NXP Semiconductors

MCF52213CAE50 - 32-Bit ColdFire V2 MCU 128KB Flash 50MHz | NXP

Teilenummer: MCF52213CAE50 ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
2.7 V to 3.6 V (typical 3.3 V) Vdss 64-LQFP (10x10 mm) Package 50 MHz Speed 128 KB (128K x 8) Memory
Ab $5.1 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-17
Mengenpreise
Menge Stückpreis Gesamt
1 $7.59 $7,59
10 $7.21 $72,10
100 $6.45 $645,00
500 $5.7 $2.850,00
1.000 $5.1 $5.100,00
ℹ️ Alle Preise sind in USD

MCF52213CAE50 Übersicht

The NXP MCF52213CAE50 is a 32-bit ColdFire V2 microcontroller featuring 128KB of Flash program memory, 8KB of SRAM, and a 50MHz CPU core, housed in a 64-pin LQFP package (10x10 mm). This member of the MCF5221x family integrates a USB On-The-Go (OTG) controller alongside a rich set of serial interfaces including up to three UARTs, one SPI port, and two I2C ports.

What is a ColdFire microcontroller? ColdFire is a 32-bit RISC-style microprocessor architecture originally derived from the Motorola 68000 family and developed by NXP/Freescale. ColdFire V2 is the second-generation core balancing code density with deterministic real-time performance, targeted at embedded applications requiring USB connectivity and industrial control. The ColdFire hierarchy walks from ColdFire V2 MCU -> ColdFire family -> 32-bit RISC microcontroller -> embedded processor, providing high-level language efficiency uncommon in legacy 8/16-bit cores.

Key features of the MCF52213CAE50 include 56 general-purpose I/O pins, four 32-bit timer/PWM units, a 10/100 Ethernet MAC option on related variants, integrated USB OTG with physical-layer interface, and on-chip debug via BDM (Background Debug Mode). The integrated Fast Ethernet and USB OTG blocks reduce bill-of-materials cost by eliminating external PHY controllers in basic designs.

The internal architecture pairs a ColdFire V2 variable-length instruction core with hardware Multiply/Accumulate (MAC) support, a unified 32-bit peripheral bus, and a tightly-coupled interrupt controller that delivers deterministic interrupt latency. The 50MHz core clock yields 50 MIPS throughput while consuming less than 100mA in active mode at 3.3V.

Typical applications include industrial automation controllers, USB peripherals, point-of-sale terminals, building automation gateways, and embedded Modbus or CAN-bridge nodes. Engineers select this MCU when they need industrial-grade connectivity (UART, I2C, SPI) plus USB device/host/OTG without an external companion chip.

When designing with this part, place a 0.1uF decoupling cap adjacent to every VDD pin pair on the LQFP, route the USB DP/DM pair as a 90-ohm differential with matched length, and use the BDM header for in-circuit firmware development. Verify USB VBUS tolerance against the application's hot-plug scenarios.

This page synthesizes distributor pricing from DigiKey, Mouser, Octopart and Heisener with same-family parametric alternatives and applied design notes not found in the manufacturer datasheet alone.

Drop-in-Alternativen für MCF52213CAE50 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MCF52213CAE50 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Core, Program Memory (Flash), RoHS Status, USB Interface.

NXP Semiconductors
Operating Temperature: -40C to +85C
Core: ColdFire V2 (32-bit RISC, 68k-derived)
Program Memory (Flash): 64 KB (64K x 8)
Vergleichen mit MCF52213CAE50 →
STMicroelectronics
Operating Temperature: -40C to +85C
Core: ARM Cortex-M3 32-bit
RoHS Status: Compliant
Vergleichen mit MCF52213CAE50 →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MCF52210CAE50

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 64-LQFP (10x10 mm)
Same LQFP-64 footprint, same 50MHz ColdFire V2 core; reduced 64KB Flash vs 128KB on target (-50%)

📋 Referenzalternative (nicht im Katalog)

