MCF5233CVM100 - ColdFire V2 32-bit MPU, 100MHz, 256-MAPBGA | NXP
MPN: MCF5233CVM100 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $52.04 | $52.04 |
| 10 | $52.04 | $520.40 |
| 100 | $52.04 | $5,204.00 |
| 500 | $52.04 | $26,020.00 |
| 1,000 | $52.04 | $52,040.00 |
| 10,000 | $39.81 | $398,100.00 |
MCF5233CVM100 Overview
A microprocessor (MPU) is the central processing unit of an embedded system; the ColdFire V2 architecture is a 32-bit variable-length RISC ISA that is binary-compatible with the m68k family while consuming less silicon area and lower power than legacy 68000 cores. Within the broader taxonomy, the MCF5233 sits under microcontroller (MCU/MPU) -> ColdFire family -> V2 core -> MCF523x peripheral-rich class, targeting networked industrial applications that previously required a microcontroller paired with a separate Ethernet controller.
Key features highlighted on the NXP product page include 64 KB of on-chip SRAM, 32 KB of Flash cache (the device is listed as 'ROMless' because program code is sourced from external memory), a 16-channel enhanced Time Processing Unit (eTPU), a 10/100 Ethernet MAC, and a hardware-accelerated encryption module. Other integrated peripherals typically available in this family include UARTs, an I2C bus, QSPI, a CAN module, general-purpose timers, and a DDR/SDRAM controller for external memory expansion.
Architecturally, the ColdFire V2 core uses a 6-stage pipeline and a unified instruction/data path with 32-bit internal registers, delivering 100 MIPS (Dhrystone 2.1) at 100 MHz core frequency. The integrated 10/100 MAC includes a full scatter/gather DMA engine, while the eTPU provides microcoded motion-control and waveform-generation capability - features that offload real-time tasks from the CPU.
Typical applications include industrial automation controllers, building-automation gateways, networked sensor nodes, and factory-floor protocol bridges. The combination of MAC + eTPU + encryption acceleration makes it attractive where deterministic I/O handling and IP connectivity must coexist on one chip.
When designing with the MCF5233, engineers should plan for external boot Flash because the device is ROMless; a stable SDRAM interface is required for working memory. Pay close attention to the MAPBGA 17x17 mm PCB layout rules (trace escape, microvia stack-up) and to thermal management since industrial temperatures can push junction temperatures up.
This page consolidates distributor pricing, MDR-compatible MAPBGA drop-in alternatives, and engineering notes that go beyond what the standalone Freescale/NXP datasheet provides - giving you a single reference for procurement and design reviews.
Drop-in alternatives for MCF5233CVM100 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCF5233CVM100 (same form factor and footprint) — differing in Package, Ethernet MAC, Core Architecture, DMA Channels, Hardware Encryption.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCF5235CVM150J
✅ Drop-In✓ In Stock
$18.4 / Unit
View Datasheet →MCF5235CVM100J
✅ Drop-In✓ In Stock
$15.95 / Unit
View Datasheet →MCF5234CVM150J
✅ Drop-In✓ In Stock
$17.1 / Unit
View Datasheet →MCF5232CVM100J
✅ Drop-In✓ In Stock
$17.05 / Unit
View Datasheet →MCF5280CVM66J
✅ Drop-In✓ In Stock
$0.8 / Unit
View Datasheet →MCF5233CVM100 Maximum Ratings & Electrical Characteristics
| Core Architecture | ColdFire V2 (32-bit) |
| Maximum CPU Frequency | 100 MHz |
| On-chip SRAM | 64 KB |
| Program Memory | ROMless (external memory required) |
| Instruction Cache | 32 KB (4-way set-associative) |
| Package | 256-MAPBGA, 17x17 mm |
| Ethernet MAC | 10/100 Mbps (MII/RMII) |
| Enhanced Time Processing Unit (eTPU) | 16 channels |
| Hardware Encryption | Yes (hardware-accelerated) |
| Operating Voltage (Core) | 1.5 V |
| Operating Voltage (I/O) | 3.3 V |
| External Memory Bus | 32-bit SDRAM / DDR support |
| Operating Temperature Range | -40C to +85C (industrial, per NXP datasheet) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
MCF5233CVM100 256-mapbga, 17x17 mm Pin Configuration Guide
Pin configuration for MCF5233CVM100 (256-mapbga, 17x17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCF5233CVM100.
Refer to the datasheet for full pin configuration.
Typical Applications
MCF5233CVM100 is suitable for 6 applications: Industrial Automation Controllers, Building Automation Gateways, Networked Sensor Concentrators, Factory Floor Protocol Bridges, Medical Instrument Control, Industrial Security Appliances.
Industrial Automation Controllers
The MCF5233CVM100 is well suited to industrial PLCs and machine controllers because it pairs the ColdFire V2 core's deterministic interrupt response with a 16-channel eTPU for motion I/O. At 100 MHz the core executes deterministic servo loops while the on-chip 10/100 Ethernet MAC streams field data to a SCADA host via Modbus TCP. The 64 KB on-chip SRAM provides zero-wait-state scratch space for real-time variables, while external SDRAM handles program and historian storage. Power dissipation is modest enough that industrial enclosure cooling is not required.
