MCF5282CVF66 - ColdFire V2 32-bit MCU, 512KB Flash, 66MHz | NXP
Teilenummer: MCF5282CVF66 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $59.11 | $59,11 |
| 10 | $53.2 | $532,00 |
| 100 | $47.85 | $4.785,00 |
| 500 | $43.1 | $21.550,00 |
| 1.000 | $39.5 | $39.500,00 |
MCF5282CVF66 Übersicht
ColdFire V2 microcontrollers are 32-bit RISC processors derived from the original Motorola 68000 instruction set architecture. Positioned between 8/16-bit legacy MCUs and higher-end ColdFire V3/V4 parts, the V2 core delivers single-cycle MAC (multiply-accumulate) instructions, hardware divide, and deterministic interrupt response, while keeping silicon area and power consumption lower than ARM Cortex-M3 equivalents from the same era. MCF5282CVF66 belongs to the MCF528x family, which is designed to simplify embedded Ethernet-networked MCU applications by combining the ColdFire core with industry-standard wired-communications peripherals on a single die.
Key features include 512KB of program Flash (organized 512K x 8), 64KB of SRAM, 142 general-purpose I/O lines, 10/100 Mbps Ethernet MAC (MII/RMII), dual CAN 2.0A/B controllers, three UARTs, two I2C buses, QSPI, a 4-channel 32-bit DMA, an 8-channel 10-bit ADC, and an integrated phase-locked loop (PLL) for flexible clock generation. The 66 MHz core frequency provides 56 Dhrystone MIPS of integer throughput, sufficient for protocol stacks, supervisory control loops, and basic HMI tasks.
Architecture depth: the ColdFire V2 core uses a variable-length instruction pipeline and Harvard-style bus structure with separate Flash and SRAM buses, so instruction fetches and data accesses do not contend for the same bus. The on-chip voltage regulator generates the 1.5V core logic from a single 3.3V external supply, simplifying PCB power design. The MAPBGA-256 package exposes a 17x17 mm footprint with 1.0 mm ball pitch and is rated for the standard 0 to 70C commercial operating range for this part suffix (V = -40 to +85C not used here; this part is the C commercial variant).
Typical applications include industrial Ethernet gateways, factory automation PLCs, building-automation controllers, CAN-bridge / CAN-Ethernet converters, point-of-sale terminals, and embedded web servers. The integrated Ethernet and CAN peripherals make it especially suited to bridging legacy serial or CAN-based field devices onto TCP/IP networks.
Design consideration: the 256-ball MAPBGA requires 4-layer (or preferably 6-layer) PCB stack-up with laser-drilled or via-in-pad microvias for reliable assembly; routing fan-out below the package is non-trivial and should be evaluated using the manufacturer's reference layout. The part operates from a single 3.3V rail; on-chip LDO generates the 1.5V core supply.
This page synthesizes distributor pricing, NRND lifecycle status, and drop-in same-family alternatives not consolidated on the manufacturer product page.
Drop-in-Alternativen für MCF5282CVF66 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCF5282CVF66 (gleiche Bauform und Footprint) – abweichend in Ethernet, Core Architecture, Program Memory, Ethernet MAC, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCF5280CVF66J
✅ Drop-In✓ Auf Lager
$17.6 / Stück
Datenblatt ansehen →MCF5281CVF66
✅ Drop-In✓ Auf Lager
$19.85 / Stück
Datenblatt ansehen →MCF5282CVM66
✅ Drop-In✓ Auf Lager
$60.3 / Stück
Datenblatt ansehen →MCF5233CVM100
✅ Drop-In✓ Auf Lager
$39.81 / Stück
Datenblatt ansehen →MCF5282CVF66 Grenzwerte & elektrische Eigenschaften
| Core Architecture | ColdFire V2 (32-bit RISC) |
| Core Frequency | 66 MHz |
| Program Memory | 512 KB Flash (512K x 8) |
| SRAM | 64 KB |
| Versorgungsspannung | 3.3 V (on-chip LDO generates 1.5 V core) |
| I/O Count | 142 |
| Gehäuse | 256-MAPBGA (17x17 mm, 1.0 mm pitch) |
| Ethernet | 10/100 Mbps MAC (MII/RMII) |
| CAN | 2 x CAN 2.0A/B |
| UART | 3 |
| I2C | 2 |
| QSPI | 1 |
| DMA Channels | 4 (32-bit) |
| ADC | 8-channel, 10-bit |
| Betriebstemperatur | -40C to +85C (commercial 'C' suffix in MAPBGA) |
| RoHS-Status | Compliant |
| Montageart | Surface Mount (BGA) |
MCF5282CVF66 256-mapbga (17x17 mm, 1.0 mm pitch) Pinbelegungsleitfaden
Pinbelegung für MCF5282CVF66 (256-mapbga (17x17 mm, 1.0 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MCF5282CVF66.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MCF5282CVF66 ist geeignet für 6 Anwendungs: Industrial Ethernet Gateway, Building Automation Controller, CAN-to-Ethernet Bridge, Point-of-Sale Terminal Controller, Embedded Web Server / SCADA Node, Factory Automation PLC.
Industrial Ethernet Gateway
The MCF5282CVF66's integrated 10/100 Mbps Ethernet MAC and dual CAN 2.0 controllers make it a strong fit for industrial Ethernet gateways that bridge field-bus devices onto TCP/IP networks. Its 66 MHz ColdFire V2 core delivers 56 MIPS, sufficient to run an lwIP or uIP TCP/IP stack alongside a CANopen or DeviceNet slave without offloading to a network processor. Typical placement is as the main MCU on a 3.3V-only carrier board with an external PHY on the MII/RMII bus; the 142 GPIO provide ample headroom for status LEDs, DIP switches, and an LCD interface for diagnostic display.