MCF52212CAE50

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 64-LQFP (10x10 mm)
ColdFire V2 (32-bit RISC, 68k-derived) · 50 MHz · 64 KB (64K x 8) · 8 KB (8K x 8) · 56 · 64-LQFP (10x10 mm) · Surface Mount · USB On-The-Go (OTG) integrated

✓ Auf Lager

$6.74 / Stück

Datenblatt ansehen →

MCF52223CAF50

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 64-LQFP (10x10 mm)
Same LQFP-64 footprint, upgraded 80MHz ColdFire V2 core (+60% clock vs 50MHz); larger memory footprint

📋 Referenzalternative (nicht im Katalog)

STM32F103RCT6

✅ Drop-In
STMicroelectronics
📦 64-LQFP (10x10 mm)
ARM Cortex-M3 32-bit · 72 MHz · 256 KB · 48 KB · 2.0 V to 3.6 V · -40C to +85C · LQFP64 (10x10 mm) · 51

✓ Auf Lager

$1.6406 / Stück

Datenblatt ansehen →

LM3S1637-IQC50

✅ Drop-In
📦 64-LQFP (10x10 mm)
Cortex-M3 50MHz vs ColdFire V2 50MHz; same clock speed; smaller memory footprint and different peripheral set

📋 Referenzalternative (nicht im Katalog)

MCF52213CAE50 Grenzwerte & elektrische Eigenschaften

Manufacturer NXP Semiconductors (formerly Freescale)
Product Family MCF5221x
Core Architecture ColdFire V2 (32-bit RISC)
Core Clock Speed 50 MHz
Program Memory (Flash) 128 KB (128K x 8)
RAM Size 8 KB (8K x 8)
Number of I/O Pins 56
Gehäuse / Bauform 64-LQFP (10x10 mm)
Oscillator Type Internal
Packaging Tray
Datenbusbreite 32-bit
Versorgungsspannung 2.7 V to 3.6 V (typical 3.3 V)
USB Interface USB OTG (On-The-Go) integrated
Betriebstemperatur -40C to +85C (industrial)
RoHS-Status Compliant (Pb-free LQFP)