Recommended
Building Automation Gateways
BACnet, KNX, LonWorks, and Modbus gateways benefit from the MCF5233CVM100's combination of multiple UARTs, CAN, I2C, and a hardware encryption accelerator. The 10/100 Ethernet MAC terminates the IP backbone while encryption offloads TLS for secure remote access. The wide industrial temperature range of -40C to +85C makes the part suitable for basement mechanical rooms. Boot from external SPI NOR Flash and Linux uClinux BSP shorten the firmware path.
Recommended
Networked Sensor Concentrators
The MCF5233CVM100 acts as a concentrator hub for distributed sensors in process plants, aggregating analog and digital inputs and forwarding them over Ethernet. The 16-channel eTPU handles up to 16 pulse streams from flow or position sensors with deterministic latency, while the eTPU runs in parallel with the CPU executing application tasks. External SDRAM stores sensor history for transmission during comms windows, and the integrated Ethernet MAC supports both MII and RMII PHYs.
Recommended
Factory Floor Protocol Bridges
Use the MCF5233CVM100 as a protocol bridge translating between CAN, RS-485 Modbus, and Ethernet/IP at the machine level. The ColdFire V2 core handles two or more protocol stacks simultaneously, and the hardware encryption engine secures cross-segment traffic. The 256-MAPBGA package supplies sufficient I/O for multiple fieldbuses. External SDRAM buffers traffic bursts during handoff between protocols.
Recommended
Medical Instrument Control
The MCF5233CVM100 fits non-critical medical instrumentation - analyzers, centrifuges, and laboratory automation - where deterministic I/O and Ethernet data export are priorities. The hardware encryption accelerator secures patient logs prior to transmission. Designers should add external watchdog and brown-out monitoring for medical risk mitigation; the part itself is not AEC-Q100 qualified and is therefore intended for IEC 60601 systems operating outside the patient environment.
Recommended
Industrial Security Appliances
Built-in hardware encryption on the MCF5233CVM100 enables VPN, IPsec, and TLS termination in industrial security appliances without external crypto chips. The 10/100 Ethernet MAC handles line-rate packet inspection for small-office firewalls, and the ColdFire V2 core runs the policy engine. Wide-temperature operation and the rugged MAPBGA package suit DIN-rail mounted appliance chassis.
Recommended
Recommended Products Summary
Engineering reference data for MCF5233CVM100 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCF5235CVM150J | MCF5235CVM100J | MCF5234CVM150J | MCF5232CVM100J | MCF5280CVM66J |
|---|---|---|---|---|---|---|
| Package | 256-MAPBGA (17x17 mm) | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA - same family |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) |
| Maximum CPU Frequency | 100 MHz | 150 MHz | 100 MHz | 150 MHz | 100 MHz | 66 MHz |
| Ethernet MAC | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 |
| Hardware Encryption | Yes | Yes | Yes | Yes | Yes | No |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Drop-in upgrade to 150 MHz at the same package (vs MCF5235CVM150J)
- Sibling with identical footprint and same peripheral set (vs MCF5235CVM100J)
- Higher-clock motor-control sibling on same footprint (vs MCF5234CVM150J)
- Integrates hardware encryption (vs MCF5280CVM66J)
Design Notes
Estimated: at 1.5 V core and 100 MHz, the device dissipates ~0.3-0.5 W typical. With a low-thermal-resistance MAPBGA package and a properly populated thermal-via array under the BGA, ambient up to +85C is achievable without forced-air cooling. Add a copper pour on both top and inner layers to spread heat. For sealed enclosures or higher ambient, derate system clock or switch to the higher-speed MCF5235CVM150J for shorter active-time at equivalent workload.
The 256-MAPBGA package requires a microvia-compatible PCB stack-up (typically a 4-6 layer build-up with 0.1 mm pitch microvias under the BGA). Escape route the inner-row balls through the inner signal layers; do not attempt dog-bone fan-out beyond the first row on the surface layers. Match trace lengths on the SDRAM bus (±50 ps on clock, ±100 ps on data/address) and provide adequate decoupling: place 0.1 µF + 10 µF caps within 5 mm of each power pin pair.
Boot configuration: the device is ROMless - the reset vector is fetched from external NOR Flash through the FlexBus or SPI interface. A bootloader must initialize the SDRAM controller before transferring control to the application image, otherwise the program crashes immediately. Reserve the lowest 256 KB of boot Flash for the bootloader and protect that region from accidental erasure. Also verify the eTPU microcode load - the eTPU functions are not factory-programmed and must be downloaded to eTPU RAM on every reset.
Ethernet MAC to PHY: route MII/RMII signals as 50 Ω controlled-impedance traces, keep under 50 mm to the magnetics, and place the PHY's center-tap capacitors within 5 mm of the chip. For 100 Mbps operation, source-terminate TX_CLK if the PHY is more than 25 mm away. On the SDRAM bus, use series 33 Ω resistors on clock, command, and data strobe nets to dampen overshoot.
Compliance Information
RoHS compliance per NXP product page; REACH compliance indicated by the J-grade suffix variants in the family. AEC-Q100 not claimed on the NXP product page - not for automotive safety-critical use.