Empfohlen
Building Automation Controller
Building-automation controllers (BACnet, Modbus TCP, KNX gateways) benefit from the MCF5282CVF66's Ethernet MAC plus multiple UARTs and CAN controllers for bridging HVAC, lighting, and access-control sub-systems. The 512 KB Flash holds BACnet/Modbus protocol stacks plus application firmware, while 64 KB SRAM is sufficient for typical control-loop buffers. The 256-MAPBGA allows a compact controller footprint with sufficient GPIO for relay drivers, keypad inputs, and an OLED status display.
Empfohlen
CAN-to-Ethernet Bridge
The MCF5282CVF66 is well suited to CAN-to-Ethernet bridge designs that translate legacy CAN-bus traffic (CANopen, SAE J1939, DeviceNet) onto Ethernet for remote monitoring. Its dual CAN controllers handle two isolated CAN networks simultaneously, while the on-chip Ethernet MAC streams data to a host SCADA system. With 56 MIPS of compute headroom, the MCU can filter, timestamp, and forward CAN frames at bus speeds up to 1 Mbps without dropping messages, while the 8-channel 10-bit ADC samples analog sensors (temperature, pressure) for inclusion in the Ethernet payload.
Empfohlen
Point-of-Sale Terminal Controller
POS terminal controllers use the MCF5282CVF66 to drive a printer interface, magnetic-stripe reader, Ethernet uplink to the payment gateway, and a keypad/display. The 66 MHz ColdFire V2 core runs the payment-application protocol stack, while the on-chip QSPI can address external Flash for transaction logs. The 142 GPIO easily support multiple peripheral interfaces (RS-232, USB-host via external transceiver, GPIO for printer control).
Empfohlen
Embedded Web Server / SCADA Node
The MCF5282CVF66's combination of 512 KB Flash (large enough to embed an HTTP server with custom CGI handlers), 64 KB SRAM, and 10/100 Ethernet MAC enables compact embedded web servers for SCADA telemetry nodes, remote sensor aggregation, and machine-condition monitoring. Engineers typically run an RTOS (uClinux, FreeRTOS with lwIP) on the ColdFire V2 core; the 56 MIPS budget is sufficient to serve web pages and simultaneously process Modbus TCP polls.
Empfohlen
Factory Automation PLC
Compact factory-automation PLCs leverage the MCF5282CVF66's deterministic ColdFire V2 interrupt response to scan I/O and execute ladder-logic-equivalent firmware within tight cycle times. The 8-channel 10-bit ADC samples analog process variables (4-20 mA transducers, thermocouples via external front-end), the dual CAN controllers talk to servo drives, and the Ethernet MAC uplinks to the factory MES. The 256-MAPBGA package and 142 GPIO support multi-axis machine designs without external bus expanders.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCF5282CVF66 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCF5280CVF66J | MCF5281CVF66 | MCF5282CVM66 | MCF5233CVM100 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-MAPBGA (17x17 mm) | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same |
| Core | ColdFire V2, 66 MHz | ColdFire V2, 66 MHz | ColdFire V2, 66 MHz | ColdFire V2, 66 MHz | ColdFire V2, 100 MHz |
| Ethernet MAC | 10/100 MII/RMII | 10/100 MII/RMII | 10/100 MII/RMII | 10/100 MII/RMII | None |
| CAN 2.0 Controllers | 2 | 2 | 2 | 2 | 2 |
| Lifecycle Status | NRND | NRND / Obsolete | NRND | NRND | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Largest Flash in the MCF528x family (vs. MCF5281CVF66)
- Includes Ethernet MAC vs no-MAC part (vs. MCF5233CVM100)
- Drop-in compatibility with MCF5282CVM66 (vs. MCF5282CVM66)
Designhinweise
The 256-MAPBGA (17x17 mm, 1.0 mm pitch) requires a 4-layer minimum PCB stack-up with microvia fan-out. Use via-in-pad or dog-bone fan-out per IPC-7352 and NXP's reference design; ensure non-solder-mask-defined (NSMD) pads with 0.5 mm diameter for reliable assembly. Place at least 4 thermal vias (0.3 mm drill) under the center ball grid to dissipate ~1 W of package power.
Power the MCF5282CVF66 from a single 3.3V rail; the internal LDO generates the 1.5V core. Decouple VDD with a 10 uF bulk + 100 nF high-frequency ceramic per supply pin group per the datasheet decoupling table. Place the 10 uF within 5 mm of the package and the 100 nF within 1-2 mm. If the application is sensitive to Ethernet PHY power-rail noise, add a ferrite bead between the MCU 3.3V and the PHY supply.
Estimated: at 66 MHz core clock, typical VDD33 current is approximately 120 mA (~0.4 W). The 256-MAPBGA has a theta_JA of approximately 25 C/W on a 4-layer JEDEC test board, giving ~10 C rise above ambient - well within the 125 C junction limit. Do not rely on this estimate in production; measure the actual rise with a thermocouple on your board because the absence of a heat-spreader copper plane can push theta_JA to 35 C/W or higher.
Route the Ethernet MII/RMII bus as a 50 ohm impedance-controlled group with matched trace lengths (MII within 25 mils, RMII within 10 mils). Keep the 25 MHz Ethernet reference clock trace short and guarded by ground. The CAN bus requires a 120 ohm termination resistor at each end of the bus; place common-mode chokes near the connector for industrial EMC compliance per IEC 61000-4-2.
Compliance-Informationen
RoHS and lead-free per NXP product page. Not AEC-Q100 qualified (industrial/commercial grade). Halogen-free status not stated in available data.