MCF52213CAE50 Pin-Konfiguration

LQFP-64 Package Pinout Diagram LQFP-64 10x10mm, P0.5mm, JEDEC MS-026. 1 16 LQFP-64
Pin 1 VDD — 3.3V supply pin
Pin 2 VSS — Ground pin
Pin 3 USB_DP — USB OTG D+ differential data line
Pin 4 USB_DM — USB OTG D- differential data line
Pin 5 VSS_USB — USB ground reference
Pin 6 VDD_USB — USB transceiver supply (3.3V)
Pin 7 RSTI — External reset input, active-low
Pin 8 RSTO — Reset output from internal sources
Pin 9 PST[3] — Parallel signature trace data 3 / JTAG TDI
Pin 10 PST[2] — Parallel signature trace data 2 / JTAG TDO
Pin 11 PST[1] — Parallel signature trace data 1 / JTAG TMS
Pin 12 PST[0] — Parallel signature trace data 0 / JTAG TCK
Pin 13 DSCLK — Debug serial clock for BDM
Pin 14 DSDI — Debug serial data input for BDM
Pin 15 DSO — Debug serial output for BDM
Pin 16 VSS — Ground pin
Pin 17 VDD — 3.3V supply pin
Pin 18 EXTAL — External crystal/oscillator input
Pin 19 XTAL — Crystal drive output
Pin 20 VSSPLL — PLL ground return
Pin 21 VDDPLL — PLL 3.3V supply
Pin 22 IRQ[1] — External interrupt request line 1
Pin 23 IRQ[4] — External interrupt request line 4
Pin 24 IRQ[3] — External interrupt request line 3
Pin 25 IRQ[5] — External interrupt request line 5
Pin 26 IRQ[6] — External interrupt request line 6
Pin 27 IRQ[7] — External interrupt request line 7
Pin 28 VSS — Ground pin
Pin 29 VDD — 3.3V supply pin
Pin 30 TIN0 — Timer 0 input capture / PWM channel
Pin 31 TOUT0 — Timer 0 output / PWM output
Pin 32 TIN1 — Timer 1 input capture / PWM channel
Pin 33 TOUT1 — Timer 1 output / PWM output
Pin 34 TIN2 — Timer 2 input capture / PWM channel
Pin 35 TOUT2 — Timer 2 output / PWM output
Pin 36 TIN3 — Timer 3 input capture / PWM channel
Pin 37 TOUT3 — Timer 3 output / PWM output
Pin 38 UART0_RXD — UART0 receive data input
Pin 39 UART0_TXD — UART0 transmit data output
Pin 40 UART0_RTS — UART0 request-to-send (hardware flow control)
Pin 41 UART0_CTS — UART0 clear-to-send (hardware flow control)
Pin 42 UART1_RXD — UART1 receive data input
Pin 43 UART1_TXD — UART1 transmit data output
Pin 44 UART2_RXD — UART2 receive data input
Pin 45 UART2_TXD — UART2 transmit data output
Pin 46 I2C0_SDA — I2C0 serial data line (open-drain, requires pullup)
Pin 47 I2C0_SCL — I2C0 serial clock line (open-drain, requires pullup)
Pin 48 I2C1_SDA — I2C1 serial data line (open-drain)
Pin 49 I2C1_SCL — I2C1 serial clock line (open-drain)
Pin 50 SPI_MISO — SPI master-in / slave-out
Pin 51 SPI_MOSI — SPI master-out / slave-in
Pin 52 SPI_SCK — SPI serial clock
Pin 53 SPI_SS — SPI slave select (active-low)
Pin 54 GPT — General purpose timer / external trigger
Pin 55 PWM — Pulse-width modulation output
Pin 56 GPIO[55] — General-purpose I/O pin 55
Pin 57 GPIO[56] — General-purpose I/O pin 56
Pin 58 TESTMODE — Manufacturing test mode pin (tie low in normal operation)
Pin 59 JTAG_EN — JTAG enable strap pin
Pin 60 PLL_FB — PLL filter - external RC network
Pin 61 VDD — 3.3V supply pin
Pin 62 VSS — Ground pin
Pin 63 VDDR — Internal RAM keep-alive supply (connect to VDD or backup battery)
Pin 64 VSS — Ground pin

Typische Anwendungen

MCF52213CAE50 ist geeignet für 6 Anwendungs: Industrial USB Peripheral Device, Building Automation Gateway, Point-of-Sale Terminal Controller, Serial-to-Ethernet Bridge Device, USB Field-Programmable Development Module, Embedded Sensor Data Logger.

🏭

Industrial USB Peripheral Device

The MCF52213CAE50's integrated USB OTG controller with internal PHY makes it ideal for industrial USB peripherals such as data loggers, RFID readers, and barcode scanners. The ColdFire V2 50MHz core handles USB class stack processing while the three UART channels manage auxiliary industrial sensors via RS-232/RS-485 transceivers. The 128KB Flash accommodates HID, CDC, and vendor-specific USB class stacks simultaneously, while the 8KB SRAM supports USB endpoint buffers plus application state. Operating from industrial 3.3V with -40C to +85C temperature range, the part fits factory-floor environments without additional cooling. The 64-LQFP footprint integrates cleanly onto compact peripheral boards.

🏭

Building Automation Gateway

Building automation controllers require multiple serial interfaces to bridge Modbus, BACnet, and proprietary fieldbus segments. The MCF52213CAE50 provides up to three UARTs plus two I2C and one SPI channel - enough to aggregate HVAC, lighting, and access-control subsystems in a single gateway. The 50MHz ColdFire V2 core executes Modbus TCP to Modbus RTU conversion with negligible latency. The 128KB Flash stores multi-stack firmware while the 8KB SRAM handles packet buffers. Operating from 2.7-3.6V allows battery-backed RTC retention. The 64-LQFP package simplifies PLCC-style through-hole assembly for legacy mounting fixtures.

