intended for industrial/automotive body (non-safety) applications. Halogen-free status not specified in verified data.