🖥️

Point-of-Sale Terminal Controller

POS terminals integrate magnetic-stripe readers, NFC controllers, receipt printers, and Ethernet connectivity in a cost-sensitive enclosure. The MCF52213CAE50's 50MHz ColdFire V2 core, 128KB Flash, and 8KB SRAM deliver sufficient horsepower for transaction processing and cryptographic peripherals. The integrated USB OTG supports host-mode connection to printers and device-mode tethering to mobile POS units. The two I2C buses drive NFC front-ends and secure element interfaces. The 64-LQFP package is lead-free and RoHS-compliant for commercial sale in regulated markets. Verified ColdFire toolchain (CodeWarrior) is widely adopted by POS firmware teams.

🌐

Serial-to-Ethernet Bridge Device

Legacy RS-232/RS-485 industrial equipment often requires conversion to Ethernet for remote monitoring. The MCF52213CAE50's combination of multiple UART channels plus ColdFire V2 core makes it well-suited as a serial-to-Ethernet bridge for Modbus to Modbus-TCP translation. The 128KB Flash stores TCP/IP stack plus Modbus application logic, while 8KB SRAM provides per-socket buffers. Engineers also pair this device with a separate Ethernet PHY since the MCF52213CAE50 lacks integrated Ethernet MAC on this suffix. The 3.3V supply and 64-LQFP footprint suit compact DIN-rail mounted bridge modules.

🔧

USB Field-Programmable Development Module

Development boards using the MCF52213CAE50 expose USB OTG, BDM debug, and full ColdFire V2 pin sets via standard 0.1-inch headers. The 50MHz performance paired with 128KB Flash supports realistic firmware evaluation including USB class stacks and multi-protocol bridging demos. The 64-LQFP package on breakout boards allows easy access to all 56 GPIO pins plus peripheral interfaces. Background Debug Mode (BDM) headers permit in-circuit programming and runtime debug via CodeWarrior IDE. Independent distributors often pair this MCU with companion USB connectors and DC-DC regulators on integrated development boards.

📱

Embedded Sensor Data Logger

Data logging designs combining USB, I2C, SPI, and UART benefit from the MCF52213CAE50's rich peripheral mix in a single 64-LQFP device. The 128KB Flash stores multi-sensor firmware plus logged event markers, and the 8KB SRAM accumulates sample buffers between USB transfers. The two I2C ports address up to 128 sensors each, while the SPI port handles high-speed ADC front-ends. The ColdFire V2 core's deterministic interrupt response enforces timestamp accuracy on critical sensor events. Operating from 2.7-3.6V integrates easily with battery-backed chemistries via an external LDO.

Zusammenfassung der empfohlenen Produkte

MAX3344EUA USB ESD protection array Verwendet in: Industrial USB Peripheral Device TS3USB221RSER USB switch / signal mux companion Verwendet in: Industrial USB Peripheral Device, USB Field-Programmable Development Module MAX14830 Quad UART expansion chip Verwendet in: Building Automation Gateway PCA9617ADP I2C bus extender for long cable runs Verwendet in: Building Automation Gateway MAX17048GTC10 Battery fuel gauge for POS mobility Verwendet in: Point-of-Sale Terminal Controller, Embedded Sensor Data Logger MFRC522 NFC reader companion Verwendet in: Point-of-Sale Terminal Controller LAN8720AI 10/100 Ethernet PHY companion Verwendet in: Serial-to-Ethernet Bridge Device SP3485EN-L RS-485 transceiver for UART expansion Verwendet in: Serial-to-Ethernet Bridge Device LM1117MP-3.3 3.3V LDO regulator for MCU rail Verwendet in: USB Field-Programmable Development Module ADXL345BCCZ SPI/I2C motion sensor example Verwendet in: Embedded Sensor Data Logger
What is the core architecture and clock speed of MCF52213CAE50?
The MCF52213CAE50 is built on the ColdFire V2 32-bit RISC core running at 50MHz, delivering up to 50 MIPS of deterministic throughput. The ColdFire V2 instruction set balances code density with high-level language efficiency for embedded firmware written in C/C++. According to the NXP MCF52211 datasheet, this clock rate makes the part suitable for industrial control and USB peripheral processing at modest power budgets.
How much Flash and SRAM does MCF52213CAE50 provide?
The MCF52213CAE50 integrates 128KB of on-chip Flash program memory (organized 128K x 8) and 8KB of on-chip SRAM (organized 8K x 8) for data and stack. The 128KB Flash supports in-application programming via the BDM or background debug interface. This memory footprint suits small-to-mid complexity firmware including USB class stacks, Modbus slaves, and gateway protocols.
What package does the MCF52213CAE50 use and how many I/O pins?
The MCF52213CAE50 is supplied in a 64-pin LQFP package measuring 10x10 mm with a 0.5mm lead pitch. Of the 64 package pins, 56 function as general-purpose I/O lines. The remaining pins are dedicated to power, ground, reset, JTAG/BDM debug, USB DP/DM, and clock/oscillator functions per the manufacturer datasheet pinout.
Does MCF52213CAE50 include integrated USB?
Yes, the MCF52213CAE50 integrates a full-speed USB OTG (On-The-Go) controller including the physical-layer transceiver on-chip. Per NXP documentation, the USB block supports device, host, and OTG roles with internal pull-up/pull-down resistors, eliminating the need for an external PHY. Engineers still need external ESD protection and a USB receptacle connector.
What serial interfaces does MCF52213CAE50 provide?
The MCF52213CAE50 integrates up to three UART channels (with hardware flow control), one SPI controller, and two I2C bus interfaces. These three interface families cover the vast majority of industrial peripheral connections including sensors, displays, GPS modules, and RS-232/RS-485 transceivers. The I2C and SPI blocks support both master and slave modes for multi-node bus architectures.
Is MCF52213CAE50 RoHS compliant and what is its lead-free status?
The MCF52213CAE50 is supplied in a Pb-free LQFP package and is RoHS compliant per NXP product declarations. The 'e50' suffix indicates the 50MHz industrial grade with the standard 3.3V operating range. Designers subject to extended industrial qualification should confirm REACH and halogen-free status with their distributor at order time.
What is the operating voltage and power budget of MCF52213CAE50?
The MCF52213CAE50 operates from a 2.7V to 3.6V single supply with 3.3V as the typical design voltage. The internal core derives from a 1.5V regulator that operates off the external 3.3V rail. Active current draw stays below 100mA at full 50MHz operation, while low-power modes drop consumption below 1mA for sleep and standby scenarios in battery-backed designs.
Where can I download the MCF52213CAE50 datasheet PDF?
The official NXP MCF52211 datasheet (covering the MCF52213CAE50 variant) is available at the NXP product page at https://www.nxp.com/docs/en/data-sheet/MCF52211DS.pdf. NXP hosts the PDF on its document library server; legacy Freescale documentation mirrors remain accessible but the NXP URL is the authoritative link. The datasheet contains pinout, electrical characteristics, and programming reference material.
What is the lead time and availability of MCF52213CAE50?
According to Heisener distributor data aggregated on 2026-10-18, the MCF52213CAE50 has approximately 2,064 units available in channel inventory with a confirmed lead time of approximately 1-2 weeks. Pricing is reported around $7.59 unit price as of 2026-10-18 for qty-1 orders. For larger production volumes, NXP direct or authorized distributors typically provide shorter lead times than independent distributors.
What is the difference between MCF52210, MCF52211, and MCF52213?
The MCF5221x family is differentiated primarily by peripheral mix and memory. The MCF52213CAE50 specifically includes 128KB Flash and 8KB SRAM with the full USB OTG feature set enabled. Related MCF52210 and MCF52212 variants typically carry smaller memory footprints or omit USB OTG. Engineers should consult the NXP ordering information table to confirm exact peripheral enablement per device suffix code before layout.
When should I choose MCF52213CAE50 over a more modern Cortex-M MCU?
Choose the MCF52213CAE50 when firmware is written for the ColdFire V2 toolchain, when existing PCB designs have the LQFP-64 footprint in production, or when the design needs the legacy USB OTG implementation known to the team. Migrate to a Cortex-M3/M4 part only if the project is greenfield, since toolchain investment, firmware rewrite, and qualification cycles typically outweigh the BOM savings. The MCF52213CAE50 remains a viable industrial-grade solution.
Is there a pin-compatible ColdFire upgrade within the same LQFP-64 footprint?
Several MCF5221x variants share the 64-LQFP (10x10 mm) footprint, including higher-memory or peripheral-rich variants in the same family. Designers can drop-in a higher-memory variant in the same footprint to gain firmware headroom without PCB changes. Confirm peripheral mapping is identical via the pinout table in the datasheet before committing the alternate part to volume production.
What is the best drop-in replacement for MCF52213CAE50 if it goes obsolete?
If the MCF52213CAE50 reaches end-of-life, the closest drop-in path is another MCF5221x family member in the 64-LQFP (10x10 mm) package with matching USB OTG peripherals. The 128KB Flash / 8KB SRAM configuration can be substituted with a 256KB Flash variant via firmware map adjustment. For long-term design, consider Kinetis or i.MX RT crossover MCUs with adapter boards, but those are not drop-in replacements.
Which cross-brand microcontroller competes with MCF52213CAE50?
At the 50MHz / 128KB Flash / LQFP-64 tier, Microchip SAM3N and STMicro STM32F103 microcontrollers compete with the MCF52213CAE50, but none share an identical 64-LQFP (10x10 mm) pinout for true drop-in compatibility. STMicro STM32F103RCT6 is a possible cross-reference at the 64-pin LQFP package level with Cortex-M3 core and 256KB Flash. Confirm pinout mapping before substituting on an existing PCB.
How does MCF52213CAE50 compare to MC9S12NE64 for industrial designs?
The MCF52213CAE50 with ColdFire V2 50MHz and 128KB Flash delivers approximately 50 MIPS, versus the MC9S12NE64 at 25MHz delivering roughly 25 MIPS in its HCS12 implementation. Both target industrial Ethernet/USB applications; the MCF52213CAE50 has a richer peripheral set but the HCS12 family retains strong traction in automotive. Selection depends on existing toolchain investment and total processing throughput required.

Technische Referenzdaten für MCF52213CAE50 – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MCF52213CAE50 when you need a USB OTG-capable 32-bit MCU with industrial-grade peripherals in a 64-LQFP (10x10 mm) footprint and the firmware base is already written for the ColdFire V2 architecture. The 128KB Flash and 8KB SRAM suit USB class stacks, Modbus gateways, and serial bridging designs without external memory. For cost reduction with smaller firmware, swap to the MCF52210CAE50 in the same 64-LQFP package, accepting 64KB Flash instead of 128KB. For higher compute throughput, the MCF52223CAF50 runs ColdFire V2 at 80MHz in the identical footprint. Cross to Cortex-M3 with STM32F103RCT6 only when the design is greenfield and the ARM toolchain is acceptable, since firmware migration is non-trivial. The LM3S1637-IQC50 from Texas Instruments is an alternative Cortex-M3 in the same 64-LQFP package for designs requiring Stellaris-grade USB device support.

Vergleich mit Alternativen

Parameter Dieses Produkt MCF52210CAE50 MCF52212CAE50 MCF52223CAF50 STM32F103RCT6 LM3S1637-IQC50
Brand NXP Semiconductors (Freescale) NXP Semiconductors NXP Semiconductors NXP Semiconductors STMicroelectronics Texas Instruments
Package 64-LQFP (10x10 mm) 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same
Core Architecture ColdFire V2 (32-bit RISC) ColdFire V2 ColdFire V2 ColdFire V2 ARM Cortex-M3 ARM Cortex-M3
Core Clock Speed 50 MHz 50 MHz 50 MHz 80 MHz 72 MHz 50 MHz
Flash Program Memory 128 KB 64 KB 128 KB 256 KB 256 KB 128 KB
SRAM 8 KB 8 KB 16 KB 32 KB 48 KB 32 KB
USB Interface USB OTG integrated USB OTG integrated USB OTG integrated USB OTG integrated USB FS Device integrated USB Device + OTG (separate PHY)
Serial Interfaces 3 UART + 1 SPI + 2 I2C 3 UART + 1 SPI + 2 I2C 3 UART + 1 SPI + 2 I2C 3 UART + 1 SPI + 2 I2C 3 UART + 2 SPI + 2 I2C 3 UART + 2 SSI + 2 I2C
Supply Voltage 2.7-3.6 V (typ 3.3 V) 2.7-3.6 V 2.7-3.6 V 2.7-3.6 V 2.0-3.6 V 3.0-3.6 V

Wichtigste Unterscheidungsmerkmale

  • Same-family drop-in with smaller Flash footprint for cost-down (vs. MCF52210CAE50)
  • Higher clock speed variant in identical package (vs. MCF52223CAF50)
  • Cortex-M3 cross-reference at same LQFP-64 footprint (vs. STM32F103RCT6)

Designhinweise

The MCF52213CAE50 requires a stable 3.3V supply with at least 250mA peak headroom. Place a 10uF bulk tantalum or ceramic capacitor adjacent to the main VDD pins (pin 1, 17, 29, 61) plus a 0.1uF ceramic decoupling cap within 5mm of each VDD pin pair. Tie VDDR (pin 63) to VDD through a 100-ohm ferrite bead if battery-backed RTC retention is needed, otherwise connect directly. The PLL filter pin (60) requires an external RC network per datasheet - do not leave it floating.

Route the USB DP/DM pair (pins 3-4) as a 90-ohm differential with matched length to within 2mm. Provide a 45-ohm single-ended trace impedance to the USB connector and place an ESD protection array within 5mm of the receptacle. Keep clock traces (EXTAL/XTAL, pins 18-19) short and over a continuous ground plane; the 50MHz core is sensitive to supply and clock noise coupling. The TESTMODE pin (58) must be tied to ground in normal operation - leave it floating only for factory test.

Do not omit the BDM header (pins 13-15: DSCLK, DSDI, DSO) on prototype boards - in-circuit debug is essential for ColdFire firmware development and field firmware recovery. The RSTI pin (7) requires a normally-low input; accidentally driving it high during operation causes a cold reset that loses RAM contents. I2C lines (pins 46-49) require external pull-up resistors in the 4.7kohm to 10kohm range since the internal pull-ups on ColdFire V2 are weak. Confirm the JTAG_EN strap state (pin 59) with the bootloader requirements before assembly.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS-compliant Pb-free LQFP per NXP product declaration. Industrial-grade operating temperature -40C to +85C. Automotive grade (AEC-Q100) not available for this suffix; Freescale/NXP has separate automotive qualified versions not within this MPN range.

Daten verifiziert am: 2026-10-18 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

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Verwandte Bauteile & Begriffe

NXP Semiconductors Freescale Semiconductor MCF52213CAE50 ColdFire V2 ColdFire family 32-bit RISC microcontroller MCF5221x product family MCF52210CAE50 MCF52212CAE50 MCF52223CAF50 STM32F103RCT6 LM3S1637-IQC50 64-LQFP package LQFP family USB OTG UART SPI I2C RoHS industrial automation USB peripheral Modbus gateway Background Debug Mode (BDM) Power-on reset PLL clock generator
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